Substrate-free resistor forming blank and substrate-free resistor plate

Abstract

The utility model provides a base-material-free resistor forming blank and a base-material-free resistor plate. The base-material-free resistor forming blank comprises electrodes, a resistor body and a heat-resistant foam layer, the electrode is formed on the upper end surface of the resistor body; one end face of the heat-resistant foam layer has adhesive force and is attached to the lower end face of the resistor body. The electrode of the resistor on the upper end face of the resistor body ensures stable transmission of current and exertion of the resistor function, and the heat-resistant foam layer has high shear force adhesion performance, so that one side of the heat-resistant foam layer is attached to the lower end face of the resistor body to provide independent stable support and can also be used as a medium for attaching the resistor body to a temporary support plate; meanwhile, due to the high shear force adhesion performance of the heat-resistant foam layer, the heat-resistant foam layer can be separated from the resistor body without being illuminated or heated, and can be separated from the resistor body without traces only by a certain external force, so that the production flow and process requirements of the substrate-free resistor are simplified, the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of passive components and manufacturing thereof, in particular to a resistor forming embryo without a substrate and a resistor plate without a substrate. Background Art

[0002] Currently, the existing resistor manufacturing process often uses ceramic (thicker, ~0.3mm) or fiberglass (thinner, ~0.05mm) as a substrate, upon which the electrode areas and resistor body are formed, as shown in CN101430955A. However, the current electronics industry demands thinness and lightness. Due to the limitations of the aforementioned substrates, existing resistors have a maximum thickness, which also limits the resistor's resistance range.

[0003] Therefore, how to overcome the above problems is a technical problem that urgently needs to be solved. Utility Model Content

[0004] The purpose of the present invention is to provide a resistor forming embryo without a substrate and a resistor plate without a substrate, which can improve the above-mentioned problems.

[0005] The embodiment of the present utility model is achieved as follows:

[0006] In a first aspect, the present invention provides a substrate-free resistor embryo, comprising an electrode, a resistor body, and a heat-resistant foam layer. The electrode is formed on the upper end surface of the resistor body. The heat-resistant foam layer has an adhesive end surface that is attached to the lower end surface of the resistor body. The heat-resistant foam layer is a heat-resistant foam with a surface having high shear adhesion.

[0007] As a preferred embodiment, a temporary carrier is provided on the side opposite to the bonding surface of the heat-resistant foam layer and the resistor body. The temporary carrier supports the heat-resistant foam layer, thereby providing a flat and stable supporting surface for the resistor body and providing good stability for the precision production of the resistor.

[0008] In order to have adhesion performance on the lower end surface of the heat-resistant foam and prevent its adhesion from affecting the conveying process, the lower end surface of the heat-resistant foam is provided with a protective pad.

[0009] As a preferred embodiment, the protective liner is a peelable protective liner, which can be peeled off to achieve adhesion according to production or transportation needs.

[0010] As a preferred embodiment, in the case where a temporary carrier is provided, in order to facilitate peeling of the temporary carrier, the adhesion between the protective pad and the heat-resistant foam is greater than the adhesion between the protective pad and the temporary carrier.

[0011] This difference in adhesion is achieved by the difference in adhesion between the protective liner and the heat-resistant foam. Alternatively, it can be achieved by adding an adhesive, such as a photolytic adhesive or hot-melt adhesive, between the contact surface of the protective liner and the temporary carrier. When peeling is required, achieving these conditions weakens the adhesion between the protective liner and the temporary carrier, enabling efficient and complete peeling.

[0012] As a preferred embodiment, the protective liner is a PET release liner, which has a strong adhesive ability and has the effect of leaving no glue residue on the adhesive surface when the liner is released.

[0013] When the resistor without substrate is formed into an embryonic body without a temporary carrier, the thickness of the heat-resistant foam layer is 0.5 mm to 1.5 mm, ensuring that the hardness of the heat-resistant foam layer is sufficient to provide a flat and stable supporting surface for the resistor body.

[0014] When the resistor-forming embryo without a substrate is provided with a temporary carrier, the thickness of the heat-resistant foam layer is 0.02 mm to 0.5 mm, which effectively saves consumables.

[0015] In a possible embodiment, in order to improve the stability of the connection between the heat-resistant foam and the PET release liner, the heat-resistant foam and the PET release liner are adhered to each other by a heat-resistant adhesive.

[0016] In a possible embodiment, the temporary carrier is a temporary carrier made of a release material, specifically a release paper or a release film.

[0017] A resistor board is provided with the above-mentioned resistor-forming embryos without a substrate, and the resistor-forming embryos are arranged in an array; in the case where there is no temporary carrier, the resistor-forming embryos are connected to form a resistor board through a heat-resistant foam layer; in the case where a temporary carrier is provided, the resistor-forming embryos are connected to form a resistor board through a heat-resistant foam layer or a temporary carrier.

[0018] Beneficial effects:

[0019] The present invention provides a substrate-free resistor body and substrate-free resistor board. Using a heat-resistant foam with high shear adhesion properties attached to the bottom surface of the resistor body, this foam provides a flat and stable independent support for the resistor body and also serves as a medium for attaching the resistor body to a temporary carrier. Furthermore, the high shear adhesion of the heat-resistant foam allows for seamless detachment from the resistor body with only a certain amount of external force, without the need for light or heating, simplifying the production process and process requirements for substrate-free resistors.

[0020] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 It is a schematic diagram of the resistor structure without a temporary carrier;

[0023] Figure 2 It is a structural diagram of a resistor board without a substrate and a temporary carrier;

[0024] Figure 3 This is a schematic diagram of the resistor structure with a temporary carrier;

[0025] Figure 4 The present invention is a structural diagram of a resistor plate without a substrate and having a temporary carrier plate.

[0026] 11. Electrode; 12. Resistor body; 13. Heat-resistant foam layer; 14. Protective pad; 15. Temporary carrier board. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the utility model for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0028] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0030] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the invented product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as a limitation on the present invention.

[0031] Example 1:

[0032] like Figure 1 As shown, a resistor without a substrate is formed into an embryonic body, which includes an electrode 11, a resistor body 12 and a heat-resistant foam layer 13. The electrode 11 is formed on the upper end face of the resistor body 12. One end face of the heat-resistant foam layer 13 has adhesion, and the end face is bonded to the lower end face of the resistor body 12. This bonding performance is based on the high shear force bonding performance of the surface of the heat-resistant foam layer 13. After bonding, it provides stable support for the resistor body 12 during the production process. Within the range that the shear force can withstand, the heat-resistant foam layer 13 and the resistor body 12 are tightly bonded. When the resistor body 12 needs to be separated from the heat-resistant foam layer 13, a pulling force is applied to make the two form a relative movement trend, and the pulling force is greater than the shear force. At the same time, the heat resistance of the heat-resistant foam layer 13 enables it to maintain a good state in a high temperature environment, and the bonding performance will not be affected by temperature changes. At the same time, the heat-resistant foam has high shear adhesion performance and does not require light or heating. It can be separated from the resistor body 12 without a trace with only a certain external force, which simplifies the production process and process requirements of substrate-free resistors, improves production efficiency, reduces production costs, and lays the foundation for the widespread application of resistors.

[0033] When heat-resistant foam layer 13 needs to independently support the resistor without temporary support plate 15, its thickness should be between 0.5mm and 1.5mm. Within this thickness range, heat-resistant foam layer 13 is sufficiently hard to support the entire structure, functioning as temporary support plate 15 and providing stable support for resistor body 12, ensuring the resistor maintains good condition in various environments.

[0034] In the substrate-free resistor embryo, a protective liner 14 is placed on the lower surface of the heat-resistant foam layer 13. This liner is a removable PET release liner, offering excellent flexibility and practicality. During the resistor's production, transportation, and storage, the liner effectively protects the heat-resistant foam layer 13 and the entire resistor structure from potential damage. For example, it prevents scratches, impacts, and dust contamination. When the resistor is ready for use, simply peel off the liner 14 to reveal the intact heat-resistant foam layer 13 and other components. This is a quick and easy process.

[0035] like Figure 2 As shown, a resistor board with the above-mentioned substrate-free resistor forming embryos is arranged in an array. In the case where there is no temporary carrier 15, each resistor forming embryo is connected to form a resistor board through a heat-resistant foam layer 13. The heat-resistant foam layer 13 not only provides support for a single resistor body 12, but also serves to connect each resistor forming embryo, tightly combining each resistor body 12 together to form a whole.

[0036] Example 2:

[0037] Based on the substrate-free resistor forming body and substrate-free resistor plate provided in Example 1 of this application, Example 2 of this application provides a substrate-free resistor forming body and substrate-free resistor plate. This Example 2 is merely a preferred embodiment of Example 1; the implementation of Example 2 will not affect the independent implementation of Example 1. The second embodiment of this utility model will be further described below.

[0038] like Figure 3 As shown, a temporary support plate 15 is provided on the side of the heat-resistant foam layer 13 opposite the surface where it mates with the resistor body 12. This temporary support plate 15 adds further stability and functionality to the entire resistor structure. When the heat-resistant foam layer 13 is bonded to one side of the resistor body 12, the temporary support plate 15 on the other side provides additional support for the resistor, ensuring a more secure bond between the heat-resistant foam layer 13 and the resistor body 12.

[0039] The thickness of the heat-resistant foam layer 13 ranges from 0.02mm to 0.5mm. With the added support of the temporary carrier 15, the thickness range can be slightly smaller than without the temporary carrier 15. The heat-resistant foam layer 13 and the temporary carrier 15 work together to create a stable working environment for the resistor body 12. The temporary carrier 15 is made of release paper, which offers excellent flatness and smoothness, providing a stable support surface for the resistor body 12. Furthermore, the release paper is easy to peel off, leaving no residue during the separation process, ensuring the cleanliness and integrity of the resistor body 12.

[0040] When a temporary carrier 15 is provided, the adhesion between the protective pad 14 and the heat-resistant foam layer 13 is greater than the adhesion between the protective pad 14 and the temporary carrier 15. Since the resistor structure needs to be assembled and disassembled at different stages when the temporary carrier 15 is provided, the strong adhesion between the protective pad 14 and the heat-resistant foam layer 13 ensures that the protective pad 14 will not easily separate from the heat-resistant foam layer 13 during operation, thereby providing effective protection for the heat-resistant foam layer 13 at all times. The relatively weak adhesion between the protective pad 14 and the temporary carrier 15 ensures that when the resistor body 12 needs to be removed from the temporary carrier 15, the protective pad 14 can be easily separated from the temporary carrier 15 along with the resistor body 12, eliminating unnecessary trouble in the operation.

[0041] The protective liner 14 is bonded to the temporary carrier 15 with an adhesive. This adhesive has moderate adhesion, ensuring that the protective liner 14 remains firmly attached to the temporary carrier 15 when needed, while also leaving no residue when removed. The adhesive is carefully selected for its excellent heat and chemical resistance, ensuring that it will not lose its adhesion due to temperature fluctuations or contact with chemicals in the resistor's operating environment.

[0042] The temporary carrier 15 is a release paper, which has good flatness and smoothness and can provide a stable support surface for the resistor body 12. At the same time, the release paper is easy to peel off and will not leave residue during the separation process, ensuring the cleanliness and integrity of the resistor body 12. When the protective liner 14 and the temporary carrier 15 are bonded together by an adhesive, the characteristics of the release paper make the entire structure more stable and reliable. When the resistor body 12 needs to be removed from the temporary carrier 15, the easy peelability of the release paper makes the operation simpler and faster, while also reducing the risk of damage to the resistor body 12 and the heat-resistant foam layer 13.

[0043] like Figure 2 、 Figure 4 As shown, a resistor board with the aforementioned substrate-free resistor forming blanks arranged in an array is provided. In the presence of a temporary carrier 15, the individual resistor forming blanks can be connected to form a resistor board via a heat-resistant foam layer 13 or the temporary carrier 15. In this case, the temporary carrier 15 and the heat-resistant foam layer 13 serve the same function, providing more options and possibilities for connecting the resistor forming blanks. Whether using the heat-resistant foam layer 13 or the temporary carrier 15, both ensure the stability and reliability of the resistor board.

[0044] The difference between this second embodiment and the first embodiment is that a temporary carrier plate 15 is provided on the side opposite to the bonding surface of the heat-resistant foam layer 13 and the resistor body 12. When the heat-resistant foam layer 13 is bonded to one side of the resistor body 12, the temporary carrier plate 15 on the other side provides additional support for the resistor. The temporary carrier plate 15 enhances the stability of the entire resistor structure. It can effectively disperse external pressure, ensuring a tighter and more secure bond between the heat-resistant foam layer 13 and the resistor body 12, further improving the reliability and durability of the resistor, and providing a stronger guarantee for its wide application in various fields. The remaining conditions are consistent with those of the first embodiment, so they will not be repeated in this embodiment.

[0045] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A resistor-forming embryo without a substrate, characterized in that; It includes electrodes, a resistor body and a heat-resistant foam layer; The electrode is formed on the upper end surface of the resistor body; One end surface of the heat-resistant foam layer has adhesion, and the end surface is attached to the lower end surface of the resistor body.

2. The resistor-forming embryo without a substrate according to claim 1, characterized in that: A temporary carrier plate is provided on the side of the heat-resistant foam layer opposite to the bonding surface of the resistor body.

3. The resistor-forming embryo without a substrate according to claim 1, characterized in that: The thickness of the heat-resistant foam layer is 0.5 mm to 1.5 mm.

4. The resistor-forming embryo without a substrate according to claim 2, characterized in that: The thickness of the heat-resistant foam layer is 0.02 mm to 0.5 mm.

5. The substrate-less resistor forming embryo according to claim 1 or 2, characterized in that: The lower end surface of the heat-resistant foam is provided with a protective pad.

6. The resistor-forming embryo without a substrate according to claim 5, characterized in that: The protective liner is a peelable protective liner.

7. The resistor-forming embryo without a substrate according to claim 5, characterized in that: In the case where a temporary carrier plate is provided, the adhesion between the protective pad and the heat-resistant foam is greater than the adhesion between the protective pad and the temporary carrier plate.

8. The resistor-forming embryo without a substrate according to claim 7, characterized in that: The protective pad is bonded to the temporary carrier plate through an adhesive.

9. The resistor-forming embryo without a substrate according to claim 2, characterized in that: The temporary carrier is a temporary carrier of release material.

10. A resistor board, comprising the resistor forming embryo body without a substrate according to any one of claims 1 to 9, characterized in that: The resistors are arranged in an embryonic array; In the case of no temporary carrier, each resistor forming embryo is connected to form a resistor board through a heat-resistant foam layer; In the case where a temporary carrier is provided, each resistor forming embryonic body is connected to form a resistor board through a heat-resistant foam layer or a temporary carrier.

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