Cutting mechanism of high-speed wire feeding machine for processing semiconductor parts

Abstract

The utility model provides a cutting mechanism of a fast wire feeding machine for semiconductor part processing, which relates to the technical field of semiconductor part processing and comprises a shell, a guide mechanism is arranged on the upper surface of the shell, an adjusting mechanism is arranged on the upper surface of the shell, and a wire feeding mechanism is arranged on the surfaces of the guide mechanism and the shell. The position of the workpiece can be flexibly adjusted through the guide mechanism, especially in the curved surface machining process, the wire moving mechanism and the adjusting mechanism are matched, the machining angle can be freely adjusted, the angle and position change of the workpiece is more flexible, and therefore the machining requirements of various complex shapes and angles can be met; according to the curved surface cutting device, curved surface part cutting can be more efficiently and accurately completed in actual operation, the adaptability and stability of overall machining are improved, high-precision support is provided for machining of complex structures, and the machining applicability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor component processing, in particular to a high-speed wire cutting machine cutting mechanism for semiconductor component processing. Background Art

[0002] Announcement No. CN221516395U discloses a high-speed wire cutting machine, including a processing table, a wire-cutting motor is installed on the top of the processing table, a wire-cutting wheel seat is provided above the wire-cutting motor, an electrode wire is connected between the output shaft of the wire-cutting motor and the wire-cutting wheel seat, and an adjustment component is provided on the top of the processing table. The high-speed wire cutting machine, by setting up an electric slide, a U-shaped fixing plate and a limiting screw group, can facilitate the staff to quickly fix the material to be processed, and can drive the material to be processed to move horizontally back and forth. The relative setting of the two U-shaped fixing plates is used to make the part of the material to be cut suspended in the air, providing assistance for subsequent cutting, and facilitating the movement of the material to be processed. At the same time, the setting of the drive motor provides power for the lifting transmission, facilitates the height adjustment of the wire winding wheel seat, reduces the labor workload of the staff, and thus facilitates the use of the staff. Traditional methods have limitations in processing complex curved surfaces, mainly because of their insufficient adjustment ability, resulting in insufficient flexibility in adjusting the position and angle of the workpiece. In traditional cutting equipment, flexible multi-angle adjustment is usually not possible, and the screw and guide rail structure limits the moving range of the workpiece. This makes it difficult to accurately adjust to the required angle when processing curved surfaces or parts with complex angles, and it is difficult to adapt to subtle adjustments during the curved surface cutting process. It is easy to result in a small cutting range and is difficult to apply to different cutting directions, which affects the processing quality and increases the scrap rate, and needs to be improved. Utility Model Content

[0003] The purpose of this utility model is to solve the technical problems raised in the above background technology.

[0004] The utility model adopts the following technical solution: a high-speed wire cutting machine cutting mechanism for semiconductor component processing, comprising a housing, a guide mechanism provided on the upper surface of the housing, an adjustment mechanism provided on the upper surface of the housing, and a wire cutting mechanism provided on the surfaces of the guide mechanism and the housing;

[0005] The guide mechanism includes a mounting frame, a threaded rod is rotatably connected to the interior of the mounting frame, a motor is fixedly installed inside the mounting frame, a lifting frame is threadedly connected to the surface of the threaded rod, a moving block is slidably connected to the interior of the lifting frame, and a driving member A is fixedly installed on the surface of the lifting frame;

[0006] The wire feeding mechanism includes an electric slide rail A, which is fixedly connected to the housing. A motor is slidably connected to the surface of the electric slide rail A. A reel is fixedly mounted on the output end of the motor, and an electrode wire is wound on the surface of the reel.

[0007] The adjustment mechanism includes a driving member B, which is arranged on the surface of the shell, and the upper surface of the shell is slidably connected to an electric slide rail B, and the surface of the electric slide rail B is slidably connected to a slider, a turntable is fixedly installed on the upper surface of the slider, and the upper surface of the turntable is rotatably connected to a mounting block, a fastener is provided on the side of the mounting block, a placement plate is fixedly installed inside the mounting block, a pressure plate is slidably connected inside the mounting block, a screw rod is threadedly connected inside the mounting block, and a rotating head is fixedly installed on the top of the screw rod.

[0008] Preferably, the output end of the motor is fixedly connected to the threaded rod, and the lifting frame is slidably connected to the mounting frame. Here, the motor can stably drive the threaded rod, and the sliding movement of the lifting frame and the mounting frame can limit the lifting frame during lifting and lowering, thereby preventing misalignment during lifting and lowering.

[0009] Preferably, the output end of the driver A is fixedly connected to the moving block, and one end of the electrode wire is fixedly connected to the moving block. Here, the driver A can freely change the moving block inside the lifting frame, so that the electrode wire can be adjusted to different angles for use.

[0010] Preferably, the fastener is connected to the turntable, the output end of the driver B is fixedly connected to the electric slide rail B, and the bottom end of the screw is rotatably connected to the pressure plate. Here, the fastener can be used to limit and fix the mounting block at a suitable position and angle on the turntable, while the driver B can control the workpiece to be adjusted in the appropriate position.

[0011] Preferably, the surfaces of the pressure plate and the placement plate are provided with a limiting mechanism, the limiting mechanism comprising an anti-slip pad fixedly connected to the placement plate, a sliding rod slidably connected to the interior of the pressure plate, a limiting block fixedly mounted at the bottom end of the sliding rod, a stopper fixedly mounted at the top end of the sliding rod, and a tension spring fixedly mounted on the lower surface of the stopper. The sliding rod and the limiting block can thereby clamp workpieces of different shapes, with the clamping position being aligned with the concave and convex positions of the workpiece surface, thereby improving clamping stability.

[0012] Preferably, one end of the tension spring is fixedly connected to the pressing plate. Here, when the clamp is released, the sliding rod can be driven to move by the tension spring, so that the sliding rod is automatically

[0013] Compared with the prior art, the advantages and positive effects of the present invention are:

[0014] 1. In the present invention, the position of the workpiece can be flexibly adjusted through the guide mechanism, especially in curved surface processing. In conjunction with the wire feeding mechanism and the adjustment mechanism, the processing angle can be freely adjusted, making the angle and position of the workpiece more flexible, thereby being able to adapt to the processing needs of various complex shapes and angles, so that in actual operation, the cutting of curved surface parts can be completed more efficiently and accurately, thereby improving the adaptability and stability of the overall processing, providing high-precision support for the processing of complex structures, and improving the applicability of processing.

[0015] 2. In the utility model, the limiting mechanism is used to stably clamp workpieces of different shapes and with uneven surfaces, and to stably clamp objects with special surface shapes. The sliding rod can be adjusted according to the position of the uneven surface, thereby improving the stability of the clamping limit. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The utility model provides a schematic diagram of the overall structure of a cutting mechanism of a high-speed wire cutting machine for processing semiconductor components;

[0017] Figure 2 The utility model proposes an exploded diagram of a cutting mechanism of a high-speed wire cutting machine for processing semiconductor components;

[0018] Figure 3 This utility model proposes a cutting mechanism for a high-speed wire cutting machine used for processing semiconductor components. Figure 1 Enlarged view of point A in the middle;

[0019] Figure 4 This utility model proposes a cutting mechanism for a high-speed wire cutting machine used for processing semiconductor components. Figure 2 Enlarged view of point B in the middle.

[0020] Legend:

[0021] 1. Housing; 2. Mounting frame; 3. Threaded rod; 4. Motor; 5. Lifting frame; 6. Moving block; 7. Driving part A; 8. Motor; 9. Reel; 10. Electrode wire; 11. Electric slide rail A; 12. Driving part B; 13. Electric slide rail B; 14. Slider; 15. Turntable; 16. Mounting block; 17. Fastener; 18. Placement plate; 19. Screw; 20. Rotating head; 21. Pressing plate; 22. Anti-slip pad; 23. Sliding rod; 24. Limit block; 25. Stop block; 26. Tension spring. DETAILED DESCRIPTION

[0022] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0023] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0024] Example 1

[0025] See also Figure 1-4The utility model provides a technical solution: a high-speed wire cutting machine cutting mechanism for semiconductor component processing, comprising a shell 1, a guide mechanism is provided on the upper surface of the shell 1, an adjustment mechanism is provided on the upper surface of the shell 1, and a wire-feeding mechanism is provided on the surface of the guide mechanism and the shell 1. The guide mechanism comprises a mounting frame 2, the internal rotation of the mounting frame 2 is connected to a threaded rod 3, and the threaded rod 3 can make the lifting frame 5 smoothly lift and lower, the interior of the mounting frame 2 is fixedly installed with a motor 4, and the threaded rod 3 can be driven to rotate by the motor 4, and the surface of the threaded rod 3 is threadedly connected to the lifting frame 5, so that the overall length of the electrode wire 10 can be adjusted, and the internal sliding connection of the lifting frame 5 is connected to a moving block 6, so that the angle of the electrode wire 10 can be adjusted, and the surface of the lifting frame 5 is fixed. A driving member A7 is fixedly installed to automatically adjust the position of the moving block 6; the wire feeding mechanism includes an electric slide rail A11, which is fixedly connected to the housing 1, and the surface of the electric slide rail A11 is slidably connected to the motor 8, and the output end of the motor 8 is fixedly installed with a reel 9, and the surface of the reel 9 is wound with an electrode wire 10, so that the position and length of the electrode wire 10 can be adjusted; the adjustment mechanism includes a driving member B12, and the driving member B12 is arranged on the surface of the housing 1, so that the electric slide rail B13 can slide freely, and the upper surface of the housing 1 is slidably connected to the electric slide rail B13, and the surface of the electric slide rail B13 is slidably connected to the slider 14, so that the position of the workpiece can be smoothly adjusted, and the upper surface of the slider 14 is fixedly installed with a turntable 15, the turntable The upper surface of 15 is rotatably connected to a mounting block 16, and a fastener 17 is provided on the side of the mounting block 16, so that the mounting block 16 can be fixed at any angle on the surface of the turntable 15. A placement plate 18 is fixedly installed inside the mounting block 16 to support the workpiece. A pressure plate 21 is slidably connected to the inside of the mounting block 16. A screw rod 19 is connected to the internal thread of the mounting block 16, and a rotary head 20 is fixedly installed on the top of the screw rod 19 to clamp and fix the workpiece. The driving part A7 and the driving part B12 include an electric telescopic rod and a hydraulic rod. The output end of the motor 4 is fixedly connected to the threaded rod 3, and the lifting frame 5 is slidably connected to the mounting frame 2. The threaded rod 3 can be stably driven by the motor 4, and the lifting frame 5 and the mounting frame 2 The sliding of the lifting frame 5 can limit the position when it is lifted and lowered to avoid misalignment during lifting and lowering. The output end of the driving member A7 is fixedly connected to the moving block 6, and one end of the electrode wire 10 is fixedly connected to the moving block 6. The driving member A7 can make the moving block 6 change at will inside the lifting frame 5, so that the electrode wire 10 can be adjusted to different angles for use. The fastener 17 is connected to the turntable 15, so that the mounting block 16 is clamped and fixed in different directions. The output end of the driving member B12 is fixedly connected to the electric slide rail B13, so that the position of the electric slide rail B13 can be changed at will. The bottom end of the screw rod 19 is rotatably connected to the pressure plate 21, so that the pressure plate 21 can move smoothly and clamp and fix the workpiece.

[0026] Example 2

[0027] See also Figure 1-4 A limiting mechanism is provided on the surface of the pressing plate 21 and the placing plate 18, and the limiting mechanism includes an anti-slip pad 22, which is fixedly connected to the placing plate 18 to reduce the slipping of the workpiece. The internal sliding connection of the pressing plate 21 is provided with a sliding rod 23, so that the limiting block 24 can clamp workpieces of different shapes as needed. The bottom end of the sliding rod 23 is fixedly installed with a limiting block 24, and the top end of the sliding rod 23 is fixedly installed with a stopper 25, so that the tension spring 26 can be stably installed. The lower surface of the stopper 25 is fixedly installed with a tension spring 26, and one end of the tension spring 26 is fixedly connected to the pressing plate 21, so that after the clamping plate and the placing plate 18 are unfastened, the sliding rod 23 can be automatically restored by the tension spring 26.

[0028] Working principle: The outer shell 1 serves as the overall supporting structure, and the motor 4 in the mounting frame 2 drives the threaded rod 3 to rotate, thereby achieving lifting and lowering adjustment through the threaded lifting frame 5. The moving block 6 inside the lifting frame 5 is linked with the driving part A7, and the motor 8 slides on the surface of the electric slide rail A11, so that the moving block 6 can adjust the angle of the electrode wire 10. At the same time, the motor 8 can rotate the reel 9 to keep the electrode wire 10 in a taut state at all times. Before clamping the workpiece, first release the connection between the fastener 17 and the turntable 15, rotate the mounting block 16 to the appropriate position, and then fix it with the fastener 17. After that, the driving part B12 drives the electric slide rail to adjust to the appropriate position, and then the workpiece is placed on the protective pad position on the placement table. By grabbing the rotary head 20 and rotating it, the rotary head 20 drives the screw rod 19 to rotate inside the mounting block 16, so that the pressure plate 21 presses the workpiece. Press tightly. At the same time, the sliding rod 23 can be used to make the limit block 24 correspond to the uneven position of the workpiece surface, so that it fits the workpiece better. When processing the workpiece, the position of the motor 8 can be controlled by the electric slide A11, and the driving part A7 can control the position of the moving block 6 to adjust the angle of the electrode wire 10. At the same time, the driving part B12 adjusts the position of the electric slide B13, and the slider 14 slides on the surface of the electric slide B13, so that the position of the workpiece can be changed at will, so that the workpiece can be processed in different positions and directions as needed. After taking out the workpiece, the stop block 25 and the sliding rod 23 can be moved by the tension spring 26 to restore the sliding rod 23 to the position of the clamp.

[0029] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any other form. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes for application in other fields. However, any simple modification, equivalent change and modification of the above embodiment made according to the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A high-speed wire cutting machine for semiconductor component processing, comprising a housing (1), characterized in that: The upper surface of the housing (1) is provided with a guide mechanism, the upper surface of the housing (1) is provided with an adjustment mechanism, and the guide mechanism and the surface of the housing (1) are provided with a wire feeding mechanism; The guide mechanism comprises a mounting frame (2), a threaded rod (3) is rotatably connected to the interior of the mounting frame (2), a motor (4) is fixedly installed to the interior of the mounting frame (2), a lifting frame (5) is threadedly connected to the surface of the threaded rod (3), a moving block (6) is slidably connected to the interior of the lifting frame (5), and a driving member A (7) is fixedly installed to the surface of the lifting frame (5); The wire-feeding mechanism comprises an electric slide rail A (11), the electric slide rail A (11) is fixedly connected to the housing (1), a motor (8) is slidably connected to the surface of the electric slide rail A (11), a reel (9) is fixedly mounted on the output end of the motor (8), and an electrode wire (10) is wound around the surface of the reel (9); The adjustment mechanism includes a driving member B (12), the driving member B (12) is arranged on the surface of the shell (1), the upper surface of the shell (1) is slidably connected to an electric slide rail B (13), the surface of the electric slide rail B (13) is slidably connected to a slider (14), a turntable (15) is fixedly installed on the upper surface of the slider (14), the upper surface of the turntable (15) is rotatably connected to a mounting block (16), a fastener (17) is provided on the side of the mounting block (16), a placement plate (18) is fixedly installed inside the mounting block (16), a pressure plate (21) is slidably connected inside the mounting block (16), a screw rod (19) is threadedly connected inside the mounting block (16), and a rotating head (20) is fixedly installed on the top of the screw rod (19).

2. The cutting mechanism of the high-speed wire cutting machine for semiconductor component processing according to claim 1, characterized in that: The output end of the motor (4) is fixedly connected to the threaded rod (3), and the lifting frame (5) is slidably connected to the mounting frame (2).

3. The cutting mechanism of the high-speed wire cutting machine for semiconductor component processing according to claim 1, characterized in that: The output end of the driving member A (7) is fixedly connected to the moving block (6), and one end of the electrode wire (10) is fixedly connected to the moving block (6).

4. The cutting mechanism of the high-speed wire cutting machine for semiconductor component processing according to claim 1, characterized in that: The fastener (17) is connected to the turntable (15), the output end of the driving member B (12) is fixedly connected to the electric slide rail B (13), and the bottom end of the screw rod (19) is rotatably connected to the pressure plate (21).

5. The cutting mechanism of the high-speed wire cutting machine for semiconductor component processing according to claim 1, characterized in that: A limiting mechanism is provided on the surfaces of the pressing plate (21) and the placing plate (18), and the limiting mechanism includes an anti-slip pad (22). The anti-slip pad (22) is fixedly connected to the placing plate (18). The interior of the pressing plate (21) is slidably connected to a sliding rod (23). A limiting block (24) is fixedly installed at the bottom end of the sliding rod (23). A stop block (25) is fixedly installed at the top end of the sliding rod (23). A tension spring (26) is fixedly installed on the lower surface of the stop block (25).

6. The cutting mechanism of the high-speed wire cutting machine for semiconductor component processing according to claim 5, characterized in that: One end of the tension spring (26) is fixedly connected to the pressure plate (21).

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