Improved structure of probe card circuit substrate

Abstract

The utility model relates to an improved structure of a circuit substrate of a probe card. The structure comprises a circuit substrate, a setting part, a probe card, an outer frame body, a supporting assembly, a positioning guide seat, at least one fixing structure, a reinforcing assembly and a plurality of horizontal adjusting pieces. By means of the structure, when a user operates the probe card, the outer frame body is used for pressing the periphery of the probe card, the supporting assembly is used for pressing the circuit substrate in a large area, and the strengthening assembly is in lap joint with the inner side wall of the outer frame body and combined with the supporting assembly to strengthen the strength of the circuit substrate. As the probe card is fixed on one side of the setting part by using the positioning guide seat, even if the probe card is pushed by external force during operation, the circuit substrate can be prevented from buckling and deforming by using the supporting assembly and the reinforcing assembly, or the level between the probe card and the outer frame body is further finely adjusted by using the horizontal adjusting piece.

Description

Technical field

[0001] The utility model provides an improved structure of the probe card circuit substrate which can increase the structural strength of the probe card circuit substrate and avoid warping and deformation caused by external forces during the testing process. [Background Technology]

[0002] During semiconductor wafer testing, vertical probe cards are used to perform electrical and functional tests to confirm chip yield. Vertical probe cards feature multiple vertically arranged probes. Because they are typically designed to move vertically up and down, these probes may exhibit height differences and be non-coplanar. This can cause abnormal contact impedance during semiconductor wafer testing.

[0003] To address this issue, a conventional approach involves placing a large metal frame around the periphery of the probe card and securing it to the circuit substrate, thereby increasing the strength of the circuit substrate. However, the metal frame is only secured to the periphery of the probe card. During actual testing, the probe card's probes must contact the object under test below, transferring the reaction force exerted by the probe card to the circuit substrate. Furthermore, because the probe card is located in the center of the metal frame and there is no supporting structure between the probe card and the metal frame, this reaction force directly causes deformation of the circuit substrate. For example, when contacting the object under test, the circuit substrate may warp upward. Once the circuit substrate deforms, the probe card tilts, and all probes on the probe card are no longer coplanar.

[0004] How to solve the above problems and deficiencies is the direction that this applicant and related manufacturers engaged in this industry are eager to study and improve. [Utility Model Content]

[0005] In view of the above-mentioned deficiencies, the present application designs an improved structure of the probe card circuit substrate that can increase the structural strength of the probe card circuit substrate and prevent warping and deformation caused by external forces during the testing process.

[0006] The main purpose of the utility model is to utilize a reinforcing component combined with the center of the outer frame to enhance the overall structural strength of the circuit substrate, and utilize a supporting component to press the circuit substrate over a large area to cooperate with the reinforcing component to prevent the circuit substrate from warping and deformation.

[0007] Another main purpose of the present invention is to utilize the design of the level adjustment member to allow the user to fine-tune the levelness between the probe card and the outer frame.

[0008] To achieve the above-mentioned objectives, the present invention comprises a circuit substrate, a mounting portion, a probe card, an outer frame, a support assembly, a positioning guide seat, at least one fixing structure, a reinforcement assembly, and a plurality of level adjustment members. The mounting portion is defined on the circuit substrate, the probe card is mounted on one side of the mounting portion, the outer frame is fixedly mounted on the circuit substrate and surrounds the probe card, the support assembly is mounted on the circuit substrate to press the circuit substrate, and the pressing area of ​​the support assembly is larger than the area of ​​the probe card, the positioning guide seat is mounted on the support assembly and communicates with the mounting portion, the fixing structure is mounted between the support assembly and the circuit substrate to keep the circuit substrate flat against one side of the support assembly, the reinforcement assembly is mounted on the inner sidewall of the outer frame and coupled to the support assembly, and the level adjustment members are movably disposed through the reinforcement assembly and the support assembly to adjust the levelness between the probe card and the outer frame.

[0009] When the user operates the probe card to perform semiconductor testing, in addition to using the outer frame to press the periphery of the probe card, the support component also presses the circuit substrate over a large area. At the same time, the reinforcement component is overlapped with the inner wall of the outer frame and combined with the support component to strengthen the strength of the circuit substrate in the center of the outer frame. At this time, since the probe card is fixed to one side of the setting part using the positioning guide seat, even if it is pushed by external force during operation, the support component and the reinforcement component can be used to prevent the circuit substrate from warping and deformation, or the level adjustment member can be used to fine-tune the level between the probe card and the outer frame to ensure the normal operation of the probe card.

[0010] The above-mentioned technology can overcome the problem that there is no other supporting structure between the conventional probe card and the metal frame, so the reaction force exerted by the probe card during the contact directly causes the circuit substrate to warp upward. Once the circuit substrate is deformed, the probe card will tilt, making it impossible to ensure that all probes on the probe card are coplanar, thereby achieving the practical progress mentioned above.

Brief Description of the Drawings

[0011] Figure 1 It is a three-dimensional diagram of the first preferred embodiment of the utility model.

[0012] Figure 2 This is an exploded view of the first preferred embodiment of the present utility model.

[0013] Figure 3 This is a schematic diagram of the implementation of the first preferred embodiment of the present utility model.

[0014] Figure 4 This is a schematic diagram of the level adjustment of the first preferred embodiment of the present utility model.

[0015] Figure 5 This is an exploded view of the second preferred embodiment of the present invention.

[0016] Figure 6 It is a three-dimensional diagram of the third preferred embodiment of the utility model.

[0017] Figure 7 This is a three-dimensional diagram of the fourth preferred embodiment of the present invention.

[0018] Figure 8 This is a perspective view of the fifth preferred embodiment of the present invention.

[0019] Figure 9 This is an exploded view of the sixth preferred embodiment of the present invention. [Specific implementation method]

[0020] In order to achieve the above-mentioned objectives and effects, the technical means and structures adopted by the present invention are illustrated in detail with reference to the drawings for the preferred embodiments of the present invention, and their features and functions are as follows.

[0021] See also Figures 1 to 4 As shown in the figure, it is a perspective view and a horizontal adjustment schematic diagram of the first preferred embodiment of the utility model. It can be clearly seen from the figure that the utility model includes:

[0022] a circuit substrate 1;

[0023] A setting portion 11 is defined on the circuit substrate 1 for setting a probe card 7;

[0024] an outer frame 2 fixedly mounted on the circuit substrate 1 and surrounding the probe card 7;

[0025] a support assembly 3 disposed on the circuit substrate 1 for pressing the circuit substrate 1, wherein the pressing area of ​​the support assembly 3 is larger than the area of ​​the probe card 7;

[0026] a positioning guide seat 31, disposed on the support assembly 3 and connected to the setting portion 11;

[0027] At least one fixing structure 4 is provided between the supporting component 3 and the circuit substrate 1 so that the circuit substrate 1 is flatly attached to one side of the supporting component 3;

[0028] a reinforcing component 5, disposed on the inner side wall of the outer frame 2 and coupled to the supporting component 3; and

[0029] A plurality of level adjustment members 6 are movably provided through the reinforcing component 5 and the supporting component 3 to adjust the levelness between the probe card 7 and the outer frame 2 .

[0030] Among them, the setting portion 11 is an opening or one of the connectors on the circuit substrate 1, and the present embodiment takes the opening as an example; the probe card 7 is a vertical probe card 7, and is combined with one side of the setting portion 11 by a screw locking method as an example; the outer frame 2 is an example of a metal rectangular frame; the support component 3 is an example of a plastic or metal structure with a bottom flatly attached to the circuit substrate 1, so a flat portion 32 is defined at the bottom of the support component 3; the positioning guide seat 31 is a card seat with a shape corresponding to the probe card 7; the reinforcement component 5 is a metal bracket provided on both sides of the probe card 7, or a metal frame surrounding the probe card 7. The present embodiment takes the metal frame as an example, and the support component 3 and the reinforcement component 5 are two independent structures, and have a plurality of screw holes on the support component 3. The reinforcing component 5 has a plurality of docking portions 51 corresponding to the respective positioning portions 33, so that the supporting component 3 and the reinforcing component 5 can be correspondingly combined; the fixing structure 4 is one of adhesive, a concave-convex fixing structure, or a screw assembly. The present embodiment takes a screw assembly as an example. In addition, the fixing structure 4 in the present embodiment has a pressing portion 41 provided in the docking portion 51, and a screwing portion 42 formed on one side of the pressing portion 41. Since the aperture of the docking portion 51 is larger than the aperture of the positioning portion 33, the pressing portion 41 can be limited in the reinforcing component 5, and the screwing portion 42 in the form of a stud can be used to lock the supporting component 3 and the circuit substrate 1, so that the fixing structure 4 can simultaneously fix the supporting component 3, the reinforcing component 5 and the circuit substrate 1.

[0031] Through the above description, the structure of the present technology can be understood. According to the corresponding cooperation of this structure, the structural strength of the circuit substrate 1 of the probe card 7 can be increased, so as to achieve the advantage of avoiding warping and deformation due to external forces during the test process. It can be clearly seen from the figure that before the user operates the probe card 7 to perform semiconductor testing, the outer frame 2 is pre-set on the circuit substrate 1 outside the setting portion 11, and the support component 3 is used to press the circuit substrate 1 near the setting portion 11 over a large area. At the same time, the reinforcing coupling portion 52 in the form of a locking piece on the reinforcing component 5 is overlapped on the outer frame 2 in a locking manner, so that the inner side wall of the outer frame 2 is in contact with the reinforcing component 5 and connected, and the reinforcing component 5 is combined with the support component 3 to strengthen the strength of the circuit substrate 1 in the center of the outer frame 2, and the probe card 7 is fixed to one side of the setting portion 11 using the positioning guide seat 31. In this way, even if the probe card 7 is pushed by external force during operation, the presence of the support component 3 can utilize the large-area pressing design of its flat portion 32 to disperse the reaction force received by the probe card 7 to the entire support component 3, and the thickness of the support component 3 can be used to reduce the extent of the warping of the circuit substrate 1. At the same time, due to the presence of the reinforcement component 5, the structural strength of the outer frame 2 is extended to the support component 3, so that the circuit substrate 1 can lean on the strong reinforcement component 5 to effectively prevent the circuit substrate 1 from warping and deformation. Even if warping still occurs, it will not be obvious. The horizontal adjustment member 6 can be further used to push the circuit substrate 1 from top to bottom from the reinforcement component 5, thereby fine-tuning the level of the probe card 7 and the outer frame 2. Maintaining a level with the outer frame 2 is equivalent to maintaining a level machine, thereby ensuring the normal operation of the probe card 7.

[0032] Also refer to Figure 52 and 3. As shown in FIG, it is an exploded view of the second preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is similar to the first preferred embodiment, except that at least one limiting groove 21 is provided on the outer frame 2, at least one limiting block 22 is protruded on the inner wall of the outer frame 2, and the reinforcing component 5 has a plurality of reinforcing joints 52 fixed with the limiting groove 21, wherein the limiting block 22 is formed at the lower edge of the inner wall as an example to support the outer wall of the supporting component 3 and / or the reinforcing component 5, and the limiting groove 21 is a notch or a stepped groove surrounded by the upper surface and the inner surface of the outer frame 2. The embodiment was used as an example before, and is respectively located on the opposite side walls of the rectangular outer frame 2, so the reinforcing joints 52 can be implemented in the form of a lug. In this way, not only can the height of the reinforcing component 5 be reduced and the surface flatness of the outer frame 2 and the reinforcing component 5 be improved, but also while the outer frame 2 and the reinforcing component 5 are combined by fixing components such as screws or pins at the reinforcing joint 52, the side walls of the limiting groove 21 are used to abut the outer edge of the reinforcing joint 52 to assist in the stability of the fixing components. In this embodiment, the reinforcing joint 52 is respectively provided at the two side walls of the reinforcing component 5 adjacent to the outer frame 2, so that the supporting effect of the limiting groove 21 on the reinforcing joint 52 can come from the four directions of front, back, left and right at the same time, and cooperate with the limiting block 22 to abut the support component 3 and / or the reinforcing component 5 from the lower edge, so that their setting position can be further stabilized to prevent displacement.

[0033] Also refer to Figure 6 The figure shows a perspective view of a third preferred embodiment of the present invention. As can be clearly seen from the figure, this embodiment is largely similar to the first preferred embodiment, except that at least one extension arm 53 is provided on at least one side of the reinforcement assembly 5 for attachment to the outer frame 2. The extension arm 53 is generally C-shaped, with one on each side being used as an example in this embodiment. If the length of the reinforcement assembly 5 is shorter than the distance between the inner walls of the outer frame 2, only one side of the reinforcement joint on the reinforcement assembly 5 may be able to overlap and secure with the outer frame 2. In this case, the reinforcement assembly 5 can be replaced with an extension arm 53. The extension arm 53 can be used to extend the length of the reinforcement assembly 5 and engage with the locking hole on the outer frame 2. Of course, the extension arm 53 also has an extension joint 531 corresponding to the locking hole on the outer frame 2. This allows the reinforcement assembly 5 to be adapted for outer frames 2 of varying sizes.

[0034] Also refer to Figure 7The figure shows a perspective view of a fourth preferred embodiment of the present invention. As can be clearly seen from the figure, this embodiment differs from the second and third preferred embodiments in that at least one limiting groove 21 is provided on the outer frame 2, at least one limiting block 22 is formed as a protrusion on the inner sidewall of the outer frame 2, and at least one extending arm 53 is provided on at least one side of the reinforcing assembly 5. Each extending arm 53 has at least one extending engagement portion 531 that is fixed to the limiting groove 21. In this way, when the extending arm 53 is used to overlap the outer frame 2, it can also engage with the limiting groove 21, thereby reducing the height of the reinforcing assembly 5, improving the smoothness of the surfaces of the outer frame 2 and the reinforcing assembly 5, and enhancing the stability of the connection between the support assembly 3 and the circuit substrate 1. Furthermore, the reinforcing assembly 5 is adaptable to outer frames 2 of varying sizes.

[0035] Also refer to Figure 8 FIG. 1 is a perspective view of a fifth preferred embodiment of the present invention. As can be clearly seen from the figure, this embodiment is similar to the fourth preferred embodiment, except that the support assembly 3 and the reinforcement assembly 5 are integrally formed, so that the entire assembly is made of metal. This eliminates the need for screws for fixing the support assembly 3 and the reinforcement assembly 5. Therefore, the fixing structure between the support assembly 3 and the circuit substrate 1 is fixed by adhesive instead, which also simplifies the bonding process with the circuit substrate 1. If the reinforcement assembly 5 has an extension arm 53, it can also be integrally formed. As shown in the figure, in this embodiment, the support assembly 3 and the reinforcement assembly 5 both include portions of the extension arm 53.

[0036] Also refer to Figure 9 FIG. 1 shows an exploded view of a sixth preferred embodiment of the present invention. As can be clearly seen from the figure, this embodiment is substantially similar to the above-described embodiments, except that the reinforcement assembly 5 includes at least one first connecting portion 54, and the extension arm 53 includes a removable second connecting portion 532 that mates with the first connecting portion 54. The second connecting portion 532 is a notch or groove on the extension arm 53, while the first connecting portion 54 is a bump on the reinforcement assembly 5. During manufacture, the reinforcement assembly 5 can be modularized into fixed sizes. When used with a larger or larger outer frame 2, the correspondingly sized extension arm 53 can be replaced. The first connecting portion 54 and the second connecting portion 532 are of the same size. This not only allows the reinforcement assembly 5 to be used with outer frames 2 of varying sizes, but also avoids stockpiling reinforcement assemblies 5 of multiple sizes, reducing storage costs.

[0037] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made using the contents of the description and drawings of the present invention should be included in the patent scope of the present invention.

Claims

1. An improved structure of a probe card circuit substrate, characterized in that: It includes: a circuit substrate; A setting portion is defined on the circuit substrate for setting a probe card; An outer frame is fixed on the circuit substrate and surrounds the periphery of the probe card; a supporting component disposed on the circuit substrate for pressing the circuit substrate, wherein the pressing area of ​​the supporting component is larger than the area of ​​the probe card; A positioning guide seat is provided on the supporting assembly and is connected to the setting portion; At least one fixing structure is provided between the support assembly and the circuit substrate, so that the circuit substrate is flatly attached to one side of the support assembly; a reinforcing component, disposed on the inner side wall of the outer frame and coupled to the supporting component; and A plurality of level adjustment pieces are movably arranged in the strengthening component and the supporting component to adjust the levelness between the probe card and the outer frame.

2. The improved structure of the probe card circuit substrate according to claim 1, wherein: The supporting component is provided with a plurality of positioning parts, and the reinforcing component is provided with a plurality of docking parts corresponding to each of the positioning parts.

3. The improved structure of the probe card circuit substrate according to claim 2, characterized in that: The fixing structure comprises a pressing portion arranged in the docking portion and a screw-engaging portion formed on one side of the pressing portion.

4. The improved structure of the probe card circuit substrate according to claim 1, wherein: The outer frame is provided with at least one limiting groove, and the reinforcing component is provided with a plurality of reinforcing joints fixed with the limiting groove.

5. The improved structure of the probe card circuit substrate according to claim 1, wherein: At least one limiting block is protruded from the inner side wall of the outer frame.

6. The improved structure of the probe card circuit substrate according to claim 1, wherein: At least one side of the strengthening component has at least one extension arm for being arranged on the outer frame.

7. The improved structure of the probe card circuit substrate according to claim 4, characterized in that: At least one side of the reinforcing component is provided with at least one extension arm, and the extension arm is provided with at least one extension joint portion fixed to the limiting groove.

8. The improved structure of the probe card circuit substrate according to claim 1, wherein: The supporting component and the reinforcing component are formed as one piece.

9. The improved structure of the probe card circuit substrate according to claim 8, wherein: The supporting component and the reinforcing component are made of metal.

10. The improved structure of the probe card circuit substrate according to claim 6, wherein: The reinforcing component has at least one first connecting portion, and the extending arm has a detachable second connecting portion correspondingly combined with the first connecting portion.

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