Dustproof switch convenient for heat dissipation

Abstract

The utility model relates to the technical field of network switches, and discloses a dustproof switch convenient for heat dissipation, which comprises a switch, a heat dissipation base arranged at the bottom of the switch and a dust removal part arranged at the top of the switch, the top of the switch is provided with an opening, and a circuit board in the switch can be exposed to the outside through the opening. The circuit board is provided with a chip, the chip is located in the center of the circuit board, heat generated by the switch is absorbed through the heat dissipation base attached to the bottom of the switch, dust removal is conducted on the interior of the switch through the dust removal part arranged on the top of the switch, and dust removal is conducted on the circuit board in the switch. The problem that electronic components on the circuit board are covered by dust and heat is not easy to transfer out is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of network switches, in particular to a dust-proof switch which is convenient for heat dissipation. Background Art

[0002] A switch is a device used for data transmission, data handshaking between different devices, and the coordinated operation of multiple devices. It can also form an internal network and realize the mutual transmission of information between internal networks. Common switches are Ethernet switches, telephone voice switches, fiber optic switches, etc. There is a CPU in the switch, commonly known as the chip, which acts as the brain for data exchange and distribution within the switch. Whether the normal operation of the "brain" is smooth is a barometer of whether the switch data exchange is stuck.

[0003] According to a core network switch with high-efficiency dust removal and heat dissipation disclosed on the patent website (authorization announcement number: CN219287551U), "a cooling tank is installed inside the base, a circulating pump is installed inside the base, a liquid inlet pipe of the circulating pump is connected to the cooling tank through a pipeline, one end of the cooling pipe is connected to the circulating pump, the cooling pipe runs through the first heat sink, the second heat dissipation component includes a fixing frame and a second heat dissipation fan, the fixing frame is fixed to the back of the housing, the second heat dissipation fan is embedded in the fixing frame, and the switch component is installed inside the inner tank."

[0004] In view of the above description, the applicant believes that the following problems exist:

[0005] During use of the utility model, since a cooling tank is installed inside the base, the circulating pump is installed inside the base, the liquid inlet pipe of the circulating pump is connected to the cooling tank through a pipeline, one end of the cooling pipe is connected to the circulating pump, and the cooling pipe passes through a heat sink. Such a cooling method does have an obvious heat dissipation effect, but this heat dissipation method is only to stack the heat dissipation components of the entire switch, and the installation structure is complicated, and it cannot accurately cool the heat source of the switch. In actual use, there is a risk of leakage of the cooling tank. Therefore, it is necessary to improve a dust-proof switch that is easy to dissipate heat to solve the above problems. Utility Model Content

[0006] In order to overcome the problem that a core network switch with efficient dust removal and heat dissipation has a complex installation structure and cannot accurately cool the heat source of the switch, there is also a risk of leakage in the cooling tank during actual use.

[0007] The technical solution of the utility model is: a dust-proof switch that is easy to dissipate heat, comprising a switch, a heat dissipation base placed at the bottom of the switch, and a dust removal portion placed at the top of the switch. The top of the switch is provided with an opening, and a circuit board inside the switch can be exposed to the outside through the opening. A chip is provided on the circuit board, and the chip is located in the center of the circuit board.

[0008] Preferably, the heat generated by the switch is absorbed by the heat dissipation base attached to the bottom of the switch, and the dust removal part placed on the top of the switch is used to remove dust from the inside of the switch and the circuit boards inside the switch, thereby reducing the problem of electronic components on the circuit boards being covered by dust and causing heat to be difficult to transfer out.

[0009] Preferably, the top of the switch is further provided with a through hole 1, the heat dissipation base is provided with a through hole 2 corresponding to the through hole 1, the bottom of the dust removal part is provided with a threaded hole corresponding to the through hole 1, and the bottom of the dust removal part is also provided with an air outlet corresponding to the opening. The dust removal part, the switch and the heat dissipation base are connected together through the through hole 1, the through hole 2 and the threaded hole, and the opening is aligned with the air outlet, which is conducive to effective dust removal and heat dissipation of the dust removal part.

[0010] Preferably, observation windows are provided on both sides of the dust removal part, through which the circuit boards in the switch can be seen. When the switch cannot perform normal data exchange, the observation windows are helpful for simple troubleshooting of electronic components on the circuit boards.

[0011] Preferably, a crossbeam connecting the two inner sides is provided inside the dust removal part, a motor is mounted on the crossbeam, the rotating shaft of the motor passes through the crossbeam and points to the chip on the circuit board, a fan wheel is mounted on the rotating shaft, and the rotating shaft passes through the crossbeam and points to the chip on the circuit board so that more airflow can flow to the chip, thereby cooling the chip.

[0012] Preferably, a socket is provided on the side of the dust removal part, through which a filter element can be inserted. The filter element is perpendicular to the rotating shaft. The filter element isolates dust particles in the external air to ensure the cleanliness of the inside of the switch.

[0013] Preferably, the heat dissipation base is made of copper. The heat dissipation base includes a base plate attached to the bottom of the switch and a heat dissipation support plate perpendicular to the base plate. A heat dissipation fin is provided at the position of the base plate corresponding to the chip. The heat dissipation fin is perpendicular to the base plate. The thickness of the heat dissipation fin is one millimeter. The heat dissipation support plate and the heat dissipation fin are arranged to dissipate heat to the circuit board, especially the chip on the circuit board.

[0014] Preferably, at least one side of the switch is provided with a network cable port, and the remaining sides are exhaust vents, through which the airflow generated by the dust removal unit is discharged.

[0015] Beneficial effects of the utility model:

[0016] 1. The heat generated by the switch is absorbed by the heat dissipation base attached to the bottom of the switch. The dust removal part placed on the top of the switch removes dust from the inside of the switch and the circuit boards inside the switch, reducing the problem of electronic components on the circuit boards being covered by dust, which makes it difficult to transfer heat. The dust removal part is used to prevent leakage of the cooling tank.

[0017] 2. The integrated connection and installation method reduces the difficulty of manufacturing and installing the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is an explosion diagram of the utility model;

[0019] Figure 2 This is a schematic diagram of the exhaust vent structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the connection structure of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the observation window of the utility model;

[0022] Figure 5 This is the AA section view of the utility model

[0023] Figure 6 This is a schematic diagram of the heat dissipation fin structure of the utility model.

[0024] Explanation of the accompanying reference numerals: 1. switch; 11. opening; 12. circuit board; 121. chip; 13. network cable port; 14. exhaust vent; 15. through hole one; 2. heat dissipation base; 21. bottom plate; 22. heat dissipation support plate; 23. heat dissipation fin; 24. through hole two; 3. dust removal unit; 31. threaded hole; 32. air outlet; 33. observation window; 34. crossbeam; 35. motor; 351. rotating shaft; 36. fan wheel; 37. socket; 371. filter element. DETAILED DESCRIPTION

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0026] like Figures 1-6 As shown:

[0027] See also Figure 1The present invention provides an embodiment of a dustproof switch for facilitating heat dissipation, comprising a switch 1, a heat sink 2 disposed at the bottom of the switch 1, and a dust removal unit 3 disposed at the top of the switch 1. The switch 1 has an opening 11 at the top, through which a circuit board 12 within the switch 1 is exposed to the outside world. A chip 121 is disposed on the circuit board 12, and the chip 121 is located directly in the center of the circuit board 12. The heat sink 2, attached to the bottom of the switch 1, absorbs heat generated by the switch 1, while the dust removal unit 3, disposed at the top of the switch 1, removes dust from the switch 1. The dust removal unit 3 removes dust from the switch 1 because the circuit board 12 within the switch 1 has an opening 11, through which the circuit board 12 is exposed to the outside world, allowing air outlets 32 of the dust removal unit 3 to interface. This removes dust from the circuit board 12 within the switch 1, reducing the problem of dust covering electronic components on the circuit board 12, which can hinder heat transfer. The chip 121, located directly in the center of the circuit board 12, effectively absorbs cool air from the dust removal unit 3 while maximizing heat transfer efficiency to the heat sink 2.

[0028] See also Figure 2 In this embodiment, the switch 1 has a network cable port 13 on at least one side, and exhaust vents 14 on the remaining sides. The switch 1 has a network cable port 13 on at least one side, through which data is exchanged. Exhaust vents 14 are provided on the side without the network cable port 13. Air blown from the dust removal unit 3 is discharged through the exhaust vents 14, achieving air circulation and removing dust and heat from the circuit board 12.

[0029] See also Figure 3 In this embodiment, the switch 1 further has a first through-hole 15 at the top, the heat sink base 2 has a second through-hole 24 corresponding to the first through-hole 15, and the dust collector 3 has a threaded hole 31 at the bottom corresponding to the first through-hole 15. The dust collector 3 also has an air outlet 32 ​​at the bottom corresponding to the opening 11. The switch 1 has the first through-hole 15 at the top, the heat sink base 2 has the second through-hole 24, and the dust collector 3 has the threaded hole 31 at the bottom. By sequentially inserting bolts into the second through-hole 24 and the first through-hole 15, and then connecting them with the threaded hole 31, the switch 1, heat sink base 2, and dust collector 3 are secured. This allows the air outlet 32 ​​to be precisely aligned with the opening 11, minimizing dust removal efficiency loss in the dust collector 3.

[0030] See also Figure 4 In this embodiment, observation windows 33 are provided on both sides of the dust removal unit 3, through which the circuit board 12 inside the switch 1 can be seen. The observation windows 33 on both sides can roughly observe the status of the electronic components inside the circuit board 12 of the switch 1. When the switch 1 cannot exchange data, it can first roughly check whether there are any electronic components burned out, and then conduct other troubleshooting.

[0031] See also Figure 5 In this embodiment, a crossbeam 34 connecting the two inner side surfaces of the dust removal unit 3 is provided inside. A motor 35 is mounted on the crossbeam 34. A rotating shaft 351 of the motor 35 passes through the crossbeam 34 and points to the chip 121 of the circuit board 12. A fan wheel 36 is mounted on the rotating shaft 351. The crossbeam 34 connecting the two inner side surfaces of the dust removal unit 3 is provided inside the dust removal unit 3. The crossbeam 34 supports the motor 35. The rotating shaft 351 of the motor 35 can pass through the crossbeam 34 and point to the chip 121 of the circuit board 12. The fan wheel 36 is mounted on the rotating shaft 351. The arrangement of the rotating shaft 351 pointing to the chip 121 of the circuit board 12 allows the area with greater wind force to be directed to the area with the highest temperature on the circuit board 12, thereby achieving rapid heat dissipation of the circuit board 12.

[0032] See also Figure 5 In this embodiment, the side of the dust removal unit 3 is further provided with an insertion hole 37, through which a filter element 371 can be inserted. The filter element 371 is perpendicular to the rotating shaft 351. By inserting the filter element 371 into the insertion hole 37, external dust is prevented from entering the dust removal unit 3. This further prevents dust from being blown onto the circuit board 12 by the dust removal unit 3, thereby preventing dust from getting stuck in the gaps between electronic components. The filter elements 371 here can be of different specifications and quantities according to needs.

[0033] See also Figure 6 In this embodiment, the heat dissipation base 2 is made of copper. The heat dissipation base 2 includes a base plate 21 attached to the bottom of the switch 1 and a heat dissipation support plate 22 perpendicular to the base plate 21. A heat dissipation fin 23 is provided at the position of the base plate 21 corresponding to the chip 121. The heat dissipation fin 23 is perpendicular to the base plate 21 and has a thickness of one millimeter. The heat sink 2 is made of copper because copper has excellent thermal conductivity, which improves the heat dissipation efficiency. The heat dissipation support plate 22 perpendicular to the base plate 21 can provide support for the heat sink 2. The heat dissipation support plate 22 of the heat sink 2 can also dissipate heat for the circuit board 12 in the switch 1. At the same time, a heat sink 23 is provided at the position of the base plate 21 corresponding to the chip 121. The heat sink 23 is also perpendicular to the base plate 21, but the heat sink 23 does not support the heat sink 2. The thickness of the heat sink 23 is one millimeter. Within a certain spatial range, when a single heat sink 23 has a small unit volume, it also has a large surface area. The large surface area can fully contact with the air, allowing the air to take away the heat of the heat sink 23.

[0034] When the switch 1 is turned on, the dust removal unit 3 is also turned on at the same time. The fan wheel 36 in the dust removal unit 3 rotates rapidly, forming a negative pressure on the upper side of the fan wheel 36 and a positive pressure on the lower side. At this time, airflow will enter the dust removal unit 3 from the top hole of the dust removal unit 3. The airflow will then filter out dust particles in the air through the filter element 371, and then be discharged from the air outlet 32 ​​of the dust removal unit 3 and enter the opening 11 of the switch 1. The clean airflow entering the opening 11 will cool the circuit board 12. The airflow at the chip 121 located in the middle of the circuit board 12 is the largest. The hot airflow that has flushed the circuit board 12 is then discharged from the exhaust port 14. At the same time, the heat dissipation base 2 below the switch 1 also absorbs heat from the circuit board 12 and dissipates it through the heat dissipation support plate 22. Heat dissipation fins 23 are also provided on the bottom plate 21 at the position corresponding to the chip 121. The heat dissipation fins 23 mainly absorb the heat generated by the chip 121 and then transfer the heat to the air.

[0035] Through the above steps, the heat generated by the switch 1 is absorbed by the heat dissipation base 2 attached to the bottom of the switch 1, and the dust removal unit 3 placed on the top of the switch 1 removes dust from the inside of the switch 1. The circuit board 12 in the switch 1 is also removed, thereby reducing the problem of electronic components on the circuit board 12 being covered by dust, which makes it difficult to transfer heat. This solves the problem that a core network switch with efficient dust removal and heat dissipation has a complex installation structure, cannot accurately cool the heat source of the switch, and has the risk of leakage of the cooling tank during actual use.

Claims

1. A dust-proof switch that facilitates heat dissipation, characterized by: The invention comprises a switch (1), a heat dissipation base (2) disposed at the bottom of the switch (1), and a dust removal portion (3) disposed at the top of the switch (1); an opening (11) is provided at the top of the switch (1); a circuit board (12) in the switch (1) can be exposed to the outside through the opening (11); a chip (121) is provided on the circuit board (12); and the chip (121) is located in the center of the circuit board (12).

2. The dust-proof switch for facilitating heat dissipation according to claim 1, characterized in that: At least one side of the switch (1) is provided with a network cable port (13), and the remaining sides are air outlets (14).

3. The dust-proof switch for facilitating heat dissipation according to claim 2, characterized in that: The switch (1) is further provided with a through hole 1 (15) on the top, the heat dissipation base (2) is provided with a through hole 2 (24) corresponding to the through hole 1 (15), the dust removal part (3) is further provided with a threaded hole (31) corresponding to the through hole 1 (15) on the bottom, and an air outlet (32) corresponding to the opening (11) on the bottom.

4. The dust-proof switch for facilitating heat dissipation according to claim 3, characterized in that: Observation windows (33) are provided on both sides of the dust removal portion (3), and the circuit board (12) inside the switch (1) can be seen through the observation windows (33).

5. The dust-proof switch for facilitating heat dissipation according to claim 1, characterized in that: A crossbeam (34) connecting the two inner side surfaces is provided inside the dust removal portion (3); a motor (35) is mounted on the crossbeam (34); a rotating shaft (351) of the motor (35) passes through the crossbeam (34) and points toward the chip (121) of the circuit board (12); and a fan wheel (36) is mounted on the rotating shaft (351).

6. The dust-proof switch for facilitating heat dissipation according to claim 5, characterized in that: The side of the dust removal part (3) is also provided with an insertion port (37), through which a filter element (371) can be inserted, and the filter element (371) and the rotating shaft (351) are perpendicular to each other.

7. The dust-proof switch for facilitating heat dissipation according to claim 6, characterized in that: The heat dissipation base (2) is made of copper. The heat dissipation base (2) comprises a base plate (21) attached to the bottom of the switch (1) and a heat dissipation support plate (22) perpendicular to the base plate (21). A heat dissipation fin (23) is further provided at a position of the base plate (21) corresponding to the location of the chip (121). The heat dissipation fin (23) is perpendicular to the base plate (21) and has a thickness of one millimeter.

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