Coil pipe applied to wafer heating base

Abstract

The utility model discloses a coil pipe applied to a wafer heating base, and relates to the technical field of semiconductor equipment. Comprising a heating plate formed by coiling a heating pipe body and a lead pipe, a resistance wire is arranged in the heating plate, and a resistance wire lead is arranged in the lead pipe; the heating disc comprises symmetrically arranged first arc-shaped parts, symmetrically arranged second arc-shaped parts and an annular part with an opening structure, the second arc-shaped parts are located on the inner sides of the first arc-shaped parts, the second arc-shaped parts and the first arc-shaped parts are connected through first bent parts, and a first interval is formed between the first bent parts; the annular parts are connected with the second arc-shaped parts through the second bent parts respectively, a second interval is formed between the second bent parts, and the second interval is larger than the first interval. By means of the coil pipe, the heating wire can be coiled in a circular ring shape, electric energy is fully utilized and converted into heat energy, and the heating process is more efficient. According to the design, the required heating temperature can be quickly reached, so that the wafer heating treatment time is shortened, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a coil used in a wafer heating base. Background Art

[0002] In semiconductor film formation equipment, wafer heating pedestals not only support wafers but also heat them, improving the quality and yield of thin film growth during the film formation process. Existing wafer heating pedestals use a resistance wire heater embedded in the pedestal body to heat the pedestal body through thermal radiation, which then heats the wafer through heat conduction.

[0003] However, in existing technologies, it's often difficult to achieve ideal uniformity in the placement of resistance wires, resulting in temperature variations during wafer heating. These temperature variations can affect wafer processing quality and performance. Resistance wires are also difficult to form into complex shapes during processing, and it's especially difficult to create resistance wires that meet specific placement requirements. This increases the difficulty and cost of resistance wire manufacturing.

[0004] Wafer heating bases must ensure uniform temperature across the wafer during heating. However, this can be difficult to achieve due to limitations such as the arrangement and shape of the resistor wires. Temperature differences can be particularly pronounced in areas where the resistor wires are densely or sparsely arranged. Utility Model Content

[0005] The purpose of the utility model is to provide a coil for use in a wafer heating base, which has a novel winding method and a built-in resistance wire that can ensure that the wafer is heated evenly during the heating process and also helps to optimize the heating efficiency.

[0006] To achieve the above-mentioned purpose, the present application proposes a coil for use in a wafer heating base, comprising a heating plate formed by winding a heating tube body and a lead tube, wherein a resistance wire is built into the heating plate, and a resistance wire conductor is built into the lead tube; the heating plate comprises a symmetrically arranged first arc portion, a symmetrically arranged second arc portion and an annular portion with an opening structure, the second arc portion is located on the inner side of the first arc portion and the two are connected by a first bending portion, and there is a first spacing between the first bending portions; the annular portion is connected to the second arc portion respectively through the second bending portion, and there is a second spacing between the second bending portions, and the second spacing is greater than the first spacing.

[0007] In one embodiment, the heating plate and the lead tube are arranged vertically.

[0008] In one embodiment, the first arc-shaped portion, the second arc-shaped portion, and the annular portion have the same center.

[0009] In one embodiment, the first bending portion includes first curved tubes provided at both ends of the first straight tube, wherein one of the first curved tubes is connected to the first arc portion, and the other first curved tube is connected to the second arc portion.

[0010] In one embodiment, the second bent portion is an arc-shaped tube.

[0011] In one embodiment, the second arc portion is connected to the corresponding lead tube through the second straight tube and the third bent portion in sequence.

[0012] In one embodiment, the third bend portions extending into the annular portion have an inwardly expanding spacing therebetween, and each third bend portion includes a short tube, a third straight tube, and a third bend tube connected in sequence, wherein the short tube is connected to the second straight tube, and the third bend tube is connected to the lead tube.

[0013] In one embodiment, the straight tubes are spaced parallel to each other.

[0014] In one embodiment, magnesium oxide powder is filled between the heating tube and the resistance wire.

[0015] In one embodiment, the heating tube is made of 316L or Incoloy800.

[0016] The above technical solution adopted by the present invention has the following advantages compared with the prior art:

[0017] 1) Improved Heating Efficiency: The coiled tube of this application allows the heating wire to be coiled in a circular shape, more effectively converting electrical energy into thermal energy, making the heating process more efficient. This design helps quickly reach the required heating temperature, thereby shortening the wafer heating process time and improving production efficiency.

[0018] 2) Achieve temperature uniformity: The circular coiled heating wire ensures even heat distribution on the wafer heating base. Through the reasonable coiling method and spacing design, the temperature uniformity is further optimized, so that the wafer is heated more evenly during the heating process, avoiding local overheating or insufficient temperature, which helps to improve the quality and consistency of wafer processing.

[0019] 3) Optimizing Equipment Performance: The circular coiled heating filament design helps reduce heat loss and improve the thermal efficiency of semiconductor equipment. Its excellent structural stability and durability can extend the service life of the equipment and reduce maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the coil structure used in the wafer heating base;

[0021] Figure 2A top view of the coil used in the wafer heating base;

[0022] Among them: 11, first arc-shaped portion, 12, second arc-shaped portion, 13, annular portion, 14, lead tube, 21, first bent portion, 211, first bent tube, 212, first straight tube, 22, second bent portion, 23, third bent portion, 231, short tube, 232, third straight tube, 232, third bent tube. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0024] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0025] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0026] In the description of this application, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0028] See also Figure 1-2 This embodiment provides a coil for use in a wafer heating base, comprising a heating plate formed by winding a heating tube body and a lead tube, wherein the heating plate and the lead tube are arranged vertically;

[0029] A resistance wire is built into the heating plate, and magnesium oxide powder is filled between the heating tube and the resistance wire. Magnesium oxide powder has a high thermal conductivity coefficient and can effectively transfer the heat generated by the resistance wire to the heating tube, and then further to the wafer to be heated, thereby achieving a highly efficient heating effect. Magnesium oxide powder is also an excellent insulator, which can effectively isolate the electrical contact between the resistance wire and the heating tube, ensuring that the surface of the heating tube is not charged, thereby improving the safety performance of the heating tube. The resistance wire conductor is built into the lead tube, and this lead tube part does not conduct heat.

[0030] The heating plate includes a symmetrically arranged first arc-shaped portion, a symmetrically arranged second arc-shaped portion and an annular portion with an opening structure, the second arc-shaped portion is located inside the first arc-shaped portion and the two are connected by a first bend, the annular portion is connected to the second arc-shaped portion through the second bend, and the second arc-shaped portion is connected to the corresponding lead tube through the second straight tube and the third bend in turn. The shape design of the heating plate limits the shape of the resistance wire, ensuring uniform energy distribution of the wafer during the heating process. This not only helps to achieve consistent heating effects in various areas on the wafer, but also avoids wafer quality problems caused by local overheating or insufficient overheating. Uniform heating can also reduce thermal stress inside the wafer and prevent deformation or cracking of the wafer due to thermal expansion and contraction.

[0031] As a preferred implementation provided in this embodiment, there is a first spacing between the first bending portions; there is a second spacing between the second bending portions, and the second spacing is greater than the first spacing, which helps to optimize the current distribution on the entire resistance wire and reduce local overheating and energy loss.

[0032] As a preferred embodiment provided by this embodiment, the first bent portion includes first bent tubes arranged at both ends of the first straight tube, one of the first bent tubes is connected to the first curved portion, and the other first bent tube is connected to the second curved portion. This not only enhances the overall structural strength of the resistance wire, but also improves its stability in high temperature environments and reduces deformation or damage caused by thermal expansion and contraction. The second bent portion is an arc-shaped tube, which increases the contact area between the resistance wire and the top structure of the heating plate, thereby improving heat dissipation efficiency. This helps to reduce the operating temperature of the resistance wire, extend its service life, and reduce energy loss. The third bent portions extending into the annular portion have an inwardly expanding spacing between them, which helps to optimize current distribution. Each third bent portion includes a short tube, a third straight tube, and a third bent tube connected in sequence, wherein the short tube is connected to the second straight tube, and the third bent tube is connected to the lead tube. The straight tubes are spaced parallel to each other. This structure can guide the current to flow more evenly through the resistance wire, reduce local overheating and energy loss, and improve energy efficiency.

[0033] As a preferred embodiment provided by this example, the first arc-shaped portion, the second arc-shaped portion, and the annular portion have the same center. The entire resistance wire structure exhibits a high degree of symmetry, which helps ensure uniformity and stability during heating. The shared center design simplifies the design and manufacturing process of the resistance wire. Designers can more easily determine the size and shape of the arc-shaped portions, while manufacturers can use standardized tools and molds to produce these portions, thereby improving production efficiency and reducing costs.

[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A coil used in a wafer heating base, characterized in that: It includes a heating plate formed by winding a heating tube body and a lead tube, a resistance wire is built into the heating plate, and a resistance wire conductor is built into the lead tube; the heating plate includes a symmetrically arranged first arc portion, a symmetrically arranged second arc portion and an annular portion with an opening structure, the second arc portion is located inside the first arc portion and the two are connected by a first bending portion, and there is a first spacing between the first bending portions; the annular portion is connected to the second arc portion respectively through the second bending portion, and there is a second spacing between the second bending portions, and the second spacing is greater than the first spacing.

2. The coil used in the wafer heating base according to claim 1, characterized in that: The heating plate and the lead tube are arranged vertically.

3. The coil used in the wafer heating base according to claim 1, characterized in that: The first arc-shaped portion, the second arc-shaped portion, and the annular portion have the same center.

4. The coil used in the wafer heating base according to claim 1, characterized in that: The first bending portion includes first curved tubes arranged at both ends of the first straight tube, wherein one of the first curved tubes is connected to the first arc portion, and the other first curved tube is connected to the second arc portion.

5. The coil used in the wafer heating base according to claim 1, characterized in that: The second bending portion is an arc-shaped tube.

6. The coil used in the wafer heating base according to claim 1, characterized in that: The second arc portion is connected to the corresponding lead tube through the second straight tube and the third bent portion in sequence.

7. The coil used in the wafer heating base according to claim 4, characterized in that: There is an inwardly expanding spacing between the third bending portions extending into the annular portion. Each third bending portion includes a short tube, a third straight tube, and a third bent tube connected in sequence, wherein the short tube is connected to the second straight tube, and the third bent tube is connected to the lead tube.

8. The coil used in the wafer heating base according to claim 7, characterized in that: There are parallel intervals between the first straight tubes and between the third straight tubes.

9. The coil used in the wafer heating base according to claim 1, characterized in that: The space between the heating tube and the resistance wire is filled with magnesium oxide powder.

10. The coil used in the wafer heating base according to claim 1, characterized in that: The heating tube body is made of 316L or Incoloy800.

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