Test fixture and test device
The performance of magnetic thin film absorbing materials is evaluated through test fixtures and probes of printed circuit board structures, which solves the problems of tearing and high cost of traditional test fixtures, realizes efficient and accurate performance evaluation and simplifies the test process.
Patent Information
- Application Number
- CN202422599840.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-10-25
AI Technical Summary
Traditional test fixtures are difficult to meet the testing requirements of magnetic thin film absorbing materials, are prone to tearing and high costs, and the testing process is complicated and tedious, affecting efficiency.
The test fixture adopts a printed circuit board structure, including a top layer, a dielectric layer and a bottom layer. The top layer is placed with absorbing material, and the microstrip line is connected to the connector. The absorbing performance is evaluated by signal radiation and the signal strength received by the probe. The combination of identification lines and metal plating improves the bonding quality and conductive performance.
It achieves more accurate performance evaluation, simplifies test steps, reduces damage risk, saves costs, extends service life and improves test efficiency.
Smart Images
Figure CN223377231U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of absorbing material testing, and more particularly, to a testing fixture and a testing device. Background Art
[0002] Magnetic thin film absorbing material is a new type of material with a series of characteristics such as low strength, light weight, good temperature resistance and reliable performance. It is increasingly widely used in the aerospace manufacturing industry.
[0003] However, as the aerospace manufacturing industry places increasingly higher demands on its products, traditional test fixtures are unlikely to meet the testing requirements for magnetic thin-film absorbing materials. For example, using traditional fixtures to test magnetic thin-film absorbing materials faces many challenges, especially when the film surface is relatively tough, which can easily cause tearing during the test, resulting in insufficient accuracy in the test results. In addition, traditional test fixtures are typically bulky and have high requirements for probes. Constructing such a test fixture requires a significant investment in construction costs, and the testing process of traditional test fixtures is often complex and cumbersome, which seriously affects the testing efficiency of magnetic thin-film absorbing materials. Therefore, there is an urgent need to explore more advanced test fixtures to ensure that the performance of magnetic thin-film absorbing materials can be accurately evaluated while improving test efficiency. Utility Model Content
[0004] The present application provides a test fixture and a test device that can more accurately evaluate the performance of absorbing materials and improve test efficiency.
[0005] In a first aspect, a test fixture is provided, comprising: a printed circuit board and at least one connector; the printed circuit board is composed of a stack of a top layer, a dielectric layer, and a bottom layer, wherein an absorbing material is placed on the top layer, the top layer includes a microstrip line, and the microstrip line is connected to the at least one connector; the dielectric layer is made of an insulating material; and the bottom layer includes a ground line.
[0006] The microstrip line enables the top layer to radiate a signal, and the signal strength after the signal passes through the absorbing material is used to test the absorbing performance of the absorbing material.
[0007] The test fixture provided in the embodiment of the present application can more accurately evaluate the performance of the absorbing material and improve the efficiency of the test. In addition, the test fixture has a simple structure. When used for testing, the test steps can be simplified and the test difficulty can be reduced, thereby saving test costs.
[0008] In combination with the first aspect, in some implementations of the first aspect, a plurality of marking lines are provided on the upper surface of the top layer, the intervals between the plurality of marking lines are preset values, and the absorbing material is placed at the locations of the plurality of marking lines.
[0009] In the embodiment of the present application, a plurality of marking lines are provided on the upper surface of the top layer to clearly mark the attachment position of the absorbing material, so that the absorbing material can be well attached to the top layer, thereby improving the attachment quality of the absorbing material. On the other hand, the tester can quickly identify and locate the attachment area of the absorbing material, reducing the time consumption during the material attachment process, thereby further improving the testing efficiency.
[0010] In combination with the first aspect, in certain implementations of the first aspect, the upper surface of the top layer is covered by a metal plating layer.
[0011] In the embodiments of the present application, a metal coating is applied to the top surface of the top layer, which can prevent the printed circuit board from oxidizing during prolonged use, thereby extending the service life of the test fixture. Furthermore, the metal coating can effectively improve the conductivity of the top layer's solder joints and contact points, ensuring efficient signal transmission on the top layer and reducing signal loss and interference.
[0012] In combination with the first aspect, in certain implementations of the first aspect, the top layer and the bottom layer have the same thickness, and the dielectric layer has a thickness greater than that of the top layer and the bottom layer.
[0013] In combination with the first aspect, in some implementations of the first aspect, the printed circuit board is rectangular, the long side of the rectangle is 30 centimeters long, and the short side of the rectangle is 20 centimeters long.
[0014] In combination with the first aspect, in some implementations of the first aspect, the absorbing material is a magnetic thin film absorbing material.
[0015] In a second aspect, a test device is provided, comprising: a test fixture and a test probe; the test fixture comprises: a printed circuit board and at least one connector; the printed circuit board is composed of a stack of a top layer, a dielectric layer, and a bottom layer, the top layer is provided with an absorbing material, the top layer comprises a microstrip line, the microstrip line is connected to the at least one connector, the dielectric layer is made of an insulating material, and the bottom layer comprises a ground line; the test probe tests the signal strength of a signal after passing through the absorbing material, the signal being generated by the top layer.
[0016] The test device provided in the embodiments of the present application can more accurately evaluate the performance of absorbing materials and improve test efficiency. In addition, the test device has a simple structure. Through the coordinated use of a test fixture and a test probe, it can simplify test steps and reduce test difficulty, thereby reducing the risk of damage to the absorbing material during the test process and avoiding the problem of physical damage to the absorbing material that may occur in traditional testing methods.
[0017] In combination with the second aspect, in some implementations of the second aspect, a plurality of marking lines are provided on the upper surface of the top layer, the intervals between the plurality of marking lines are preset values, and the absorbing material is placed at the locations of the plurality of marking lines.
[0018] In the embodiment of the present application, a plurality of marking lines are provided on the upper surface of the top layer of the test fixture to clearly mark the pasting position of the absorbing material, so that the absorbing material can be well adhered to the top layer, thereby improving the pasting quality of the absorbing material. On the other hand, the tester can quickly identify and locate the pasting area of the absorbing material, reducing the time consumption during the material pasting process, thereby further improving the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 Schematic diagram of the top structure of the test fixture provided in the embodiment of the present application;
[0020] Figure 2 Schematic diagram of the underlying structure of the test fixture provided in the embodiment of the present application;
[0021] Figure 3 It is a side view of the test fixture provided in an embodiment of the present application. DETAILED DESCRIPTION
[0022] In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In this application, "at least one" refers to one or more, and "more than one" refers to two or more. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc, where a, b, c can be single or multiple.
[0023] In the embodiments of this application, prefixes such as "first" and "second" are used only to distinguish different description objects and have no limiting effect on the position, order, priority, quantity, or content of the described objects. The use of prefixes such as ordinal numbers in the embodiments of this application to distinguish description objects does not constitute a limitation on the described objects. For a statement of the described objects, please refer to the description in the context of the claims or embodiments, and the use of such prefixes should not constitute an unnecessary limitation.
[0024] The technical solution in this application will be described below with reference to the accompanying drawings.
[0025] As a new material, magnetic thin-film absorbers are gaining popularity in a growing number of industries, particularly in the aerospace manufacturing industry, due to their unique performance and superior physical properties. These materials offer numerous significant advantages, including low strength, light weight, excellent temperature resistance, and reliable performance. Given the extremely stringent requirements for lightweight, high-temperature resistance, and high-strength materials in the aerospace industry, magnetic thin-film absorbers offer superior electromagnetic wave absorption without adding additional weight, making them an ideal choice.
[0026] However, as the aerospace manufacturing industry places increasingly higher demands on its products, traditional testing methods are unlikely to meet the testing requirements for magnetic thin-film absorbing materials. For example, using traditional methods to test magnetic thin-film absorbing materials faces many challenges, especially when the film surface is relatively tough, which can easily cause tearing during the test, resulting in insufficient accuracy in the test results. In addition, traditional test fixtures are typically bulky and have high requirements for probes. Constructing such test fixtures requires significant construction costs, and the testing process for traditional test fixtures is often complex and cumbersome, which seriously affects the testing efficiency of magnetic thin-film absorbing materials. Therefore, there is an urgent need to explore more advanced testing tools to ensure that the performance of magnetic thin-film absorbing materials can be accurately evaluated.
[0027] The embodiments of the present application provide a test fixture and a test device that can more accurately evaluate the performance of absorbing materials and improve test efficiency.
[0028] The test fixture provided in an embodiment of the present application includes: a printed circuit board and at least one connector; the printed circuit board is composed of a top layer, a dielectric layer and a bottom layer stacked together, the top layer is used to place an absorbing material, the top layer includes a microstrip line, and the microstrip line is connected to at least one connector; the dielectric layer is made of an insulating material; and the bottom layer includes a ground line.
[0029] The microstrip line enables the top layer to radiate a signal, and the signal strength after the signal passes through the absorbing material is used to test the absorbing performance of the absorbing material. Specifically, when the absorbing material is not attached to the top layer, a cable is inserted into at least one connector, and an electromagnetic signal is transmitted to the microstrip line. At this time, the top layer can radiate a signal. The signal is received by a test probe and a spectrum is plotted, and a first signal strength corresponding to the signal can be obtained. Then, the absorbing material is attached to the top layer, allowing the signal to pass through the absorbing material. The signal after passing through the absorbing material is received by a test probe and a spectrum is plotted, and a second signal strength after passing through the absorbing material can be obtained. By comparing the second signal strength and the second signal strength, the absorbing performance of the absorbing material can be determined. Compared with other complex material performance testing methods, this testing method can simply and effectively evaluate the performance of the absorbing material, and can effectively reduce the risk of damage to the absorbing material during the testing process, avoiding the problem of physical damage to the absorbing material that may occur in traditional testing methods.
[0030] Optionally, the first signal strength and the second signal strength correspond to the same frequency.
[0031] Optionally, the at least one connector may be a subminiature version A (SMA) connector, and the at least one connector may be connected to a cable, and the cable may transmit an electromagnetic signal to the microstrip line through the at least one connector, thereby causing the top layer to radiate the signal.
[0032] Optionally, the absorbing material may be a magnetic thin film absorbing material.
[0033] Optionally, the microstrip line has the same dimensions as the top layer; for example, the length of the microstrip line is the same as the length of the top layer, or the top layer is completely covered with microstrip lines. This design helps reduce signal reflections and electromagnetic interference, improving signal radiation quality. Furthermore, it can help reduce the complexity of test fixture design, lower test fixture manufacturing costs, and improve test fixture production efficiency.
[0034] Optionally, the top and bottom layers have the same thickness, and the dielectric layer is thicker than the top and bottom layers. For example, the top and bottom layers have a thickness of 0.35 mm, and the dielectric layer has a thickness of 1.3 mm. Further, the dielectric layer may be made of fiberglass cloth (FR4).
[0035] Optionally, the printed circuit board may be in any shape. For example, the printed circuit board is rectangular, the long side of the rectangle is 30 cm long, and the short side of the rectangle is 20 cm long.
[0036] The test fixture provided in the embodiment of the present application can more accurately evaluate the performance of the absorbing material and improve the efficiency of the test. In addition, the test fixture has a simple structure. When used for testing, the test steps can be simplified and the test difficulty can be reduced, thereby saving test costs.
[0037] In a possible implementation, a plurality of marking lines are provided on the upper surface of the top layer, the intervals between the plurality of marking lines are preset values, and the absorbing material is placed at the locations of the plurality of marking lines.
[0038] For example, the above preset value is 1 cm.
[0039] In the embodiment of the present application, a plurality of marking lines are provided on the upper surface of the top layer to clearly mark the attachment position of the absorbing material, so that the absorbing material can be well attached to the top layer, thereby improving the attachment quality of the absorbing material. On the other hand, the tester can quickly identify and locate the attachment area of the absorbing material, reducing the time consumption during the material attachment process, thereby further improving the testing efficiency.
[0040] In one possible implementation, the upper surface of the top layer is covered by a metal plating layer.
[0041] Optionally, a metal plating layer may be covered on the upper surface of the top layer using an immersion gold process.
[0042] In the embodiments of the present application, a metal coating is applied to the top surface of the top layer, which can prevent the printed circuit board from oxidizing during prolonged use, thereby extending the service life of the test fixture. Furthermore, the metal coating can effectively improve the conductivity of the top layer's solder joints and contact points, ensuring efficient signal transmission on the top layer and reducing signal loss and interference.
[0043] The following combination Figures 1 to 3 This section introduces the structure of the test fixture in detail.
[0044] like Figure 1 and Figure 2 As shown in the figure, the test fixture is equipped with two SMA connectors. The soldering positions of the two SMA connector ports are located in the center of the two sides of the printed circuit board. The SMA connectors can be used to connect cables, which can transmit electromagnetic signals to the microstrip line through the SMA connectors, thereby causing the top layer to radiate signals. Seven marking lines are set on the top surface of the top layer. Among them, the length of the fourth marking line is longer than that of the other marking lines. The marking lines can be set to 1 cm apart.
[0045] like Figure 3 As shown, the printed circuit board can be formed by stacking a top layer, a dielectric layer, and a bottom layer, wherein the thickness of the top layer and the bottom layer is 0.35 mm, and the thickness of the dielectric layer is 1.3 mm.
[0046] During the test, when the absorbing material is not attached to the top layer, a cable is inserted into the SMA connector and an electromagnetic signal is transmitted to the microstrip line. The top layer can now radiate the signal. The test probe receives this signal and plots a spectrum to obtain the corresponding first signal strength. The absorbing material is then attached to the top layer's marked line. The signal can now pass through the absorbing material. The test probe receives the signal after passing through the absorbing material and plots a spectrum to obtain the second signal strength after passing through the absorbing material. By comparing the second signal strength with the second signal strength, the absorbing material's absorbing performance can be tested.
[0047] An embodiment of the present application also provides a testing device, which includes: a test fixture and a test probe; the test fixture includes: a printed circuit board and at least one connector; the printed circuit board is composed of a top layer, a dielectric layer and a bottom layer stacked together, the top layer is placed with an absorbing material, the top layer includes a microstrip line, the microstrip line is connected to at least one connector, the dielectric layer is made of an insulating material, and the bottom layer includes a ground wire; the test probe tests the signal strength after the signal passes through the absorbing material, and the signal is generated by the top layer.
[0048] The test device provided in the embodiments of the present application can more accurately evaluate the performance of absorbing materials and improve test efficiency. In addition, the test device has a simple structure. Through the coordinated use of a test fixture and a test probe, it can simplify test steps and reduce test difficulty, thereby reducing the risk of damage to the absorbing material during the test process and avoiding the problem of physical damage to the absorbing material that may occur in traditional testing methods.
[0049] In a possible implementation, a plurality of marking lines are provided on the upper surface of the top layer, the intervals between the plurality of marking lines are preset values, and the absorbing material is placed at the locations of the plurality of marking lines.
[0050] For example, the test fixture can be as follows Figures 1 to 3 shown.
[0051] In the embodiment of the present application, a plurality of marking lines are provided on the upper surface of the top layer of the test fixture to clearly mark the pasting position of the absorbing material, so that the absorbing material can be well adhered to the top layer, thereby improving the pasting quality of the absorbing material. On the other hand, the tester can quickly identify and locate the pasting area of the absorbing material, reducing the time consumption during the material pasting process, thereby further improving the test efficiency.
[0052] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.
Claims
1. A test fixture, characterized in that: The test fixture comprises: a printed circuit board and at least one connector; The printed circuit board is composed of a stack of a top layer, a dielectric layer, and a bottom layer, wherein the top layer is provided with an absorbing material, and the top layer includes a microstrip line, and the microstrip line is connected to the at least one connector; The dielectric layer is made of insulating material; The bottom layer includes a ground line.
2. The test fixture according to claim 1, wherein: A plurality of marking lines are arranged on the upper surface of the top layer, the intervals between the plurality of marking lines are preset values, and the absorbing material is placed at the positions of the plurality of marking lines.
3. The test fixture according to claim 1 or 2, wherein: The upper surface of the top layer is covered by a metal plating layer.
4. The test fixture according to claim 1 or 2, wherein: The top layer and the bottom layer have the same thickness, and the dielectric layer has a thickness greater than that of the top layer and the bottom layer.
5. The test fixture according to claim 1 or 2, wherein: The printed circuit board is rectangular, the long side of the rectangle is 30 cm long, and the short side of the rectangle is 20 cm long.
6. The test fixture according to claim 1 or 2, wherein: The wave absorbing material is a magnetic thin film wave absorbing material.
7. A testing device, characterized in that: The device includes: a test fixture and a test probe; The test fixture includes: a printed circuit board and at least one connector; the printed circuit board is composed of a top layer, a dielectric layer, and a bottom layer, the top layer is provided with an absorbing material, the top layer includes a microstrip line, the microstrip line is connected to the at least one connector, the dielectric layer is made of an insulating material, and the bottom layer includes a ground line; The test probe tests the signal strength after the signal passes through the absorbing material, and the signal is generated by the top layer.
8. The testing device according to claim 7, wherein: A plurality of marking lines are arranged on the upper surface of the top layer, the intervals between the plurality of marking lines are preset values, and the absorbing material is placed at the positions of the plurality of marking lines.