Wafer appearance detection equipment
By integrating front and back inspection modules into wafer appearance inspection equipment, the problem of low inspection efficiency in the existing technology is solved, and efficient inspection is achieved without flipping or replacing the handling module.
Patent Information
- Application Number
- CN202421971150.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-08-14
AI Technical Summary
Existing wafer inspection equipment is inefficient when inspecting the front and back sides of wafers and requires flipping or the use of additional devices, which cannot meet the needs of large-scale inspection.
A wafer appearance inspection device is designed that integrates front and back inspection modules. The transport module transfers between the wafer cassette, front inspection module, and back inspection module, enabling inspection without flipping or replacing the transport module, thus simplifying the inspection process.
It improves the efficiency of wafer inspection, simplifies the inspection process, and meets the needs of large-scale inspection.
Smart Images
Figure CN223377219U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of wafer inspection technology, and in particular to a wafer appearance inspection device. Background Art
[0002] During the wafer production process, the appearance of the wafer needs to be inspected to ensure the accuracy and reliability of subsequent inspections and actual use of the wafer. Currently, the appearance inspection of wafers generally includes front inspection, back inspection, side inspection, and edge inspection, etc. In related technologies, the industry's common wafer inspection equipment generally only has a front inspection function. If the back of the wafer is to be inspected, the wafer needs to be flipped or an additional back inspection device needs to be used to inspect the wafer. This results in low overall inspection efficiency and cannot meet the needs of larger-scale inspection and production. Utility Model Content
[0003] Based on this, it is necessary to provide a wafer appearance inspection device that does not require replacement of the handling module during front-side inspection and back-side inspection, thereby simplifying the inspection process and improving inspection efficiency.
[0004] A wafer appearance inspection device includes a front inspection module, a back inspection module, a wafer box module and a handling module; the front inspection module is used to inspect the front side of the wafer, the back inspection module is used to inspect the back side of the wafer, the wafer box module is used to store wafers, the front inspection module, the back inspection module and the wafer box module are respectively arranged on the peripheral sides of the handling module, and the handling module is used to transport wafers between the wafer box module, the front inspection module and the back inspection module.
[0005] It can be understood that the wafer appearance inspection equipment integrates a front inspection module and a back inspection module, and the handling module transports the wafers in the wafer box module to realize front inspection and back inspection respectively; and, there is no need to replace the handling module or inspection device during the front inspection and back inspection, nor is there a need to flip the wafer, which simplifies the inspection process and improves the inspection efficiency.
[0006] In some embodiments, the back-side detection module includes a first light source, a supporting platform and a first image collector, the first light source is used to emit illumination light to the back side of the wafer, the supporting platform is constructed with a through hole for the illumination light to be incident on the back side of the supported wafer, and the first image collector is arranged below the supporting platform and adapted to the through hole, and is used to collect imaging light from the back side of the wafer.
[0007] In some embodiments, the back detection module further includes a reflective bowl, one end of which is connected to the collection end of the first image collector, and the other end of which is connected to the light source, and the reflective bowl is arranged to be tapered from the supporting platform to the collection end along the axial direction of the through hole.
[0008] In some embodiments, the wafer appearance inspection equipment also includes an EFEM system and an inspection system, which are arranged adjacent to or spaced apart; the back inspection module, the wafer material box module and the handling module are all installed in the EFEM system, and the front inspection module is installed in the inspection system.
[0009] In some embodiments, the detection system includes a second movable component and a detection base, the front detection module includes a second image collector, the second image collector is arranged above the detection base, the detection base is arranged on the second movable component, and moves relative to the second image collector under the action of the second movable component.
[0010] In some embodiments, the EFEM system further includes an alignment module, which is used to calibrate the wafer posture before detection, and the transport module is used to transport the calibrated wafer to the front detection module and / or the back detection module for appearance inspection.
[0011] In some embodiments, the alignment module includes an alignment base having a first axis and a third image collector, wherein the third image collector is disposed above the alignment base, and the alignment base is configured to rotate around the first axis in response to acquisition information of the third image collector.
[0012] In some embodiments, the transport module includes a first moving component and a picking component provided on the first moving component. Under the action of the first moving component, the picking component can flow between the wafer box module, the front detection module and the back detection module.
[0013] In some embodiments, the pickup assembly includes at least a pickup support seat and a plurality of adsorption members, the pickup support seat is configured with a notch, and the plurality of adsorption members are spaced apart on the pickup support seat and arranged around the outer periphery of the notch.
[0014] In some embodiments, the wafer material box module includes a loading platform, a material box carrier and a positioning component, and the material box carrier is limited to the loading platform by the positioning component. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0016] Figure 1 A top view of a wafer appearance inspection device provided in one embodiment of the present application;
[0017] Figure 2 A schematic diagram of a wafer appearance inspection device provided in one embodiment of the present application;
[0018] Figure 3 A partial schematic diagram of a backside inspection module in a wafer appearance inspection device provided in one embodiment of the present application;
[0019] Figure 4 A cross-sectional view of a backside inspection module in a wafer appearance inspection device provided in one embodiment of the present application.
[0020] Reference numerals: 10, front detection module; 11, second image collector; 12, second light source; 20, back detection module; 21, second housing; 22, carrier platform; 23, first image collector; 24, first light source; 25, reflective bowl; 26, support plate; 27, support arm; 28, air induction member; 29, ion wind rod; 30, wafer cassette module; 31, carrying platform; 32, positioning component; 40, transport module; 41, first moving group Parts; 42. Picking component; 43. Robotic arm; 50. EFEM system; 51. Alignment module; 52. First box; 60. Detection system; 61. Second moving component; 62. Detection base; 63. Third box; 70. Interaction module; 210. Second window; 211. Extension section; 212. Partition; 213. Bottom plate; 214. Air outlet; 215. Air inlet; 420. Notch; 2110. Extension cavity; 2120. Air outlet. DETAILED DESCRIPTION
[0021] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.
[0022] It should be noted that when a component is referred to as being "fixed to" or "provided on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.
[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.
[0024] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.
[0025] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.
[0026] See also Figure 1 and Figure 2 One embodiment of the present application provides a wafer appearance inspection device, comprising a front inspection module 10, a back inspection module 20, a wafer magazine module 30, and a handling module 40. The front inspection module 10 is used to inspect the front side of the wafer, the back inspection module 20 is used to inspect the back side of the wafer, and the wafer magazine module 30 is used to store the wafers. The front inspection module 10, the back inspection module 20, and the wafer magazine module 30 are respectively arranged on the periphery of the handling module 40. The handling module 40 is used to transport wafers between the wafer magazine module 30, the front inspection module 10, and the back inspection module 20.
[0027] In actual use, the transport module 40 can transport the wafers in the wafer cassette module 30 to the front inspection module 10 for front inspection, and then transport the wafers after front inspection to the back inspection module 20 for back inspection. During the entire process, there is no need to replace the transport module 40, nor to replace the inspection equipment, and there is no need to flip the wafer. Therefore, the wafer appearance inspection equipment integrates the front inspection module 10 and the back inspection module 20, and the transport module 40 can transport the wafers in the wafer cassette module 30 to realize front inspection and back inspection respectively; moreover, there is no need to replace the transport module 40 during front inspection and back inspection, which simplifies the inspection process and improves inspection efficiency.
[0028] Alternatively, the wafers in the wafer magazine module 30 may be first moved to the backside inspection module 20, and then moved to the frontside inspection module 10 after backside inspection. After both frontside and backside inspections are completed, the wafers may be moved to the wafer magazine module 30 for collection, or the inspected wafers may be transported to other unloading locations or unloading modules.
[0029] In some specific embodiments, the front detection module 10 and the back detection module 20 are respectively arranged on both sides of the transport module 40 along the X-axis direction, and the wafer material box module 30 is arranged on the same side as the back detection module 20 and is spaced apart along the Y-axis direction. Among them, the wafer material box module 30 can also be set into two and spaced apart along the Y-axis direction, where one wafer material box module 30 is used to provide wafers to be inspected, and the other wafer material box module 30 is used to collect wafers after inspection. Alternatively, the front detection module 10 and the wafer material box module 30 are respectively arranged on both sides of the transport module 40 along the X-axis direction, and the back detection module 20 is arranged on one side of the transport module 40 along the Y-axis direction. This is only for illustration.
[0030] Please continue reading Figure 1 and Figure 2 Exemplarily, the wafer appearance inspection equipment also includes an EFEM (Equipment Front End Modules) system 50 and an inspection system 60, which are arranged adjacent to or spaced apart from each other. The backside inspection module 20, wafer cassette module 30, and handling module 40 are all installed in the EFEM system 50, and the frontside inspection module 10 is installed in the inspection system 60.
[0031] The EFEM system 50 primarily includes a wafer loader, a wafer handling robot, and an alignment module 51. During semiconductor production, wafers frequently need to be switched between environments with varying degrees of cleanliness. During these transitions, it is necessary to ensure that the wafers are protected from adhesion and impact by particles. Therefore, the wafer loader serves as the input and output for wafer environmental conversion, enabling wafer transport between the production workshop's tracks and the wafer appearance inspection equipment. The wafer handling robot is used to pick up wafers and transport them between different workstations. This wafer handling robot can be the aforementioned handling module 40.
[0032] Both the wafer cassette module 30 and the backside inspection module 20 are detachably connected to the EFEM system 50, facilitating installation and replacement. For example, when the backside inspection module 20 is needed, it can be installed in the EFEM system 50; when it is no longer needed, it can be removed and replaced with another wafer cassette module 30. Both the wafer cassette module 30 and the backside inspection module 20 are installed on the side of the EFEM system 50 facing away from the inspection system 60, thereby preventing interference with the inspection system 60 and the frontside inspection module 10 caused by the installation and removal of the wafer cassette module 30 and the backside inspection module 20 relative to the EFEM system 50.
[0033] Alternatively, only the backside inspection module 20 may be detachably connected to the EFEM system 50 ; or only the wafer cassette module 30 may be detachably connected to the EFEM system 50 .
[0034] like Figure 1 and Figure 2 As shown, in actual use, the EFEM system 50 and the detection system 60 are arranged along the X-axis as an example. The EFEM system 50 includes a first housing 52 that encloses a first cavity. The first housing 52 has two first windows spaced apart along the Y-axis and connected to the first cavity on one side of the first housing 52 facing away from the detection system 60. The backside inspection module 20 includes a second housing 21 that encloses a second cavity. The second housing 21 has a second window 210 connected to the second cavity. The second window 210 is positioned toward and connected to one of the first windows. This facilitates the transfer module 40 to transfer wafers within the first housing 52 from the first and second windows 210 to the second housing 21.
[0035] Furthermore, the detection system 60 includes a third box 63 that encloses a third cavity. The sides of the third box 63 and the first box 52 that face each other can be opened to allow the third cavity to communicate with the first cavity, facilitating the transfer module 40 to transfer wafers between the first and third cavities. Alternatively, the third box 63 can be configured with a third window connected to the third cavity on the side facing the EFEM system 50 along the X-axis direction, and the first box 52 can be configured with a fourth window connected to the first cavity on the side facing the detection system 60 along the X-axis direction. The fourth window is arranged corresponding to and connected to the third window, and the transfer module 40 can transfer wafers between the third cavity and the first cavity through the third and fourth windows. Alternatively, the detection system 60 and the EFEM system 50 can share a single box, i.e., the first box 52 and the third box 63 are an integrated structure. This is merely an example.
[0036] Furthermore, the EFEM system 50 is also connected to an interaction module 70 to facilitate human-computer interaction.
[0037] like Figure 1 As shown, optionally, the alignment module 51 in the EFEM system 50 is used to calibrate the wafer posture, and the handling module 40 can transport the wafer, which has been calibrated by the alignment module 51, to the front inspection module 10 and the back inspection module 20 for appearance inspection. In other words, the handling module 40 can first pick up the wafer from the wafer cassette module 30 and transport it to the alignment module 51 for wafer posture calibration. The handling module 40 then starts up again to pick up the wafer and transport it to the front inspection module 10 for front inspection. After the front inspection, the handling module 40 starts up again to transport the wafer to the back inspection module 20 for back inspection. As mentioned above, the wafer, which has been calibrated by the alignment module 51, can also be first transported to the back inspection module 20, and then the wafer, which has undergone back inspection, can be transported to the front inspection module 10.
[0038] Furthermore, the alignment module 51 includes an alignment base having a first axis and a third image collector. The third image collector is positioned above the alignment base, and the alignment base is configured to rotate about the first axis in response to information captured by the third image collector. It will be understood that the alignment base is used to support and position the wafer, and then the alignment base can rotate about the first axis to drive the wafer. During this process, the third image collector captures image information of the wafer, facilitating adjustment of the wafer to the target position. The third image collector can be a camera.
[0039] In actual use, the edge of the wafer is provided with a notch. Before alignment, the position of the notch is uncertain. Therefore, it is necessary to use the alignment module 51 to locate the position of the notch on the edge of the wafer and rotate the direction of the notch to the specified direction. Among them, the alignment base is constructed with a first adsorption portion to fix the wafer by vacuum adsorption. After the wafer is fixed relative to the alignment base, the third image collector obtains wafer image information, obtains the position of the notch on the edge of the wafer, and then rotates the alignment base by a corresponding angle to adjust the direction of the notch to the specified direction.
[0040] The specific structure of the alignment module 51 is an existing mature technology and is only illustrated here as an example.
[0041] like Figure 1 and Figure 2 As shown, as some examples, the detection system 60 also includes a second moving component 61 and a detection base 62. The front detection module 10 includes a second image collector 11. The second image collector 11 is arranged above the detection base 62. The detection base 62 is arranged on the second moving component 61 and moves relative to the second image collector 11 under the action of the second moving component 61. Among them, the detection base 62 is constructed with a second adsorption portion, which uses the vacuum adsorption of the second adsorption portion to act on the wafer. In actual use, the transport module 40 transports the wafer to the detection base 62, fixes and positions it via the detection base 62; then, the second moving component 61 drives the detection base 62 to move to adjust its position relative to the second image collector 11; and during the detection process, the wafer can also be driven to move to capture multiple segments of image information to improve detection accuracy.
[0042] The second moving assembly 61 includes an X-axis linear module and a Y-axis linear module to achieve movement along the X-axis and Y-axis directions. The second image collector 11 can also be a camera. In actual use, the front detection module 10 also includes a second light source 12 for illuminating the capture field of view of the second image collector 11.
[0043] See also Figures 1 to 4In some optional embodiments, the backside inspection module 20 includes a first light source 24, a support platform 22, and a first image collector 23. The first light source 24 is used to emit illumination light toward the backside of the wafer. The support platform 22 is configured with a through-hole for illumination light to enter the backside of the supported wafer. The first image collector 23 is located below the support platform 22 and aligns with the through-hole to collect imaging light from the backside of the wafer. Specifically, the first light source 24 is used to illuminate the wafer and the field of view of the first image collector 23. The first light source 24 is an annular light source to minimize blind spots. The annular light source is arranged around the through-hole in the support platform 22 and is located on the outer periphery of the through-hole to ensure a wide illumination range. The first light source 24 includes a diffuse reflector and multiple LEDs mounted on the diffuse reflector. The direct illumination direction of the LEDs is set at an angle of, for example, 0°-45° relative to the support platform 22, and can be, for example, 0°, 15°, 28°, 36°, or 45°. The wafer is supported and positioned on the carrier 22. The backside of the wafer is fully exposed to the field of view of the first image collector 23 through the through-hole, facilitating backside inspection of the wafer. The first image collector 23 is used to capture image information of the wafer backside, enabling backside appearance inspection of the wafer. The first image collector 23 can utilize a high-resolution area array metrology camera. A macro lens is also connected to the acquisition end of the first image collector 23 for adjusting the imaging focal length.
[0044] like Figure 3 and Figure 4 As shown, backside inspection module 20 further includes a reflector 25. One end of reflector 25 is connected to the acquisition end of first image collector 23, and the other end is connected to a light source. Reflector 25 is arranged to taper along the axis of the through hole from support platform 22 toward the acquisition end. In other words, reflector 25 reflects the illumination light from first light source 24, providing more uniform and stable illumination of the wafer backside, thereby improving the illumination effect.
[0045] In actual use, the back detection module 20 also includes a support plate 26 connected to the second box body 21, the reflective bowl 25 is supported on the support plate 26, and the support plate 26 is connected to a support arm 27 extending downward, and the support arm 27 is connected to the first image collector 23 and the macro lens to realize the assembly and support of the first image collector 23 and the macro lens.
[0046] Furthermore, the carrier 22 includes a carrier substrate and at least two adsorption forks provided on the carrier substrate. The aforementioned through-hole is provided through the carrier substrate, and the at least two adsorption forks are spaced apart around the axis of the through-hole. Each adsorption fork is constructed with a limiting step, and the limiting step has a horizontally arranged step surface and a vertically arranged limiting surface, and the step surface is constructed with an adsorption groove. The wafer is supported on the step surface, and the adsorption groove is used to vacuum adsorb the wafer. Each adsorption fork is also connected to a linear drive mechanism, such as a cylinder, for driving the corresponding adsorption fork to reciprocate along the radial direction of the through-hole, so as to use the limiting surface to press against the edge of the wafer to improve the fixing effect.
[0047] At the same time, the carrier substrate is also connected to an adjustment component for adjusting the horizontality of the carrier substrate. The adjustment component may include a bolt and a nut, the bolt passing through the nut and connected to the carrier substrate, and the carrier substrate overlaps the upper surface of the nut. By rotating the nut, it can be moved back and forth along the axial direction of the bolt (i.e., the Z-axis direction), thereby driving the carrier substrate to move and achieve horizontality adjustment. Of course, there are multiple groups of adjustment components, which are arranged at intervals around the axis of the through hole. The bottom of the bolt is connected to a base, and the bolt and the base can be spherically matched, so that the bolt can produce a small angle of deflection when the nut is adjusted, thereby reducing the deformation of the carrier substrate. This is just an example.
[0048] Please continue to combine Figure 3 and Figure 4 Exemplarily, the back detection module 20 also includes an ion wind rod 29 and an air induction member 28 arranged in the second box body 21, and the two are staggered along the X-axis direction. The ion wind rod 29 is located obliquely above the carrier platform 22, and is used to blow ion wind to the wafer on the carrier platform 22, thereby neutralizing the charge on the wafer and playing a role in eliminating static electricity. The ion wind rod 29 is arranged obliquely relative to the carrier platform 22 to facilitate the ion wind to fully contact the charge on the wafer and improve the neutralization effect. The air induction member 28 is located obliquely below the carrier platform 22, and is used to pump the neutralized ion wind and discharge it. Among them, an extension section 211 extends upward from the top of the second box body 21, and the extension section 211 is surrounded by an extension cavity 2110 connected to the second cavity, and an air inlet 215 connected to the extension cavity 2110 is left at the end of the extension section 211. The ion wind rod 29 is arranged at the connection between the extension cavity 2110 and the second cavity, so that the ion wind is mixed with the fresh air flow sent in through the air inlet 215. The bottom of the second housing 21 is provided with a bottom plate 213, which is configured with a plurality of spaced-apart air outlets 214. Above the bottom plate 213 is a partition plate 212, to which the air inducing member 28 is mounted, and the partition plate 212 is configured with an air outlet 2120.
[0049] In actual use, the fresh air flow introduced through the air inlet 215 mixes with the ionized air and fully acts on the wafers on the carrier 22. The air then flows downward under the action of the air induction member 28, passes through the air outlet 2120 and the air induction member 28, and flows to the air outlet 214, and is discharged through the air outlet 214. The air outlet 214 can also be used to dissipate heat from the electrical structure in the second housing 21.
[0050] As mentioned above, the wafer magazine module 30 is used to store wafers, and the transport module 40 is required to pick up wafers from the wafer magazine module 30. Figure 1 and Figure 2 As shown, in some embodiments, the wafer magazine module 30 includes a loading platform 31, a magazine carrier, and a positioning component 32. The magazine carrier is limited to the loading platform 31 by the positioning component 32. The loading platform 31 is connected to the aforementioned EFEM system 50 and is used to support the magazine carrier. The magazine carrier is used to carry the magazine loaded with wafers and is limited to the loading platform 31 by the positioning component 32 to ensure stability when taking and placing wafers. The positioning component includes a positioning clamping arm provided on the loading platform 31 and a fixed clamping block provided on the magazine carrier. The extended end of the fixed clamping block is configured with a hook back portion, and the fixed clamping block is fixed to the positioning clamping arm by the hook back portion. At the same time, the positioning component also includes a positioning column provided on the loading platform 31 and a positioning block provided on the magazine carrier. The positioning block is configured with a socket, and the positioning column can be plugged into the positioning block through the socket for positioning. A plurality of positioning blocks are provided and arranged at intervals, and each positioning block corresponds to a positioning column. In this way, the magazine carrier can be positioned relative to the mounting platform 31, making it easier for the transport module 40 to pick up and place the wafer.
[0051] like Figure 1 and Figure 2 As shown, in some specific embodiments, the interactive module 70 includes an operating keyboard and a display. Image information captured by the first image collector 23, the second image collector 11, and the third image collector is transmitted to the interactive module 70 and displayed on the display for easy viewing by the operator. The operating keyboard also facilitates the operator's input of operational commands and control. Furthermore, both the EFEM system 50 and the detection system 60 include an electrical control box, located below, which houses the electrical components.
[0052] See also Figure 1Exemplarily, the transport module 40 includes a first moving component 41 and a picking component 42 provided on the first moving component 41. The picking component 42 can flow between the wafer box module 30, the front detection module 10 and the back detection module 20 under the action of the first moving component 41. Among them, the first moving component 41 also includes an X-axis linear module and a Y-axis linear module, and the first moving component 41 also includes a Z-axis linear module, which facilitates the picking component 42 to carry the wafer and move along the X-axis direction, the Y-axis direction and the Z-axis direction, so as to realize the transport, placement and removal of the wafer between various modules. Among them, each linear module is an existing mature technology and will not be described in detail here. Alternatively, the first moving component 41 can also be a six-axis robotic arm.
[0053] Furthermore, the pick-up assembly 42 at least includes a pick-up support seat and a plurality of adsorption members, the pick-up support seat is constructed with a notch 420, and the plurality of adsorption members are arranged at intervals on the pick-up support seat and arranged around the outer peripheral side of the notch 420. The pick-up support seat is connected to the first moving assembly 41. For example, the X-axis linear module may be connected to the power output end of the Y-axis linear module, the Z-axis linear module may be connected to the power output end of the X-axis linear module, and the pick-up support seat may be connected to the power output end of the Z-axis linear module. The adsorption member is provided for vacuum adsorption of wafers to reduce wear on the wafers. The notch 420 on the pick-up support seat is provided to reduce the interference of the pick-up assembly 42 with other structures when placing and picking up wafers, such as reducing the interference between the pick-up assembly 42 and the alignment module 51. The notch 420 is provided in a semicircular shape. When the alignment module 51 uses a calibrator to calibrate the wafer posture, the semicircular notch 420 just matches the periphery of the calibrator, and the center of the semicircular notch 420 coincides with the center of the calibrator.
[0054] In actual use, the pickup support is plate-shaped. The magazine for storing wafers has a storage cavity and multiple support platforms within the cavity. The multiple support platforms are grouped in pairs and together define a support surface. The multiple groups of support platforms are spaced apart along the Z-axis, with each group of support platforms configured to support a single wafer. Therefore, the plate-shaped pickup support can fit neatly into the gap between any two adjacent groups of support platforms to absorb the corresponding wafer.
[0055] like Figure 1 As shown, further, the transport module 40 further includes a robotic arm 43 connected between the first moving component 41 and the picking component 42. The robotic arm 43 can be rotated by the picking component 42 to improve operational flexibility. The robotic arm 43 is a multi-axis robotic arm.
[0056] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0057] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.
Claims
1. A wafer appearance inspection device, characterized in that: It comprises a front detection module (10), a back detection module (20), a wafer cassette module (30) and a transport module (40); The front detection module (10) is used to detect the front of the wafer, the back detection module (20) is used to detect the back of the wafer, and the wafer box module (30) is used to store the wafer; The front detection module (10), the back detection module (20), and the wafer material box module (30) are respectively arranged on the peripheral side of the conveying module (40), and the conveying module (40) is used to convey the wafers between the wafer material box module (30), the front detection module (10), and the back detection module (20).
2. The wafer appearance inspection device according to claim 1, characterized in that: The back detection module (20) includes a first light source (24), a carrier platform (22) and a first image collector (23), wherein the first light source (24) is used to emit illumination light to the back of the wafer, the carrier platform (22) is configured with a through hole for the illumination light to be incident on the back of the wafer, and the first image collector (23) is arranged below the carrier platform (22) and adapted to the through hole, and is used to collect imaging light from the back of the wafer.
3. The wafer appearance inspection equipment according to claim 2, characterized in that: The back detection module (20) further comprises a reflective bowl (25), one end of the reflective bowl (25) being connected to the collecting end of the first image collector (23), the other end of the reflective bowl (25) being connected to the first light source (24), and the reflective bowl (25) being arranged to gradually shrink from the supporting platform (22) to the collecting end along the axial direction of the through hole.
4. The wafer appearance inspection device according to claim 1, characterized in that: The wafer appearance inspection device includes an EFEM system (50) and a detection system (60), which are arranged adjacently or spaced apart; The backside detection module (20), wafer cassette module (30) and handling module (40) are all installed in the EFEM system (50), and the frontside detection module (10) is located in the detection system (60).
5. The wafer appearance inspection device according to claim 4, characterized in that: The detection system (60) further comprises a second movable component (61) and a detection base (62); the front detection module (10) comprises a second image collector (11); the second image collector (11) is arranged above the detection base (62); the detection base (62) is arranged on the second movable component (61) and moves relative to the second image collector (11) under the action of the second movable component (61).
6. The wafer appearance inspection device according to claim 4, characterized in that: The EFEM system (50) further comprises an alignment module (51), wherein the alignment module (51) is used to calibrate the wafer posture, and the transport module (40) is used to transport the calibrated wafer to the front detection module (10) and / or the back detection module (20) for appearance inspection.
7. The wafer appearance inspection device according to claim 6, characterized in that: The alignment module (51) comprises an alignment base having a first axis and a third image collector, wherein the third image collector is arranged above the alignment base, and the alignment base is configured to rotate around the first axis in response to collection information of the third image collector.
8. The wafer appearance inspection device according to claim 1, characterized in that: The transport module (40) includes a first moving component (41) and a picking component (42) provided on the first moving component (41); the picking component (42) can flow between the wafer box module (30), the front detection module (10) and the back detection module (20) under the action of the first moving component (41).
9. The wafer appearance inspection device according to claim 8, characterized in that: The pickup assembly (42) comprises at least a pickup support seat and a plurality of adsorption members, wherein the pickup support seat is provided with a notch (420), and the plurality of adsorption members are arranged at intervals on the pickup support seat and are arranged around the outer periphery of the notch (420).
10. The wafer appearance inspection device according to claim 1, characterized in that: The wafer material box module (30) comprises a carrying platform (31), a material box carrier and a positioning component (32), and the material box carrier is limited to the carrying platform (31) by the positioning component (32).