Testing device
By setting insulating and metal through-holes in the guide plate structure of the probe card, a current diversion path is provided, which solves the abnormal problems of the probe caused by high temperature, fatigue, etc., and improves the success rate and efficiency of wafer testing.
Patent Information
- Application Number
- CN202421709458.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-07-15
- Filing Date
- 2024-07-18
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-07-18
AI Technical Summary
During wafer testing, probe burnout, bent probes, and other abnormalities caused by high temperature, metal fatigue, contamination, or deformation can severely impact test time and reliability, especially during high-density, high-current chip testing.
A test device is designed, comprising a guide plate structure, a shunt structure, and multiple probes. The guide plate structure is provided with through holes made of insulating and metallic materials, through which the probes are inserted to provide a current shunt path, thereby avoiding excessive current or open circuit problems caused by probe abnormalities.
The design of the shunt structure prevents probe ablation or open circuit due to excessive current, ensures the stability and reliability of electrical testing, and improves the success rate and efficiency of testing.
Smart Images
Figure CN223377437U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a testing device, and more particularly to a testing device related to a probe card. Background Art
[0002] In traditional wafer testing, test signals are input into the integrated circuit (IC) of the device under test (DUT). This is achieved by using multiple tiny probes on a probe card to contact the pads (or bumps) of the DUT. Test signals are then sent from the test machine through the probes and pads (or bumps) to the IC. After being processed by the IC, the test signals are fed back to the test machine via the probes. Finally, the test machine analyzes the feedback signals to achieve wafer test results.
[0003] Furthermore, in recent years, chip design has been trending towards higher density and higher current. This demand has led to a significant increase in chip operating temperature, along with the current density. However, during wafer testing, test equipment uses 150mA to 2A current through probes to perform electrical tests. Due to electrical heating (high temperature), metal fatigue, contamination, or deformation, the probes can experience transient overcurrent, leading to burnout and bending problems, seriously impacting both processing time and reliability.
[0004] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be solved urgently. Utility Model Content
[0005] In view of the various deficiencies of the above-mentioned prior art, the present application provides a testing device, comprising: a guide plate structure; a shunt structure, which is combined with the guide plate structure; and a plurality of probes, which pass through the guide plate structure and the shunt structure, wherein the shunt structure contacts a portion of the plurality of probes to provide a current shunt path.
[0006] In the aforementioned testing device, one side of the guide plate structure is used to connect to the circuit board, and the other side is used to connect to the object under test.
[0007] In the aforementioned testing device, the guide plate structure includes a first guide plate and a second guide plate. The first guide plate and the second guide plate are arranged parallel to each other and separated by a gap.
[0008] In the aforementioned testing device, the first guide plate is provided with a plurality of first openings, and the second guide plate is provided with a plurality of second openings. The plurality of first openings respectively correspond to the plurality of second openings to slidably accommodate the plurality of probes.
[0009] In the aforementioned testing device, each probe includes a travel segment and a testing segment and a transition segment extending from both sides of the travel segment; the travel segment is located in the gap between the first guide plate and the second guide plate, and the travel segment is curved and has the function of absorbing external forces and travel; the testing segment extends from one end of the travel segment through the first guide plate for connection to the object under test; the transition segment extends from the other end of the travel segment through the second guide plate for connection to the circuit board.
[0010] In the aforementioned testing device, the diversion structure is disposed in the first guide plate or between the first guide plate and the second guide plate.
[0011] In the aforementioned testing device, the shunt structure defines at least one first area and at least one second area. The at least one first area is made of insulating material and has multiple first through holes, and the at least one second area is made of metal material and has multiple second through holes, so that the multiple probes can pass through the multiple first through holes and the multiple second through holes.
[0012] In the aforementioned testing device, the probes passing through the first through holes are used for signal testing, and the probes passing through the second through holes are used for power testing.
[0013] Through the implementation of the present application, the testing device includes a guide plate structure, a shunt structure combined with the guide plate structure, and multiple probes passing through the guide plate structure and the shunt structure. The shunt structure is mainly added inside or outside the guide plate structure. If a current-related abnormality occurs, the metal material in the shunt structure can contact part of the multiple probes to provide a current shunt path, thereby avoiding abnormalities in the probes themselves that cause excessive current to pass through and cause burning, or the probes being open and affecting the electrical test results. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1A and Figure 1B This is a cross-sectional diagram of the application of the first embodiment of the testing device of the present application.
[0015] Figure 2 Schematic top view of the shunt structure of the testing device of the present application.
[0016] Figure 3A and Figure 3B This is a cross-sectional diagram of the application of the second embodiment of the testing device of the present application.
[0017] Main component symbols
[0018] 1 Test equipment
[0019] 11 Guide plate structure
[0020] 111 First guide plate
[0021] 1110 First opening
[0022] 1120 Second opening
[0023] 112 Second guide plate
[0024] 113 Gap
[0025] 12,12' probe
[0026] 121 travel segments
[0027] 122 test segment
[0028] 123 transfer segment
[0029] 13 Diversion structure
[0030] 131 First Area
[0031] 1310 First Through Hole
[0032] 132 Second Area
[0033] 1320 Second Through Hole
[0034] 2 Circuit Boards
[0035] 3 Object under test. DETAILED DESCRIPTION
[0036] The following describes the implementation of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.
[0037] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.
[0038] See also Figure 1A and Figure 1B , which is a cross-sectional view of the application of the first embodiment of the test device 1 of the present application. The test device 1 includes: a guide plate structure 11, a plurality of probes 12 and a diversion structure 13.
[0039] One side of the guide plate structure 11 is connected to a circuit board 2, and the other side is connected to a device under test (DUT) 3. A plurality of probes 12 are disposed within the guide plate structure 11 and electrically connected to the circuit board 2 to transmit test signals to the DUT 3. The DUT 3 is, for example, a wafer or chip.
[0040] In this embodiment, the guide plate structure 11 includes a first guide plate 111 and a second guide plate 112. The first guide plate 111 and the second guide plate 112 are arranged parallel to each other and separated by a gap 113. The first guide plate 111 defines a plurality of first openings 1110, and the second guide plate 112 defines a plurality of second openings 1120. The first openings 1110 correspond to the second openings 1120. The first openings 1110 and the second openings 1120 can be aligned or offset with each other to slidably accommodate the plurality of probes 12.
[0041] The plurality of probes 12 are, for example, vertical probes. Each of the probes 12 includes a travel section 121 and a testing section 122 and a transition section 123 extending from both sides of the travel section 121. The travel section 121 is located in the gap 113 between the first guide plate 111 and the second guide plate 112. The travel section 121 is curved and has the function of absorbing external force and travel.
[0042] The test section 122 extends from one end of the travel section 121, passes through the first guide plate 111, and connects to the DUT 3. The test section 122 contacts the pads or bumps on the DUT 3 (wafer / chip), thereby eliciting DUT signals. This DUT signal data is then sent to the test equipment for analysis and evaluation.
[0043] The transition section 123 extends from the other end of the travel section 121 and passes through the second guide plate 112 to connect to the circuit board 2 .
[0044] Please also refer to Figure 2The shunt structure 13 is disposed within the first guide plate 111 to contact the test sections 122 of the plurality of probes 12. In this embodiment, the shunt structure 13 is a plate-shaped structure, which defines at least one first region 131 and at least one second region 132 (one first region 131 and three second regions 132 are shown in this embodiment), and is provided with a plurality of first through holes 1310 and a plurality of second through holes 1320, respectively, for the plurality of probes 12 to pass through. The first region 131 of the shunt structure 13 is made of an insulating material and has a plurality of first through holes 1310, wherein the probes 12 passing through the plurality of first through holes 1310 are used for testing signals. In addition, the second region 132 of the shunt structure 13 is made of a metal material and has a plurality of second through holes 1320, wherein the probes 12 passing through the plurality of second through holes 1320 are used for power supply testing.
[0045] The diversion structure 13 of this embodiment is disposed in the first guide plate 111 , which has the advantage of preventing the problem of short circuit caused by coating shedding and adhesion of external particles.
[0046] like Figure 1A As shown, in an application scenario, if one or part of the probes 12' are damaged and have high impedance, the shunt structure 13 provided in the first guide plate 111 can contact other undamaged probes 12 to shunt the current to other undamaged probes 12, thereby avoiding the aforementioned ablation problem of the damaged probes 12'.
[0047] like Figure 1B As shown, in another application scenario, if one or part of the probes 12' is open circuit and no current flows through, the shunt structure 13 provided in the first guide plate 111 can contact other probes 12 to shunt the current to the aforementioned probes 12', so that current can flow through the aforementioned probes 12'.
[0048] See also Figure 3A and Figure 3B , which is a schematic cross-sectional view of the application of the second embodiment of the testing device of the present application. This embodiment is substantially the same as the previous embodiment, and the similarities are not repeated here. The main difference is that the diversion structure 13 of this embodiment is disposed between the first guide plate 111 and the second guide plate 112 and contacts the travel section 121 of the probe 12.
[0049] The shunt structure 13 in this embodiment is a metal film structure, and its top view is as follows: Figure 2As shown, a first area 131 and a second area 132 are also defined, wherein the material forming the first area 131 is an insulating material and has a plurality of first through holes 1310, and the probes 12 passing through the plurality of first through holes 1310 are used for testing signals, and the material forming the second area 132 is a metal material and has a plurality of second through holes 1320, and the probes 12 passing through the plurality of second through holes 1320 are used for power supply testing.
[0050] The diversion structure 13 in this embodiment is disposed between the first guide plate 111 and the second guide plate 112 , which has the advantages of low cost and easy replacement.
[0051] like Figure 3A As shown, if one or part of the probes 12' is damaged and leads to high impedance, the shunt structure 13 provided between the first guide plate 111 and the second guide plate 112 can shunt the current to other undamaged probes 12, thereby avoiding the aforementioned ablation problem of the damaged probes 12'. Figure 3B As shown, if one or part of the probes 12 ′ is open circuit and no current flows through, the shunt structure 13 disposed between the first guide plate 111 and the second guide plate 112 can shunt the current to the probes 12 ′, so that current can flow through the probes 12 ′.
[0052] Therefore, the testing device of the present application includes a guide plate structure, a shunt structure combined with the guide plate structure, and multiple probes passing through the guide plate structure and the shunt structure. The shunt structure is mainly added inside or outside the guide plate structure. If a current-related abnormality occurs, the metal material in the shunt structure can contact part of the multiple probes to provide a current shunt path, thereby avoiding abnormalities in the probes themselves that cause excessive current to pass through and cause burning, or the probes being open and affecting the electrical test results.
[0053] The above embodiments are intended to illustrate the principles and effects of this application and are not intended to limit this application. Any person skilled in the art may modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be as set forth in the claims.
Claims
1. A testing device, characterized in that: include: Guide plate structure; a flow diversion structure combined with the guide plate structure, wherein the guide plate structure includes a first guide plate and a second guide plate, the first guide plate and the second guide plate are arranged parallel to each other and separated by a gap, and the flow diversion structure is arranged in the first guide plate or between the first guide plate and the second guide plate; and A plurality of probes are provided through the guide plate structure and the shunt structure, wherein the shunt structure contacts a portion of the plurality of probes to provide a current shunt path.
2. The testing device according to claim 1, wherein: One side of the guide plate structure is used to connect with the circuit board, and the other side is used to connect with the object to be tested.
3. The testing device according to claim 1, wherein: The first guide plate is provided with a plurality of first openings, and the second guide plate is provided with a plurality of second openings. The plurality of first openings respectively correspond to the plurality of second openings to slidably accommodate the plurality of probes.
4. The testing device according to claim 3, wherein: Each of the probes includes a travel section and a testing section and a transfer section extending from two sides of the travel section.
5. The testing device according to claim 4, wherein: The travel section is located in the gap between the first guide plate and the second guide plate, and the travel section is curved and has the function of absorbing external force and travel.
6. The testing device according to claim 4, wherein: The testing section extends from one end of the travel section and passes through the first guide plate for connecting to the object to be tested.
7. The testing device according to claim 4, wherein: The transfer section extends from the other end of the travel section and passes through the second guide plate for connecting to the circuit board.
8. The testing device according to claim 1, wherein: The shunt structure is defined by at least one first region and at least one second region. The at least one first region is made of insulating material and has a plurality of first through holes. The at least one second region is made of metal material and has a plurality of second through holes for the plurality of probes to pass through the plurality of first through holes and the plurality of second through holes.
9. The testing device according to claim 8, wherein: The probes passing through the first through holes are used for signal testing, and the probes passing through the second through holes are used for power testing.