Wafer adsorption device

Abstract

The embodiment of the utility model discloses a wafer adsorption device, which comprises a vacuum module, an auxiliary vacuum module, a vacuum breaking module and an operation table, and is characterized in that when wafer processing equipment is in a power-off state, an auxiliary vacuum loop is in a conduction state, a vacuum loop is in a disconnection state, and the auxiliary vacuum module generates negative pressure; the adsorption force provided for the target conduction port is maintained through the auxiliary vacuum loop, so that the operation table adsorbs the wafer; the vacuum breaking module is used for inputting air into the vacuum loop under the condition that the operation table does not need to adsorb the wafer so as to counteract the adsorption force provided by the target conduction port and enable the operation table to release the wafer, so that the auxiliary vacuum module continues to provide negative pressure when the wafer processing equipment is powered on and breaks down, wafer adsorption is ensured not to be influenced, and the service life of the wafer processing equipment is prolonged. And when the wafer does not need to be adsorbed, the vacuum breaking module controls the operation table to release the adsorbed wafer.

Description

Technical Field

[0001] The embodiments of the present application relate to wafer processing technology, and relate to but are not limited to a wafer adsorption device. Background Art

[0002] Conventional wafer processing utilizes vacuum suction, with the suction source provided by a vacuum module. However, in emergencies, such as power outages or the pressing of the emergency stop button, the vacuum module ceases operation and is unable to generate negative pressure. If wafers are being processed during this time, the vacuum level gradually decreases, leading to insufficient suction, potentially damaging the wafers and causing financial losses.

[0003] Therefore, how to continue to provide negative pressure to the wafer when the vacuum module stops working, ensure that the wafer adsorption is not affected, and control the operating table to release the adsorbed wafer is an urgent problem to be solved. Utility Model Content

[0004] In view of this, the embodiment of the present application provides a wafer adsorption device, which can, when the wafer processing equipment is powered on, the vacuum circuit is in a conductive state and the auxiliary vacuum circuit is in a disconnected state, the vacuum pump is used to extract the air from the vacuum circuit and provide adsorption force through the target conductive port, so that the operating table adsorbs the wafer; when the wafer processing equipment is powered off, the auxiliary vacuum circuit is in a conductive state and the vacuum circuit is in a disconnected state, the auxiliary vacuum module generates negative pressure and maintains the adsorption force provided to the target conductive port through the auxiliary vacuum circuit, so that the operating table adsorbs the wafer; the vacuum breaking module is used to input air into the vacuum circuit when the operating table does not need to adsorb the wafer to offset the adsorption force provided by the target conductive port, so that the operating table releases the wafer. In this way, when the wafer processing equipment is powered on and fails, the auxiliary vacuum module continues to provide negative pressure to ensure that the wafer adsorption is not affected, and when there is no need to adsorb the wafer, the vacuum breaking module controls the operating table to release the adsorbed wafer. The wafer adsorption device provided by the embodiment of the present application is implemented as follows:

[0005] An embodiment of the present application provides a wafer adsorption device for wafer processing equipment, the device comprising: a vacuum module, an auxiliary vacuum module, a vacuum breaking module, and an operating table, the vacuum module comprising a vacuum circuit and a vacuum pump, the auxiliary vacuum module comprising an auxiliary vacuum circuit, the vacuum circuit and the operating table being connected via a target conducting port, the auxiliary vacuum circuit being connected to the vacuum circuit, and the vacuum breaking module being connected to the vacuum circuit, wherein:

[0006] When the wafer processing equipment is powered on, the vacuum circuit is in an on state and the auxiliary vacuum circuit is in an off state, and the vacuum pump is used to extract air from the vacuum circuit and provide adsorption force through the target conductive port so that the operating table adsorbs the wafer;

[0007] When the wafer processing equipment is powered off, the auxiliary vacuum circuit is in an on state and the vacuum circuit is in an off state, the auxiliary vacuum module generates negative pressure and maintains the suction force provided to the target conducting port through the auxiliary vacuum circuit, so that the operating table suctions the wafer;

[0008] The vacuum breaking module is used to input air into the vacuum circuit when the operating table does not need to absorb the wafer, so as to offset the absorption force provided by the target conducting port, so that the operating table releases the wafer.

[0009] In some embodiments, the auxiliary vacuum module includes an air compression pump, a first on-off valve, a vacuum generator, and a one-way valve. The air compression pump is connected to the first on-off valve, the first on-off valve is connected to the vacuum generator, and the vacuum generator is connected to the one-way valve. The air compression pump, the first on-off valve, the vacuum generator, and the one-way valve form the auxiliary vacuum circuit, and the auxiliary vacuum circuit is connected to the vacuum circuit through the one-way valve.

[0010] The air compression pump is used to generate compressed air and input the compressed air into the vacuum generator;

[0011] The first on-off valve is used to conduct when the wafer processing equipment is in the power-off state, so that the air compression pump and the vacuum generator are in a conducting state;

[0012] The vacuum generator is used to change the flow rate of the compressed air in the vacuum generator to generate negative pressure, so that the one-way valve is in a conductive state, so as to connect the auxiliary vacuum circuit and the vacuum circuit through the one-way valve, and provide the negative pressure to the vacuum circuit to maintain the adsorption force provided to the target conductive port.

[0013] In some embodiments, the auxiliary vacuum module further comprises an exhaust unit connected to the vacuum generator, wherein:

[0014] The exhaust unit is used to discharge the compressed air.

[0015] In some embodiments, the auxiliary vacuum module further includes a first pressure switch, and the wafer processing equipment further includes a controller, wherein the first pressure switch is connected to the air compression pump and the first on-off valve, respectively, wherein:

[0016] The first pressure switch is used to monitor the air pressure provided by the air compression pump and send the air pressure to the controller;

[0017] The controller is used to determine whether the air pressure reaches a first preset value, and if the air pressure does not reach the first preset value, determine that the air compression pump is in an abnormal state.

[0018] In some embodiments, the vacuum breaking module includes a second on-off valve, which is connected to the air compression pump. The air compression pump and the second on-off valve form the vacuum breaking circuit, wherein:

[0019] When the second on-off valve is turned on, the vacuum breaking circuit and the vacuum circuit are in a conducting state, so that the compressed air is input into the vacuum circuit.

[0020] In some embodiments, the vacuum breaking module further includes a throttle valve, the throttle valve is connected to the second on-off valve, and the air compression pump, the second on-off valve, and the throttle valve form the vacuum breaking circuit, wherein:

[0021] The throttle valve is used to control the flow rate of the compressed air output to the vacuum circuit when the vacuum breaking circuit and the vacuum circuit are in a conducting state.

[0022] In some embodiments, the vacuum module further includes a third on-off valve, and the vacuum pump is connected to the third on-off valve, wherein:

[0023] The third on-off valve is used to be turned on when the wafer processing equipment is in the power-on state, so that the vacuum pump draws air from the vacuum circuit and provides adsorption force through the target conductive port; and to be turned off when the wafer processing equipment is in the power-off state, so as to maintain the adsorption force provided to the target conductive port through the auxiliary vacuum circuit.

[0024] In some embodiments, the vacuum module further includes a fourth on-off valve, wherein a first end of the fourth on-off valve is connected to the third on-off valve and the one-way valve respectively, a second end of the fourth on-off valve is connected to the target conduction port, and a control end of the fourth on-off valve is connected to the two-position five-way valve, wherein:

[0025] The two-position five-way valve is used to keep the fourth on-off valve open in both the power-off state and the power-on state of the wafer processing equipment.

[0026] In some embodiments, the vacuum module further includes a second pressure switch, which is connected to the fourth on-off valve and the operating console respectively, wherein:

[0027] The second pressure switch is used to monitor the vacuum degree of the operating table and send the vacuum degree to the controller;

[0028] The controller is configured to determine whether the vacuum degree reaches a second preset value, and if the vacuum degree does not reach the second preset value, determine that the operating table and / or the target conducting port is in an abnormal state.

[0029] In some embodiments, the operating table includes at least two sub-operating workbenches, the vacuum breaking circuit includes at least two sub-vacuum breaking circuits, and the vacuum circuit includes at least two sub-vacuum circuits. Each sub-operating workbench corresponds to a sub-vacuum breaking circuit and a sub-vacuum circuit respectively. Each sub-vacuum breaking circuit is used to input the compressed air to the corresponding sub-vacuum circuit, and each sub-vacuum circuit is connected to the third on-off valve.

[0030] The embodiment of the present application provides a wafer adsorption device, in which the vacuum circuit is in an on state and the auxiliary vacuum circuit is in an off state, and the vacuum pump is used to extract air from the vacuum circuit and provide adsorption force through the target conductive port, so that the operating table adsorbs the wafer; when the wafer processing equipment is in a power-off state, the auxiliary vacuum circuit is in an on state and the vacuum circuit is in a off state, the auxiliary vacuum module generates negative pressure and maintains the adsorption force provided to the target conductive port through the auxiliary vacuum circuit, so that the operating table adsorbs the wafer; the vacuum breaking module is used to input air into the vacuum circuit when the operating table does not need to adsorb the wafer, so as to offset the adsorption force provided by the target conductive port, so that the operating table releases the wafer. In this way, when the wafer processing equipment is powered on and fails, the auxiliary vacuum module continues to provide negative pressure to ensure that the wafer adsorption is not affected, and when there is no need to adsorb the wafer, the vacuum breaking module is used to control the operating table to release the adsorbed wafer, thereby solving the technical problems raised in the background technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and, together with the specification, are used to illustrate the technical solutions of the present application.

[0032] Figure 1 This is a schematic structural diagram of a wafer adsorption device disclosed in an embodiment of the present application;

[0033] Figure 2 This is a schematic structural diagram of another wafer adsorption device disclosed in an embodiment of the present application;

[0034] Figure 3 This is a schematic structural diagram of another wafer adsorption device disclosed in an embodiment of the present application;

[0035] Figure 4This is a schematic structural diagram of another wafer adsorption device disclosed in an embodiment of the present application;

[0036] Figure 5 This is a schematic structural diagram of another wafer adsorption device disclosed in an embodiment of the present application;

[0037] Figure 6 This is a schematic structural diagram of another wafer adsorption device disclosed in an embodiment of the present application;

[0038] Figure 7 This is a schematic structural diagram of another wafer adsorption device disclosed in an embodiment of the present application;

[0039] Figure 8 This is a schematic structural diagram of another wafer adsorption device disclosed in an embodiment of the present application;

[0040] Figure 9 This is a schematic structural diagram of another wafer adsorption device disclosed in an embodiment of the present application;

[0041] Figure 10 This is a schematic diagram of an implementation of a wafer adsorption device disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0042] To make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the specific technical solutions of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application but are not intended to limit the scope of the present application.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing the embodiments of this application only and are not intended to limit this application.

[0044] In the following description, reference is made to “some embodiments”, which describes a subset of all possible embodiments, but it will be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0045] It should be pointed out that the terms "first\second\third" involved in the embodiments of the present application are used to distinguish similar or different objects, and do not represent a specific ordering of the objects. It can be understood that "first\second\third" can be interchanged with a specific order or sequence where permitted, so that the embodiments of the present application described here can be implemented in an order other than that illustrated or described here.

[0046] In view of this, an embodiment of the present application provides a wafer adsorption device 10 . Figure 1This is a schematic structural diagram of a wafer adsorption device 10 provided in an embodiment of the present application. Figure 1 As shown, the wafer adsorption device 10 includes: a vacuum module 102, an auxiliary vacuum module 101, a vacuum breaking module 104 and an operating table 103, wherein the vacuum module 102 includes a vacuum circuit 1021 and a vacuum pump 1022, the auxiliary vacuum module 101 includes an auxiliary vacuum circuit 1011, the vacuum circuit 1021 and the operating table 103 are connected through a target conductive port 105, the auxiliary vacuum circuit 1011 is connected to the vacuum circuit 1021, and the vacuum breaking circuit 1041 is connected to the vacuum circuit 1021. Figure 1 As shown, the vacuum breaking circuit 1041 is connected to the vacuum circuit 1021, which may mean that both circuits are connected to a position before the target conductive port 105, and the position before the target conductive port 105 can be understood as a position between the vacuum module 102 and the target conductive port 105; in addition, the auxiliary vacuum circuit 1011 is connected to the vacuum circuit 1021, which may also mean that the auxiliary vacuum circuit 1011 and the vacuum circuit 1021 are both connected to a position before the target conductive port 105. Figure 1 Not shown.

[0047] When the wafer processing equipment adopting the above structure is powered on, the vacuum circuit 1021 is in the on state and the auxiliary vacuum circuit 1011 is in the off state. The vacuum pump 1022 is used to extract the air from the vacuum circuit 1021 and provide adsorption force through the target conductive port 105, so that the operating table 103 adsorbs the wafer.

[0048] In an embodiment of the present application, when the vacuum module 102 is started, power is first supplied to the vacuum pump 1022 to trigger its start. The pump starts running and quickly extracts the air in the vacuum circuit 1021, reducing the pressure to a preset value. During this process, the vacuum sensor monitors the pressure changes in real time to ensure that the required vacuum level is achieved. After reaching the preset vacuum, the adsorption force of the target conduction port 105 is enhanced, allowing the operating table 103 to effectively adsorb the wafer through the negative pressure generated on the surface. At the same time, the control system continuously monitors the vacuum state so as to adjust the operation of the pump in time to maintain a stable adsorption force.

[0049] When the wafer processing equipment is in a power-off state, the auxiliary vacuum circuit 1011 is in an on state and the vacuum circuit 1021 is in a disconnected state, the auxiliary vacuum module 101 generates negative pressure and maintains the adsorption force provided to the target conductive port 105 through the auxiliary vacuum circuit 1011, so that the operating table 103 adsorbs the wafer.

[0050] In an embodiment of the present application, when the device is powered off, the auxiliary vacuum module 101 is automatically activated and generates negative pressure through its internal structure. At this time, the auxiliary vacuum circuit 1011 and the vacuum circuit 1021 are kept connected through a specific valve to ensure that negative pressure is continuously provided to the vacuum circuit 1021, so that the target conduction port 105 maintains a certain adsorption force to prevent the wafer from being released without the vacuum module 102 providing negative pressure. Throughout the process, the pressure sensor of the auxiliary vacuum module 101 will monitor the air pressure status in real time and alarm when the air pressure is abnormal. The operating frequency is automatically adjusted as needed to ensure the stability and effectiveness of the adsorption force.

[0051] The vacuum breaking module 104 is used to input air into the vacuum circuit 1021 when the operating table 103 does not need to absorb the wafer, so as to offset the absorption force provided by the target conducting port 105 and enable the operating table 103 to release the wafer.

[0052] In this embodiment of the present application, when a wafer needs to be released, vacuum breaker module 104 first receives a release command from the control system. At this point, the valve of vacuum breaker module 104 opens, introducing outside air into vacuum circuit 1021. As air enters, the pressure within the circuit gradually increases, and the vacuum level decreases.

[0053] During this process, the pressure sensor in the system monitors the pressure changes in the circuit in real time to ensure that it reaches the set safe release threshold. When the pressure rises to a level sufficient to offset the suction force of the operating table 103, the suction force of the wafer will weaken, ensuring that the wafer can be safely released.

[0054] Once the release is completed, the vacuum breaking module 104 will automatically close the valve to cut off the air input, and at the same time recheck the pressure of the circuit to ensure that the system returns to normal state in preparation for subsequent operations.

[0055] The present embodiment provides an efficient and stable wafer adsorption and release mechanism. When powered on, the vacuum module 102 ensures strong adsorption, suitable for processing. When powered off, the auxiliary vacuum module 101 maintains adsorption to prevent accidental loosening. The vacuum release module 104 precisely controls the release process, ensuring safe wafer release and reducing the risk of damage, thereby improving equipment operational reliability and processing efficiency.

[0056] In the above Figure 1 On the basis of , the embodiment of the present application also provides a structural diagram of a wafer adsorption device 10. Figure 2As shown, the auxiliary vacuum module 101 includes an air compression pump 10111, a first on-off valve 10112, a vacuum generator 10113 and a one-way valve 10114. The air compression pump 10111 is connected to the first on-off valve 10112, the first on-off valve 10112 is connected to the vacuum generator 10113, the vacuum generator 10113 is connected to the one-way valve 10114, the air compression pump 10111, the first on-off valve 10112, the vacuum generator 10113 and the one-way valve 10114 form the auxiliary vacuum circuit 1011, and the auxiliary vacuum circuit 1011 is connected to the vacuum circuit 1021 through the one-way valve 10114, wherein: the air compression pump 10111 is used to generate compressed air and input the compressed air into the vacuum generator 10113.

[0057] In this embodiment of the present application, a suitable compressed air pump 10111 is selected and connected to a vacuum generator 10113. A pressure regulating valve is configured to ensure that the pressure of the output compressed air is within the operating range of the vacuum generator 10113. A suitable power supply is designed for the compressed air pump 10111, and a control system with start, stop, and fault protection functions is provided to facilitate operation and monitoring.

[0058] The first on-off valve 10112 is used to be turned on when the wafer processing equipment is in the power-off state, so that the air compression pump 10111 and the vacuum generator 10113 are in a conducting state.

[0059] In the embodiment of the present application, a suitable first on-off valve 10112 is selected to ensure that it can automatically turn on in the power-off state, and a spring-reset valve can be selected; the first on-off valve 10112 is installed on the pipeline between the air compression pump 10111 and the vacuum generator 10113; the valve is connected to the electronic control system to ensure that the valve can be closed by the control signal during normal operation, and the connection between the valve and the pipeline is well sealed to avoid gas leakage. Consider setting up a pressure monitoring device to ensure that there will be no overpressure or underpressure when the valve is turned on.

[0060] The vacuum generator 10113 is used to change the flow rate of the compressed air in the vacuum generator 10113 to generate negative pressure, so that the one-way valve 10114 is in a conductive state, so as to connect the auxiliary vacuum circuit 1011 and the vacuum circuit 1021 through the one-way valve 10114, and provide the negative pressure to the vacuum circuit 1021 to maintain the adsorption force provided to the target conductive port 105.

[0061] In an embodiment of the present application, a suitable vacuum generator 10113 is selected to ensure that it can effectively change the flow rate of compressed air and generate the required negative pressure. A flow regulating valve is installed at the air inlet or outlet of the vacuum generator 10113 to control the flow rate and optimize the generation of negative pressure. A one-way valve 10114 is installed between the auxiliary vacuum circuit 1011 and the vacuum circuit 1021 to ensure that the air flow can only flow in one direction to avoid backflow. Design and install appropriate pipelines to connect the vacuum generator 10113, the one-way valve 10114 and the target conduction port 105 to ensure sealing and avoid leakage. A pressure sensor is set in the vacuum circuit 1021 to monitor the negative pressure state in real time and ensure that it is within the design range. The vacuum generator 10113 is integrated with the control system, and the flow rate and negative pressure can be adjusted as needed to maintain the adsorption force of the target conduction port 105.

[0062] Specifically, compressed air enters from the air supply port of the vacuum generator 10113 and flows through the ejection port of the vacuum generator 10113. The ejection port has a relatively small cross-sectional area. Assuming that the pressure of the input fluid is stable, its flow rate Q = S × v. As its cross-sectional area S decreases, the flow velocity v increases. According to the Bernoulli equation P + ρv 2 / 2+ρgh=C, where C is a constant. It can be seen that, assuming that air is incompressible, that is, ρ remains unchanged, and ignoring the change in height h, it can be seen that the changing trends of the gas static pressure P and the flow velocity v are opposite. As the flow velocity increases, the static pressure at this location will decrease. When the flow velocity increases to a certain value, the static pressure at this location decreases to below atmospheric pressure, that is, the suction port of the vacuum generator 10113 generates negative pressure, and the one-way valve 10114 on the passage opens, providing backup negative pressure for the adsorption of the operating table 103, maintaining the adsorption force of the operating table 103, and preventing the wafer from falling.

[0063] One-way valve 10114 ensures that negative pressure can only flow from auxiliary vacuum circuit 1011 to vacuum circuit 1021, with reverse flow prohibited. Under negative pressure, one-way valve 10114 is in an open state. One-way valves suitable for the negative pressure level and flow requirements can be selected to ensure effective operation under negative pressure conditions. The air compressor pump 10111, first on-off valve 10112, vacuum generator 10113, and one-way valve 10114 are connected to form a complete auxiliary vacuum circuit 1011.

[0064] When the vacuum module 102 is in a non-operating state due to an abnormal power outage of the wafer processing equipment, the first on-off valve 10112 automatically opens, putting the air compression pump 10111 and the vacuum generator 10113 in a conductive state. The air compression pump 10111 starts to operate and generates compressed air. The compressed air flows into the vacuum generator 10113, and the vacuum generator 10113 changes the air flow rate to generate negative pressure. The negative pressure is transmitted to the vacuum circuit 1021 through the one-way valve 10114 and exchanges with the gas in the vacuum circuit 1021. The one-way valve 10114 remains in a conductive state under negative pressure conditions, ensuring that the negative pressure of the auxiliary vacuum circuit 1011 is effectively transmitted to the vacuum circuit 1021. This maintains the adsorption force at the first conductive port 105, so that the wafer to be processed remains in an adsorbed state on the operating table 103.

[0065] This embodiment of the present application combines an air compressor pump 10111, a first on-off valve 10112, a vacuum generator 10113, and a one-way valve 10114 into an auxiliary vacuum circuit 1011, effectively maintaining wafer suction during power outages. This ensures that the operating table 103 can still reliably hold the wafer even during power outages, thereby improving equipment safety and operational continuity.

[0066] Furthermore, the auxiliary vacuum module 101 also includes an exhaust unit 10115, which is connected to the vacuum generator 10113, wherein: the exhaust unit 10115 is used to exhaust the compressed air.

[0067] Specifically, a solenoid valve or a pneumatic valve is selected with the function of rapid opening and closing so as to adjust the exhaust volume in real time. Pressure-resistant and corrosion-resistant materials (such as PVC or metal pipes) are used to ensure that there will be no leakage in a high-pressure environment. When the system is running, compressed air flows into the vacuum generator 10113 through the first on-off valve 10112. The vacuum generator 10113 adjusts the internal airflow according to the set flow rate and negative pressure requirements, thereby affecting the operation of the exhaust unit 10115. When the pressure sensor detects that the internal pressure of the system is too high, the automatic control system instructs the exhaust valve to open, allowing excess air to be released quickly to maintain a stable negative pressure. Pressure sensors are set inside the exhaust unit 10115 and the vacuum module 102 to monitor pressure changes in real time. An overpressure protection device, such as a safety valve, can also be added to automatically open when the system pressure exceeds the safety value to avoid equipment damage. An emergency exhaust system is designed to manually or automatically discharge compressed air in the event of equipment failure to ensure safety.

[0068] The embodiment of the present application provides an effective gas exhaust function through the exhaust unit 10115, which can prevent the accumulation of compressed air, thereby ensuring the stable operation of the auxiliary vacuum module 101. This helps to improve the efficiency and reliability of wafer adsorption, avoid the decrease in adsorption force due to gas stagnation, and ultimately improve the performance and safety of wafer processing equipment.

[0069] In the above Figure 2 On the basis of , the embodiment of the present application also provides a structural diagram of a wafer adsorption device 10. Figure 4 As shown, the auxiliary vacuum module 101 also includes a first pressure switch 10116, and the wafer processing equipment also includes a controller. The first pressure switch 10116 is respectively connected to the air compression pump 10111 and the first on-off valve 10112, wherein: the first pressure switch 10116 is used to monitor the air pressure provided by the air compression pump 10111 and send the air pressure to the controller.

[0070] In an embodiment of the present application, a suitable first pressure switch 10116 is selected to monitor the air pressure within the required range, typically an electronic pressure switch. The first pressure switch 10116 is installed on the exhaust port of the air compression pump 10111 or on the pipeline connected to the vacuum generator 10113 to accurately measure the air pressure of the air output by the air compression pump. Ensure that the wiring port of the pressure switch is connected to the controller and use an appropriate communication protocol (such as analog signal, RS-485 or CAN bus) for data transmission. When the air compression pump 10111 is working, the first pressure switch 10116 monitors the air pressure changes in real time. According to the monitored air pressure value, it is converted into an electrical signal (for example, 4-20mA or 0-10V) and sent to the controller. After receiving the signal, the controller performs A / D conversion (if applicable) to obtain the air pressure value and determines whether the current air pressure value reaches the preset threshold value according to the set logic. The controller decides whether to adjust the working state of the air compression pump 10111, such as start, stop or alarm, based on the air pressure value data. The current air pressure value is displayed in real time on the controller or user interface, and an indicator light or sound and light alarm system is set to prompt the operator of abnormal conditions.

[0071] The controller is used to determine whether the air pressure reaches a first preset value. If the air pressure does not reach the first preset value, it is determined that the air compression pump 10111 is in an abnormal state.

[0072] In an embodiment of the present application, the signal line of the first pressure switch 10116 is connected to the analog input channel of the controller to obtain the air pressure value data in real time. Set the first preset value on the programming interface of the controller, and ensure that the preset value can be adjusted as needed. Read the air pressure value regularly (for example, every second), and compare the current air pressure value with the first preset value. If the current air pressure value does not reach the first preset value, perform the following operations: Record the abnormal event, including the time and air pressure value. Trigger the alarm system, send an audible and visual alarm, or send a notification to the operator. Cut off the power supply of the air compression pump 10111 through a control signal to ensure system safety. Design a manual reset button and require the operator to manually reset the system after confirming that the fault has been eliminated to avoid misoperation.

[0073] In this embodiment of the present application, the first pressure switch 10116 monitors the air pressure provided by the air compression pump 10111 in real time to ensure that it is within the normal operating range. If the air pressure does not reach the preset value, the controller can quickly identify the abnormality and take timely measures to avoid equipment failure or processing quality degradation, thereby improving the safety and reliability of wafer processing.

[0074] In the above Figure 2 On the basis of , the embodiment of the present application also provides a structural diagram of a wafer adsorption device 10. Figure 5 As shown, the vacuum breaking module 104 includes a second on-off valve 10412, which is also connected to the air compression pump 10111. The air compression pump 10111 and the second on-off valve 10412 form the vacuum breaking circuit 1041, wherein: when the second on-off valve 10412 is turned on, the vacuum breaking circuit 1041 and the vacuum circuit 1021 are in a conducting state to input the compressed air into the vacuum circuit 1021.

[0075] In an embodiment of the present application, the vacuum breaking circuit 1041 is effectively connected to the vacuum circuit 1021 through the second on-off valve 10412 so that compressed air can flow into the vacuum circuit 1021. The second on-off valve 10412, which is electrically or pneumatically controlled, is opened when a release command is received. The air compression pump 10111 is started, and the compressed air flows into the vacuum circuit 1021 through the vacuum breaking circuit 1041, rapidly reducing the vacuum degree. A pressure sensor is installed to monitor the pressure changes of the vacuum circuit 1021 in real time to ensure that the input of compressed air is stopped in time. If the pressure reaches the set release threshold, the control system automatically closes the second on-off valve 10412 to end the release process.

[0076] By providing a second on-off valve 10412, the embodiment of the present application can precisely control the operation of the vacuum breaker module 104 when wafers need to be released, thereby quickly releasing the wafers. The design of the vacuum breaker circuit 1041 effectively controls the input of air, preventing misoperation due to air leakage, and improving the reliability and stability of the entire device.

[0077] In the above Figure 5 On the basis of , the embodiment of the present application also provides a structural diagram of a wafer adsorption device 10. Figure 6 As shown, the vacuum breaking module 104 also includes a throttle valve 10413, which is connected to the second on-off valve 10412. The air compression pump 10111, the second on-off valve 10412 and the throttle valve 10413 form the vacuum breaking circuit 1041, wherein: the throttle valve 10413 is used to control the flow rate of the compressed air output to the vacuum circuit 1021 when the vacuum breaking circuit 1041 and the vacuum circuit 1021 are in a conductive state.

[0078] In an embodiment of the present application, the throttle valve 10413 may be of adjustable design, with a knob or electric control system, so as to adjust the flow under different working conditions. The throttle valve 10413 is installed between the vacuum breaking circuit 1041 and the vacuum circuit 1021 to ensure that the inflow of compressed air can be accurately controlled when needed. When the vacuum breaking circuit 1041 and the vacuum circuit 1021 are connected, the throttle valve 10413 adjusts the flow to control the compressed air entering the vacuum circuit 1021. By changing the valve opening, the air flow speed is adjusted to ensure that excessive pressure is not generated. The configuration is connected to the controller, monitors the system pressure in real time, and feeds back to the controller to automatically adjust the opening of the throttle valve 10413 to maintain the preset flow and pressure to avoid damage to the system. Under abnormal conditions, the controller can instruct the throttle valve 10413 to close, prevent the inflow of compressed air, and protect the safety of the equipment.

[0079] The embodiment of the present application, through the introduction of throttle valve 10413, allows for precise control of the compressed air flow output to vacuum circuit 1021, thereby making the vacuum release process more controllable. This effectively prevents system shocks caused by excessive air flow, thereby protecting other components of the device. By controlling the compressed air flow, it is possible to reduce the pressure, ensure stability during the release process, and improve operational safety.

[0080] In the above Figure 2 On the basis of , the embodiment of the present application also provides a structural diagram of a wafer adsorption device 10. Figure 7As shown, the vacuum module 102 also includes a third on-off valve 10211, and the vacuum pump 1022 is connected to the third on-off valve 10211, wherein: the third on-off valve 10211 is used to be turned on when the wafer processing equipment is in the power-on state, so that the vacuum pump 1022 extracts air from the vacuum circuit 1021 and provides adsorption force through the target conductive port 105; and is disconnected when the wafer processing equipment is in the power-off state to maintain the adsorption force provided to the target conductive port 105 through the auxiliary vacuum circuit 1011.

[0081] In an embodiment of the present application, the vacuum module 102 includes a vacuum pump 1022 and a third on-off valve 10211, and the third on-off valve 10211 is connected to the air inlet of the vacuum pump 1022. The vacuum circuit 1021 is connected to the operating table 103 through the target conduction port 105, and the auxiliary vacuum circuit 1011 maintains the adsorption force when the power is off. In the power-on state, the third on-off valve 10211 is turned on, the vacuum pump 1022 is started, and the air in the vacuum circuit 1021 is extracted to form a negative pressure, so that the operating table 103 can effectively adsorb the wafer. In the power-off state, the third on-off valve 10211 is disconnected and the vacuum pump 1022 stops working. At this time, the auxiliary vacuum module 101 maintains the adsorption force of the operating table 103 through negative pressure to ensure that the wafer does not fall. The controller monitors the power-on status of the equipment and controls the switch of the third on-off valve 10211 accordingly. When powered on, the controller ensures that the vacuum pump 1022 operates normally and maintains negative pressure. When powered off, the controller switches to the auxiliary vacuum circuit 1011 to ensure continued suction force. A sensor or pressure switch can be provided to monitor the vacuum state to prevent insufficient suction force due to equipment failure.

[0082] By introducing the third on-off valve 10211, the embodiment of the present application can achieve more effective vacuum control in both the powered-on and powered-off states of the wafer processing equipment. This ensures that the vacuum pump 1022 can effectively extract air and provide suction when powered-on, while switching to the auxiliary vacuum module 101 when powered-off to maintain suction on the wafers. This improves the stability and safety of the equipment and prevents wafers from falling and breaking.

[0083] In the above Figure 7 On the basis of , the embodiment of the present application also provides a structural diagram of a wafer adsorption device 10. Figure 8As shown, the vacuum module 102 also includes a fourth on-off valve 10212, the first end of the fourth on-off valve 10212 is respectively connected to the third on-off valve 10211 and the one-way valve 10114, the second end of the fourth on-off valve 10212 is connected to the target conduction port 105, and the control end of the fourth on-off valve 10212 is connected to the two-position five-way valve, wherein: the two-position five-way valve is used to keep the fourth on-off valve 10212 conductive when the wafer processing equipment is in the power-off state and the power-on state.

[0084] In this embodiment of the present application, a two-position, five-way valve is electromagnetically controlled to automatically switch connections. The two ports of the two-position, five-way valve are connected to the fourth on-off valve 10212 and the auxiliary vacuum module 101, respectively. When the device is powered on, the solenoid valve is turned on, maintaining a connection between the fourth on-off valve 10212 and the vacuum circuit 1021. In the power-off state, the valve core of the two-position, five-way valve remains in place, ensuring that the fourth on-off valve 10212 remains on, thereby maintaining the effectiveness of the auxiliary vacuum.

[0085] By connecting the fourth on-off valve 10212 to the two-position, five-way valve, this embodiment of the present application allows for flexible control of the operating state of the vacuum module 102 in both the on and off states, ensuring stable suction force in all circumstances. Whether powered on or off, the device maintains its suction function, effectively preventing wafers from falling during processing due to loss of suction force, thereby improving processing safety and reliability.

[0086] In the above Figure 8 On the basis of , the embodiment of the present application also provides a structural diagram of a wafer adsorption device 10. Figure 9 As shown, the vacuum module 102 also includes a second pressure switch 10213, which is respectively connected to the fourth on-off valve 10212 and the operating table 103, wherein: the second pressure switch 10213 is used to monitor the vacuum degree of the operating table 103 and send the vacuum degree to the controller.

[0087] In an embodiment of the present application, a suitable second pressure switch 10213 is selected to provide accurate vacuum degree measurement within the required vacuum range. The second pressure switch 10213 is installed in a suitable position of the operating table 103 to ensure that it can accurately monitor the vacuum degree in the operating table 103. This is usually located in an area connected to the vacuum cavity of the operating table 103. The second pressure switch 10213 is connected to the controller using a suitable cable or wireless transmission method to transmit measurement data in real time. The controller receives the signal from the second pressure switch 10213 and processes it. The controller should have an algorithm for processing pressure signals and can convert the pressure value into the corresponding vacuum degree. A threshold value for the vacuum degree (a second preset value) is preset in the controller and is calibrated regularly to ensure its accuracy.

[0088] The controller is configured to determine whether the vacuum degree reaches a second preset value, and if the vacuum degree does not reach the second preset value, determine that the operating table 103 and / or the target conducting port 105 is in an abnormal state.

[0089] In this embodiment of the present application, the controller continuously monitors the signal from the second pressure switch 10213, displays the current vacuum level in real time, and compares it with a second preset value. If the actual vacuum level does not reach the preset value, the controller will identify it as an abnormal state and can trigger an alarm or initiate protective measures.

[0090] The embodiment of the present application can monitor the vacuum degree near the operating table 103 in real time through the second pressure switch 10213, and feed the data back to the controller to ensure that the system is always in the best working state. By setting the second preset value, the controller can determine whether the operating table 103 and the target conductive port 105 are in an abnormal state, so as to take timely measures to avoid potential damage or failure. When an abnormality occurs in the system, it can respond quickly to avoid accidents during the adsorption or release process of the wafer, thereby improving operational safety. Through effective monitoring and control, the stable adsorption and release process of the wafer is guaranteed, and the working efficiency of the entire processing equipment is improved.

[0091] Furthermore, the operating table 103 includes at least two sub-operating workbenches, the vacuum breaking circuit 1041 includes at least two sub-vacuum breaking circuits, and the vacuum circuit 1021 includes at least two sub-vacuum circuits. Each sub-operating workbench corresponds to a sub-vacuum breaking circuit and a sub-vacuum circuit respectively. Each sub-vacuum breaking circuit is used to input the compressed air to the corresponding sub-vacuum circuit, and each sub-vacuum circuit is connected to the third on-off valve 10211.

[0092] Specifically, the operating table 103 includes at least two sub-operating workstations, each independently configured to form multiple operating areas. Each sub-operating workstation is equipped with a sub-vacuum breaking circuit 1041 and a sub-vacuum circuit 1021. Each sub-vacuum circuit 1021 is connected to a third on-off valve 10211, which can also be understood as sharing the same third on-off valve 10211 across all sub-vacuum circuits 1021. This valve is responsible for controlling air extraction and maintaining suction force. A vacuum pump 1022 is connected to the sub-operating workstation via its respective sub-vacuum circuit 1021, ensuring independent vacuum control for each sub-operating workstation. Each sub-vacuum breaking circuit 1041 is connected to its corresponding sub-operating workstation for injecting compressed air into the sub-vacuum circuit 1021 when needed. The flow of compressed air is controlled by a second on-off valve 10412 in the sub-vacuum breaking circuit 1041, ensuring precise adjustment of the suction state of each sub-operating workstation. The system is equipped with a controller that can individually monitor and control the status of each sub-operating workstation, including the vacuum level and suction force. The controller realizes independent workflow and adsorption management through corresponding valve control according to the needs of each sub-operation workbench.

[0093] During wafer processing, the corresponding sub-vacuum circuit 1021 and sub-vacuum breaking circuit 1041 are activated or deactivated according to the specific needs of each sub-operation workbench. By adjusting the working state of each sub-vacuum breaking circuit 1041, rapid adsorption and release of each sub-operation workbench can be achieved.

[0094] By introducing multiple sub-operation workstations and corresponding sub-vacuum circuits 1021 and sub-vacuum breaking circuits 1041, the present embodiment enables independent control of different wafers, improving the flexibility and efficiency of adsorption and release. This design makes the system more efficient when processing wafers of different specifications or types, ultimately improving the reliability and accuracy of the entire wafer processing process.

[0095] It should be noted that in the above embodiment, the wafer processing equipment may be a wafer thinning device. In this case, the sub-operation workstation may be a cleaning table within a rotary cleaning unit, which can be used to absorb the wafer during cleaning. The sub-operation workstation may also be a loading arm, an unloading arm, a robot, etc., and examples are not given here. The following description uses the example of at least one sub-operation workstation being a cleaning table, a loading arm, an unloading arm, and a robot.

[0096] In the above Figure 1-9 On the basis of , the embodiment of the present application also provides a schematic diagram of the implementation of a wafer adsorption device 10. Figure 10As shown, the wafer adsorption device 10 is composed of an auxiliary vacuum module 101, a vacuum module 102, a vacuum breaking module 104 and an operating table 103. The auxiliary vacuum module 101 includes an auxiliary vacuum circuit 1011, the vacuum module 102 includes a vacuum circuit 1021, the vacuum breaking module 104 includes a vacuum breaking circuit 1041, and the operating table 103 includes a cleaning table 1031, a loading arm suction cup 1032 and a unloading arm suction cup 1033. It should be noted that in Figure 10 The target conducting port 105 is not shown.

[0097] The auxiliary vacuum circuit 1011 includes an air compression pump 10111 , a first on-off valve 10112 , a vacuum generator 10113 , a one-way valve 10114 , an exhaust unit 10115 and a first pressure switch 10116 .

[0098] The vacuum breaking circuit 1041 includes a first second sub-on-off valve 104121 , a second second sub-on-off valve 104122 , a third second sub-on-off valve 104123 , a first throttle valve 104131 , a second throttle valve 104132 and a third throttle valve 104133 .

[0099] The vacuum circuit 1021 includes a first fourth on-off valve 102121, a second fourth on-off valve 102122, a third fourth on-off valve 102123, a third on-off valve 10211, a first second pressure switch 102131, a second second pressure switch 102132, a third second pressure switch 102133, a fourth second pressure switch 102134, a first two-position five-way valve 10216, a second two-position five-way valve 10217, a third two-position five-way valve 10218, a third pressure switch 10215 and a vacuum pump 102114.

[0100] The suction port of the vacuum pump 102114 is connected to one end of the third on-off valve 10211, with a third pressure switch 10215 positioned between them. The third pressure switch 10215 is used to sound an alarm if the vacuum level does not reach the set value. One end of the third on-off valve 10211 is connected to one end of the first two-position five-way valve 10216. The other end of the third on-off valve 10211 is connected to one end of the first four-position on-off valve 102121. The other end of the first four-position on-off valve 102121 is connected to the cleaning table. A first second pressure switch 102131 is positioned in the pipeline to detect whether the cleaning table is holding the wafer. The first four-position on-off valve 102121 is in an on state under the control of the first two-position five-way valve 10216. When the third on-off valve 10211 is on, the wafer is held on the cleaning table. When the third on-off valve 10211 is off, the cleaning table releases the wafer. Similarly, the second fourth on-off valve 102122 is in the on state under the control of the second two-position five-way valve 10217, and controls the loading arm suction cup to adsorb or release the wafer according to the on or off state of the third on-off valve 10211; the third fourth on-off valve 102123 is in the on state under the control of the third two-position five-way valve 10218, and controls the unloading arm suction cup to adsorb or release the wafer according to the on or off state of the third on-off valve 10211; and, controls the robot arm to grab or release the wafer according to the on or off state of the third on-off valve 10211.

[0101] The air compressor pump 10111 is connected to the inlet of the first on-off valve 10112, with a first pressure switch 10116 interposed therebetween, configured to sound an alarm if the compressed air pressure does not reach the set value. The outlet of the first on-off valve 10112 is connected to the air supply port P of the vacuum generator 10113. The exhaust port R of the vacuum generator 10113 is connected to the exhaust unit 10115. The suction port A of the vacuum generator 10113 is connected to the outlet of the one-way valve 10114. The inlet of the one-way valve 10114 is connected between the third on-off valve 10211 and the first of the fourth on-off valves 102121. If the wafer processing equipment suddenly loses power, the vacuum pump 102114 stops working. At this time, the third on-off valve 10211 loses power and closes, disconnecting from the vacuum pump 102114. The first on-off valve 10112 loses power and opens. Compressed air enters from the air supply port P of the vacuum generator 10113 and flows through the injection port R of the vacuum generator 10113. The cross-sectional area of ​​the injection port is relatively small. For the input fluid, assuming that its flow rate Q = S × v, the smaller its cross-sectional area S, the larger the flow rate v. According to the Bernoulli equation P + ρv 2 / 2+ρgh=C(constant). It can be seen that, assuming that air is incompressible (i.e., ρ is constant) and ignoring the change in height h, it can be seen that the changing trends of gas static pressure P and flow velocity v are opposite. As the flow velocity increases, the static pressure at this location will decrease. When the flow velocity increases to a certain value, the static pressure at this location decreases to below atmospheric pressure, that is, the suction port A of the vacuum generator 10113 generates negative pressure, and the one-way valve 10114 on the passage opens to provide backup negative pressure for the adsorption of the cleaning table, as well as the upper and lower arm suction cups and the robot suction cups, to maintain the adsorption force of these actuators and prevent the wafer from falling.

[0102] The air compressor pump 10111 is connected to the inlets of the first second sub-on-off valve 104121, the second second sub-on-off valve 104122, and the third second sub-on-off valve 104123. The outlet of the first second sub-on-off valve 104121 is connected to the inlet of the first throttle valve 104131, the outlet of the second second sub-on-off valve 104122 is connected to the inlet of the second throttle valve 104132, and the outlet of the third second sub-on-off valve 104123 is connected to the inlet of the third throttle valve 104133. The first throttle valve 104131, the second throttle valve 104132, and the third throttle valve 104133 are used to adjust the airflow to prevent excessive airflow from blowing away the wafer when releasing it. The first throttle valve 104131 is connected to the unloading arm suction cup. Compressed air enters the unloading arm suction cup, breaking the original vacuum state and allowing the suction cup to quickly release the wafer. The second throttle valve 104132 is connected to the loading arm suction cup, and compressed air enters the loading arm suction cup, breaking the original vacuum state and causing the suction cup to quickly release the wafer. The third throttle valve 104133 is connected to the cleaning table, and compressed air enters the cleaning table, breaking the original vacuum state and causing the cleaning table to quickly release the wafer.

[0103] It should be understood that "one embodiment" or "an embodiment" or "some embodiments" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" or "in some embodiments" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. The above-mentioned serial numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments. The above description of the various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced to each other. For the sake of brevity, they will not be repeated here.

[0104] The term "and / or" in this article is only a description of the association relationship between associated objects, indicating that there can be three relationships. For example, object A and / or object B can mean: object A exists alone, object A and object B exist at the same time, and object B exists alone.

[0105] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0106] In the several embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. The embodiments described above are merely illustrative. For example, the division of the modules is merely a logical function division. In actual implementation, there may be other division methods, such as: multiple modules or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or modules can be electrical, mechanical or other forms.

[0107] The modules described above as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules; they may be located in one place or distributed across multiple network units; some or all of the modules may be selected according to actual needs to achieve the purpose of this embodiment.

[0108] In addition, all functional modules in the embodiments of the present application can be integrated into one processing unit, or each module can be a separate unit, or two or more modules can be integrated into one unit; the above-mentioned integrated modules can be implemented in the form of hardware or in the form of hardware plus software functional units.

[0109] The features disclosed in the several product embodiments provided in this application can be arbitrarily combined without conflict to obtain new product embodiments.

[0110] The features disclosed in the several device embodiments provided in this application can be arbitrarily combined without conflict to obtain new device embodiments.

[0111] The above is merely an embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A wafer adsorption device, which is used in wafer processing equipment, characterized in that: The device includes: a vacuum module, an auxiliary vacuum module, a vacuum breaking module and an operating table, the vacuum module includes a vacuum circuit and a vacuum pump, the auxiliary vacuum module includes an auxiliary vacuum circuit, the vacuum circuit is connected to the operating table through a target conducting port, the auxiliary vacuum circuit is connected to the vacuum circuit, and the vacuum breaking module is connected to the vacuum circuit, wherein: When the wafer processing equipment is powered on, the vacuum circuit is in an on state and the auxiliary vacuum circuit is in an off state, and the vacuum pump is used to extract air from the vacuum circuit and provide adsorption force through the target conductive port so that the operating table adsorbs the wafer; When the wafer processing equipment is powered off, the auxiliary vacuum circuit is in an on state and the vacuum circuit is in an off state, the auxiliary vacuum module generates negative pressure and maintains the suction force provided to the target conducting port through the auxiliary vacuum circuit, so that the operating table suctions the wafer; The vacuum breaking module is used to input air into the vacuum circuit when the operating table does not need to absorb the wafer, so as to offset the absorption force provided by the target conducting port, so that the operating table releases the wafer.

2. The device according to claim 1, characterized in that The auxiliary vacuum module includes an air compression pump, a first on-off valve, a vacuum generator, and a one-way valve. The air compression pump is connected to the first on-off valve, the first on-off valve is connected to the vacuum generator, and the vacuum generator is connected to the one-way valve. The air compression pump, the first on-off valve, the vacuum generator, and the one-way valve form the auxiliary vacuum circuit, which is connected to the vacuum circuit via the one-way valve. The air compression pump is used to generate compressed air and input the compressed air into the vacuum generator; The first on-off valve is used to conduct when the wafer processing equipment is in the power-off state, so that the air compression pump and the vacuum generator are in a conducting state; The vacuum generator is used to change the flow rate of the compressed air in the vacuum generator to generate negative pressure, so that the one-way valve is in a conductive state, so as to connect the auxiliary vacuum circuit and the vacuum circuit through the one-way valve, and provide the negative pressure to the vacuum circuit to maintain the adsorption force provided to the target conductive port.

3. The device according to claim 2, characterized in that The auxiliary vacuum module further comprises an exhaust unit connected to the vacuum generator, wherein: The exhaust unit is used to discharge the compressed air.

4. The device according to claim 2, characterized in that The auxiliary vacuum module further includes a first pressure switch, and the wafer processing equipment further includes a controller, wherein the first pressure switch is connected to the air compression pump and the first on-off valve respectively, wherein: The first pressure switch is used to monitor the air pressure provided by the air compression pump and send the air pressure to the controller; The controller is used to determine whether the air pressure reaches a first preset value, and if the air pressure does not reach the first preset value, determine that the air compression pump is in an abnormal state.

5. The device according to claim 2, characterized in that The vacuum breaking module includes a second on-off valve, which is connected to the air compression pump. The air compression pump and the second on-off valve form a vacuum breaking circuit, wherein: When the second on-off valve is turned on, the vacuum breaking circuit and the vacuum circuit are in a conducting state, so that the compressed air is input into the vacuum circuit.

6. The device according to claim 5, characterized in that The vacuum breaking module further includes a throttle valve, which is connected to the second on-off valve. The air compression pump, the second on-off valve, and the throttle valve form the vacuum breaking circuit, wherein: The throttle valve is used to control the flow rate of the compressed air output to the vacuum circuit when the vacuum breaking circuit and the vacuum circuit are in a conducting state.

7. The device according to claim 2, characterized in that The vacuum module further includes a third on-off valve, and the vacuum pump is connected to the third on-off valve, wherein: The third on-off valve is used to be turned on when the wafer processing equipment is in the power-on state, so that the vacuum pump draws air from the vacuum circuit and provides adsorption force through the target conductive port; and to be turned off when the wafer processing equipment is in the power-off state, so as to maintain the adsorption force provided to the target conductive port through the auxiliary vacuum circuit.

8. The device according to claim 7, characterized in that The vacuum module further includes a fourth on-off valve, wherein a first end of the fourth on-off valve is connected to the third on-off valve and the one-way valve respectively, a second end of the fourth on-off valve is connected to the target conduction port, and a control end of the fourth on-off valve is connected to the two-position five-way valve, wherein: The two-position five-way valve is used to keep the fourth on-off valve open in both the power-off state and the power-on state of the wafer processing equipment.

9. The device according to claim 8, characterized in that The vacuum module further includes a second pressure switch, which is connected to the fourth on-off valve and the operating table respectively, wherein: The second pressure switch is used to monitor the vacuum degree of the operating table and send the vacuum degree to the controller; The controller is configured to determine whether the vacuum degree reaches a second preset value, and if the vacuum degree does not reach the second preset value, determine that the operating table and / or the target conducting port is in an abnormal state.

10. The device according to claim 9, characterized in that The operating table includes at least two sub-operating workbenches, the vacuum breaking module includes a vacuum breaking circuit, the vacuum breaking circuit includes at least two sub-vacuum breaking circuits, and the vacuum circuit includes at least two sub-vacuum circuits. Each sub-operating workbench corresponds to a sub-vacuum breaking circuit and a sub-vacuum circuit respectively, and each sub-vacuum breaking circuit is used to input the compressed air to the corresponding sub-vacuum circuit, and each sub-vacuum circuit is connected to the third on-off valve.

Images