Spraying device in semiconductor cleaning equipment

Abstract

The utility model relates to the technical field of spraying and cleaning, and discloses a spraying device in semiconductor cleaning equipment, which comprises a shell, the top of the shell is fixedly connected with a motor II, the output end of the motor II is fixedly connected with a half gear, the inner wall of the shell is fixedly connected with a fixed rod, the bottom of the fixed rod is provided with a sliding rail, and the sliding rail is fixedly connected with the half gear. A toothed ring is slidably connected to the outer wall of the sliding rail, the outer wall of the toothed ring is in meshing connection with the outer wall of the half gear, water tanks are fixedly connected to the front side and the rear side of the top of the fixing rod, a water pump is fixedly connected between every two adjacent water tanks, and a telescopic pipe is fixedly connected to the bottom of each water pump. According to the utility model, the movable spraying device ensures that the cleaning liquid can uniformly cover the whole surface, especially on wafers with complex shapes or large areas, so that pollutants at different parts can be removed, and residues and local pollution caused by non-uniform spraying are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of spray cleaning, in particular to a spray device in semiconductor cleaning equipment. Background Art

[0002] Semiconductors are materials with electrical conductivity between conductors and insulators. They play an extremely important role in electronic technology and information technology, and are core components of modern computers, mobile phones, and household electronic devices. As the size of transistors continues to decrease, the manufacturing process faces increasingly complex technical challenges. At the micron or even nanometer scale, how to control atomic-level precision and reduce manufacturing defects is a major problem in current semiconductor manufacturing.

[0003] Semiconductor cleaning equipment is an important device used in the semiconductor manufacturing process to clean silicon wafers and remove surface contaminants. These devices are used in various links of the production process, such as wafer production, photolithography and etching, to ensure that the wafer surface reaches extremely high cleanliness. The purpose of cleaning is to remove particles, metal ions and organic impurities on the wafer surface to ensure the smooth progress of the next process and improve the quality and yield of the final product.

[0004] Semiconductor cleaning equipment includes spray cleaning, immersion cleaning and ultrasonic cleaning. Spray cleaning removes particulate contamination and surface impurities through high-pressure spraying. It is used in combination with deionized water. The semiconductor spray device uses a water pump to transport the cleaning liquid to the nozzle to spray the semiconductor. However, the spray direction is fixed, the spray position cannot be moved, and the spray range is small, which leads to incomplete semiconductor cleaning. Utility Model Content

[0005] In order to make up for the above deficiencies, the present invention provides a spray device in a semiconductor cleaning device, aiming to improve the problem in the prior art that the spray position cannot be moved and the spray range is small.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a spray device in a semiconductor cleaning equipment, comprising a shell, the top of the shell is fixedly connected to motor 2, the output end of the motor 2 is fixedly connected to a half gear, the inner wall of the shell is fixedly connected to a fixed rod, the bottom of the fixed rod is provided with a slide rail, the outer wall of the slide rail is slidably connected to a toothed ring, the outer wall of the toothed ring is meshingly connected with the outer wall of the half gear, the front and rear sides of the top of the fixed rod are fixedly connected to water tanks, a water pump is fixedly connected between the two adjacent water tanks, the bottom of the water pump is fixedly connected to a telescopic tube, the other end of the telescopic tube is fixedly connected to a water pipe, the bottom of the water pipe is fixedly connected to a water outlet pipe, the bottom of the water outlet pipe is evenly connected to a pressurized nozzle, and the inner wall of the shell is provided with a fixing mechanism, which is used to fix the semiconductor.

[0007] As a further description of the above technical solution:

[0008] The fixing mechanism includes motor 1, the top of motor 1 is fixedly connected to the inner wall of the shell, the output end of motor 1 is fixedly connected to a rotating rod, the bottom of the rotating rod is fixedly connected to a turntable, the lower side of the turntable is rotatably connected to a connecting rod, the inner wall of the shell is fixedly connected to a limit block, the inner part of the limit block is slidably connected to a fixing clamp, the left and right sides of the rotating rod are rotatably connected to connecting rods, and the other end of the connecting rod is rotatably connected to the rear side of the fixing clamp.

[0009] As a further description of the above technical solution:

[0010] A controller is fixedly connected to the front side of the housing, and the controller is electrically connected to the second motor and the first motor.

[0011] As a further description of the above technical solution:

[0012] The tops of the front and rear sides of the shell are fixedly connected with protection pads, and the front side of the shell is provided with a feeding port.

[0013] As a further description of the above technical solution:

[0014] A cleaning platform is fixedly connected to the interior of the shell, and a conveying platform is rotatably connected to the upper side of the cleaning platform.

[0015] As a further description of the above technical solution:

[0016] The front side of the shell is fixedly connected with an oblique support rod, and the top of the oblique support rod is fixedly connected with a storage platform.

[0017] As a further description of the above technical solution:

[0018] The four corners of the bottom of the shell are fixedly connected with support columns, and the bottoms of the support columns are fixedly connected with anti-slip pads.

[0019] As a further description of the above technical solution:

[0020] The front side of the shell is fixedly connected with a screw, and the outer wall of the screw is fixedly connected with an information plate.

[0021] The utility model has the following beneficial effects:

[0022] 1. In the present invention, a water pump delivers water from the water tank to the outlet pipe through a telescopic tube, and then sprays the water onto the semiconductor through a pressurized nozzle. The toothed ring moves back and forth to drive the pressurized nozzle to move and spray on the semiconductor. The movable spraying device ensures that the cleaning liquid can evenly cover the entire surface, especially on wafers with complex shapes or large areas, which helps to remove pollutants from different parts and avoid residues and local contamination due to uneven spraying.

[0023] 2. In the present invention, the turntables on the left and right sides are driven to rotate by a connecting rod, and multiple semiconductors are clamped for cleaning. By fixing the semiconductors, the sprayed liquid can accurately cover the entire surface, avoiding uneven spraying due to the movement of the semiconductors, ensuring the consistency and efficiency of cleaning. The clamping device helps to maintain the stability of the cleaning process and ensure efficient and accurate cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a front perspective view of a shell of a spray device in a semiconductor cleaning device proposed in the present invention;

[0025] Figure 2 This is a left perspective view of the housing of a spray device in a semiconductor cleaning device proposed in the present invention;

[0026] Figure 3 This is a partial structural diagram of a fixing rod of a spray device in a semiconductor cleaning device proposed by the present invention;

[0027] Figure 4 This is a diagram showing the partial structure of a fixing rod of a spray device in a semiconductor cleaning device proposed by the present invention;

[0028] Figure 5 This is a schematic diagram of the partial structure of the fixing mechanism of the spray device in the semiconductor cleaning equipment proposed by the present invention.

[0029] Legend:

[0030] 1. Housing; 2. Fixing mechanism; 201. Motor 1; 202. Rotating rod; 203. Turntable; 204. Linking rod; 205. Connecting rod; 206. Limit block; 207. Fixing clamp; 3. Motor 2; 4. Half gear; 5. Fixing rod; 6. Slide rail; 7. Toothed ring; 8. Water tank; 9. Water pump; 10. Telescopic tube; 11. Water supply pipe; 12. Water outlet pipe; 13. Pressurized nozzle; 14. Controller; 15. Protective pad; 16. Feed port; 17. Cleaning table; 18. Diagonal support rod; 19. Storage table; 20. Conveyor table; 21. Support column; 22. Anti-slip mat; 23. Screw; 24. Information board. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] Please see the attached Figure 1 , Attachment Figure 3 and attached Figure 4 The utility model provides an embodiment of a spray device in a semiconductor cleaning device, comprising a shell 1, a motor 2 3 fixedly connected to the top of the shell 1, which has precise control capabilities to ensure the continuity and uniformity of the entire spraying process, a half gear 4 fixedly connected to the output end of the motor 2 3, which can efficiently convert the power of the motor into the movement required by the spray device, a fixed rod 5 fixedly connected to the inner wall of the shell 1, a slide rail 6 is provided at the bottom of the fixed rod 5, a toothed ring 7 is slidably connected to the outer wall of the slide rail 6, and the outer wall of the toothed ring 7 is meshed with the outer wall of the half gear 4 to ensure the movement accuracy and synchronization of the spray device, and the front and rear sides of the top of the fixed rod 5 are fixedly connected There is a water tank 8, and a water pump 9 is fixedly connected between the two adjacent water tanks 8. The bottom of the water pump 9 is fixedly connected to a telescopic tube 10, and the telescopic tube 10 can be flexibly adjusted to meet different cleaning needs. The other end of the telescopic tube 10 is fixedly connected to a water pipe 11, and the water pipe 11 ensures smooth and uniform distribution of water flow. The bottom of the water pipe 11 is fixedly connected to a water outlet pipe 12, and the bottom of the water outlet pipe 12 is evenly connected to a pressurized nozzle 13. The pressurized nozzle 13 can produce a uniform and powerful spray to achieve the best cleaning effect. The inner wall of the shell 1 is provided with a fixing mechanism 2, which is used to fix the semiconductor and can ensure the stability and safety of the semiconductor during the cleaning process.

[0033] Please see the attached Figure 2 and attached Figure 5 The fixing mechanism 2 includes a motor 201. The top of the motor 201 is fixedly connected to the inner wall of the shell 1 to ensure its stability during operation. The output end of the motor 201 is fixedly connected to a rotating rod 202. The bottom of the rotating rod 202 is fixedly connected to a turntable 203. The lower side of the turntable 203 is rotatably connected to a connecting rod 204, so that the entire mechanism can achieve precise motion control. The inner wall of the shell 1 is fixedly connected to a limit block 206. The internal sliding connection of the limit block 206 is a fixed clamp 207, which ensures the accuracy and safety of the mechanical action. The left and right sides of the rotating rod 202 are rotatably connected to the connecting rod 205, and the other end of the connecting rod 205 is rotatably connected to the rear side of the fixed clamp 207.

[0034] Please see the attached Figure 1 and attached Figure 2 A controller 14 is fixedly connected to the front side of the shell 1. The controller 14 is electrically connected to the motor 2 3 and the motor 1 201, and is responsible for coordinating and controlling the precise operation of the motor 2 3 and the motor 1 201. A protective pad 15 is fixedly connected to the top of the front and rear sides of the shell 1. The protective pad 15 provides additional protection for the equipment and ensures safety during operation. A feeding port 16 is provided on the front side of the shell 1. A cleaning table 17 is fixedly connected to the inside of the shell 1. The upper side of the cleaning table 17 is rotatably connected to the conveying table 20. The conveying table 20 can rotate flexibly to improve the efficiency and performance of the entire equipment.

[0035] Please see the attached Figure 1 and attached Figure 2 The front side of the shell 1 is fixedly connected with an oblique support rod 18 to ensure the stability of the structure. The top of the oblique support rod 18 is fixedly connected with a storage table 19, which provides a convenient platform for users to place items. The four corners of the bottom of the shell 1 are fixedly connected with support columns 21. The bottom of the support column 21 is fixedly connected with an anti-slip pad 22. The support column 21 enhances the overall stability. The fixed connection between the bottom and the anti-slip pad 22 ensures the stability of the equipment on various floors. The front side of the shell 1 is fixedly connected with a screw 23, and the outer wall of the screw 23 is fixedly connected with an information plate 24. The information plate 24 records the product information in detail, which is convenient for users to quickly understand and use the equipment.

[0036] Working principle: Place the semiconductor in the correct position, start the controller 14 to start the motor 2 3, and the motor 2 3 starts to rotate the half gear 4, so that the toothed ring 7 moves back and forth in the slide rail 6 of the fixed rod 5. The water pump 9 transports the water in the water tank 8 to the water outlet pipe 12 through the telescopic tube 10, and then sprays it onto the semiconductor through the pressurized nozzle 13. The toothed ring 7 moves back and forth to drive the pressurized nozzle 13 to move and spray on the semiconductor. The movable spraying device ensures that the cleaning liquid can evenly cover the entire surface, especially on wafers with complex shapes or large areas, which helps to remove pollutants in different parts and avoid residues and local contamination due to uneven spraying.

[0037] When the semiconductor is being sprayed, the semiconductor needs to be clamped and fixed for better cleaning. The motor 201 is started to rotate the rotating rod 202, driving the connecting rod 205 to move, and at the same time driving the fixed clamp 207 to move in the limit block 206 to clamp the semiconductor. The turntables 203 on the left and right sides are then driven to rotate through the connecting rod 204 to clamp multiple semiconductors for cleaning. By fixing the semiconductor, the sprayed liquid can accurately cover the entire surface, avoiding uneven spraying due to the movement of the semiconductor, ensuring the consistency and efficiency of cleaning. The clamping device helps to maintain the stability of the cleaning process and ensure efficient and accurate cleaning.

[0038] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A spray device in a semiconductor cleaning device, comprising a housing (1), characterized in that: The top of the housing (1) is fixedly connected to a second motor (3), the output end of the second motor (3) is fixedly connected to a half gear (4), the inner wall of the housing (1) is fixedly connected to a fixed rod (5), the bottom of the fixed rod (5) is provided with a slide rail (6), the outer wall of the slide rail (6) is slidably connected to a toothed ring (7), the outer wall of the toothed ring (7) is meshingly connected to the outer wall of the half gear (4), the front and rear sides of the top of the fixed rod (5) are fixedly connected to a water tank (8), and the two A water pump (9) is fixedly connected between adjacent water tanks (8), a telescopic tube (10) is fixedly connected to the bottom of the water pump (9), the other end of the telescopic tube (10) is fixedly connected to a water pipe (11), the bottom of the water pipe (11) is fixedly connected to a water outlet pipe (12), the bottom of the water outlet pipe (12) is evenly connected to a pressurized nozzle (13), and a fixing mechanism (2) is provided on the inner wall of the shell (1), and the fixing mechanism (2) is used to fix the semiconductor.

2. The spray device in a semiconductor cleaning device according to claim 1, characterized in that: The fixing mechanism (2) comprises a motor (201), the top of the motor (201) is fixedly connected to the inner wall of the housing (1), the output end of the motor (201) is fixedly connected to a rotating rod (202), the bottom of the rotating rod (202) is fixedly connected to a rotating disk (203), the lower side of the rotating disk (203) is rotatably connected to a connecting rod (204), the inner wall of the housing (1) is fixedly connected to a limit block (206), the interior of the limit block (206) is slidably connected to a fixing clamp (207), the left and right sides of the rotating rod (202) are both rotatably connected to connecting rods (205), and the other end of the connecting rod (205) is rotatably connected to the rear side of the fixing clamp (207).

3. The spray device in a semiconductor cleaning device according to claim 1, wherein: A controller (14) is fixedly connected to the front side of the housing (1), and the controller (14) is electrically connected to the second motor (3) and the first motor (201).

4. The spray device in a semiconductor cleaning device according to claim 1, wherein: The tops of the front and rear sides of the shell (1) are fixedly connected with protective pads (15), and the front side of the shell (1) is provided with a feed opening (16).

5. The spray device in a semiconductor cleaning device according to claim 1, characterized in that: A cleaning platform (17) is fixedly connected to the interior of the housing (1), and a conveying platform (20) is rotatably connected to the upper side of the cleaning platform (17).

6. The spray device in a semiconductor cleaning device according to claim 1, characterized in that: The front side of the housing (1) is fixedly connected to an oblique support rod (18), and the top of the oblique support rod (18) is fixedly connected to a storage platform (19).

7. The spray device in a semiconductor cleaning device according to claim 1, characterized in that: Support columns (21) are fixedly connected at the four corners of the bottom of the shell (1), and anti-slip pads (22) are fixedly connected to the bottoms of the support columns (21).

8. The spray device in semiconductor cleaning equipment according to claim 1, characterized in that: The front side of the housing (1) is fixedly connected with a screw (23), and the outer wall of the screw (23) is fixedly connected with an information plate (24).

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