Gluing developing machine for chip processing

Abstract

The utility model discloses a gluing and developing machine for chip processing, which comprises a gluing and developing machine box body, the top end of the gluing and developing machine box body is rotatably connected with a rotating table at the central position, the top end of the rotating table is provided with a gluing and developing groove, and the inner bottom surface of the gluing and developing groove is movably inserted with an adjusting column. According to the utility model, the servo electric cylinder drives the adjusting column to move downwards, so that the placing table drives the wafer to enter the gluing developing tank, in the entering process, the adjusting column drives the four connecting rods to move downwards and pulls the four clamping blocks to contract towards the center, and when the servo electric cylinder stops moving, the periphery of the wafer is centered and fixed; after the wafer processing is completed, the servo electric cylinder drives the placing table to reset, and the wafer is ejected out of the gluing developing tank, so that the wafers with different sizes are centered and positioned when being processed, and the processing efficiency and the gluing quality of the wafer are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of glue coating and developing machines, in particular to a glue coating and developing machine for chip processing. Background Art

[0002] The glue coating and developing machine is mainly used to process photosensitive materials or substrates in photography, printing technology, semiconductor and PCB (printed circuit board) manufacturing. In the chip processing process, the glue coating and developing equipment is mainly used in the front-end EUV lithography in wafer production, and plays an important role in wafer production.

[0003] In the prior art, for example, Chinese patent CN219758660U discloses "a glue coating and developing machine with smooth glue coating", which includes a glue coating and developing machine housing, wherein the interior of the glue coating and developing machine housing is movably connected to two rotating suction cup devices, a double-headed nozzle pipe fitting is provided in the middle of the interior of the glue coating and developing machine housing and in the middle of the two rotating suction cup devices, and a baffle door is movably connected to the interior of the glue coating and developing machine housing near the back.

[0004] As in the above-mentioned utility model, although the wafer can be fixed inside the glue coating and developing tank by setting the vacuum suction chamber and the suction nozzle, when the size of the wafer cannot cover the suction nozzle, the vacuum suction chamber and the suction nozzle cannot produce an adsorption effect on the wafer or the adsorption force is small, which makes the wafer easy to shake during the glue coating process, affecting the quality of the glue coating. Utility Model Content

[0005] The purpose of the present utility model is to provide a chip processing glue coating and developing machine to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a glue coating and developing machine for chip processing, comprising a glue coating and developing machine housing, a rotating table is rotatably connected to the top of the glue coating and developing machine housing and located at the center position, a glue coating and developing tank is provided at the top of the rotating table, an adjusting column is movably inserted into the bottom surface of the inner part of the glue coating and developing tank, a servo electric cylinder is rotatably provided at the bottom end of the adjusting column through the interior of the rotating table, the bottom end of the servo electric cylinder is fixedly connected to the bottom surface of the inner part of the glue coating and developing machine housing, four guide through-holes are provided through the top of the rotating table, clamping blocks are slidably provided inside the four guide through-holes, the bottom ends of the four clamping blocks are rotatably connected to connecting rods, the other ends of the four connecting rods are rotatably connected to the outer surface of the adjusting column, and the top of the adjusting column is fixedly connected to a placing table.

[0007] As a further preferred embodiment of the present technical solution, a colloid feeding device is fixedly connected to the bottom surface of the inner side of the glue coating and developing machine casing near the edge position, the output end of the colloid feeding device passes through the top surface of the inner side of the glue coating and developing machine casing and is fixedly connected to a feeding screw, the outer surface of the feeding screw is threadedly connected to an adjusting screw sleeve, the outer surface of the adjusting screw sleeve is rotatably connected to a connecting frame, the top of the connecting frame is passed through and connected to a glue coating head near the edge position, the top of the glue coating head is fixedly connected to a connecting hose, and the other end of the connecting hose is fixedly connected to the top of the feeding screw.

[0008] As a further preferred embodiment of the present technical solution, a limiting block is fixedly connected to one side of the connecting frame, a limiting frame is slidably connected inside the limiting block, and a bottom end of the limiting frame is fixedly connected to the top end of the coating and developing machine housing.

[0009] As a further preferred embodiment of the present technical solution, the bottom end of the rotating table is fixedly connected to a driven gear ring, the outer surface of the driven gear ring is engaged with a driving motor, and the bottom end of the driving motor is fixedly connected to the inner bottom surface of the coating and developing machine housing.

[0010] As a further preferred embodiment of the present technical solution, positioning grooves are provided on both side walls of the guide through hole, positioning blocks are fixedly connected on both sides of the clamping block, the outer surfaces of the two positioning blocks are respectively slidably connected to the inside of the two positioning grooves, and the clamping surface of the clamping block is fixedly connected to an elastic rubber pad.

[0011] As a further preferred embodiment of the present technical solution, the outer surface of the adjusting column is fixedly connected to the limiting block, the inner surface of the joint between the rotating table and the adjusting column is provided with a limiting groove, the outer surface of the limiting block is slidably inserted into the inside of the limiting groove, the outer surface of the rotating table is fixedly connected to a rotating ring, the inner top surface of the glue coating and developing machine housing is fixedly connected to a positioning sleeve, and the outer surface of the rotating ring is rotatably connected to the inside of the positioning sleeve.

[0012] As a further preferred embodiment of the present technical solution, the bottom end of the adjusting column is fixedly connected to a docking sleeve, the telescopic end of the servo electric cylinder is fixedly connected to a rotating plate, and the outer surface of the rotating plate is rotatably connected to the inside of the docking sleeve.

[0013] The utility model provides a glue coating and developing machine for chip processing, which has the following beneficial effects:

[0014] (1) The utility model drives the adjustment column downward by the servo electric cylinder, so that the placement table drives the wafer into the glue coating and developing tank. During the entry process, the adjustment column drives the four connecting rods to move downward and pulls the four clamping blocks to retract toward the center. When the servo electric cylinder stops moving, the four sides of the wafer are centered and fixed. After the wafer processing is completed, the servo electric cylinder drives the placement table to reset and push the wafer out of the glue coating and developing tank, thereby realizing the centering positioning when processing wafers of different sizes, thereby improving the processing efficiency and glue coating quality of the wafer.

[0015] (2) The utility model can adjust the height of the glue coating head by setting the feeding screw tube, the adjusting screw sleeve and the connecting frame, thereby indirectly changing the spray diameter of the glue coating head. At the same time, by setting the limiting frame, the glue coating head can always be in the center position of the glue coating developer tank, thereby ensuring the glue coating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the internal structure of the casing of the glue coating and developing machine of the present invention;

[0018] Figure 3 This is an exploded schematic diagram of the internal structure of the turntable of the utility model;

[0019] Figure 4 This is an exploded schematic diagram of the structure between the feeding spiral tube and the limiting frame of the utility model.

[0020] In the figure: 1. Glue coating and developing machine housing; 2. Rotating table; 3. Adjusting column; 4. Placing table; 5. Guide hole; 6. Clamping block; 7. Connecting rod; 8. Servo electric cylinder; 9. Driven gear ring; 10. Driving motor; 11. Positioning groove; 12. Positioning block; 13. Limiting block; 14. Limiting groove; 15. Elastic rubber pad; 16. Glue coating and developing tank; 17. Rotating ring; 18. Positioning sleeve; 19. Glue feeding device; 20. Feeding screw; 21. Adjusting screw sleeve; 22. Connecting frame; 23. Gluing head; 24. Connecting hose; 25. Limiting block; 26. Limiting frame; 27. Docking sleeve; 28. Rotating plate. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0022] The utility model provides a technical solution: Figure 1-3As shown in the embodiment, a coating and developing machine for chip processing includes a coating and developing machine housing 1, a rotating table 2 is rotatably connected to the top of the coating and developing machine housing 1 and located at the center, a coating and developing tank 16 is provided on the top of the rotating table 2, an adjusting column 3 is movably inserted into the bottom surface of the coating and developing tank 16, and a servo electric cylinder 8 is provided at the bottom end of the adjusting column 3 through the inside of the rotating table 2, and the bottom end of the servo electric cylinder 8 is fixedly connected to the bottom surface of the inside of the coating and developing machine housing 1, and four guide holes 5 are provided on the top of the rotating table 2. Each of the four clamping blocks 6 is slidingly provided, and the bottom ends of the four clamping blocks 6 are rotatably connected to the connecting rod 7. The other ends of the four connecting rods 7 are rotatably connected to the outer surface of the adjusting column 3. The top of the adjusting column 3 is fixedly connected to the placing table 4. Among them, by setting the adjusting column 3, the placing table 4 can be driven to move up and down, and the wafer is placed in the glue developing tank 16 for positioning. By setting the guide through hole 5, the clamping block 6 can be guided and positioned. By setting the connecting rod 7, the clamping block 6 can be driven to move together when the adjusting column 3 moves, thereby achieving the centering and fixing effect of the wafer.

[0023] like Figure 1 、 Figure 2 and Figure 4 As shown, a colloid feeding device 19 is fixedly connected to the bottom surface of the inner side of the glue developing machine housing 1 and near the edge position, the output end of the colloid feeding device 19 passes through the inner top surface of the glue developing machine housing 1 and is fixedly connected to a feeding screw 20, the outer surface of the feeding screw 20 is threadedly connected to an adjusting screw sleeve 21, the outer surface of the adjusting screw sleeve 21 is rotatably connected to a connecting frame 22, the top of the connecting frame 22 and near the edge position passes through and is connected to a glue coating head 23, the top of the glue coating head 23 is fixedly connected to a connecting hose 24, the other end of the connecting hose 24 is fixedly connected to the top of the feeding screw 20, by arranging the adjusting screw sleeve 21, the connecting frame 22 can be driven to move up and down during the rotation process, and by arranging the connecting hose 24, it can be extended and retracted and is not prone to breakage.

[0024] like Figure 4 As shown, a limiting block 25 is fixedly connected to one side of the connecting frame 22, and a limiting frame 26 is slidably connected inside the limiting block 25. The bottom end of the limiting frame 26 is fixedly connected to the top of the coating and developing machine housing 1, which can position the connecting frame 22 so that it is not easy to tilt during the movement, so that the coating head 23 can always be in the center position of the coating and developing tank 16.

[0025] like Figure 2 and Figure 3 As shown, the bottom end of the rotating table 2 is fixedly connected to a driven gear ring 9, and the outer surface of the driven gear ring 9 is engaged with a driving motor 10. The bottom end of the driving motor 10 is fixedly connected to the bottom surface of the inner side of the coating and developing machine housing 1, which can drive the rotating table 2 to rotate, making the coating more uniform.

[0026] like Figure 3As shown, positioning grooves 11 are provided on both side walls of the inner portion of the guide through hole 5, and positioning blocks 12 are fixedly connected on both sides of the clamping block 6. The outer surfaces of the two positioning blocks 12 are respectively slidably connected to the inside of the two positioning grooves 11, and the clamping surface of the clamping block 6 is fixedly connected with an elastic rubber pad 15, which can position the clamping block 6 to prevent it from tilting during movement. By setting the elastic rubber pad 15, damage to the outer surface of the wafer can be avoided.

[0027] like Figure 2 and Figure 3 As shown, the outer surface of the adjusting column 3 is fixedly connected to the limiting block 13, and the inner surface of the joint between the rotating table 2 and the adjusting column 3 is provided with a limiting groove 14, the outer surface of the limiting block 13 is slidably inserted into the inner part of the limiting groove 14, the outer surface of the rotating table 2 is fixedly connected to the rotating ring 17, and the inner top surface of the coating and developing machine housing 1 is fixedly connected to the positioning sleeve 18, and the outer surface of the rotating ring 17 is rotatably connected to the inner part of the positioning sleeve 18. By setting the limiting block 13 and the limiting groove 14, the adjusting column 3 can be limited so that it can rotate with the rotating table 2. By setting the rotating ring 17 and the positioning sleeve 18, the rotating table 2 can be positioned and rotated.

[0028] like Figure 3 As shown, the bottom end of the adjusting column 3 is fixedly connected to a docking sleeve 27, and the telescopic end of the servo electric cylinder 8 is fixedly connected to a rotating plate 28. The outer surface of the rotating plate 28 is rotatably connected to the inside of the docking sleeve 27, which enables the servo electric cylinder 8 to be rotatably connected to the adjusting column 3, and will not affect the servo electric cylinder 8 when the adjusting column 3 rotates.

[0029] The utility model provides a glue coating and developing machine for chip processing, and the specific working principle is as follows:

[0030] The staff places the wafer to be coated with glue directly above the placement table 4 through the suction cup, and then the servo electric cylinder 8 moves downward and pulls the placement table 4 connected to the adjusting column 3 into the glue coating and developing tank 16. During the entry process, the adjusting column 3 drives the four connecting rods 7 to move downward and pulls the four clamping blocks 6 to retract toward the center. When the servo electric cylinder 8 stops moving, the clamping blocks 6 center and fix the wafer on all sides. After the fixation is completed, the staff rotates the adjusting screw sleeve 21 so that the adjusting screw sleeve 21 moves up and down on the outer surface of the feeding screw tube 20. When the injection diameter of the glue coating head 23 is the same as the size of the wafer, it stops rotating. Then the driving motor 10 drives the driven gear ring 9 to rotate, so that the rotating table 2 and the wafer rotate together. The colloid loading device 19 pumps glue onto the glue coating head 23 for coating. After the gluing and drying are completed, the servo electric cylinder 8 pushes the adjusting column 3 to move upward, so that the clamping block 6 is separated from the outer surface of the wafer, the restriction on the wafer is released and the glued wafer is taken out through the suction cup.

[0031] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip processing glue coating and developing machine, comprising a glue coating and developing machine housing (1), characterized in that: The top of the coating and developing machine housing (1) is rotatably connected to a rotating table (2) at the center position, the top of the rotating table (2) is provided with a coating and developing tank (16), the bottom surface of the inside of the coating and developing tank (16) is movably connected with an adjusting column (3), the bottom end of the adjusting column (3) passes through the inside of the rotating table (2) and is provided with a servo electric cylinder (8), the bottom end of the servo electric cylinder (8) is fixedly connected to the bottom surface of the inside of the coating and developing machine housing (1), four guide through holes (5) are provided through the top of the rotating table (2), the inside of the four guide through holes (5) are all slidably provided with clamping blocks (6), the bottom ends of the four clamping blocks (6) are rotatably connected to connecting rods (7), the other ends of the four connecting rods (7) are rotatably connected to the outer surface of the adjusting column (3), and the top of the adjusting column (3) is fixedly connected to a placing table (4).

2. The chip processing glue coating and developing machine according to claim 1, characterized in that: A colloid feeding device (19) is fixedly connected to the bottom surface of the inner side of the coating and developing machine housing (1) and near the edge thereof; an output end of the colloid feeding device (19) passes through the inner top surface of the coating and developing machine housing (1) and is fixedly connected to a feeding screw (20); an outer surface of the feeding screw (20) is threadedly connected to an adjusting screw sleeve (21); an outer surface of the adjusting screw sleeve (21) is rotatably connected to a connecting frame (22); a top end of the connecting frame (22) and near the edge thereof passes through and is connected to a coating head (23); a top end of the coating head (23) is fixedly connected to a connecting hose (24); the other end of the connecting hose (24) is fixedly connected to the top end of the feeding screw (20).

3. The chip processing glue coating and developing machine according to claim 2, characterized in that: A limiting block (25) is fixedly connected to one side of the connecting frame (22), a limiting frame (26) is slidably connected inside the limiting block (25), and the bottom end of the limiting frame (26) is fixedly connected to the top end of the coating and developing machine housing (1).

4. The chip processing glue coating and developing machine according to claim 1, characterized in that: The bottom end of the rotating platform (2) is fixedly connected to a driven gear ring (9), the outer surface of the driven gear ring (9) is engaged with a driving motor (10), and the bottom end of the driving motor (10) is fixedly connected to the inner bottom surface of the coating and developing machine housing (1).

5. The chip processing glue coating and developing machine according to claim 4, characterized in that: Positioning grooves (11) are provided on both side walls of the guide through hole (5), and positioning blocks (12) are fixedly connected to both sides of the clamping block (6). The outer surfaces of the two positioning blocks (12) are respectively slidably connected to the inside of the two positioning grooves (11), and the clamping surface of the clamping block (6) is fixedly connected to an elastic rubber pad (15).

6. The chip processing glue coating and developing machine according to claim 1, characterized in that: The outer surface of the adjusting column (3) is fixedly connected to a limiting block (13); the inner surface of the joint between the rotating platform (2) and the adjusting column (3) is provided with a limiting groove (14); the outer surface of the limiting block (13) is slidably connected to the inside of the limiting groove (14); the outer surface of the rotating platform (2) is fixedly connected to a rotating ring (17); the inner top surface of the coating and developing machine housing (1) is fixedly connected to a positioning sleeve (18); the outer surface of the rotating ring (17) is rotatably connected to the inside of the positioning sleeve (18).

7. The chip processing glue coating and developing machine according to claim 6, characterized in that: The bottom end of the adjusting column (3) is fixedly connected to a docking sleeve (27), the telescopic end of the servo electric cylinder (8) is fixedly connected to a rotating plate (28), and the outer surface of the rotating plate (28) is rotatably connected to the inside of the docking sleeve (27).

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