Heat dissipation structure and LED lamp

Abstract

The utility model discloses a heat dissipation structure and an LED lamp, and the heat dissipation structure comprises a metal substrate which is provided with a first surface and a second surface which are opposite to each other in the thickness direction; the insulating layer is arranged on the first surface of the metal substrate; the flat cable layer is arranged on the surface of one side, far away from the metal substrate, of the insulating layer; the mounting area penetrates through the insulating layer and the flat cable layer; the heating device is placed in the mounting area and is in direct contact with the first surface of the metal substrate; the size of the heating device is smaller than that of the installation area, and a gap is formed between the outer edge of the heating device and the edge of the installation area. According to the utility model, the mounting areas are arranged on the insulating layer and the flat cable layer, and the heating devices are arranged in the mounting areas and are directly connected with the metal substrate, so that the heat dissipation performance of the heat dissipation structure is improved, and the size of the heat dissipation structure is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LED module structure setting, in particular to a heat dissipation structure and an LED lamp. Background Art

[0002] As the power of light-emitting components in LED lamps continues to increase, the requirements for the heat dissipation performance of LED lamps are also increasing. The existing technology for the various structural settings of LED lamps either uses an insulating layer and a circuit layer to embed the substrate and set the light-emitting components thereon, or provides a boss on the substrate and places the light-emitting components on the boss. The above structural settings have the defect of heat storage and inability to dissipate heat in time, resulting in poor heat dissipation performance of the LED lamp, which in turn affects its service life. Utility Model Content

[0003] In view of the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is how to improve the heat dissipation performance of the heat dissipation structure.

[0004] In order to solve at least one of the above-mentioned technical problems, the present invention discloses a heat dissipation structure and an LED lamp.

[0005] According to one aspect of the present disclosure, a heat dissipation structure and an LED lamp are provided, comprising:

[0006] a metal substrate having a first surface and a second surface facing each other in a thickness direction;

[0007] an insulating layer, the insulating layer being disposed on the first surface of the metal substrate;

[0008] a wiring layer, the wiring layer being disposed on a surface of the insulating layer away from the metal substrate;

[0009] a mounting area, the mounting area penetrating the insulating layer and the wiring layer;

[0010] A heating device is placed inside the mounting area and in direct contact with the first surface of the metal substrate; the size of the heating device is smaller than the size of the mounting area, and a gap is formed between the outer edge of the heating device and the edge of the mounting area.

[0011] In some possible embodiments, the gap width ranges from 0.1 mm to 2 mm.

[0012] In some possible embodiments, a gap formed between an outer edge of the heating element and an edge of the mounting area is filled with fixing glue.

[0013] In some possible embodiments, the thickness of the heating device is greater than or equal to the height from the side surface of the wiring layer away from the metal substrate to the first surface of the metal substrate.

[0014] In some possible embodiments, a surface of the heating element that contacts the first surface of the metal substrate is made of an insulating material.

[0015] In some possible embodiments, a surface of the heating device away from the first surface of the metal substrate is electrically connected to the wiring layer through a bonding metal wire.

[0016] In some possible embodiments, the heat dissipation structure further includes a mounting hole, and the mounting hole passes through the metal substrate, the insulating layer, and the wiring layer.

[0017] In some possible embodiments, the heat dissipation structure further includes a heat dissipation device; and the heat dissipation device is disposed on the second surface of the metal substrate.

[0018] In some possible embodiments, the heating device is fixed to the first surface of the metal substrate through a die bonding process.

[0019] According to a second aspect of the present disclosure, there is provided an LED lamp, comprising: the heat dissipation structure described in any one of the above items, wherein the heat-generating device is an LED module.

[0020] The implementation of this utility model has the following beneficial effects:

[0021] In the present invention, the heat dissipation structure includes a metal substrate, an insulating layer, a wiring layer, a mounting area and a heating device; the mounting area is set to pass through the insulating layer and the wiring layer, so that the heating device can be placed inside the mounting area and directly contact the first surface of the metal substrate, so that the heat generated by the heating device can be directly conducted to the metal substrate and then transmitted to the outside, thereby improving the heat dissipation performance of the heat dissipation structure; at the same time, the heating device is embedded in the mounting area, which can reduce the size of the heat dissipation structure; in addition, the size of the heating device is set to be smaller than the size of the mounting area, and a gap is formed between the outer edge of the heating device and the edge of the mounting area, so that the heating device can be in direct contact with the insulating layer and / or the wiring layer, so that heat is conducted to the insulating layer and / or the wiring layer, thereby further improving the heat dissipation performance. On the basis of improving the heat dissipation performance, the service life of the heat dissipation structure can be further improved, and the impact of heat accumulation on the heat dissipation structure can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solution of the present invention, the following will briefly introduce the drawings required for use in the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 A first partial side view corresponding to a heat dissipation structure provided by an embodiment of the present utility model;

[0024] Figure 2 A first partial top view corresponding to a heat dissipation structure provided by an embodiment of the present utility model;

[0025] Figure 3 A second partial side view corresponding to a heat dissipation structure provided by an embodiment of the present utility model;

[0026] Figure 4 A second partial top view corresponding to a heat dissipation structure provided by an embodiment of the present utility model;

[0027] Among them, the figures are marked as: 1-metal substrate, 2-insulating layer, 3-wiring layer, 4-mounting area, 5-heating device, 6-bonding metal wire, 7-mounting hole. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this utility model.

[0029] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0030] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise indicated.

[0031] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0032] The term "and / or" herein simply describes an association relationship between associated objects, indicating that three relationships can exist. For example, "A and / or B" can represent the existence of three situations: A alone, A and B simultaneously, and B alone. Furthermore, the term "at least one" herein refers to any combination of at least two of any one or more of a plurality of items. For example, "at least one of A, B, and C" can represent any one or more elements selected from the set consisting of A, B, and C.

[0033] In addition, numerous specific details are provided in the following detailed description to better illustrate the present disclosure. Those skilled in the art will appreciate that the present disclosure can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art are not described in detail in order to highlight the main points of the present disclosure.

[0034] Figure 1 Shows a first partial side view of a heat dissipation structure and an LED lamp; see Figure 1 , a heat dissipation structure and an LED lamp may include:

[0035] A metal substrate 1 having a first surface and a second surface facing each other in a thickness direction;

[0036] an insulating layer 2, the insulating layer 2 being disposed on the first surface of the metal substrate 1;

[0037] a wiring layer 3, the wiring layer 3 being disposed on a surface of the insulating layer 2 away from the metal substrate 1;

[0038] A mounting area 4, the mounting area 4 passes through the insulating layer 2 and the wiring layer 3;

[0039] A heating device 5 is placed inside the mounting area 4 and in direct contact with the first surface of the metal substrate 1; the heating device 5 is fixed to the first surface of the metal substrate 1 by a die bonding process;

[0040] The size of the heating device 5 is smaller than the size of the installation area 4 , and a gap is formed between the outer edge of the heating device 5 and the edge of the installation area 4 .

[0041] In a specific embodiment, the metal substrate 1 has good thermal conductivity. To improve the heat dissipation performance of the heat dissipation structure, a metal substrate can be selected as the substrate of the heat dissipation structure. Specifically, the metal substrate 1 can be a copper substrate or a substrate of other metal materials, and the selection can be based on specific needs.

[0042] As for the mounting area 4, it penetrates the insulating layer 2 and the wiring layer 3 to form a first hole on the insulating layer 2 and a second hole on the wiring layer 3; in order to facilitate the packaging of the heat dissipation structure and the installation of the heating device 5, the position, shape and size of the first hole on the insulating layer 2 can be set to be the same as the position, shape and size of the second hole on the wiring layer 3. The specific position, shape and size can be designed according to specific needs in combination with the heating device 5, and the present invention does not impose any restrictions; for example, the first hole is set to be a square hole with a side length of x, and the intersection of its diagonals is the center point of the insulating layer 2, then the second hole is also set to be a square hole with a side length of x, and the intersection of its diagonals is the center point of the wiring layer 3.

[0043] Regarding the insulation layer 2 and the wiring layer 3, the insulation layer 2 provides electrical insulation, preventing disconnection between the wiring layers 3 and the metal substrate 1, thereby ensuring circuit safety. The wiring layer 3 is a conductive layer that carries current. Since the first and second holes are clearly defined during design, a protective layer (such as a mask) can be applied to the metal substrate 1 based on the locations of the first and second holes. This ensures that the insulating layer 2 corresponding to the first hole is not covered by the insulation layer 2, and the wiring layer 3 corresponding to the second hole is not covered by the wiring layer 3 during subsequent heat dissipation structure processing. This ensures that the first surface of the metal substrate 1 is not covered by any structure.

[0044] Regarding the heating device 5, the heating device 5 in the heat dissipation structure can be any device that can generate heat and / or has heat dissipation requirements, such as an LED module lamp. The heating device 5 can be set inside the installation area 4. Since the installation area 4 passes through the insulating layer 2 and the wiring layer 3, and the first surface of the metal substrate 1 is not covered with any structure, the heating device 5 can be in direct contact with the first surface of the metal substrate 1. In order to improve the stability of the fixing of the heating device 5, a solid crystal process can be used to achieve a fixed connection between the heating device 5 and the metal substrate 1; thereby, the heat generated by the heating device 5 can be directly transferred to the metal substrate 1, and then transferred to the outside of the heat dissipation structure through the metal substrate 1.

[0045] Since the heating device 5 is arranged inside the mounting area 4, its size should be smaller than or equal to the size of the mounting area 4. In the present utility model, in order to facilitate the installation and replacement of the heating device 5 and prevent the heat generated by the heating device 5 from being conducted to the wiring layer 3 and the insulating layer 2 due to direct contact, the size of the heating device 5 is set to be smaller than the size of the mounting area 4, and a gap is formed between the outer edge of the heating device 5 and the edge of the mounting area 4.

[0046] In addition, since the heating device 5 is arranged inside the installation area 4, it can be understood that the installation area 4 is used to accommodate the heating device 5, and the shape and size of the installation area 4 should match the structure and size of the heating device 5. In specific applications, the shape and size of the installation area 4 can change with the change of the structure and size of the heating device 5; for example, when the heating device 5 is a rectangular structure with a size of m*n, the installation area 4 can be a rectangular structure with a size of (m+k)*(n+l), where l and k are the gap widths, l and k can be equal or unequal, and the specific size can be determined when the heat dissipation structure is designed.

[0047] Figure 2 A first partial top view corresponding to a heat dissipation structure provided by an embodiment of the present utility model is shown as follows: Figure 2 As shown, the width of the gap formed between the outer edge of the heating device 5 and the edge of the mounting area 4 is 0.1-2 mm, and the gap formed between the outer edge of the heating device 5 and the edge of the mounting area 4 is filled with fixing glue.

[0048] In a specific embodiment, the gap formed between the outer edge of the heating element 5 and the edge of the mounting area 4 can have a size range of 0.1 mm to 2 mm, preferably 0.65 mm. The gap formed between the outer edge of the heating element 5 and the edge of the mounting area 4 can, on the one hand, prevent the heating element 5 from directly contacting the insulating layer 2 and the wiring layer 3, thereby preventing heat conduction and affecting the heat dissipation effect. On the other hand, it can further limit the position of the heating element 5 within the mounting area 4 in combination with the fixing glue, thereby further strengthening the fixing of the heating element 5 to the metal substrate 1.

[0049] Specifically, fixing glue can be filled between the gap formed by the outer edge of the heating device 5 and the edge of the mounting area 4, and the amount of fixing glue used is determined according to the size of the gap; when the heating device 5 is large in size, the gap width is also relatively large, and more fixing glue can be filled in the gap to achieve the limitation of the heating device 5. When the heating device 5 is small in size, the gap width is also relatively small, and a small amount of fixing glue can be filled in the gap, thereby reducing the manufacturing cost of the heat dissipation structure; at the same time, in addition to limiting the heating device 5, the setting of the fixing glue can also provide a certain buffering effect to the heating device 5, thereby reducing the influence of external stress (such as side stress, vibration lamp) on the structure and position of the heating device 5.

[0050] Furthermore, the thickness of the heating element 5 is greater than or equal to the height from the side surface of the wiring layer 3 away from the metal substrate 1 to the first surface of the metal substrate 1 .

[0051] In a specific embodiment, the thickness of the heating device 5 can be equal to the height from the side surface of the wiring layer 3 away from the metal substrate 1 to the first surface of the metal substrate 1, so that the upper surface of the heating device 5 is flush with the upper surface of the wiring layer 3, which is convenient for the packaging of the heat dissipation structure, thereby reducing the space occupied by the protrusion of the heating device 5 during the packaging process of the heat dissipation structure; wherein, the upper surface mentioned in the present invention is the side surface away from the metal substrate 1.

[0052] In another specific embodiment, the thickness of the heating element 5 can be set to be slightly greater than the height from the side surface of the wiring layer 3 away from the metal substrate 1 to the first surface of the metal substrate 1, such as Figure 1 As shown; the thickness of the heating device 5 can be higher than the height from the side surface of the wiring layer 3 away from the metal substrate 1 to the first surface of the metal substrate 1. The size can be designed according to specific needs, and the present invention does not impose any restrictions; for example, the thickness of the heating device 5 can be higher than the height from the side surface of the wiring layer 3 away from the metal substrate 1 to the first surface of the metal substrate 1 by 0.01mm to 3mm.

[0053] Furthermore, Figure 3 A second partial side view corresponding to a heat dissipation structure provided by an embodiment of the present utility model; Figure 3 As shown, the heating element 5 has an insulating surface on the side in contact with the first surface of the metal substrate 1. The side of the heating element 5 away from the first surface of the metal substrate 1 is electrically connected to the wiring layer 3 via a bonding wire 6.

[0054] In a specific embodiment, the surface of the heating device 5 on the side in contact with the first surface of the metal substrate 1 is made of an insulating material. Specifically, the surface of the heating device 5 on the side in contact with the first surface of the metal substrate 1 can be set as a heat dissipation pad with no electrical properties. A die bonding process is used between the heat dissipation pad and the first surface of the metal substrate 1 to achieve a fixed connection between the heating device 5 and the metal substrate 1 to ensure the safety of the heat dissipation structure.

[0055] In addition, the side surface of the heating device 5 away from the first surface of the metal substrate 1, that is, the upper surface of the heating device 5, can be electrically connected to the wiring layer 3. Specifically, bonding wires 6 can be used to achieve the electrical connection between the upper surface of the heating device 5 and the wiring layer 3. The electrical signal of the wiring layer 3 can be transmitted to the heating device 5 through the bonding wires 6, so that the heating device 5 performs the corresponding operation, such as making the LED module emit light. The electrical connection between the heating device 5 and the wiring layer 3 can also use other conductive connection materials and can be designed according to specific needs.

[0056] Figure 4 A second partial top view corresponding to a heat dissipation structure provided by an embodiment of the present utility model; Figure 4 As shown, the heat dissipation structure further includes a mounting hole 7 , which passes through the metal substrate 1 , the insulating layer 2 and the wiring layer 3 .

[0057] In a specific embodiment, the provision of mounting holes 7 can facilitate the installation of the heat dissipation structure. For example, two mounting holes 7 can be provided, with mounting holes 7 extending through and symmetrically located at both ends of the mounting area 4. The mounting holes 7 extend through the metal substrate 1, the insulating layer 2, and the wiring layer 3, and are symmetrically located at two ends of the mounting area 4 or the heating element 5. The mounting holes 7 can be used to securely connect the heat dissipation structure to other structures. Furthermore, the present invention does not impose any restrictions on the location, shape, or number of mounting holes 7.

[0058] In addition, the heat dissipation structure further includes a heat dissipation device; the heat dissipation device is arranged on the second surface of the metal substrate 1 .

[0059] In a specific embodiment, in order to further improve the heat dissipation performance of the heat dissipation structure and further improve the heat dissipation efficiency of the heating device 5, a heat dissipation device can be provided on the second surface of the metal substrate 1. Although the specific position of the heat dissipation device is not shown in the figure, it can be understood that the heat dissipation device can be provided on the second surface of the metal substrate 1 and embedded in the metal substrate 1. Other settings that can realize the heat dissipation device being provided on the second surface of the metal substrate 1 can also be selected. The present invention does not impose any restrictions on this. The heat generated by the heating device 5 can be directly conducted to the metal substrate 1. On the one hand, the heat is conducted to the outside through the metal substrate 1. On the other hand, the heat is further dissipated in cooperation with the heat dissipation device, thereby improving the heat dissipation efficiency of the heating device 5 and extending the service life of the heating device 5.

[0060] According to another aspect of the present invention, an LED lamp is also disclosed. The LED lamp includes the heat dissipation structure described above, and the heating device 5 is an LED module.

[0061] In a specific embodiment, the heat dissipation structure is provided in the LED lamp, which can facilitate the heat dissipation of the LED module to extend the service life of the LED lamp; and the LED module is embedded in the installation area 4, which can save the internal space of the LED lamp and realize the compact design of the LED lamp.

[0062] According to the embodiments provided by the above-mentioned utility model, it can be seen that in the utility model, the heat dissipation structure includes a metal substrate, an insulating layer, a wiring layer, a mounting area and a heating device; the mounting area is set to pass through the insulating layer and the wiring layer, so that the heating device can be placed inside the mounting area and directly contact the first surface of the metal substrate, so that the heat generated by the heating device can be directly conducted to the metal substrate, and then transmitted to the outside, so as to improve the heat dissipation performance of the heat dissipation structure; at the same time, the heating device is embedded in the mounting area, which can reduce the size of the heat dissipation structure; in addition, the size of the heating device is set to be smaller than the size of the mounting area, and a gap is formed between the outer edge of the heating device and the edge of the mounting area, so that the heating device can be in direct contact with the insulating layer and / or the wiring layer, so that the heat is conducted to the insulating layer and / or the wiring layer, thereby further improving the heat dissipation performance.

[0063] It should be noted that the various embodiments of the present disclosure have been described above. The above description is exemplary and not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles, practical applications, or technical improvements to the market of the various embodiments, or to enable other persons skilled in the art to understand the various embodiments disclosed herein.

Claims

1. A heat dissipation structure, characterized in that: include: a metal substrate having a first surface and a second surface facing each other in a thickness direction; an insulating layer, the insulating layer being disposed on the first surface of the metal substrate; a wiring layer, the wiring layer being disposed on a surface of the insulating layer away from the metal substrate; a mounting area, the mounting area penetrating the insulating layer and the wiring layer; A heating device is placed inside the mounting area and in direct contact with the first surface of the metal substrate; the size of the heating device is smaller than the size of the mounting area, and a gap is formed between the outer edge of the heating device and the edge of the mounting area.

2. The heat dissipation structure according to claim 1, characterized in that: The gap width ranges from 0.1 mm to 2 mm.

3. The heat dissipation structure according to claim 1, characterized in that: A gap formed by the outer edge of the heating element and the edge of the mounting area is filled with fixing glue.

4. The heat dissipation structure according to claim 1, characterized in that: The thickness of the heating element is greater than or equal to the height from the side surface of the wiring layer away from the metal substrate to the first surface of the metal substrate.

5. The heat dissipation structure according to claim 1, characterized in that: The surface of the heating element that contacts the first surface of the metal substrate is made of insulating material.

6. The heat dissipation structure according to claim 5, characterized in that: A surface of the heating element that is away from the first surface of the metal substrate is electrically connected to the wiring layer through a bonding metal wire.

7. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further includes a mounting hole, which passes through the metal substrate, the insulating layer, and the wiring layer.

8. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further includes a heat dissipation device; the heat dissipation device is arranged on the second surface of the metal substrate.

9. The heat dissipation structure according to claim 1, characterized in that: The heating element is fixed to the first surface of the metal substrate through a die-bonding process.

10. An LED lamp comprising the heat dissipation structure according to any one of claims 1 to 9, characterized in that: The heating device is an LED module.

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