Heat dissipation mechanism and dental light curing machine

Abstract

According to the heat dissipation mechanism and the dental light curing machine, the heat conduction plate is tightly attached to the light curing lamp, so that heat generated by the light curing lamp can be conducted to the part, used for forming the main body part, on the machine shell through the heat conduction plate and the heat pipe on at least one side of the heat conduction plate to be released; the heat conduction speed can be greatly increased due to the existence of the heat pipe, so that the area, close to the light curing lamp, on the machine shell is rapidly cooled, a patient is prevented from being scalded, and meanwhile the light emitting efficiency and the service life of the light curing lamp are guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of oral medical devices, and in particular to a heat dissipation mechanism and a dental light curing machine. Background Art

[0002] The light emitted by the dental curing light machine is irradiated on the light-curing resin, which can cure the light-curing resin and thus achieve treatment such as tooth repair.

[0003] For dental curing lights with small size, compact structure and high light intensity, the curing light generates a lot of heat during operation, which will cause the local temperature near the curing light to be higher. On the one hand, it affects the luminous efficiency and life of the curing light. On the other hand, it may burn the patient when working in the patient's mouth. Utility Model Content

[0004] The purpose of the present application is to provide a heat dissipation mechanism and a dental curing light, which can achieve rapid cooling of the area on the housing near the curing light to avoid scalding the patient while ensuring the luminous efficiency and life of the curing light.

[0005] The embodiments of the present application can be implemented as follows:

[0006] In a first aspect, the present invention provides a heat dissipation mechanism for a dental curing light, comprising a housing and a heat-conducting assembly. The housing has an inner cavity comprising a head and a main body that are connected, the head being used to mount a curing light of the dental curing light; the heat-conducting assembly comprising a heat-conducting plate and a heat pipe on at least one side of the heat-conducting plate, the heat-conducting plate partially extending into the head so as to be in close contact with the curing light, and the other end of the heat-conducting plate extending into the main body to conduct heat generated by the curing light to a portion of the housing forming the main body.

[0007] In an optional embodiment, the heat conducting plate is a copper plate, and the heat pipes are provided on opposite sides of the heat conducting plate.

[0008] In an optional embodiment, the main body is filled with a heat storage material, and the heat conducting plate and the heat pipe are both wrapped by the heat storage material.

[0009] In an optional embodiment, the heat storage material includes a phase change material.

[0010] In an optional embodiment, the heat conducting plate divides the head into an installation cavity and an insulation cavity, the installation cavity is used for installing a light curing lamp, the insulation cavity is connected to the main body, and the side of the heat conducting plate facing the installation cavity is used to be in close contact with the light curing lamp.

[0011] In an optional embodiment, the head has a mounting hole located between the mounting cavity and the insulation cavity, and the heat conducting plate has a mounting protrusion, which is engaged with the mounting hole, and the side of the mounting protrusion facing the mounting cavity is used to fit tightly against the light curing lamp.

[0012] In an optional embodiment, a thermal insulation pad is in close contact with a side of the heat conducting plate facing away from the installation cavity, and the thermal insulation pad is spaced apart from an area on the inner wall of the thermal insulation cavity away from the installation cavity.

[0013] In an optional embodiment, the heat pipe is provided between the thermal insulation pad and the heat conducting plate.

[0014] In a second aspect, the present invention provides a dental light curing machine, comprising a light curing lamp and the heat dissipation mechanism described in any one of the aforementioned embodiments, wherein the light curing lamp is located in the head, and the heat conducting plate is in close contact with the light curing lamp.

[0015] In an optional embodiment, the dental light curing machine further includes a lens, which is embedded in the head and corresponds to the light output side of the light curing lamp.

[0016] Compared with the prior art, the beneficial effects of the embodiments of the present application include, for example:

[0017] By closely attaching the heat conducting plate to the curing light, the heat generated by the curing light can be conducted through the heat conducting plate and the heat pipe on at least one side of the heat conducting plate to the portion of the housing that forms the main body for release. The presence of the heat pipe can greatly increase the speed of heat conduction, thereby achieving rapid cooling of the area of ​​the housing near the curing light, avoiding burns to the patient, while ensuring the luminous efficiency and lifespan of the curing light. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] Figure 1 This is a schematic diagram of the internal structure of a dental light curing machine according to an embodiment of the present application;

[0020] Figure 2 for Figure 1 Schematic diagram of the local structure.

[0021] Icons: 100-housing; 110-head; 111-insulation cavity; 112-mounting cavity; 113-mounting hole; 120-main body; 200-heat conduction component; 210-heat conduction plate; 211-mounting protrusion; 220-heat pipe; 300-curing lamp; 400-lens; 500-insulation pad; 600-heat storage material. DETAILED DESCRIPTION

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0024] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.

[0025] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended only to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0027] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0028] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0029] refer to Figure 1 and Figure 2 The embodiment of the present application discloses a dental light curing machine, which includes a heat dissipation mechanism and a light curing lamp 300.

[0030] The heat dissipation mechanism includes a housing 100 and a heat-conducting assembly 200. The inner cavity of the housing 100 includes a head 110 and a main body 120 that are connected. The head 110 is used to mount a curing light 300 of a dental curing light machine. The heat-conducting assembly 200 includes a heat-conducting plate 210 and a heat pipe 220 on at least one side of the heat-conducting plate 210. The heat-conducting plate 210 partially extends into the head 110 to be in close contact with the curing light 300. The other end of the heat-conducting plate 210 extends into the main body 120 to conduct heat generated by the curing light 300 to the portion of the housing 100 that forms the main body 120.

[0031] In this way, by closely contacting the heat conducting plate 210 with the curing light 300, the heat generated by the curing light 300 can be conducted through the heat conducting plate 210 and the heat pipe 220 on at least one side of the heat conducting plate 210 to the portion of the housing 100 forming the main body 120 for release. The presence of the heat pipe 220 can greatly increase the speed of heat conduction, thereby achieving rapid cooling of the area near the curing light 300 on the housing 100, avoiding burns to the patient, while ensuring the luminous efficiency and lifespan of the curing light 300.

[0032] A heat pipe 220 is a highly efficient heat transfer element, typically consisting of a shell, a wick, and end caps. Its interior is pumped to a negative pressure and filled with a suitable liquid. The wick is made of a capillary, porous material. When heat is applied to one end of the heat pipe 220, the liquid rapidly evaporates. Driven by thermal diffusion, the vapor flows to the other end, where it condenses and releases heat. The liquid then flows back to the evaporation end via capillary action along the porous material, repeating this cycle until the temperatures at both ends of the heat pipe 220 are equal. Therefore, the heat pipe 220 has an extremely high heat conduction rate, and using it as a heat conductor can accelerate heat dissipation from the lamp holder.

[0033] Specifically, the heat conducting plate 210 is a copper plate, but it can also be made of other materials with good thermal conductivity. Heat pipes 220 are provided on opposite sides of the heat conducting plate 210. This allows heat from the curing light 300 to be quickly transferred through the heat conducting plate 210 and the heat pipes 220 to the main body 120. Of course, in some embodiments, the heat pipe 220 can be provided on only one side of the heat conducting plate 210.

[0034] The main body 120 is filled with a heat storage material 600, and both the heat conductive plate 210 and the heat pipe 220 are encased in the heat storage material 600. The heat storage material 600 can be a phase-change heat storage material 600, such as phase-change paraffin wax or phase-change microcapsules, or a mixture of a phase-change material such as phase-change paraffin wax and a heat conductive material. Heat generated by the curing light 300 is transferred through the heat conductive plate 210 and heat pipe 220 to the heat storage material 600 within the main body 120 for temporary storage. Once saturated, the heat is released outward through the housing 100, thereby reducing the heating rate of the housing 100.

[0035] Specifically, the heat conducting plate 210 divides the head portion 110 into a mounting cavity 112 and a heat-insulating cavity 111. The mounting cavity 112 is used to mount the curing light 300, while the heat-insulating cavity 111 communicates with the main body 120. The side of the heat conducting plate 210 facing the mounting cavity 112 is designed to be in close contact with the curing light 300. The formation of the heat-insulating cavity 111 reduces the contact area between the heat conducting plate 210 and the portion of the housing 100 forming the head portion 110, extending the heat conduction path and slowing the rate of heat transfer from the curing light 300 to the housing 100. This further prevents the portion of the metal housing forming the head portion 110 from overheating.

[0036] In more detail, the head 110 has a mounting hole 113 located between the insulation cavity 111 and the mounting cavity 112. The inner diameter of the mounting hole 113 is smaller than the inner diameter of the insulation cavity 111 and the inner diameter of the mounting cavity 112. The heat conducting plate 210 has a mounting protrusion 211, which is engaged with the mounting hole 113 to achieve the installation of the heat conducting plate 210 and the housing 100. The side of the mounting protrusion 211 facing the mounting cavity 112 is used to be in close contact with the light curing lamp 300, so that the heat generated by the light curing lamp 300 can be directly transferred to the heat conducting plate 210.

[0037] In addition, a thermal insulation pad 500 is tightly attached to the side of the heat conducting plate 210 facing away from the installation cavity 112. The thermal insulation pad 500 is spaced apart from the area on the inner wall of the heat insulating cavity 111 away from the installation cavity 112. The portion of the heat pipe 220 located on the side of the heat conducting plate 210 facing away from the light curing lamp 300 is located between the thermal insulation pad 500 and the heat conducting plate 210. In this way, the thermal insulation pad 500 can further prevent heat from being transferred to the part of the housing 100 used to form the head 110, so as to better prevent the local temperature of the housing 100 from being too high.

[0038] It should be noted that in the present application, there are no specific restrictions on the connection between the heat conduction plate 210 and the heat pipe 220, the light curing lamp 300 and the housing 100, and the connection between the heat pipe 220 and the thermal insulation pad 500. As long as the light curing lamp 300, the heat conduction plate 210, the heat pipe 220 and the thermal insulation pad 500 can be fixed in the housing 100, for example, it can be bonded.

[0039] In addition, the dental curing light further includes a lens 400 , which is embedded in the head 110 and corresponds to the light-emitting side of the curing light 300 . The lens 400 focuses the light emitted by the curing light 300 , thereby improving the use effect.

[0040] In summary, the embodiments of the present application disclose a heat dissipation mechanism and a dental curing light. By closely adhering to the heat conducting plate 210 and the curing light 300, heat generated by the curing light 300 can be conducted through the heat conducting plate 210 and the heat pipe 220 on at least one side of the heat conducting plate 210 to the portion of the housing 100 that forms the main body 120 for release. The presence of the heat pipe 220 can greatly increase the speed of heat conduction, thereby achieving rapid cooling of the area near the curing light 300 on the housing 100, avoiding burns to the patient, while ensuring the luminous efficiency and lifespan of the curing light 300.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation mechanism for a dental light curing machine, characterized in that: A housing (100) and a heat-conducting assembly (200), wherein the inner cavity of the housing (100) comprises a head (110) and a main body (120) which are connected to each other, wherein the head (110) is used for mounting a curing light (300) of the dental curing light machine; and the heat-conducting assembly (200) comprises a heat-conducting plate (210) and a heat pipe (220) on at least one side of the heat-conducting plate (210), wherein a portion of the heat-conducting plate (210) extends into the head (110) so as to be in close contact with the curing light (300), and the other end of the heat-conducting plate (210) extends into the main body (120) so as to conduct heat generated by the curing light (300) to a portion of the housing (100) for forming the main body (120).

2. The heat dissipation mechanism according to claim 1, characterized in that: The heat conducting plate (210) is a copper plate, and the heat pipes (220) are provided on opposite sides of the heat conducting plate (210).

3. The heat dissipation mechanism according to claim 1, wherein: The main body (120) is filled with a heat storage material (600), and the heat conducting plate (210) and the heat pipe (220) are both wrapped by the heat storage material (600).

4. The heat dissipation mechanism according to claim 3, characterized in that: The heat storage material (600) includes a phase change material.

5. The heat dissipation mechanism according to claim 1, characterized in that: The heat conducting plate (210) divides the head portion (110) into a mounting cavity (112) and a heat insulating cavity (111); the mounting cavity (112) is used for mounting a light curing lamp (300); the heat insulating cavity (111) is communicated with the main body (120); and the side of the heat conducting plate (210) facing the mounting cavity (112) is used for being in close contact with the light curing lamp (300).

6. The heat dissipation mechanism according to claim 5, characterized in that: The head (110) has a mounting hole (113) located between the mounting cavity (112) and the heat insulation cavity (111); the heat conducting plate (210) has a mounting protrusion (211); the mounting protrusion (211) is engaged with the mounting hole (113); and the side of the mounting protrusion (211) facing the mounting cavity (112) is used to be in close contact with the light curing lamp (300).

7. The heat dissipation mechanism according to claim 5, characterized in that: A heat insulating pad (500) is in close contact with the side of the heat conducting plate (210) facing away from the installation cavity (112), and the heat insulating pad (500) is spaced apart from an area on the inner wall of the heat insulating cavity (111) away from the installation cavity (112).

8. The heat dissipation mechanism according to claim 7, characterized in that: The heat pipe (220) is provided between the thermal insulation pad (500) and the heat conducting plate (210).

9. A dental light curing machine, characterized in that: The invention comprises a light curing lamp (300) and the heat dissipation mechanism according to any one of claims 1 to 8, wherein the light curing lamp (300) is located on the head (110), and the heat conducting plate (210) is in close contact with the light curing lamp (300).

10. The dental light curing machine according to claim 9, characterized in that: The dental light curing machine further comprises a lens (400), wherein the lens (400) is embedded in the head (110) and corresponds to the light emitting side of the light curing lamp (300).

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