Heat dissipation device and electronic equipment

Abstract

The utility model provides a heat dissipation device and electronic equipment, and relates to the technical field of electronic equipment. The heat dissipation device comprises a heat dissipation module which is detachably connected with a plate body provided with a target heating component, and the heat dissipation module makes contact with the target heating component so as to conduct heat exchange with the target heating component; the supporting piece is arranged between the heat dissipation module and the plate body, the supporting piece is provided with a connecting part and a supporting part, the connecting part is detachably connected with the plate body, and the connecting part is provided with an opening so that a gap can be formed between the connecting part and the target heating component; the supporting part supports the heat dissipation module, and the direction of the supporting force of the supporting part on the heat dissipation module is opposite to the direction of the pressing force of the heat dissipation module on the target heating component.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a heat dissipation device and electronic equipment. Background Art

[0002] In related technologies, heat-generating components with high performance and low power consumption are often integrated into corresponding devices, such as a laptop central processing unit (CPU). In this case, a heat sink with high heat dissipation performance is required to meet the heat dissipation requirements of the heat-generating component.

[0003] If the heat-generating component is packaged bare metal, specific maximum clamp pressure standards must be adhered to during installation to prevent physical damage. However, lower pressure may result in poor contact between the heat sink and the heat-generating component, causing the system to fail reliability testing due to heat sink shaking. Utility Model Content

[0004] The embodiments of this application provide the following technical solutions:

[0005] A first aspect of the present application provides a heat dissipation device, comprising: a heat dissipation module, which is detachably connected to a plate body provided with a target heat-generating component, the heat dissipation module and the target heat-generating component are in contact to perform heat exchange with the target heat-generating component; a support member, which is provided between the heat dissipation module and the plate body, the support member having a connecting portion and a supporting portion, the connecting portion being detachably connected to the plate body, the connecting portion having an opening so that there is a gap between the connecting portion and the target heat-generating component; the supporting portion supports the heat dissipation module, and the direction of the supporting force of the supporting portion on the heat dissipation module is opposite to the direction of the pressing force of the heat dissipation module on the target heat-generating component.

[0006] In some embodiments of the present application, the heat dissipation module includes a fixing component and a heat dissipation component, the fixing component is detachably connected to the plate body, the heat dissipation component has a heat conductor on the side facing the target heat-generating component, and the heat conductor is in contact with the target heat-generating component; the connecting portion is connected to the fixing component and / or the plate body, and the supporting portion is at least partially stopped at the heat dissipation component, so that the direction of the supporting force of the supporting portion on the heat dissipation module is opposite to the direction of the pressing force of the heat dissipation module on the target heat-generating component.

[0007] In some embodiments of the present application, the fixing assembly has multiple first connection ends; the multiple first connection ends are evenly distributed on the circumferential side of the heat conductor; the connecting portion has multiple second connection ends, each of the second connection ends is detachably connected to one of the first connection ends, or the second connection end is detachably connected to the plate body.

[0008] In some embodiments of the present application, the heat dissipation assembly includes a first heat dissipation member and a second heat dissipation member, the first heat dissipation member is connected to the heat conductive member to achieve heat exchange, the first heat dissipation member has an accommodating cavity in the middle, and the second heat dissipation member is arranged in the accommodating cavity.

[0009] In some embodiments of the present application, the heat dissipation device further includes: a fixed bracket, the fixed bracket is arranged in the accommodating cavity, the second heat dissipation component is arranged in the fixed bracket, a first limiting portion is provided on the fixed bracket, and a second limiting portion is provided on the first heat dissipation component, and the first limiting portion and the second limiting portion are abutted.

[0010] In some embodiments of the present application, the first heat dissipation element includes a pair of relatively arranged heat sink modules, and the second heat dissipation element is a fan, which is arranged between the pair of heat sink modules; the airflow direction generated by the fan is consistent with the extension direction of the heat sink spacing of the heat sink module to form a heat dissipation channel.

[0011] In some embodiments of the present application, the middle portion of the connecting portion has the opening, and the heat conductor passes through the opening to contact the target heat-generating component; the supporting portion and the fixed bracket are abutted against each other so that the direction of the supporting force of the supporting portion on the heat dissipation module is opposite to the direction of the pressing force of the heat dissipation module on the target heat-generating component.

[0012] In some embodiments of the present application, the heat dissipation device further includes: an elastic pushing member, which is arranged between the support portion and the fixed bracket; the elastic pushing member includes an elastic member and a pushing portion, one side surface of the pushing portion abuts against the fixed bracket, the elastic member is arranged between the pushing portion and the support portion, and the elastic member is in a compressed state.

[0013] In some embodiments of the present application, the fixing bracket is further provided with fixing members, and the fixing members are respectively connected to one end of a pair of the heat sink modules away from the fixing assembly.

[0014] According to a second aspect of the present application, there is provided an electronic device, comprising: a target heat-generating component; a plate body, on which the target heat-generating component is arranged; a heat dissipation device, comprising a heat dissipation module, wherein the heat dissipation module is in contact with the target heat-generating component to perform heat exchange with the target heat-generating component; a support member, disposed between the heat dissipation module and the plate body, wherein the support member has a connecting portion and a supporting portion, wherein the connecting portion is detachably connected to the plate body, and wherein the connecting portion has an opening so that a gap exists between the connecting portion and the target heat-generating component; the supporting portion supports the heat dissipation module, and a direction of a supporting force exerted by the supporting portion on the heat dissipation module is opposite to a direction of a pressing force exerted by the heat dissipation module on the target heat-generating component. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other objects, features and advantages of the exemplary embodiments of the present application will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0016] Figure 1 The schematic diagram of the structure of the heat dissipation device provided in the embodiment of the present application is shown schematically;

[0017] Figure 2 Schematically shows a structural diagram of the heat dissipation device provided by an embodiment of the present application from another perspective;

[0018] Figure 3 The figure schematically shows an exploded view of the heat dissipation device provided in an embodiment of the present application.

[0019] Description of Figure Numbers:

[0020] 1. Heat dissipation module; 101. Fixing assembly; 102. Heat dissipation assembly; 103. Heat conducting member; 104. First connection end; 105. First heat dissipating member; 106. Second heat dissipating member; 107. Second limiting portion; 2. Support member; 201. Connection portion; 202. Support portion; 203. Opening; 204. Second connection end; 3. Fixing bracket; 301. First limiting portion; 302. Fixing member; 4. Elastic pushing member; 401. Elastic member; 402. Pushing portion; 5. Support back plate; 501. Third connection end; 6. Target heating component; 7. Plate body. DETAILED DESCRIPTION

[0021] The following describes exemplary embodiments of the present application in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. Instead, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0022] It should be noted that, unless otherwise specified, the technical or scientific terms used in this application should have the common meanings understood by those skilled in the art to which this application belongs.

[0023] In the gaming console industry, desktop motherboards are often used to mount laptop central processing units (CPUs). Laptop CPUs are typically packaged bare metal, meaning they lack pre-installed heatsinks. After extensive testing and evaluation of the physical structure of laptop CPUs and the compressive strength of the chip packaging materials, Intel's technical specifications stipulate a safety limit of 20 pounds of force for fasteners. Exceeding this pressure can damage the CPU chip structure, such as damaging internal circuit connections or cracking the packaging material.

[0024] The clamp pressure of the traditional cooling fan solution can be well controlled within the standard range of 20 pounds, so it will not crush the CPU. However, its heat dissipation capacity is limited. If a desktop motherboard is used with a laptop central processing unit (CPU), it is necessary to design a heat dissipation solution with an ultra-large heat dissipation area to solve the problem of limited heat dissipation capacity of the traditional solution. However, due to the structure and installation method of the tower radiator, a large locking force, such as 40 pounds, will be generated during the locking process with the motherboard. The 40-pound locking force can achieve a stable connection between the radiator and the motherboard without shaking. During installation, it is locked down to the motherboard by screws. Due to the gravity of the radiator and the tightening force of the screws, a large locking force will be generated. This locking force will far exceed the 20-pound clamp pressure standard specified by Intel. However, if the locking force is only 20 pounds, it may cause the radiator to shake and fail the reliability test.

[0025] Example 1

[0026] The embodiment of the present application provides a heat dissipation device, such as Figures 1 to 3 As shown, it includes: a heat dissipation module 1, which is detachably connected to a plate body 7 provided with a target heat-generating component 6, and the heat dissipation module 1 is in contact with the target heat-generating component 6 to exchange heat with the target heat-generating component 6; a support member 2, which is provided between the heat dissipation module 1 and the plate body 7, and the support member 2 has a connecting portion 201 and a supporting portion 202, and the connecting portion 201 is detachably connected to the plate body 7, and the connecting portion 201 has an opening 203 so that there is a gap between the connecting portion 201 and the target heat-generating component 6; the supporting portion 202 supports the heat dissipation module 1, and the direction of the supporting force of the supporting portion 202 on the heat dissipation module 1 is opposite to the direction of the pressing force of the heat dissipation module 1 on the target heat-generating component 6.

[0027] The heat dissipation module 1 is detachably connected to a board 7 on which a target heat-generating component 6 is mounted. The board 7 can be a circuit board, and the target heat-generating component 6 can be a laptop computer's central processing unit (CPU), graphics processing unit (GPU), neural network processing unit (NPU), chipset, memory, solid-state drive, or other heat-generating components. After connection, the heat dissipation module 1 directly contacts the target heat-generating component 6, allowing heat to be transferred from the target heat-generating component 6 to the heat dissipation module 1, thereby achieving heat exchange.

[0028] The support member 2 is placed between the heat dissipation module 1 and the plate body 7, and includes a connecting portion 201 and a supporting portion 202. The connecting portion 201 is detachably connected to the plate body 7 and has an opening 203. This opening 203 can maintain a certain gap between the connecting portion 201 and the target heating component 6 to prevent the connecting portion 201 from directly pressing the target heating component 6. The supporting portion 202 supports the heat dissipation module 1, and the direction of the supporting force of the supporting portion 202 on the heat dissipation module 1 is opposite to the direction of the pressing force of the heat dissipation module 1 on the target heating component 6. In this way, the supporting force of the supporting portion 202 can be adjusted so that it is balanced with the pressure of the heat dissipation module 1 on the target heating component 6. In addition, while the supporting portion 202 provides a reverse supporting force to the heat dissipation module 1, since the connecting portion 201 of the support member 2 is connected to the plate body 7, the connecting portion 201 will act on the plate body 7 with the reverse force applied by the heat dissipation module 1, further increasing the stability of the heat dissipation device on the plate body 7. This can effectively prevent the heat dissipation module 1 from shaking or shifting during use, ensuring the stability and reliability of the heat dissipation effect. At the same time, it also helps to improve the shock resistance of the entire system and reduce the adverse effects of external vibration on the heat dissipation device and the target heat-generating component 6.

[0029] When the heat sink is installed, the heat sink module 1 exerts a pressing force on the target heat-generating component 6, while the support portion 202 simultaneously exerts an opposite supporting force on the heat sink module 1. The opening 203 of the connecting portion 201 can ensure that it does not directly press the target heat-generating component 6. By adjusting the supporting force of the support portion 202, the pressure of the heat sink module 1 on the target heat-generating component 6 can be made not to exceed the maximum clip pressure standard recommended by the server, while ensuring that the heat sink module 1 is stably connected to the board 7. This solves the pressure control problem caused by the bare metal packaging method of the target heat-generating component 6, avoids damage to the target heat-generating component 6 due to excessive pressure, and avoids the problem of poor contact between the heat sink and the target heat-generating component 6 and shaking of the heat sink due to insufficient pressure, thereby improving the reliability and heat dissipation performance of the system.

[0030] In some embodiments, the heat dissipation module 1 includes a fixing component 101 and a heat dissipation component 102, the fixing component 101 is detachably connected to the plate body 7, the heat dissipation component 102 has a heat conductor 103 on the side facing the target heat-generating component 6, and the heat conductor 103 is in contact with the target heat-generating component 6; the connecting portion 201 is connected to the fixing component 101 and / or the plate body 7, and the supporting portion 202 is at least partially stopped at the heat dissipation component 102, so that the direction of the supporting force of the supporting portion 202 on the heat dissipation module 1 is opposite to the direction of the pressing force of the heat dissipation module 1 on the target heat-generating component 6.

[0031] The heat dissipation module 1 is composed of a fixing component 101 and a heat dissipation component 102. The fixing component 101 can be detachably connected to the board body 7 (main board) by means of screws, snaps, etc. Its shape and size are designed according to the main board to ensure that the heat dissipation module 1 is stably connected to the board body 7, so that the heat conductor 103 can be in close contact with the target heating component 6. The heat dissipation component 102 is provided with a heat conductor 103 on the side facing the target heating component 6. The heat conductor 103 is in direct contact with the target heating component 6 and is used to conduct the heat generated by the target heating component 6. The heat conductor 103 can be made of copper or aluminum material with good thermal conductivity. Its surface can be designed to be slightly convex or fit the shape of the surface of the target heating component 6 to increase the contact area and improve the heat conduction efficiency.

[0032] The connecting portion 201 of the support member 2 can be connected to the fixing assembly 101, to the plate body 7, or to both at the same time, and the supporting portion 202 is at least partially offset against the heat dissipation assembly 102. During actual installation, the fixing assembly 101 can be installed on the plate body 7 first, and then the heat-conducting member 103 of the heat dissipation assembly 102 is brought into contact with the target heat-generating component 6. At this time, the connecting portion 201 of the support member 2 is well connected to the fixing assembly 101 and / or the plate body 7, and the supporting portion 202 provides a reverse supporting force to the heat dissipation assembly 102. Through the interaction between the supporting portion 202 and the heat dissipation assembly 102, the pressure applied by the heat dissipation module 1 on the target heat-generating component 6 can be accurately controlled, which not only ensures good thermal contact but also avoids damage to the target heat-generating component 6 caused by excessive pressure.

[0033] In some embodiments, the fixing assembly 101 has multiple first connection ends 104; the multiple first connection ends 104 are evenly distributed on the circumferential side of the heat conductor 103; the connecting portion 201 has multiple second connection ends 204, each second connection end 204 is detachably connected to a first connection end 104, or the second connection end 204 is detachably connected to the plate body 7.

[0034] The fixing assembly 101 has a plurality of first connection ends 104 evenly distributed around the side of the heat conductor 103. It is understood that there is no specific limit on the number of first connection ends 104. In one embodiment of the present application, the number of first connection ends 104 is four, and each first connection end 104 can be connected to the plate body 7 by a mechanical connection method such as screws or snaps. This layout can make the fixing assembly 101 more stable and uniform in fixing the heat conductor 103 and the entire heat dissipation assembly 102. The connecting portion 201 has a plurality of second connection ends 204, and the number of second connection ends 204 can be the same as or different from the number of first connection ends 104. One situation is that the number of these second connection ends 204 is the same as that of the first connection ends 104 of the fixing component 101 and they are arranged correspondingly. Each second connection end 204 is detachably connected to a first connection end 104. The connection can be achieved by respectively setting screw holes or slots on the first connection end 104 and the second connection end 204, and then tightening with screws or snapping. The second connection end 204 is connected to the plate body 7 through the first connection end 104, making connection and disassembly convenient; another situation is that the second connection end 204 is directly detachably connected to the plate body 7, and connection holes or slots for connecting to the second connection ends 204 can be further set on the plate body 7. At this time, the number of the second connection ends 204 can be different from the number of the first connection ends 104. Connecting and fixing the second connection end 204 to the connection hole or slot can avoid the second connection end 204 being directly connected to the plate body 7 through the first connection end 104, reducing the stability of the connection between the heat dissipation module 1 and the plate body 7, and avoiding stress concentration causing deformation of the plate body 7.

[0035] By evenly distributing multiple first connection ends 104 around the heat conductor 103 and connecting to the connection portion 201, the heat dissipation module 1 can be well supported and fixed in all directions, thereby enhancing the stability of the heat dissipation device. During use, the heat dissipation module 1 is not easy to shake or shift, thereby ensuring that the heat conductor 103 is in continuous good contact with the target heat-generating component 6, thereby improving the stability of the heat dissipation effect.

[0036] In some embodiments, as Figure 2 As shown, the device further includes a support backplate 5, which is disposed on the side of the plate body 7 facing away from the heat dissipation module 1. The support backplate 5 includes multiple third connection ends 501, each of which is a columnar structure. The plate body 7 is provided with multiple connection holes, through which the multiple columnar third connection ends 501 pass to connect with the first connection end 104 of the fixing assembly 101 and the second connection end 204 of the connecting portion 201. Both the first connection end 104 and the second connection end 204 can be through-holes. The provision of the support backplate 5 can prevent deformation of the plate body 7 and prevent shaking of the heat dissipation module 1.

[0037] In some embodiments, the heat dissipation assembly 102 includes a first heat dissipation element 105 and a second heat dissipation element 106. The first heat dissipation element 105 is connected to the heat conductive element 103 to achieve heat exchange. The first heat dissipation element 105 has an accommodating cavity in the middle, and the second heat dissipation element 106 is arranged in the accommodating cavity.

[0038] The heat dissipation assembly 102 includes a first heat dissipation member 105 and a second heat dissipation member 106. The heat conductor 103 is connected to the first heat dissipation member 105. The heat of the target heat-generating component 6 is first absorbed by the heat conductor 103 and then transferred to the first heat dissipation member 105. The first heat dissipation member 105 dissipates part of the heat through its own heat dissipation structure and characteristics. At the same time, the second heat dissipation member 106 located in the middle accommodating cavity of the first heat dissipation member 105 participates in the heat dissipation process, and dissipates the heat transferred by the first heat dissipation member 105 into the surrounding environment. The combined design of the first heat dissipation member 105 and the second heat dissipation member 106 increases the heat dissipation area and path. The two work together to dissipate heat more effectively, improve the overall heat dissipation efficiency, and ensure that the target heat-generating component 6 is in a suitable temperature range. The design of the accommodating cavity enables the second heat dissipation member 106 to be integrated into the interior of the first heat dissipation member 105, saving space and making the heat dissipation assembly 102 more compact, which is conducive to achieving better heat dissipation effects in a limited space and is also convenient for the installation and layout of the heat dissipation device.

[0039] In some embodiments, the heat dissipation device further includes: a fixed bracket 3, the fixed bracket 3 is arranged in the accommodating cavity, the second heat dissipation element 106 is arranged in the fixed bracket 3, a first limiting portion 301 is provided on the fixed bracket 3, and a second limiting portion 107 is provided on the first heat dissipation element 105, and the first limiting portion 301 and the second limiting portion 107 are abutted.

[0040] In the heat dissipation device, a fixing bracket 3 is provided and placed in the accommodating cavity in the middle of the first heat dissipation element 105. The second heat dissipation element 106 is installed in the fixing bracket 3. The fixing bracket 3 can be a frame structure welded together by a plate structure or a beam structure, and has an accommodating space to provide a stable installation position for the second heat dissipation element 106 and prevent the second heat dissipation element 106 from moving arbitrarily in the accommodating cavity. The fixing bracket 3 is provided with a first limiting portion 301, such as a protrusion, a groove, a buckle, etc., which cooperates with the second limiting portion 107 on the first heat dissipation element 105. The second limiting portion 107 can be set according to the type of the first limiting portion 301. For example, if the first limiting portion 301 is a pair of L-shaped plate structures arranged oppositely, a clamping portion is formed between the pair of oppositely arranged plate structures, and the second limiting portion 107 is a slot arranged on the side of the first heat dissipation element 105, the pair of oppositely arranged plate structures can respectively extend into the slots on both sides of the first heat dissipation element 105, thereby achieving limiting. When the first stopper 301 abuts the second stopper 107, the fixed bracket 3 and the second heat sink 106 are accurately positioned and are not easily dislodged by external forces. The fixed bracket 3 secures the second heat sink 106 and the stopper abuts against it, making the heat sink more stable during operation. Whether in a vibrating environment or during long-term operation, the second heat sink 106 can maintain its correct position and continuously and effectively dissipate heat.

[0041] In some embodiments, the first heat dissipation element 105 includes a pair of oppositely arranged heat sink modules, and the second heat dissipation element 106 is a fan, which is arranged between the pair of heat sink modules; the airflow direction generated by the fan is consistent with the extension direction of the heat sink spacing of the heat sink module to form a heat dissipation channel.

[0042] The first heat sink 105 is composed of a pair of heat sink modules arranged opposite to each other. The heat sink module can be made of fins made of high thermal conductivity metal such as aluminum to increase the heat dissipation area. A plurality of heat sinks can be arranged in a horizontal or vertical direction to form a heat sink module. There is a certain distance between the heat sinks. Metal materials such as aluminum or copper can be used to have good thermal conductivity. The two heat sink modules form an angle space relative to each other, for example, they are arranged in parallel, for installing the second heat sink 106. The second heat sink 106 adopts a fan structure. The direction of the airflow generated by the fan is consistent with the direction of the heat sink spacing, which can ensure that the airflow can flow along the gap between the heat sinks to form a direct heat dissipation channel. The airflow is blown out from the fan, passes through the fins of the heat sink, and takes away the heat to achieve the purpose of heat dissipation. Setting the fan between a pair of heat sink modules can make full use of the space, make the heat dissipation device structure more compact, and make the heat dissipation process more concentrated and efficient, reduce the diffusion of heat in other directions, and provide high power dissipation heat dissipation capabilities.

[0043] In some embodiments, one end of the heat conductor 103 is in direct contact with the target heat-generating component 6 and is responsible for receiving the heat generated by the target heat-generating component 6 , and the other end extends into the first heat dissipation element 105 .

[0044] Specifically, the portion of the heat conductor 103 located below the first heat sink 105 may be a cube structure having a cavity. This cube structure can provide a certain amount of storage space and help stabilize the placement of the heat conductor 103 in the installation position. The portion extending into the first heat sink 105 may be a plurality of pipeline structures, and the plurality of pipeline structures are connected to the cube structure below to form an integral heat conduction channel. The interior of the heat conductor 103 is filled with a cooling medium, such as a phase change material. The phase change material undergoes a phase change when absorbing heat, thereby effectively absorbing and storing heat. When the temperature drops, the phase change material releases heat again, realizing dynamic regulation of heat. Alternatively, the heat conductor 103 may be a solid structure, such as a solid structure made of materials such as copper, ceramics, and graphite. The heat conductor 103 utilizes its own material properties to directly conduct heat.

[0045] When the target heat-generating component 6 is working and generates heat, the heat is first transferred to the end of the heat conductor 103 in contact with the target heat-generating component 6. The heat enters the multiple pipeline structures through the square structure of the heat conductor 103. Since the pipeline structure is connected to the square structure, the heat can be quickly transferred inside the entire heat conductor 103. The cooling medium (phase change material) inside the heat conductor 103 undergoes a phase change after absorbing heat and stores the heat. At the same time, the heat conductor 103 transfers the heat to the first heat sink 105, and the first heat sink 105 dissipates the heat into the surrounding environment through its own heat dissipation structure and the heat dissipation channel formed with the fan. Thereby, the thermal conductivity efficiency is improved and an efficient heat dissipation effect is achieved.

[0046] In some embodiments, the connecting portion 201 has an opening 203 in the middle, and the heat conductor 103 passes through the opening 203 to contact the target heat-generating component 6; the supporting portion 202 abuts against the fixed bracket 3 so that the direction of the supporting force of the supporting portion 202 on the heat dissipation module 1 is opposite to the direction of the pressing force of the heat dissipation module 1 on the target heat-generating component 6.

[0047] The connecting portion 201 is a frame structure, in the middle of which is provided an opening 203 suitable for the heat conductor 103 to pass through. After passing through the opening 203, the heat conductor 103 is in direct contact with the target heat-generating component 6, ensuring that the heat is quickly transferred to the heat dissipation module 1. The supporting portion 202 can be a pair, which are relatively arranged on the connecting portion 201 to provide uniform supporting force. The supporting portion 202 is in contact with the fixed bracket 3, and the direction of its supporting force is opposite to the direction of the pressing force of the heat dissipation module 1 on the target heat-generating component 6. The supporting portion 202 can be one or more support rods, springs and other similar structures, which are used to maintain the stability of the heat dissipation module 1 and provide appropriate pressing force.

[0048] In some embodiments, the heat dissipation device also includes: an elastic pushing member 4, which is arranged between the support part 202 and the fixed bracket 3; the elastic pushing member 4 includes an elastic member 401 and a pushing part 402, one side surface of the pushing part 402 abuts against the fixed bracket 3, the elastic member 401 is arranged between the pushing part 402 and the support part 202, and the elastic member 401 is in a compressed state.

[0049] The elastic pushing member 4 is composed of an elastic member 401 and a pushing portion 402. The pushing portion 402 is a plate structure parallel to the support portion 202, and one side surface thereof abuts against the fixed bracket 3. The elastic member 401 (such as a spring or elastic gasket) is located between the pushing portion 402 and the support portion 202 and is in a compressed state, providing a preload force for the elastic pushing member 4. When the elastic member 401 is compressed, it pushes the pushing portion 402 and then pushes the fixed bracket 3, providing a reverse elastic force when the heat dissipation module 1 applies pressure to the target heating component 6, reducing the uniform pressing force applied by the heat dissipation module 1 to the heating component. The elastic pushing member 4 between the support portion 202 and the fixed bracket 3 works together to keep the heat dissipation module 1 in good contact with the target heating component 6, while avoiding damage to the target heating component 6 due to excessive pressing force. For example, when the heat dissipation module 1 is locked downwardly with the plate body 7 by the fixed bracket 3, the 20-pound reverse force of the elastic push member 4 can resist the 40-pound locking force of the heat dissipation module itself, so that the final pressure on the target heat-generating component 6 is 20 pounds, thereby meeting the standard requirements of the fastener pressure.

[0050] In some embodiments, the support portion 202 may be an L-shaped support plate, including a first connecting plate arranged horizontally and a second connecting plate arranged vertically, wherein the second connecting plate is connected to the connecting portion 201. The pushing portion 402 includes a third connecting plate parallel to the support portion 202, and the third connecting plate is connected to the first connecting plate through a pair of connecting columns. The elastic member 401, such as a spring, is sleeved on the outer periphery of the connecting column and is located between the third connecting plate and the first connecting plate. The first connecting plate is provided with a through hole, and the connecting column passes through the through hole and is loosely fitted with the first connecting plate. When the heat dissipation module 1 applies a pressing force to the target heat-generating component 6, the pressure is transmitted to the support portion 202 and then to the third connecting plate. Due to the loose fit between the connecting column and the first connecting plate, the third connecting plate can move slightly along the axial direction of the connecting column under the action of pressure, thereby compressing the elastic member 401. This enables the elastic member 401 to adaptively adjust according to the pressure changes of the heat dissipation module 1 on the target heat-generating component 6. When the pressure increases, the elastic member 401 is further compressed, providing a greater reverse support force to prevent excessive pressure from damaging the target heating component 6; when the pressure decreases, the degree of compression of the elastic member 401 decreases, and the reverse support force also decreases accordingly, ensuring that the heat dissipation module 1 and the target heating component 6 always maintain good contact.

[0051] In some embodiments, the fixing bracket 3 is further provided with a fixing member 302 , and the fixing members 302 are respectively connected to one end of a pair of heat sink modules away from the fixing assembly 101 .

[0052] A pair of heat sink modules are located on either side of the fan, with one end proximal to the fixing assembly 101 and the other end distal to the fixing assembly 101. A fixing member 302 secures the ends of the heat sink modules distal to the fixing assembly 101 in place. The fixing member 302 can be a connecting rod, connecting plate, or other similar fixing device used to connect the ends of the pair of heat sink modules. The fixing bracket 3 is located at the ends of the heat sink modules distal to the fixing assembly 101, each extending toward the heat sink modules on either side. The connecting plate has a first through-hole. The fixing member 302 is a single fixing plate with a second through-hole corresponding to the first through-hole on the connecting plate. Bolts, such as jackscrews, are then inserted through the first and second through-holes to abut the top surfaces of the heat sink modules, thereby connecting the pair of heat sink modules to the fixing bracket 3. Because the heat sink modules are susceptible to shaking or deformation during operation due to factors such as airflow and vibration, the fixing member 302 effectively limits their movement, ensuring they remain in the correct position and improving the stability of the heat dissipation effect.

[0053] The heat sink provided in the embodiments of the present application not only meets the clip pressure standards but also achieves stable locking of the heat sink. By ensuring that the direction of the support force exerted by the support portion 202 on the heat sink module 1 is opposite to the direction of the pressing force exerted by the heat sink module 1 on the target heat-generating component 6, the heat dissipation pressure exerted by the heat sink on the target heat-generating component 6 is kept within a safe range while achieving stable fixation of the heat sink. The heat sink provided in the embodiments of the present application utilizes a sandwich structure, where the fan is located between a pair of oppositely positioned heat sink modules, resulting in excellent ultra-high power dissipation and heat dissipation capabilities.

[0054] Example 2

[0055] An embodiment of the present application provides an electronic device, including: a target heating component 6; a board body 7, on which the target heating component 6 is arranged; a heat dissipation device, the heat dissipation device including a heat dissipation module 1, the heat dissipation module 1 is in contact with the target heating component 6 to exchange heat with the target heating component 6; a support member 2, arranged between the heat dissipation module 1 and the board body 7, the support member 2 having a connecting portion 201 and a supporting portion 202, the connecting portion 201 being detachably connected to the board body 7, the connecting portion 201 having an opening 203, so that there is a gap between the connecting portion 201 and the target heating component 6; the supporting portion 202 supports the heat dissipation module 1, and the direction of the supporting force of the supporting portion 202 on the heat dissipation module 1 is opposite to the direction of the pressing force of the heat dissipation module 1 on the target heating component 6.

[0056] The electronic device mainly includes a target heating component 6, a board 7 and a heat dissipation device. The target heating component 6 is arranged on the board 7, and can be a variety of electronic components that generate a large amount of heat during operation, such as a central processing unit (CPU), a graphics processing unit (GPU), a neural network processor (NPU), a chipset, a memory, a solid-state hard disk, etc. The board 7 can be a circuit board. The heat dissipation device is composed of a heat dissipation module 1 and a support member 2. The heat dissipation module 1 is in direct contact with the target heating component 6, and absorbs and dissipates the heat generated by the target heating component 6 through heat exchange. The support member 2 is arranged between the heat dissipation module 1 and the board 7, and has a connecting portion 201 and a supporting portion 202. The connecting portion 201 is detachably connected to the board 7. The direction of the supporting force of the supporting portion 202 on the heat dissipation module 1 is opposite to the direction of the pressing force of the heat dissipation module 1 on the target heating component 6. In this way, the pressure of the heat dissipation module 1 on the target heating component 6 can be balanced, which not only prevents the target heating component 6 from being physically damaged by excessive pressure, but also avoids the loose connection between the heat dissipation module 1 and the board 7 caused by too little pressure, thereby improving the structural stability of the entire electronic device.

[0057] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A heat dissipation device, characterized in that: include: a heat dissipation module detachably connected to a plate body provided with a target heat-generating component, the heat dissipation module being in contact with the target heat-generating component to perform heat exchange with the target heat-generating component; A support member is provided between the heat dissipation module and the plate body, the support member having a connecting portion and a supporting portion, the connecting portion being detachably connected to the plate body, the connecting portion having an opening so that there is a gap between the connecting portion and the target heat-generating component; the supporting portion supports the heat dissipation module, and the direction of the supporting force of the supporting portion on the heat dissipation module is opposite to the direction of the pressing force of the heat dissipation module on the target heat-generating component.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation module includes a fixing component and a heat dissipation component, wherein the fixing component is detachably connected to the plate body, and the heat dissipation component has a heat conducting member on a side facing the target heat-generating component, and the heat conducting member is in contact with the target heat-generating component; The connecting portion is connected to the fixing assembly and / or the plate body, and the supporting portion is at least partially abutted against the heat dissipation assembly so that the direction of the supporting force of the supporting portion on the heat dissipation module is opposite to the direction of the pressing force of the heat dissipation module on the target heat-generating component.

3. The heat dissipation device according to claim 2, characterized in that: The fixing assembly has a plurality of first connection ends; the plurality of first connection ends are evenly distributed around the periphery of the heat conducting member; The connecting portion has a plurality of second connecting ends, each of which is detachably connected to one of the first connecting ends, or the second connecting end is detachably connected to the plate body.

4. The heat dissipation device according to claim 2, characterized in that: The heat dissipation assembly includes a first heat dissipation member and a second heat dissipation member. The first heat dissipation member is connected to the heat conducting member to realize heat exchange. The first heat dissipation member has an accommodating cavity in the middle, and the second heat dissipation member is arranged in the accommodating cavity.

5. The heat dissipation device according to claim 4, characterized in that: Also includes: A fixing bracket is arranged in the accommodating cavity, the second heat dissipation member is arranged in the fixing bracket, a first limiting portion is provided on the fixing bracket, a second limiting portion is provided on the first heat dissipation member, and the first limiting portion and the second limiting portion are in abutment with each other.

6. The heat dissipation device according to claim 5, characterized in that: The first heat dissipation element includes a pair of heat dissipation fin modules arranged opposite to each other, and the second heat dissipation element is a fan, which is arranged between the pair of heat dissipation fin modules; The airflow direction generated by the fan is consistent with the extending direction of the heat sink spacing of the heat sink module to form a heat dissipation channel.

7. The heat dissipation device according to claim 5, characterized in that: The middle portion of the connecting portion has the opening, and the heat conducting member passes through the opening and contacts the target heat-generating component; The supporting portion abuts against the fixing bracket so that the direction of the supporting force of the supporting portion on the heat dissipation module is opposite to the direction of the pressing force of the heat dissipation module on the target heat-generating component.

8. The heat dissipation device according to claim 7, characterized in that: Also includes: an elastic pushing member, the elastic pushing member being provided between the supporting portion and the fixing bracket; The elastic pushing member includes an elastic member and a pushing portion. One side surface of the pushing portion abuts against the fixing bracket. The elastic member is arranged between the pushing portion and the supporting portion, and the elastic member is in a compressed state.

9. The heat dissipation device according to claim 6, wherein: The fixing bracket is further provided with fixing members, and the fixing members are respectively connected to one end of a pair of heat sink modules away from the fixing assembly.

10. An electronic device, characterized in that: include: Target heat-generating components; a plate body, on which the target heat-generating component is disposed; a heat dissipation device, the heat dissipation device comprising a heat dissipation module, the heat dissipation module being in contact with the target heat-generating component to perform heat exchange with the target heat-generating component; A support member is provided between the heat dissipation module and the plate body, the support member having a connecting portion and a supporting portion, the connecting portion being detachably connected to the plate body, the connecting portion having an opening so that there is a gap between the connecting portion and the target heat-generating component; the supporting portion supports the heat dissipation module, and the direction of the supporting force of the supporting portion on the heat dissipation module is opposite to the direction of the pressing force of the heat dissipation module on the target heat-generating component.

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