Distributed heat exchange heat dissipation mechanism

Abstract

The utility model discloses a distributed heat exchange heat dissipation mechanism which comprises a top cover, a tank body is connected to the lower portion of the top cover, and a contact cover is arranged at the bottom of the tank body. A liquid inlet cavity and a liquid outlet cavity are respectively formed in the tank body; the liquid inlet cavity is formed in the upper end of the interior of the tank body; the liquid outlet cavity is arranged on the periphery of the liquid inlet cavity; a heat exchange cavity is formed in the contact cover; a plurality of liquid separation channels are arranged at the bottom of the liquid inlet cavity; a plurality of jet flow holes are formed in the bottom of the inner end of the tank body and are communicated with the liquid separation channel; a plurality of liquid outlet holes are formed in the bottom of the inner end of the tank body and are communicated with the liquid outlet cavity; the surface of the bottom of the heat exchange cavity is covered with a three-period minimal curved surface structure layer. According to the utility model, the heat exchange efficiency of the chip can be improved, the working stability of the chip is ensured, and the service life of the chip is prolonged.

Description

Technical Field

[0001] The utility model relates to a distributed heat exchange and heat dissipation mechanism, belonging to the technical field of heat dissipation mechanism equipment. Background Art

[0002] Chips generate a certain amount of heat during operation. This is primarily because the electronic components within the chip consume power during high-speed computing, some of which is released as heat. If this heat is not dissipated promptly, the chip's temperature will continue to rise, potentially causing performance degradation or even damage. Therefore, timely and effective chip heat dissipation is essential to maintain a stable temperature during operation, ensuring efficient and reliable performance and extending the chip's lifespan. To this end, the industry has developed a variety of heat dissipation devices. For example, Chinese utility model patent No. CN214545265U discloses a water-cooled heat sink for power devices. Specifically, the power devices are mounted on the water-cooled heat sink, which has a cubic water channel structure. The water-cooled heat sink includes a heat exchange chamber, a water inlet sealing cover, and a water outlet sealing cover. The water inlet sealing cover and the water outlet sealing cover are disposed at the water inlet and outlet of the heat exchange chamber, respectively. The heat exchange chamber includes a chamber outer frame and heat exchange fins. The chamber outer frame is disposed around the heat exchange chamber, and heat exchange fins are disposed on the inner wall of the chamber outer frame near the power devices, extending into the water channel. This solution enhances heat dissipation by increasing the heat exchange area. However, as the heat load and power density of the power chip increase, a significant cross-flow effect is likely to occur at the water inlet and outlet, resulting in excessive system flow resistance, poor temperature uniformity, and insufficient heat exchange capacity. Utility Model Content

[0003] The purpose of the present invention is to provide a distributed heat exchange and heat dissipation mechanism, which can improve the heat exchange efficiency of the chip, ensure the working stability of the chip, and extend the service life of the chip.

[0004] The technical solution of the present utility model is as follows: a distributed heat exchange and heat dissipation mechanism, including a top cover, a tank body connected to the bottom of the top cover, and a contact cover provided at the bottom of the tank body; a liquid inlet cavity and a liquid outlet cavity are respectively provided inside the tank body; the liquid inlet cavity is provided at the upper end of the interior of the tank body; the liquid outlet cavity is provided at the periphery of the liquid inlet cavity; a heat exchange cavity is provided inside the contact cover; a plurality of liquid separation channels are provided at the bottom of the liquid inlet cavity; a plurality of jet holes are provided at the bottom of the inner end of the tank body, and the jet holes are connected with the liquid separation channels; a plurality of liquid outlet holes are provided at the bottom of the inner end of the tank body, and the liquid outlet holes are connected with the liquid outlet cavity; the bottom surface of the heat exchange cavity is covered with a three-periodic minimal surface structure layer.

[0005] In the above-mentioned distributed heat exchange and heat dissipation mechanism, the three-periodic minimal surface structure layer is formed by connecting multiple three-periodic minimal surface unit cell structure arrays.

[0006] In the aforementioned distributed heat exchange and heat dissipation mechanism, the three-periodic minimal surface unit cell structure is any one of a Gyroid surface, a Primitive surface, a Diamond surface, a Lidinoid surface, a Split P surface, and a Neovius surface structure.

[0007] The aforementioned distributed heat exchange and heat dissipation mechanism is provided with a plurality of first connecting ears on the side of the top cover, and a first through hole is provided in the first connecting ear; the side of the tank body is provided with a plurality of connecting columns, and a second through hole is provided in the connecting column, and the second through hole corresponds to the first through hole; the side of the contact cover is provided with a plurality of second connecting ears, and a threaded hole is provided in the second connecting ear, and the threaded hole corresponds to the second through hole.

[0008] In the aforementioned distributed heat exchange and heat dissipation mechanism, the bottom end of the liquid separation channel is a conical structure, and the small diameter end of the conical structure is connected to the jet hole.

[0009] In the aforementioned distributed heat exchange and heat dissipation mechanism, the jet hole is located at the center of the bottom of the tank body; the liquid outlet hole is arranged in the bottom of the tank body and is located outside the jet hole.

[0010] The above-mentioned distributed heat exchange and heat dissipation mechanism has a liquid inlet channel in the middle of the upper end of the tank body, which is connected to the liquid inlet cavity; liquid outlet channels are respectively provided on both sides of the upper end of the tank body, which are connected to the liquid outlet cavity.

[0011] In the aforementioned distributed heat exchange and heat dissipation mechanism, the outer side of the liquid inlet channel is connected to a liquid inlet connector; the outer side of the liquid outlet channel is connected to a liquid outlet connector.

[0012] In the aforementioned distributed heat exchange and heat dissipation mechanism, connecting plates are symmetrically provided on both sides of the contact cover, and connecting grooves are symmetrically provided on the upper and lower ends of the connecting plates.

[0013] Compared with the prior art, the present invention, when in use, fits the lower end surface of the contact cover to the surface of the component that needs heat dissipation, and then delivers the refrigerant to the liquid inlet chamber. The refrigerant then flows through the liquid separation channel to the jet holes, and is evenly sprayed into the heat exchange chamber through the jet hole array, so that the refrigerant exchanges heat with the component on the bottom plate of the heat exchange chamber. After the heat exchange is completed, the vapor-liquid mixed refrigerant rises, enters the liquid outlet chamber through the liquid outlet, and finally flows out of the tank body. In summary of the heat exchange process, the three-periodic minimal surface structure layer in the heat exchange chamber is a porous structure, which can form a horizontal liquid replenishment channel inside. The gradient pore structure better matches the trend of increasing bubble diameter during boiling. The small horizontal liquid replenishment channel can increase the liquid phase reflux speed through capillary action, providing a channel for steam escape. At the same time, the holes on the porous surface of the three-periodic minimal surface structure layer constrain bubble growth and hinder bubble merging, making the bubble detachment diameter smaller and the detachment frequency faster. The faster the bubble detachment frequency, the better the transient heat conduction effect, thereby significantly enhancing the boiling heat exchange performance. In addition, the porous surface structure in the three-periodic minimal surface structure layer can increase the density of active nucleation sites and the heat exchange area. The wide range of voids provides a channel for gas-liquid separation, reducing backflow resistance. Moreover, the increase in the number of nucleation sites increases the number of bubbles that detach from the heated wall surface per unit time, and significant transient heat conduction occurs in more locations, thereby increasing the overall heat dissipation performance of the heated wall surface. Moreover, under high supercooling, the range of the effective nucleation point cavity size increases, and large-sized cavities can be activated under low heat flux density. At the same time, the size of the bubbles decreases, and the probability of bubble coalescence is significantly reduced. Therefore, the three-periodic minimal surface structure layer of the present invention can significantly improve the heat exchange efficiency of power devices, ensure the working stability of power devices, and extend the service life of power devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural diagram of the utility model;

[0015] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0016] Figure 3 It is a structural diagram of the contact cover.

[0017] Figure 4 Schematic diagram of the distribution of jet holes and liquid outlet holes;

[0018] Figure 5 Schematic diagram of heat transfer principle of three-periodic minimal surface structure layer;

[0019] Figure 6 The three-periodic minimal surface unit cell structure is a schematic diagram of the primitive surface structure;

[0020] Figure 7The three-periodic minimal surface unit cell structure is a schematic diagram of the Gyroid surface structure;

[0021] Figure 8 The unit cell structure of the three-periodic minimal surface is the Diamond surface structure.

[0022] The marks in the accompanying drawings are: 1-top cover, 2-liquid inlet chamber, 3-liquid outlet chamber, 4-heat exchange chamber, 5-jet hole, 6-liquid outlet hole, 7-liquid separation channel, 8-three-periodic minimal surface structure layer, 9-liquid inlet channel, 10-liquid outlet channel, 11-three-periodic minimal surface unit cell structure, 12-tank body, 13-contact cover, 14-first connecting ear, 15-connecting column, 16-second connecting ear, 17-first through hole, 18-second through hole, 19-threaded hole, 20-liquid inlet connector, 21-liquid outlet connector, 22-connecting plate, 23-connecting groove. DETAILED DESCRIPTION

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments, but they are not intended to limit the present invention.

[0024] Embodiment: A distributed heat exchange and heat dissipation mechanism, comprising: Figure 1-4 As shown, it includes a top cover 1, a tank body 12 is connected to the bottom of the top cover 1, and the tank body 12 is connected to a contact cover 13; the tank body 12 is provided with a liquid inlet chamber 2 and a liquid outlet chamber 3 respectively; the liquid inlet chamber 2 is provided at the upper end of the tank body 12; the liquid outlet chamber 3 is provided at the periphery of the liquid inlet chamber 2; a heat exchange chamber 4 is provided in the contact cover 13; a plurality of liquid separation channels 7 are provided at the bottom of the liquid inlet chamber 2, and the bottom end of the liquid separation channel 7 is a conical structure, and the small diameter end of the conical structure is connected to the jet hole 5 and is interconnected; a plurality of liquid outlet holes 6 are provided at the bottom of the inner end of the tank body 12, and the liquid outlet holes 6 are connected to the liquid outlet chamber 3; the bottom surface of the heat exchange chamber 4 is covered with a three-periodic minimal surface structure layer 8. As shown Figure 4 As shown, the jet hole 5 is located at the center of the bottom of the tank body 12; the liquid outlet 6 is provided in the bottom of the tank body 12 and is located outside the jet hole 5. Figure 2 As shown, the jet hole 5 , the liquid separation channel 7 , the liquid outlet hole 6 and the liquid outlet cavity 3 are all perpendicular to the bottom plate of the tank body 12 .

[0025] In this embodiment, the three-periodic minimal surface structure layer 8 is a porous structure, and a horizontal liquid replenishing channel can be formed inside it, such as Figure 4As shown, the gradient pore size structure better matches the increasing trend of bubble diameter during boiling. The small horizontal liquid replenishment channel can increase the liquid phase reflux velocity through capillary action, providing a channel for vapor escape. Simultaneously, the pores on the porous surface of the three-periodic minimal surface structure layer 8 constrain bubble growth and hinder bubble merging, resulting in smaller bubble detachment diameters and faster detachment frequency. The faster the bubble detachment frequency, the better the transient heat transfer effect, which can significantly enhance boiling heat transfer performance. Furthermore, the porous surface structure of the three-periodic minimal surface structure layer 8 can increase the density of active nucleation sites and heat transfer area. The wide range of voids provides channels for gas-liquid separation, reducing backflow resistance. The increase in the number of nucleation sites increases the number of bubbles detaching from the heated wall per unit time, resulting in significant transient heat transfer at more locations and improving the overall heat dissipation performance of the heated wall. Furthermore, at high supercooling, the range of effective nucleation site sizes increases, allowing large pores to be activated at low heat flux densities. Simultaneously, the bubble size decreases, significantly reducing the probability of bubble coalescence.

[0026] Preferably, the three-periodic minimal surface structure layer 8 is formed by connecting a plurality of three-periodic minimal surface unit cell structures 11 in an array. Figure 5-7 As shown, the three-periodic minimal surface unit cell structure 11 is any one of a Gyroid surface, a Primitive surface, a Diamond surface, a Lidinoid surface, a Split P surface, and a Neovius surface structure. In this embodiment, the three-periodic minimal surface unit cell structure 11 is as follows Figure 6 The material of the three-periodic minimal surface structure layer 8 is aluminum alloy, stainless steel, titanium alloy, die steel or nickel-based high-temperature alloy. In this embodiment, the three-periodic minimal surface structure layer 8 is made of nickel-based high-temperature alloy.

[0027] Preferably, if Figure 1 and 2 As shown, the top cover 1 is provided with a plurality of first connecting ears 14 on the side, each of which has a first through-hole 17 therein. The can body 12 is provided with a plurality of connecting posts 15 on the side, each of which has a second through-hole 18 therein, corresponding to the first through-hole 17. The contact cover 13 is provided with a plurality of second connecting ears 16 on the side, each of which has a threaded hole 19 therein, corresponding to the second through-hole 18. Screws are inserted from the first through-hole 17 through the second through-hole 18, and the inner end of the screw is screwed into the threaded hole 19, thereby connecting and securing the top cover 1, the can body 12, and the contact cover 13 to form a single unit.

[0028] Preferably, if Figure 1 and 2As shown, a liquid inlet channel 9 is provided in the middle of the upper end of the tank body 12, communicating with the liquid inlet chamber 2. Liquid outlet channels 10 are provided on either side of the upper end of the tank body 12, communicating with the liquid outlet chamber 3. A liquid inlet connector 20 is connected to the outer side of the liquid inlet channel 9, while a liquid outlet connector 21 is connected to the outer side of the liquid outlet channel 10. By connecting the liquid inlet connector 20 and the liquid outlet connector 21 to external piping, refrigerant can be added and discharged more easily through the liquid inlet channel 9 and the liquid outlet channel 10.

[0029] Preferably, if Figure 3 As shown, the contact cover 13 is symmetrically provided with connecting plates 22 on both sides, and connecting grooves 23 are symmetrically provided at the upper and lower ends of the connecting plates 22. After the contact cover 13 is placed on the upper surface of the chip, screws are screwed through the connecting grooves 23 into the connecting holes on the chip mainboard to ensure a tight fit between the contact cover 13 and the chip, ensuring effective heat dissipation.

[0030] Working principle:

[0031] During use, the bottom surface of the contact cover 13 is fitted to the surface of the chip, and then the refrigerant (such as tetrafluoroethane or trifluoromethane, etc.) is transported to the liquid inlet channel 9 through the liquid inlet connector 20 and enters the liquid inlet chamber 2. The refrigerant then flows to the jet holes 5 through the liquid separation channel 7 and is evenly sprayed into the heat exchange chamber 4 through the array of jet holes 5, so that the refrigerant exchanges heat with the chip on the bottom plate of the heat exchange chamber 44. After the heat exchange is completed, the gas-liquid mixed refrigerant rises, enters the liquid outlet chamber 3 through the liquid outlet, and finally flows out of the tank body 12. In summary of the heat exchange process, by providing a three-period minimal surface structure layer 8, the heat exchange efficiency of the power device can be significantly improved, the working stability of the power device can be ensured, and the service life of the power device can be extended.

Claims

1. A distributed heat exchange and heat dissipation mechanism, characterized by: The invention comprises a top cover (1), a tank body (12) is connected to the bottom of the top cover (1), and a contact cover (13) is provided at the bottom of the tank body (12); a liquid inlet cavity (2) and a liquid outlet cavity (3) are respectively provided inside the tank body (12); the liquid inlet cavity (2) is provided at the upper end of the interior of the tank body (12); the liquid outlet cavity (3) is provided on the periphery of the liquid inlet cavity (2); a heat exchange cavity (4) is provided inside the contact cover (13); a plurality of liquid separation channels (7) are provided at the bottom of the liquid inlet cavity (2); a plurality of jet holes (5) are provided at the bottom of the inner end of the tank body (12), and the jet holes (5) are connected to the liquid separation channels (7); a plurality of liquid outlet holes (6) are provided at the bottom of the inner end of the tank body (12), and the liquid outlet holes (6) are connected to the liquid outlet cavity (3); the bottom surface of the heat exchange cavity (4) is covered with a three-periodic minimal surface structure layer (8).

2. The distributed heat exchange and heat dissipation mechanism according to claim 1, characterized in that: The three-periodic minimal surface structure layer (8) is formed by connecting a plurality of three-periodic minimal surface unit cell structures (11) in an array.

3. The distributed heat exchange and heat dissipation mechanism according to claim 2, characterized in that: The three-periodic minimal surface unit cell structure (11) is any one of a Gyroid surface, a Primitive surface, a Diamond surface, a Lidinoid surface, a Split P surface, and a Neovius surface structure.

4. The distributed heat exchange and heat dissipation mechanism according to claim 1, characterized in that: The top cover (1) is provided with a plurality of first connecting ears (14) on the side, and a first through hole (17) is provided in the first connecting ears (14); the tank body (12) is provided with a plurality of connecting columns (15) on the side, and a second through hole (18) is provided in the connecting columns (15), and the second through hole (18) corresponds to the first through hole (17); the contact cover (13) is provided with a plurality of second connecting ears (16) on the side, and a threaded hole (19) is provided in the second connecting ears (16), and the threaded hole (19) corresponds to the second through hole (18).

5. The distributed heat exchange and heat dissipation mechanism according to claim 1, characterized in that: The bottom end of the liquid separation channel (7) is a conical structure, and the small diameter end of the conical structure is connected to the jet hole (5).

6. The distributed heat exchange and heat dissipation mechanism according to claim 1, characterized in that: The jet hole (5) is located at the center of the bottom of the tank body (12); the liquid outlet hole (6) is arranged in the bottom of the tank body (12) and is located outside the jet hole (5).

7. The distributed heat exchange and heat dissipation mechanism according to claim 1, characterized in that: A liquid inlet channel (9) is provided in the middle of the upper end of the tank body (12), and the liquid inlet channel (9) is connected to the liquid inlet cavity (2); liquid outlet channels (10) are provided on both sides of the upper end of the tank body (12), and the liquid outlet channels (10) are connected to the liquid outlet cavity (3).

8. The distributed heat exchange and heat dissipation mechanism according to claim 7, characterized in that: The outer side of the liquid inlet channel (9) is connected to a liquid inlet connector (20); the outer side of the liquid outlet channel (10) is connected to a liquid outlet connector (21).

9. The distributed heat exchange and heat dissipation mechanism according to claim 7, characterized in that: Connecting plates (22) are symmetrically provided on both sides of the contact cover (13), and connecting grooves (23) are symmetrically provided at the upper and lower ends of the connecting plates (22).

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