Grinding wheel dressing mechanism and wafer grinding device

Abstract

The utility model provides a grinding wheel dressing mechanism and a wafer grinding device, and relates to the technical field of semiconductors, the grinding wheel dressing mechanism comprises a dressing plate movably arranged below a grinding wheel, the dressing plate is provided with a first initial position away from the grinding wheel and a first dressing position in contact with the grinding wheel, and the dressing plate is driven to be switched between the first initial position and the first dressing position; and the sand finishing plate is used for finishing the surface roughness of the grinding wheel at the first sand finishing position. By adjusting the surface roughness of the grinding wheel, a smooth layer or a passivated surface formed in the grinding process is removed through the sand trimming plate, and the grinding wheel recovers enough self-sharpening performance. The trimmed grinding wheel has the consistent surface roughness, it is ensured that the efficient grinding effect can be achieved when the grinding wheel is used for grinding the wafer, and the problems that the wafer is broken or the thickness is out of tolerance and the like are solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a grinding wheel dressing mechanism and a wafer grinding device. Background Art

[0002] A grinding machine uses a high-precision, high-stability spindle to carry a grinding wheel, enabling wafer thinning with micron-level feed accuracy. The grinding wheel is composed of ultra-fine diamond abrasive and a binder (resin, ceramic, metal, etc.). The porous structure is formed through compression, drying, and calcination, ensuring both grinding efficiency and heat dissipation.

[0003] During daily use, the grinding wheel is trimmed by equipment engineers upon initial installation to ensure grinding quality. Over time, the diamond grains on the wheel's surface gradually become exposed and come into contact with the wafer surface. However, as grinding progresses, the wheel's self-sharpening properties gradually decrease, and the surface gradually develops a smooth, polished finish.

[0004] When the self-sharpening performance of a grinding wheel decreases, the height measurement tool can easily misjudge that the wheel is in a state of continuous wear, causing the spindle to continuously feed downward. This can lead to a series of problems, such as the grinding wheel slipping on the wafer surface, affecting spindle machining accuracy; abnormal wear of the grinding wheel due to spindle current overload; and the possibility of the grinding wheel disintegrating after reaching critical wear, with falling abrasive and bond fragments pressing against the wafer, causing wafer cracking and damage. Utility Model Content

[0005] The purpose of this application is to provide a grinding wheel dressing mechanism and a wafer grinding device to address the deficiencies in the above-mentioned prior art.

[0006] To achieve the above objectives, the technical solutions adopted in the embodiments of the present application are as follows:

[0007] In one aspect of an embodiment of the present application, a grinding wheel dressing mechanism is provided, comprising a dressing plate movably arranged under the grinding wheel, the dressing plate having a first initial position away from the grinding wheel and a first dressing position in contact with the grinding wheel, the dressing plate being driven to switch between the first initial position and the first dressing position, and the dressing plate being used to dress the surface roughness of the grinding wheel at the first dressing position.

[0008] Optionally, the grinding wheel dressing mechanism further includes a lifting assembly and a driving assembly, and the driving assembly is connected to the sand dressing plate through the lifting assembly.

[0009] Optionally, the lifting assembly includes a first support rod, one end of the first support rod is connected to the sand dressing plate, and the other end of the first support rod is drivingly connected to the driving assembly.

[0010] Optionally, the lifting assembly includes a second support rod and a sleeve, the second support rod is connected to the sand dressing plate, the sleeve is sleeved outside the second support rod, and the driving assembly is drivingly connected to the sleeve.

[0011] Optionally, the grinding wheel dressing mechanism further includes an elastic member, a sleeve is movably sleeved outside the second support rod, and two ends of the elastic member are respectively in contact with the sleeve and the sand dressing plate.

[0012] Optionally, an abutment plate is fixedly sleeved outside the sleeve, the elastic member is located between the abutment plate and the sand repairing plate, and two ends of the elastic member abut against the abutment plate and the sand repairing plate respectively.

[0013] Optionally, the driving assembly includes a driving member and a movable member movably arranged on the driving member, and the movable member is connected to the lifting assembly.

[0014] Another aspect of an embodiment of the present application provides a wafer grinding device, comprising a grinding wheel and any one of the above-mentioned grinding wheel dressing mechanisms, wherein the grinding wheel is used to grind the wafer after being dressed by the grinding wheel dressing mechanism.

[0015] Optionally, the wafer grinding device also includes a machine table, and the grinding wheel is movably arranged on the machine table. The grinding wheel has a second sanding position away from the wafer and a grinding position in contact with the wafer. The grinding wheel dressing mechanism is used to dress the grinding wheel located at the second sanding position, and the grinding wheel is used to grind the wafer at the grinding position.

[0016] Optionally, the grinding wheel is rotatably arranged on the machine table.

[0017] The beneficial effects of this application include:

[0018] The present application provides a grinding wheel dressing mechanism and a wafer grinding device, comprising a dressing plate movably arranged below the grinding wheel, the dressing plate having a first initial position away from the grinding wheel and a first dressing position in contact with the grinding wheel, the dressing plate being driven to switch between the first initial position and the first dressing position, and the dressing plate being used to dress the surface roughness of the grinding wheel at the first dressing position. By adjusting the surface roughness of the grinding wheel, the dressing plate removes the smooth layer or passivated surface formed during the grinding process, thereby restoring sufficient self-sharpening properties of the grinding wheel. The dressed grinding wheel has a consistent surface roughness, ensuring that it can achieve efficient grinding when grinding wafers, avoiding problems such as wafer breakage or thickness deviation. In addition, after completing the dressing task, the dressing plate is driven to switch back to the first initial position so that the dressing plate does not interfere with the subsequent grinding process. In this way, not only is the grinding wheel ensured to be in an ideal state before each grinding, but it is also ensured that the grinding wheel dressing mechanism does not interfere with the grinding operation itself, thereby achieving continuity and stability of the grinding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A schematic structural diagram of a grinding wheel dressing mechanism provided in an embodiment of the present application when located in a first initial position;

[0021] Figure 2 A schematic structural diagram of a grinding wheel dressing mechanism provided in an embodiment of the present application when located in a first dressing position;

[0022] Figure 3 An exploded view of a grinding wheel dressing mechanism provided in an embodiment of the present application;

[0023] Figure 4 A schematic structural diagram of a wafer grinding device provided by an embodiment of the present application when the grinding wheel is located at a second initial position;

[0024] Figure 5 This is a structural schematic diagram of a wafer grinding device provided in an embodiment of the present application when the grinding wheel is in the grinding position.

[0025] Icons: 10-sanding plate; 20-lifting assembly; 21-second support rod; 22-sleeve; 23-abutment plate; 30-driving assembly; 31-driving part; 32-movable part; 40-elastic part; 50-grinding wheel; 60-spindle; 70-wafer. DETAILED DESCRIPTION

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application as claimed, but merely represents selected embodiments of the present application. It should be noted that, unless there is a conflict, the various features of the embodiments of the present application may be combined with each other, and the combined embodiments are still within the scope of protection of the present application.

[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0029] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended only to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0030] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0031] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0032] In one aspect of the embodiment of the present application, a grinding wheel dressing mechanism is provided to ensure that the grinding wheel 50 has stable surface self-sharpening before grinding the wafer 70, so as to improve the grinding quality and extend the service life of the grinding wheel 50. Figure 1 and Figure 2 As shown, the grinding wheel dressing mechanism includes a dressing plate 10 movably positioned below a grinding wheel 50. Its structure features two main positions: a first initial position and a first dressing position. The first initial position is a standby position where the dressing plate 10 is away from the grinding wheel 50, while the first dressing position is where the dressing plate 10 contacts the surface of the grinding wheel 50, allowing for dressing of the grinding wheel 50.

[0033] Specifically, the sanding plate 10 can be driven to switch positions. When the dressing process is initiated, the sanding plate 10 is driven to move from a first initial position to a first sanding position, where it contacts the surface of the grinding wheel 50. At this point, by adjusting the surface roughness of the grinding wheel 50, the sanding plate 10 removes the smooth layer or dull surface formed during the grinding process, restoring sufficient self-sharpening properties to the grinding wheel 50. The dressed grinding wheel 50 has a consistent surface roughness, ensuring efficient cutting when grinding the wafer 70 and avoiding problems such as wafer 70 breakage or thickness deviations.

[0034] Furthermore, after completing its dressing task, the dressing plate 10 is driven back to its initial position, preventing it from interfering with the subsequent grinding process. This not only ensures that the grinding wheel 50 is in an ideal condition before each grinding operation, but also ensures that the grinding wheel dressing mechanism does not interfere with the grinding operation itself, thereby ensuring a continuous and stable grinding process. This design, through automated dressing and resetting, not only extends the life of the grinding wheel 50 but also effectively improves the machining accuracy and yield rate of the wafer 70.

[0035] Alternatively, as Figure 1 and Figure 2 As shown, the grinding wheel dressing mechanism also includes a lifting assembly 20 and a drive assembly 30. The drive assembly 30 is driven and connected to the dressing plate 10 via the lifting assembly 20. Through the coordinated operation of the lifting assembly 20 and the drive assembly 30, precise control of the dressing plate 10 and automatic dressing of the grinding wheel 50 can be achieved, ensuring that the surface of the grinding wheel 50 always maintains ideal self-sharpening and roughness during the grinding process to meet the requirements of high-precision wafer grinding.

[0036] First, the drive assembly 30 is responsible for providing power and connecting to the trimming plate 10 through the lifting assembly 20 to adjust the position of the trimming plate 10. The power of the drive assembly 30 is transmitted through the lifting assembly 20, enabling the trimming plate 10 to move from its initial position to the trimming position, contacting the surface of the grinding wheel 50 and performing trimming. The lifting assembly 20 plays a key role in this process, and it can achieve two motion modes: one is that the drive assembly 30 drives the lifting assembly 20 to rise and fall as a whole, thereby driving the trimming plate 10 to rise and fall synchronously; the other is that the drive assembly 30 drives the lifting assembly 20 to adjust its own extension and contraction, thereby raising and lowering the trimming plate 10 to the appropriate height. This flexible structural design ensures a stable and precise trimming process.

[0037] Secondly, the lifting assembly 20, as a key component connecting the drive assembly 30 and the sand dressing plate 10, not only stably transmits the power of the drive assembly 30, but also ensures that the position of the sand dressing plate 10 can be adjusted accurately and quickly. In specific operation, when it is detected that the self-sharpening property of the surface of the grinding wheel 50 has decreased and cannot meet the grinding requirements of the wafer 70, the system will send a command to the drive assembly 30, and the drive assembly 30 will use the lifting assembly 20 to raise the sand dressing plate 10 to the first sand dressing position, so that the surface of the grinding wheel 50 can be trimmed without contacting the wafer 70. Because the sand dressing plate 10 does not overlap with the wafer 70 in the horizontal direction, and the first sand dressing position is higher than the position of the wafer 70, the trimming process will not affect the quality of the wafer 70.

[0038] After trimming is complete, the drive assembly 30 quickly returns the lifting assembly 20 to its initial state, driving the trimming plate 10 to a first initial position below the wafer 70 to prevent interference with subsequent grinding operations. This reset process ensures that the grinding wheel 50 can smoothly descend to a position of contact with the wafer 70 to continue precise grinding. This automated trimming and reset solution not only reduces downtime but also ensures the continued self-sharpening of the grinding wheel 50, preventing wafer 70 breakage or thickness deviations caused by reduced self-sharpening.

[0039] Optionally, the lifting assembly 20 includes a first support rod, one end of which is connected to the sand dressing plate 10, and the other end of the first support rod is driven and connected to the driving assembly 30 to transmit the movement of the driving assembly 30 to the sand dressing plate 10, thereby realizing the lifting and lowering adjustment of the sand dressing plate 10.

[0040] Specifically, one end of the first support rod is connected to the trimming plate 10, ensuring that the trimming plate 10 moves precisely with the support rod. The other end of the support rod is connected to the drive assembly 30, enabling the drive assembly 30 to directly control the vertical movement of the trimming plate 10 via the support rod. The first support rod can be designed as a telescopic rod or a fixed rod. Both approaches effectively adjust the height of the trimming plate 10 and accommodate different grinding applications based on specific grinding requirements.

[0041] In the telescopic rod structure, the first support rod has a telescopic function, capable of adjusting its length under the control of the drive assembly 30. When the drive assembly 30 is activated, the support rod can be extended and retracted at different heights to drive the sanding plate 10 to switch between the first initial position and the first sanding position. The advantage of this telescopic method is that the raising and lowering position of the sanding plate 10 can be fine-tuned to meet different dressing requirements, further improving the dressing accuracy of the grinding wheel 50 surface and ensuring the self-sharpening and consistency of the grinding wheel 50 during the grinding process.

[0042] In the fixed-rod structure, the first support rod maintains a fixed length, and the movement of the trimming plate 10 is achieved by the drive assembly 30, which drives the support rod upward and downward. The drive assembly 30 drives the fixed rod up and down, ensuring precise switching of the trimming plate 10 between different positions. This simple structural design is suitable for trimming at a fixed height. While maintaining a good trimming effect, it simplifies the mechanical structure and helps improve the stability and reliability of the mechanism.

[0043] Whether using a telescopic or fixed rod structure, the coordination between the lifting assembly 20 and the drive assembly 30 ensures that the dressing plate 10 contacts the surface of the grinding wheel 50 with appropriate force for efficient dressing. Through precise height control, the surface roughness of the grinding wheel 50 is consistently maintained, thus avoiding problems such as wafer 70 breakage or uneven thickness caused by reduced self-sharpening properties of the grinding wheel 50, further improving the quality and stability of the grinding process.

[0044] Alternatively, as Figure 3 As shown, the lifting assembly 20 includes a second support rod 21 and a sleeve 22 . The second support rod 21 is connected to the sand dressing plate 10 . The sleeve 22 is sleeved outside the second support rod 21 . The driving assembly 30 is drivingly connected to the sleeve 22 .

[0045] Specifically, the sleeve 22 is connected to the drive assembly 30, serving as a guide for the support rod. By adding the sleeve 22 to the exterior of the second support rod 21, the drive assembly 30 can simultaneously drive the sleeve 22 and stabilize the support rod, thereby preventing lateral movement during the lifting process that could affect dressing accuracy. This sleeve 22 structure effectively distributes the load on the dressing plate 10 during the lifting process, ensuring a smoother dressing operation and even contact force with the surface of the grinding wheel 50 during the dressing process.

[0046] Among them, the sleeve 22 can be fixedly mounted on the outside of the second support rod 21, so that the second support rod 21 moves as a whole together with the sleeve 22 under the drive of the drive assembly 30. This design can ensure the relative fixed relationship between the support rod and the sleeve 22, which is conducive to improving the positioning accuracy of the sand dressing plate 10 under stable vertical guidance, and is suitable for grinding applications with high requirements for dressing stability. The sleeve 22 can also be movably mounted on the outside of the support rod, that is, under the action of the drive assembly 30, the sleeve 22 can slide outside the support rod, driving the support rod to rise and fall. This movable mounting method makes the drive assembly 30 more flexible in adjusting the height of the sand dressing plate 10, adapting to the dressing needs under different working conditions, thereby enhancing the adaptability of the dressing mechanism. The design of the movable mounting can provide greater freedom of movement, facilitate small position adjustments, and improve the ability to fine-tune the surface roughness of the grinding wheel 50.

[0047] Alternatively, as Figures 1 to 3As shown, the grinding wheel dressing mechanism is also equipped with an elastic member 40 to further enhance the precision and safety of the dressing operation, particularly by enabling flexible control during the contact process. In this design, the sleeve 22 is movably mounted on the exterior of the second support rod 21, forming a stable guide structure. The elastic member 40 is mounted on the exterior of the sleeve 22, with its ends abutting between the sleeve 22 and the dressing plate 10, becoming a critical buffer and protective component during the dressing process.

[0048] Specifically, the elastic member 40 is designed to prevent hard contact between the dressing plate 10 and the grinding wheel 50. The elastic contraction of the elastic member 40 provides a suitable cushioning effect when the dressing plate 10 contacts the grinding wheel 50, preventing the dressing plate 10 from directly impacting the grinding wheel 50 with excessive force. This effectively reduces impact on the grinding wheel 50 surface during the dressing process, protecting the grinding wheel 50 from unnecessary damage, extending its service life, and maintaining the uniformity of the dressed surface. The elastic member 40 can be a compression spring.

[0049] Furthermore, the elastic adjustment of the elastic member 40 allows the dressing plate 10 to automatically adapt to slight height differences when dressing the grinding wheel 50. Because the elastic member 40 can appropriately contract and recover according to the dressing requirements, the elastic member 40 provides steady contact pressure as the dressing plate 10 moves up and down, even if the grinding wheel 50 has slight surface irregularities. This adaptive characteristic ensures more uniform grinding and dressing of the grinding wheel 50 by the dressing plate 10, avoiding uneven surface roughness on the grinding wheel 50 caused by unstable contact.

[0050] Overall, the combination of elastic member 40 and sleeve 22 ensures the stability and flexible adjustment capabilities of the dressing mechanism. Through effective elastic contraction, elastic member 40 protects the surface of grinding wheel 50 from wear caused by hard contact and provides stable pressure support during the dressing process, ensuring that the surface of grinding wheel 50 maintains proper self-sharpening properties, thereby improving wafer grinding performance and product quality.

[0051] Alternatively, as Figure 3 As shown, in order to further improve the stability and effect of the elastic member 40, an abutment plate 23 is fixedly sleeved on the outside of the sleeve 22, and the elastic member 40 is located between the abutment plate 23 and the sand dressing plate 10, and the two ends of the elastic member 40 abut against the abutment plate 23 and the sand dressing plate 10 respectively, thereby increasing the support contact area of ​​the elastic member 40 and preventing it from shaking or deflecting during the dressing operation.

[0052] Specifically, the elastic member 40 is positioned between the abutment plate 23 and the sanding plate 10 to provide a buffer when the sanding plate 10 and the grinding wheel 50 come into contact. One end of the elastic member 40 is fixed to the abutment plate 23, while the other end abuts the sanding plate 10. This arrangement creates a stable support structure at both ends of the elastic member 40. The abutment plate 23 serves to expand the contact surface of the elastic member 40, enabling it to maintain a stable posture when driven by the drive assembly 30 and the lifting assembly 20, thereby preventing shaking caused by lateral forces generated during movement. This allows the elastic member 40 to precisely transmit a buffering force in the vertical direction, ensuring smooth movement and precise contact of the sanding plate 10.

[0053] Alternatively, as Figure 3 As shown, the driving assembly 30 includes a driving member 31 and a movable member 32 , wherein the movable member 32 is movably mounted on the driving member 31 and connected to the lifting assembly 20 for controlling the movement of the lifting assembly 20 to achieve position switching of the sand dressing plate 10 .

[0054] Specifically, the drive assembly 30 can be driven by a cylinder, with hydraulic pressure or air pressure as the power source. In this case, the drive member 31 can be a hydraulic system or a pneumatic system, and the movable member 32 is a piston. The working principle of the hydraulic or pneumatic drive is to drive the piston movement by controlling the pressure of the fluid, thereby driving the lifting assembly 20 and the sand dressing plate 10 to rise and fall. The advantage of this driving method is that it responds quickly and can provide stable and strong thrust, which is suitable for dressing operations that require large output. Through the pressure regulation of the cylinder, the piston can achieve precise displacement, thereby ensuring that the contact force between the sand dressing plate 10 and the grinding wheel 50 is appropriate, avoiding over-dressing or under-dressing.

[0055] In addition, the drive assembly 30 can also adopt an electric drive mode, wherein the drive member 31 is a motor and the movable member 32 is a screw rod that cooperates with the motor. In the electric drive mode, the motor drives the axial movement of the screw rod by rotation, thereby driving the lifting assembly 20 and the sanding plate 10 to achieve precise up and down movement. The advantage of this design is that the motion control accuracy is high, and it is particularly suitable for dressing needs that require fine adjustment. The electric drive mode also has the advantage of being easy to integrate with the automatic control system, and can cooperate with sensors and control circuits to realize automated operation, making the entire dressing process more intelligent and efficient. It should be noted that a protective cover can also be provided on the outside of the drive assembly 30 to prevent the drive assembly 30 from being affected by the external environment.

[0056] Another aspect of the present application provides a wafer grinding device, such as Figure 4 and Figure 5As shown, the apparatus includes a grinding wheel 50 and any of the aforementioned grinding wheel dressing mechanisms. The grinding wheel 50 is used to grind a wafer 70 after being dressed by the grinding wheel dressing mechanism. The grinding wheel 50 is automatically dressed by the grinding wheel dressing mechanism to ensure that its surface maintains an appropriate self-sharpening and surface roughness, thereby ensuring that a uniform and stable grinding force is applied to the surface of the wafer 70 during the grinding process. Furthermore, since the wafer grinding apparatus utilizes the aforementioned grinding wheel dressing mechanism, it also has the same beneficial effects as the grinding wheel dressing mechanism, which will not be further described here.

[0057] Alternatively, as Figure 4 and Figure 5 As shown, the wafer grinding device further includes a machine platform, and the grinding wheel 50 is movably disposed on the machine platform via a spindle 60 so as to switch between different positions to achieve precise dressing and grinding operations.

[0058] Specifically, the grinding wheel 50 has multiple working positions, including a grinding position in contact with the wafer 70 and a second sanding position away from the wafer 70. Figure 2 As shown, when the grinding wheel 50 is located at the second dressing position, the dressing plate 10 can perform necessary dressing on the grinding wheel 50 to ensure that the surface of the grinding wheel 50 maintains the best roughness and self-sharpening properties, as shown in FIG. Figure 5 As shown, when the grinding wheel 50 is in the grinding position, the surface of the wafer 70 can be precisely ground. Figure 4 As shown, the grinding wheel 50 also has a second initial position, located on the side of the second dressing position away from the wafer 70, to facilitate quick positioning before the grinding operation. Driven by the spindle 60, the grinding wheel 50 can be quickly lowered from the second initial position to the second dressing position, saving movement time and thus improving overall work efficiency. At this position, the system first determines whether the grinding wheel 50 requires dressing. If dressing is not required, the grinding wheel 50 slowly descends directly to the grinding position and begins precision machining of the wafer 70, ensuring a smooth and stable grinding process.

[0059] When the grinding wheel 50 detects that it needs dressing, the dressing mechanism activates the dressing plate 10, which rises to the first dressing position to perform the dressing process on the grinding wheel 50. During the dressing process, the dressing plate 10 fine-tunes and sharpens the surface of the grinding wheel 50, eliminating areas of surface passivation and wear, thereby restoring the grinding capability of the grinding wheel 50. After the dressing operation is complete, the dressing plate 10 descends from the first dressing position to the first initial position, ensuring that the dressing mechanism does not interfere with subsequent grinding operations. The grinding wheel 50 then slowly descends from the second dressing position to the grinding position, commencing precision grinding of the wafer 70.

[0060] By separating the dressing process from the grinding process and providing different switching positions, this design effectively extends the life of the grinding wheel 50 while ensuring the stability and consistency of wafer grinding, improving the processing accuracy and efficiency of the entire device. The entire process enables automated dressing and precise grinding of the grinding wheel 50, providing efficient and reliable technical support for the wafer 70 processing process.

[0061] Optionally, the grinding wheel 50 is rotatably mounted on the machine platform via the spindle 60 to achieve high-precision grinding operations. During the grinding process, the spindle 60 acts as a power source to drive the grinding wheel 50 to rotate at a stable speed, so that the surface of the grinding wheel 50 is precisely ground at an angular velocity relative to the wafer 70, thereby removing material and controlling the thickness of the wafer 70. This structural design not only ensures effective contact between the grinding wheel 50 and the wafer 70, but also allows the cutting force during the grinding process to be evenly distributed on the surface of the grinding wheel 50, thereby improving the grinding accuracy and avoiding the problem of uneven surface of the wafer 70 caused by eccentric wear. Among them, by adjusting the rotation speed of the spindle 60 and the grinding parameters of the grinding wheel 50, the equipment can achieve precise processing of wafers 70 with different thickness requirements, so that the grinding results can achieve the required flatness and thickness tolerance.

[0062] The present application also provides a wafer grinding method, which is implemented by any of the above-mentioned wafer grinding devices and includes the following steps:

[0063] S1: Obtaining information on the number of wafers 70 and information on the grinding depth required for the wafers 70;

[0064] S2: Obtaining information on the degree of diamond wear on the surface of the grinding wheel 50;

[0065] S3: combining the number of wafers 70, the required grinding depth of the wafers 70, and the wear degree of the grinding wheel 50, to generate the dressing amount information of the grinding wheel 50 worn to the critical point;

[0066] S4: Determine whether the grinding wheel 50 needs to be dressed based on the number of wafers 70 and the required grinding depth;

[0067] S5: dressing the grinding wheel 50;

[0068] S6: The sanding plate 10 is out of contact with the grinding wheel 50;

[0069] S7: performing grinding processing on the wafer 70.

[0070] First, S1 involves pre-acquiring information about the number of wafers 70 and the required grinding depth. The accuracy of this data is crucial for the subsequent grinding process, as the grinding requirements of different wafers 70 affect the rate of diamond wear on the surface of the grinding wheel 50, causing the grinding wheel 50 to experience varying wear conditions over multiple uses, making it difficult to accurately determine whether wear has reached a critical point. Therefore, in practice, the information about the number of wafers 70 and grinding depth provided in this step provides essential data support for grinding control.

[0071] Next, in S2, the system acquires real-time information on the wear level of the diamonds on the surface of grinding wheel 50. This process helps generate highly adaptable dressing pressure control information, providing reliable baseline data for subsequent dressing operations. By monitoring the degree of wear, the system can dynamically determine whether grinding wheel 50 has reached a critical state that affects wafer 70 processing accuracy, providing a scientific basis for dressing decisions.

[0072] Next, S3 combines the required grinding depth information for wafer 70 and the wear level of grinding wheel 50 to generate the dressing amount information for grinding wheel 50 worn to the critical point. This personalized calculation ensures precise control of the dressing amount for grinding wheel 50 during each batch of wafers 70, making the dressing operation more consistent with actual grinding needs. This prevents excessive dressing that shortens the life of grinding wheel 50 while ensuring that the surface characteristics of grinding wheel 50 meet the wafer grinding accuracy.

[0073] S4 then determines whether the grinding wheel 50 requires dressing based on the aforementioned number of wafers 70 and grinding depth information. If dressing is not necessary, the system directly jumps to S7 to begin the grinding operation. This logic design not only improves the operating efficiency of the device but also effectively avoids the time loss caused by unnecessary dressing operations. If dressing is determined to be necessary, the system generates corresponding dressing intervention time point information and dressing pressure control information, setting specific operating parameters for the subsequent dressing process.

[0074] In S5, the dressing process for the grinding wheel 50 officially begins. When the dressing intervention time point is reached, the system controls the expansion and contraction of the elastic member 40 via the drive assembly 30, thereby precisely controlling the contact distance between the dressing plate 10 and the grinding wheel 50. Simultaneously, the system generates time control information for this dressing process based on the dressing pressure control information to ensure that the surface of the dressed grinding wheel 50 is suitable for the grinding requirements of this batch of wafers 70. During this process, the dressing pressure, dressing distance, and dressing time are controlled to prevent excessive dressing time or overdressing of the grinding wheel 50, which could delay wafer 70 processing.

[0075] In S6, after the dressing is completed, the elastic member 40 is controlled by the drive assembly 30 to extend and retract, so that the dressing plate 10 is separated from the grinding wheel 50. This step ensures that the dressing process automatically exits after achieving the desired effect, ensuring that the grinding process is not interfered with by the dressing plate 10, and improving the continuity of the entire process.

[0076] Finally, in S7 , grinding wheel 50 continuously processes wafers 70 until all wafers 70 have been processed. By rationally allocating the dressing and grinding processes, this method enables efficient and precise wafer 70 processing, ensuring that the surface accuracy and thickness of each wafer 70 meet process requirements. Furthermore, this method's intelligent dressing and grinding control effectively reduces grinding time and extends the life of grinding wheel 50 , providing efficient and reliable technical support for wafer 70 manufacturing.

[0077] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A grinding wheel dressing mechanism, characterized in that: The invention comprises a sand dressing plate (10) movably arranged below a grinding wheel (50), wherein the sand dressing plate (10) has a first initial position away from the grinding wheel (50) and a first sand dressing position in contact with the grinding wheel (50), and the sand dressing plate (10) is driven to switch between the first initial position and the first sand dressing position, and the sand dressing plate (10) is used to trim the surface roughness of the grinding wheel (50) at the first sand dressing position.

2. The grinding wheel dressing mechanism according to claim 1, characterized in that: The grinding wheel dressing mechanism further comprises a lifting assembly (20) and a driving assembly (30), wherein the driving assembly (30) is drivingly connected to the sand dressing plate (10) via the lifting assembly (20).

3. The grinding wheel dressing mechanism according to claim 2, characterized in that: The lifting assembly (20) comprises a first support rod, one end of which is connected to the sand dressing plate (10), and the other end of which is drivingly connected to the driving assembly (30).

4. The grinding wheel dressing mechanism according to claim 2, characterized in that: The lifting assembly (20) comprises a second support rod (21) and a sleeve (22), wherein the second support rod (21) is connected to the sand dressing plate (10), the sleeve (22) is sleeved outside the second support rod (21), and the driving assembly (30) is drivingly connected to the sleeve (22).

5. The grinding wheel dressing mechanism according to claim 4, characterized in that: The grinding wheel dressing mechanism further comprises an elastic member (40), the sleeve (22) is movably sleeved outside the second support rod (21), and two ends of the elastic member (40) respectively abut against the sleeve (22) and the sand dressing plate (10).

6. The grinding wheel dressing mechanism according to claim 5, characterized in that: An abutment plate (23) is fixedly sleeved outside the sleeve (22), the elastic member (40) is located between the abutment plate (23) and the sand-repairing plate (10), and two ends of the elastic member (40) respectively abut against the abutment plate (23) and the sand-repairing plate (10).

7. The grinding wheel dressing mechanism according to claim 2, characterized in that: The driving assembly (30) includes a driving member (31) and a movable member (32) movably arranged on the driving member (31), and the movable member (32) is connected to the lifting assembly (20).

8. A wafer grinding device, characterized in that: The invention comprises a grinding wheel (50) and a grinding wheel dressing mechanism according to any one of claims 1 to 7, wherein the grinding wheel (50) is used for grinding a wafer (70) after being dressed by the grinding wheel dressing mechanism.

9. The wafer grinding device according to claim 8, wherein: The wafer grinding device also includes a machine platform, the grinding wheel (50) is movably arranged on the machine platform, the grinding wheel (50) has a second sanding position away from the wafer (70) and a grinding position in contact with the wafer (70), the grinding wheel dressing mechanism is used to dress the grinding wheel (50) located at the second sanding position, and the grinding wheel (50) is used to grind the wafer (70) at the grinding position.

10. The wafer grinding apparatus according to claim 9, wherein: The grinding wheel (50) is rotatably mounted on the machine platform.

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