Pressing wheel device for bonding and bonding equipment

Abstract

The utility model provides a pressing wheel device for bonding and bonding equipment. The pressing wheel device for bonding is mounted at the edge of a runner of bonding equipment, is used for conveying a lead frame on the runner, and comprises a fixed mounting block, a supporting connecting rod, a first pressing wheel and a gravity block, the fixed mounting block can be fixedly mounted on the edge of a runner of the bonding equipment; the supporting connecting rod is provided with a first end and a second end which are deviated from each other; the first end of the supporting connecting rod is rotatably mounted at the top end of the fixed mounting block; the first pressing wheel is rotatably mounted at the second end of the supporting connecting rod and can rotate by taking the central shaft of the first pressing wheel as a rotating shaft; the gravity block is arranged on the supporting connecting rod, located between the first end and the second end and used for providing gravity so that the first pressing wheel can provide traction force for the edge of the upper surface of the lead frame located on the flow channel. According to the pressing wheel device for bonding, the stability of providing traction force for the lead frame is guaranteed, damage to the lead frame is reduced, and therefore the bonding yield is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a bonding pressure wheel device and bonding equipment. Background Art

[0002] Currently, the bonding equipment uses an online lead frame transmission method. The pressure roller device is installed at the front end of the flow channel. Its function is to push the lead frame in the material box to the flow channel inlet and outlet by the push rod, and then transmit it to the flow channel sensing position through the pressure roller. Since the pressure roller is close to the position of the wafer set on the lead frame, if the pressure roller device is offset or loose, it will cause the frame wafer to be crushed and scrapped. In related technologies, the pressure roller device uses a pneumatic linkage device. Frequent up and down force causes the pressure roller cylinder to be damaged and loose, and the pneumatic pressure is unstable, which can easily cause the pressure roller position to shift and cause failure. Summary of the Invention

[0003] The embodiment of the present application provides a bonding pressure wheel device, which is installed at the edge of a flow channel of a bonding device and is used to transport a lead frame on the flow channel, and includes:

[0004] Fixed mounting block, which can be fixedly mounted on the edge of the flow channel of the bonding equipment;

[0005] a supporting connecting rod having a first end and a second end that are separated from each other, wherein the first end of the supporting connecting rod is rotatably mounted on the top end of the fixed mounting block;

[0006] a first pressing wheel rotatably mounted on the second end of the supporting connecting rod and capable of rotating about the central axis of the first pressing wheel as a rotating axis;

[0007] The gravity block is provided on the supporting connecting rod and is located between the first end and the second end, and is used to provide gravity so that the first pressure wheel can provide traction to the edge of the upper surface of the lead frame located on the flow channel.

[0008] In some embodiments, the fixed mounting block is an integrally formed structure.

[0009] In some embodiments, the fixed mounting block has a plurality of mounting holes spaced apart along the length direction, and the plurality of mounting holes are provided with fasteners;

[0010] The fixed mounting block includes a first mounting portion located at the bottom and a second mounting portion connected to the top of the first mounting portion, the supporting connecting rod is mounted on the second mounting portion, the first mounting portion of the fixed mounting block has a top wall surface located at the top end and a bottom wall surface located at the bottom end, and the plurality of mounting holes penetrate the top wall surface and the bottom wall surface of the fixed mounting block;

[0011] The edge of the flow channel of the bonding device is provided with a mounting wall, and the mounting wall has a plurality of matching mounting holes respectively corresponding to the plurality of mounting holes.

[0012] In some embodiments, the fixed mounting block has a lateral offset limiting structure provided in the length direction.

[0013] In some embodiments, the lateral offset limit structure is a card slot provided on the bottom wall surface and extending along the length direction of the fixed mounting block; the mounting wall extends along the length direction of the flow channel of the bonding device, and the card slot is clamped at the top end of the mounting wall.

[0014] In some embodiments, the lateral offset limiting structure is a limiting protrusion provided on the bottom wall surface, wherein the limiting protrusion is a continuous protrusion extending along the length direction of the fixed installation block, or the limiting protrusion is a plurality of protrusions provided at intervals along the length direction of the fixed installation block;

[0015] The mounting wall extends along the length direction of the flow channel of the bonding device, and a snap-fitting groove that cooperates with the limiting protrusion is provided at the top of the mounting wall.

[0016] In some embodiments, the length of the fixed mounting block is 40 mm-60 mm.

[0017] In some embodiments, the thickness of the first pressing wheel is less than 2 mm.

[0018] In some embodiments, the thickness of the first pressing wheel is 1 mm.

[0019] The present application also provides a bonding device, which includes:

[0020] a runner for conveying lead frames;

[0021] An active transmission pressing wheel device is provided below the flow channel and has a second pressing wheel located below the edge of the flow channel;

[0022] A passive transmission pressure wheel device is installed on the edge of the flow channel and is used to transport the lead frame on the flow channel. The passive transmission pressure wheel device is the bonding pressure wheel device as described above; wherein the second pressure wheel is an active pressure wheel, and the first pressure wheel of the bonding pressure wheel device is a driven pressure wheel. The first pressure wheel and the second pressure wheel are arranged opposite to each other and can provide matching traction pressure to the edge of the lead frame from the upper and lower surfaces of the lead frame on the flow channel to drive the lead frame into the flow channel and move the lead frame on the flow channel.

[0023] The main technical effects achieved by the embodiments of the present application are:

[0024] The bonding pressure wheel device and bonding equipment provided in the embodiments of the present application are configured to have a structure comprising a fixed mounting block, a supporting connecting rod, a first pressure wheel and a gravity block. The bonding pressure wheel device provides gravity through the gravity block, so that the first pressure wheel can provide traction to the edge of the upper surface of the lead frame located on the flow channel. Compared with a pressure wheel device that uses a pneumatic or other power drive device to provide pressure, the resource consumption of the driving structure is reduced. Moreover, since the gravity of the gravity block is constant, it is beneficial to ensure the stability of the traction force provided to the lead frame, reduce damage to the lead frame, and thus improve the bonding yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a side view of a partial structure of a bonding device provided by an exemplary embodiment of the present application from one perspective;

[0026] Figure 2 It is a schematic exploded view from another perspective of a partial structure of a bonding device provided by an exemplary embodiment of the present application. DETAILED DESCRIPTION

[0027] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0028] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0029] The following is combined with Figure 1 and Figure 2 , some embodiments of the present application are described in detail. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0030] Reference Figure 1 , and when necessary, combine Figure 2As shown, the present application provides a bonding pressure roller device 100, which is installed at the edge of a flow channel 200 of a bonding device and is used to transport a lead frame (not shown) on the flow channel 200. The lead frame is attached to a wafer. The bonding pressure roller device 100 includes a fixed mounting block 10, a support link 20, a first pressure roller 30, and a gravity block 40.

[0031] The fixed installation block 10 can be fixedly installed on the edge of the flow channel 200 of the bonding device.

[0032] The supporting link 20 has a first end 21 and a second end 22 that are separated from each other. The first end 21 of the supporting link 20 is rotatably mounted on the top end of the fixed mounting block 10 .

[0033] The first pressing wheel 30 is rotatably mounted on the second end 22 of the supporting link 20 and can rotate around the central axis O1 of the first pressing wheel 30 as a rotation axis.

[0034] The gravity block 40 is provided on the supporting link 20 and located between the first end 21 and the second end 22 , and is used to provide gravity so that the first pressure wheel 30 can provide traction to the edge of the upper surface of the lead frame located on the flow channel 200 .

[0035] The above-mentioned bonding pressure wheel device 100 is configured to have a structure including a fixed mounting block 10, a supporting connecting rod 20, a first pressure wheel 30 and a gravity block 40. The bonding pressure wheel device 100 provides gravity through the gravity block 40, so that the first pressure wheel 30 can provide traction to the edge of the upper surface of the lead frame located on the flow channel 200. Compared with the pressure wheel device that uses pneumatic or other power drive devices to provide pressure, the resource consumption of the driving structure is reduced, and since the gravity of the gravity block 40 is constant, it is beneficial to ensure the stability of the traction provided to the lead frame, reduce damage to the lead frame and the chip thereon, and thus improve the bonding yield.

[0036] like Figure 1 As shown, in some embodiments, the fixed mounting block 10 may include a first mounting portion 11 at the bottom and a second mounting portion 12 connected to the top of the first mounting portion 11. The first mounting portion 11 may be an elongated block extending along the length direction L1 of the fixed mounting block 10. The second mounting portion 12 may be a raised block-like structure or a strip-like structure extending upward from the top of the first mounting portion 11. The support link 20 may be mounted on the top of the second mounting portion 12.

[0037] In some embodiments, the fixed mounting block 10 is an integrally formed structure, which reduces the device deviation caused by loosening or improper tightening that may occur during the operation of the bonding pressure wheel device due to the use of multiple splicing structures in the fixed mounting related structure, and is beneficial to further ensure the stability of the first pressure wheel 30 to reduce damage to the lead frame.

[0038] like Figure 1 As shown, the first mounting portion 11 and the second mounting portion 12 are an integrally formed structure.

[0039] In some embodiments, the fixed mounting block 10 has a plurality of mounting holes 103 spaced apart along its length, and fasteners (not shown) are provided in the plurality of mounting holes 103. The first mounting portion 11 of the fixed mounting block 10 has a top wall surface 102 at the top and a bottom wall surface 101 at the bottom, and the plurality of mounting holes 103 extend through the top wall surface 102 and the bottom wall surface 101 of the fixed mounting block 10.

[0040] The edge of the flow channel 200 of the bonding device has a mounting wall 201 , and the mounting wall 201 has a plurality of matching mounting holes 203 corresponding to the plurality of mounting holes 103 .

[0041] The mounting hole 103 and the matching mounting hole 203 may be threaded holes with internal threads, and the fasteners may be corresponding fastening structures such as screws and bolts.

[0042] like Figure 2 As shown, in some embodiments, the first pressing wheel 30 can be rotatably mounted on the second end 22 of the supporting link 20 via a rotating shaft 301. The cross section of the first pressing wheel 30 perpendicular to its thickness is circular, and the rotating shaft 301 is connected to the center area of ​​the first pressing wheel 30. The central axis O1 of the first pressing wheel 30 is collinear with the central axis of the rotating shaft 301.

[0043] In some embodiments, the fixed installation block 10 has a lateral offset limiting structure provided in the length direction L1 to prevent the fixed installation block 10 from offsetting to both sides in the length direction.

[0044] like Figure 2 As shown, in some embodiments, the fixed mounting block 10 has a bottom wall surface 101 at its bottom end, and the lateral offset limiting structure is a slot 1001 provided on the bottom wall surface 101 and extending along the length direction L1 of the fixed mounting block 10. The mounting wall 201 extends along the length direction L of the flow channel 200 of the bonding device, and the slot 1001 is secured to the top end 2011 of the mounting wall 201. The length direction L1 of the fixed mounting block 10 is consistent with the length direction L of the flow channel 200.

[0045] like Figure 2 As shown, the locking groove 1001 of the bottom wall 101 is surrounded by a recess 1011 located in the middle and raised steps 1012 located on both sides of the recess 1011 .

[0046] In other embodiments, the lateral offset limiting structure is a plurality of slots provided on the bottom wall surface and spaced apart along the length direction of the fixed mounting block. Accordingly, the mounting wall 201 has a protruding structure capable of cooperating with the plurality of slots.

[0047] In other embodiments, the lateral offset limiting structure is a limiting protrusion provided on the bottom wall surface 101, and the limiting protrusion is a continuous protrusion extending along the length direction of the fixed mounting block 10. Accordingly, the mounting wall 201 extends along the length direction L of the flow channel 200 of the bonding device, and the top end 2011 of the mounting wall 201 is provided with a snap-fitting groove that mates with the limiting protrusion. The snap-fitting groove is a continuous elongated groove.

[0048] In some other embodiments, the fixed mounting block 10 has a limiting protrusion at its bottom end, which is a plurality of protrusions spaced apart along the length of the fixed mounting block 10. Accordingly, the mounting wall 201 extends along the length of the flow channel 200 of the bonding device, and the top end of the mounting wall 201 is provided with a plurality of spaced apart engaging grooves that engage with the plurality of limiting protrusions.

[0049] In some embodiments, the length L0 of the fixed mounting block 10 in the longitudinal direction L1 is 40 mm to 60 mm, such as 40 mm, 42 mm, 45 mm, 46 mm, 48 mm, 49 mm, 50 mm, 55 mm, etc. Compared to a longer fixed mounting structure, at the same offset angle, this can reduce the offset of the fixed mounting block 10 and minimize damage to the lead frame in the flow channel and the wafer thereon.

[0050] In some embodiments, the thickness t of the first pressing wheel 30 is less than 2 mm. Controlling the thickness of the first pressing wheel 30 to be thinner is beneficial to controlling the distance between the first pressing wheel 30 and the wafer in the middle of the lead frame, thereby reducing damage to the wafer.

[0051] In some embodiments, the thickness t of the first pressing wheel 30 is 1 mm, which can well control the distance between the first pressing wheel 30 and the wafer in the middle of the lead frame, thereby reducing damage to the wafer.

[0052] The thickness of the first pressing wheel can also be set to other thicknesses, such as 1.8mm, 1.6mm, 1.5mm, 1.3mm, 1.2mm, 1.1mm, 0.9mm, 0.8mm, 0.7mm...

[0053] Another embodiment of the present application provides a bonding apparatus 1000, which includes a flow channel 200, an active transfer roller device, and a passive transfer roller device. The flow channel 200 is used to transfer lead frames. The active transfer roller device is located below the flow channel 200 and has a second roller 202 located below the edge of the flow channel 200.

[0054] A passive transmission pressure wheel device is installed on the edge of the flow channel 200 and is used to transport the lead frame on the flow channel 200. The passive transmission pressure wheel device is the bonding pressure wheel device 100 as described above; wherein, the second pressure wheel 202 is an active pressure wheel, and the first pressure wheel 30 of the bonding pressure wheel device 100 is a driven pressure wheel. The first pressure wheel 30 and the second pressure wheel 202 are arranged opposite to each other, and can provide matching traction pressure to the edge of the lead frame from the upper and lower surfaces of the lead frame on the flow channel 200, driving the lead frame into the flow channel 200 and enabling the lead frame to move on the flow channel 200.

[0055] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of the present application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0056] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A bonding pressure wheel device, installed at the edge of the flow channel of the bonding equipment, used to transport the lead frame on the flow channel, characterized in that: include: Fixed mounting block, which can be fixedly mounted on the edge of the flow channel of the bonding equipment; a supporting connecting rod having a first end and a second end that are separated from each other, wherein the first end of the supporting connecting rod is rotatably mounted on the top end of the fixed mounting block; a first pressing wheel rotatably mounted on the second end of the supporting connecting rod and capable of rotating about the central axis of the first pressing wheel as a rotating axis; The gravity block is provided on the supporting connecting rod and is located between the first end and the second end, and is used to provide gravity so that the first pressure wheel can provide traction to the edge of the upper surface of the lead frame located on the flow channel.

2. The bonding pressure wheel device according to claim 1, wherein: The fixed installation block is an integrally formed structure.

3. The bonding pressure wheel device according to claim 1, wherein: The fixed mounting block has a plurality of mounting holes spaced apart along the length direction, and the plurality of mounting holes are provided with fasteners; The fixed mounting block includes a first mounting portion located at the bottom and a second mounting portion connected to the top of the first mounting portion, the supporting connecting rod is mounted on the second mounting portion, the first mounting portion of the fixed mounting block has a top wall surface located at the top end and a bottom wall surface located at the bottom end, and the plurality of mounting holes penetrate the top wall surface and the bottom wall surface of the fixed mounting block; The edge of the flow channel of the bonding device is provided with a mounting wall, and the mounting wall has a plurality of matching mounting holes respectively corresponding to the plurality of mounting holes.

4. The bonding pressure wheel device according to claim 3, wherein: The fixed installation block has a lateral offset limiting structure arranged in the length direction.

5. The bonding pressure wheel device according to claim 4, wherein: The lateral offset limiting structure is a slot provided on the bottom wall surface and extending along the length direction of the fixed mounting block; the mounting wall extends along the length direction of the flow channel of the bonding device, and the slot is provided at the top end of the mounting wall.

6. The bonding pressure wheel device according to claim 4, wherein: The lateral offset limiting structure is a limiting protrusion provided on the bottom wall surface, wherein the limiting protrusion is a continuous protrusion extending along the length direction of the fixed installation block, or the limiting protrusion is a plurality of protrusions provided at intervals along the length direction of the fixed installation block; The mounting wall extends along the length direction of the flow channel of the bonding device, and a snap-fitting groove that cooperates with the limiting protrusion is provided at the top of the mounting wall.

7. The bonding pressure wheel device according to claim 1, wherein: The length of the fixed installation block is 40mm-60mm.

8. The bonding pressure wheel device according to claim 1, wherein: The thickness of the first pressing wheel is less than 2 mm.

9. The bonding pressure wheel device according to claim 8, wherein: The thickness of the first pressing wheel is 1 mm.

10. A bonding device, characterized in that: include: a runner for conveying lead frames; An active transmission pressing wheel device is provided below the flow channel and has a second pressing wheel located below the edge of the flow channel; A passive transmission pressure wheel device is installed on the edge of the flow channel and is used to transport the lead frame on the flow channel. The passive transmission pressure wheel device is a bonding pressure wheel device as described in any one of claims 1 to 9; wherein the second pressure wheel is an active pressure wheel, and the first pressure wheel of the bonding pressure wheel device is a driven pressure wheel. The first pressure wheel and the second pressure wheel are arranged opposite to each other and can provide matching traction pressure to the edge of the lead frame from the upper and lower surfaces of the lead frame on the flow channel to drive the lead frame into the flow channel and move the lead frame on the flow channel.

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