Clamping device for semiconductor cleaning machine

Abstract

The clamping device for the semiconductor cleaning machine comprises a liquid collecting box and a supporting frame, the top end of the liquid collecting box is provided with the supporting frame, the supporting frame is internally provided with an integrated frame, the integrated frame is internally and movably provided with a movable ring, the side wall of the movable ring is provided with a limiting groove, and the limiting groove is connected with the liquid collecting box. And four sets of limiting wheels are movably installed in the portion, around the limiting groove, of the integrated frame at equal intervals, the limiting wheels are slidably connected with the limiting groove, four sets of clamping air cylinders are installed on one side of the movable ring at equal intervals, and a gear ring is installed on the other side of the movable ring. According to the utility model, the semiconductor wafer can be flexibly clamped and fixed in a multi-group linkage centering manner conveniently, the semiconductor wafer can be air-dried in a circumferential rotation manner conveniently, the semiconductor wafer can be moved, adjusted and cleaned conveniently, the contact area between the wafer and gas can be increased conveniently, and the clamping and fixing convenience and the air-drying speed and effect can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of clamping devices, in particular to a clamping device for a semiconductor cleaning machine. Background Art

[0002] A semiconductor cleaning machine is a device specifically used to clean semiconductor materials. It plays a vital role in the semiconductor industry. The semiconductor industry, as the core of the modern electronics industry, is based on the silicon materials industry. Although new semiconductor materials continue to emerge, especially ultra-large-scale integrated circuits, they are all made on high-purity and high-quality silicon single crystal polished wafers and epitaxial wafers. The importance of silicon wafer cleaning to the semiconductor industry is self-evident, because contaminants on the surface of silicon wafers will seriously affect the performance, reliability and yield of the device. Therefore, the design and application of semiconductor cleaning machines are crucial to ensuring the quality and performance of semiconductor devices. Semiconductor cleaning machines often need to clamp silicon wafers for cleaning. In order to better clean silicon wafers, a clamping device for semiconductor cleaning machines is proposed.

[0003] For example, a clamping device for a semiconductor cleaning machine disclosed in the authorization announcement number CN221063851U includes a cleaning chassis, the upper end surface of the cleaning chassis is slidably connected to a push-pull plate, a handle is fixedly connected to the side of the push-pull plate, and two circular sliders are fixedly connected to the front and back surfaces of the push-pull plate. Two first sliding grooves are symmetrically provided on the inner wall of the cleaning chassis, and the circular sliders are slidably connected to the first sliding grooves. The sides of the cleaning chassis are provided with movable grooves, and multiple groups of limit clamping blocks are slidably connected in the movable grooves.

[0004] Although the clamping force of the guide hole is determined by the distance between the limit clamping blocks, the distance between the limit clamping block and the non-adjacent limit clamping blocks is manually controlled, and sponges are provided between the guide plates on the clamping plate to act as a buffer, so the clamping force of the guide hole is moderate and will not cause damage to the semiconductor;

[0005] However, it does not solve the problem that the existing clamping device is not conducive to convenient multi-group linkage alignment and flexible clamping and fixing of semiconductor wafers and convenient circular rotation to air-dry semiconductor wafers. It is not conducive to moving, adjusting and cleaning semiconductor wafers and increasing the contact area between wafers and gas, which affects the convenience of clamping and fixing as well as the speed and effect of air-drying. Utility Model Content

[0006] The purpose of the present utility model is to provide a clamping device for a semiconductor cleaning machine to solve the problem in the above background technology that the clamping device is not convenient for multiple groups of linkage alignment and flexible clamping and fixing of semiconductor wafers and convenient circular rotation to air-dry semiconductor wafers, is not conducive to moving and adjusting the cleaning of semiconductor wafers and increasing the contact area between the wafer and the gas, and affects the convenience of clamping and fixing as well as the speed and effect of air-drying.

[0007] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a clamping device for a semiconductor cleaning machine, comprising a liquid collecting box and a support frame, the support frame is installed on the top of the liquid collecting box, an integrated frame is provided inside the support frame, a movable ring is movably installed inside the integrated frame, a limiting groove is installed on the side wall of the movable ring, four sets of limiting wheels are movably installed inside the integrated frame around the limiting groove, and the limiting wheels are slidably connected to the limiting groove, four sets of clamping cylinders are installed at equal intervals on one side of the movable ring, and a movable ring is installed on the other side of the movable ring. There is a gear ring, and a waterproof motor is installed inside the integrated frame on one side of the gear ring. A driving gear is installed at the output end of the waterproof motor, and the driving gear is engaged with the gear ring. A clamping push arm is installed at the output end of the clamping cylinder, and a clamping frame is installed at the end of the clamping push arm away from the clamping cylinder. A clamping block is slidably installed inside the clamping frame, and multiple groups of springs with equal spacing are installed on one side of the clamping block, and the springs are connected to the clamping frame. Air pipes are symmetrically installed on the inner wall of the support frame, and multiple groups of air holes with equal spacing are installed on the side walls of the air pipes.

[0008] Preferably, a transverse moving frame is installed on the top end of the supporting frame, and the transverse moving frame is slidably connected to the supporting frame.

[0009] Preferably, a first motor is installed on the side wall of the transverse moving frame, and a first gear is installed on the output end of the first motor.

[0010] Preferably, a transverse rack is installed on the outer wall of the support frame on one side of the first gear, and the first gear and the transverse rack are meshed with each other.

[0011] Preferably, a vertical movable frame is provided on one side of the transverse movable frame, and the vertical movable frame is slidably connected to the transverse movable frame.

[0012] Preferably, a second motor is installed on the side wall of the vertical movable frame, and a second gear is installed on the output end of the second motor.

[0013] Preferably, a vertical rack is installed on the side wall of the transverse movable frame on one side of the second gear, and the second gear and the vertical rack are meshed with each other.

[0014] Preferably, two groups of first electric push rods are installed inside the vertical movable frame, and first push arms are installed at the output ends of the first electric push rods, and the first push arms are connected to the integrated frame.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: the clamping device not only realizes convenient multi-group linkage and centering flexible clamping and fixing of semiconductor wafers and convenient circumferential rotation air drying of semiconductor wafers, facilitates the movement, adjustment and cleaning of semiconductor wafers and increases the contact area between wafers and gas, but also improves the convenience of clamping and fixing as well as the speed and effect of air drying;

[0016] (1) The clamping push arm is driven to move by the clamping cylinder, and the clamping push arm drives the clamping frame and the clamping block to move. Under the elastic support of the spring, the clamping block is flexibly contacted with the outer wall of the semiconductor wafer to prevent the rigid clamping of the clamping block from damaging the semiconductor wafer. Because the stroke of the clamping cylinder is the same, the semiconductor wafer is centered and fixed. The first gear is driven to rotate by the first motor, and the horizontal moving frame and the semiconductor wafer are driven to move horizontally by the first motor. After moving to the cleaning position, the second gear is driven to rotate by the second motor, and the vertical moving frame and the semiconductor wafer are driven downward by the second motor. The first push rod drives the first push arm to move, and the first push arm drives the integrated frame and the semiconductor wafer to continue to move downward into the cleaning liquid, and the cleaning liquid is used to clean them. After cleaning, the above operation is repeated in reverse to lift the integrated frame and the semiconductor wafer up, realizing convenient multi-group linkage centering and flexible clamping and fixing of the semiconductor wafer, facilitating the movement, adjustment and cleaning of the semiconductor wafer, and improving the convenience of clamping and fixing;

[0017] (2) By connecting the air pipe to the external air source and turning on the external air source, the gas is ejected through the air hole through the air pipe, and two sets of air pipes are used to blow air to both sides of the semiconductor wafer from both sides to facilitate drying of its surface. The waterproof motor drives the driving gear to rotate, the driving gear drives the gear ring to rotate, the gear ring drives the movable ring to rotate inside the integrated frame, the movable ring drives the limiting groove to slide on the surface of the limiting wheel, and the movable ring drives the clamping block and the semiconductor wafer to rotate, so that the semiconductor wafer contacts the gas more evenly, thereby improving its drying effect, realizing convenient circular rotation drying of the semiconductor wafer, facilitating increasing the contact area between the wafer and the gas, and improving the drying effect and speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the three-dimensional structure of the support frame of the present invention;

[0020] Figure 3 This is a schematic diagram of the three-dimensional structure of the vertical movable frame of the present utility model;

[0021] Figure 4 This is a schematic diagram of the three-dimensional structure of the integrated frame of the utility model;

[0022] Figure 5 This is a schematic diagram of the three-dimensional structure of the movable ring of the utility model;

[0023] Figure 6 It is a schematic diagram of the cross-sectional structure of the clamping frame of the present invention when viewed from above.

[0024] In the figure: 1. Liquid collecting tank; 2. Support frame; 3. Lateral moving frame; 4. Vertical moving frame; 5. Air pipe; 6. Integrated frame; 7. Vertical rack; 8. Air hole; 9. Spring; 10. First gear; 11. Horizontal rack; 12. First motor; 13. Second motor; 14. Second gear; 15. First electric push rod; 16. First push arm; 17. Gear ring; 18. Movable ring; 19. Waterproof motor; 20. Driving gear; 21. Limiting groove; 22. Limiting wheel; 23. Clamping cylinder; 24. Clamping push arm; 25. Clamping frame; 26. Clamping block. DETAILED DESCRIPTION

[0025] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] See also Figure 1-6The utility model provides an embodiment: a clamping device for a semiconductor cleaning machine, comprising a liquid collecting box 1 and a support frame 2, the top of the liquid collecting box 1 is equipped with a support frame 2, the interior of the support frame 2 is provided with an integrated frame 6, a movable ring 18 is movably installed inside the integrated frame 6, a limiting groove 21 is installed on the side wall of the movable ring 18, four groups of limiting wheels 22 with equal spacing are movably installed inside the integrated frame 6 around the limiting groove 21, and the limiting wheels 22 are slidably connected to the limiting groove 21, one side of the movable ring 18 is equipped with four groups of clamping cylinders 23 with equal spacing, the clamping cylinders 23 play a role of power drive, and their sealing performance is good and can play a waterproof effect, and the other side of the movable ring 18 is equipped with The gear ring 17 and the integrated frame 6 on one side of the gear ring 17 are internally installed with a waterproof motor 19, which plays a role of power drive. The output end of the waterproof motor 19 is installed with a driving gear 20, and the driving gear 20 is meshed with the gear ring 17. The output end of the clamping cylinder 23 is installed with a clamping push arm 24, and the end of the clamping push arm 24 away from the clamping cylinder 23 is installed with a clamping frame 25. The inside of the clamping frame 25 is slidably installed with a clamping block 26, and one side of the clamping block 26 is installed with multiple groups of springs 9 at equal intervals, and the spring 9 is connected to the clamping frame 25. The inner wall of the support frame 2 is symmetrically installed with an air pipe 5, and the side wall of the air pipe 5 is installed with multiple groups of air holes 8 at equal intervals.

[0027] First, pour the cleaning liquid into the interior of the liquid collecting tank 1, connect the device to the external controller and the external circuit, place the semiconductor wafer to be cleaned between multiple groups of clamping blocks 26, open the clamping cylinder 23, and the clamping cylinder 23 drives the clamping push arm 24 to move, and the clamping push arm 24 drives the clamping frame 25 and the clamping block 26 to move. Under the elastic support of the spring 9, the clamping block 26 is flexibly contacted with the outer wall of the semiconductor wafer to prevent the rigid clamping of the clamping block 26 from damaging the semiconductor wafer. Because the stroke of the clamping cylinder 23 is the same, the semiconductor wafer is clamped and fixed in the center. Then turn on the first motor 12, and the first motor 12 drives the first gear 10 to rotate. The first gear 10 is engaged with the cross rack 11, and the first motor 12 drives the cross moving frame 3 under the sliding cooperation between the cross moving frame 3 and the support frame 2. The second motor 13 is turned on and the second gear 14 is driven by the second motor 13 to rotate. Under the mutual meshing of the second gear 14 and the vertical rack 7, the vertical moving frame 4 and the horizontal moving frame 3 are slidably cooperated, and the second motor 13 drives the vertical moving frame 4 and the semiconductor wafer to move downward. Then, the first electric push rod 15 is turned on and the first electric push rod 15 drives the first push arm 16 to move. The first push arm 16 drives the integrated frame 6 and the semiconductor wafer to continue to move downward into the cleaning liquid, and the cleaning liquid is used to clean them. After cleaning, the above operation is repeated in reverse to lift the integrated frame 6 and the semiconductor wafer up, thereby realizing convenient multi-group linkage alignment and flexible clamping and fixing of the semiconductor wafer, facilitating the movement, adjustment and cleaning of the semiconductor wafer, and improving the convenience of clamping and fixing.

[0028] A transverse moving frame 3 is installed on the top of the supporting frame 2, and the transverse moving frame 3 is slidably connected to the supporting frame 2;

[0029] A first motor 12 is mounted on the side wall of the transverse moving frame 3. The first motor 12 serves as a power drive. A first gear 10 is mounted on the output end of the first motor 12. A transverse rack 11 is mounted on the outer wall of the supporting frame 2 on one side of the first gear 10. The first gear 10 and the transverse rack 11 are meshed with each other.

[0030] A vertical moving frame 4 is provided on one side of the horizontal moving frame 3, and the vertical moving frame 4 is slidably connected to the horizontal moving frame 3. A second motor 13 is installed on the side wall of the vertical moving frame 4. The second motor 13 plays a role of power drive, and a second gear 14 is installed at the output end of the second motor 13;

[0031] A vertical rack 7 is installed on the side wall of the horizontal moving frame 3 on the side of the second gear 14, and the second gear 14 and the vertical rack 7 are meshed with each other. Two sets of first electric push rods 15 are installed inside the vertical moving frame 4. The first electric push rods 15 play the role of power drive. The output ends of the first electric push rods 15 are all installed with first push arms 16, and the first push arms 16 are connected to the integrated frame 6;

[0032] The air pipe 5 is connected to the external air source, and the external air source is turned on. The gas is ejected through the air hole 8 through the air pipe 5. The two groups of air pipes 5 blow air to both sides of the semiconductor wafer from both sides to facilitate drying its surface. At the same time, the waterproof motor 19 is turned on, and the waterproof motor 19 drives the driving gear 20 to rotate. Under the mutual engagement of the driving gear 20 and the gear ring 17, the driving gear 20 drives the gear ring 17 to rotate, and the gear ring 17 drives the movable ring 18 to rotate inside the integrated frame 6. The movable ring 18 drives the limiting groove 21 to slide on the surface of the limiting wheel 22, and the limiting wheel 22 provides movable limiting support for the movable ring 18 through the limiting groove 21. The movable ring 18 drives the clamping block 26 and the semiconductor wafer to rotate, so that the semiconductor wafer contacts the gas more evenly, thereby improving its drying effect, realizing convenient circular rotation drying of the semiconductor wafer, facilitating increasing the contact area between the wafer and the gas, and improving the drying effect and speed.

[0033] Working principle: First, pour the cleaning liquid into the interior of the liquid collecting tank 1, connect the device with the external controller and the external circuit, place the semiconductor wafer to be cleaned between multiple groups of clamping blocks 26, and the clamping cylinder 23 drives the clamping push arm 24 to move, and the clamping push arm 24 drives the clamping frame 25 and the clamping block 26 to move. Under the elastic support of the spring 9, the clamping block 26 is flexibly contacted with the outer wall of the semiconductor wafer to prevent the rigid clamping of the clamping block 26 from damaging the semiconductor wafer. Because the stroke of the clamping cylinder 23 is the same, the semiconductor wafer is clamped and fixed in the center. The first motor 12 drives the first gear 10 to rotate, and the first motor 12 drives the horizontal moving frame 3 and the semiconductor wafer to move horizontally. After moving to the cleaning position, the second motor 13 drives the second gear 14 to rotate, and the second motor 13 drives the vertical moving frame 4 and the semiconductor wafer to move downward, and the first electric push rod 15 drives the first push arm 16 to move, and the first push arm 16 drives The integrated frame 6 and the semiconductor wafer continue to move downward into the cleaning liquid, where they are cleaned by the cleaning liquid. After cleaning, the above operation is repeated in reverse to lift the integrated frame 6 and the semiconductor wafer up, connect the air pipe 5 to the external air source, turn on the external air source, and the gas is ejected through the air hole 8 through the air pipe 5. Two groups of air pipes 5 blow air on both sides of the semiconductor wafer from both sides to facilitate drying of its surface. The waterproof motor 19 drives the drive gear 20 to rotate, and the drive gear 20 drives the gear ring 17 to rotate. The gear ring 17 drives the movable ring 18 to rotate inside the integrated frame 6. The movable ring 18 drives the limiting groove 21 to slide on the surface of the limiting wheel 22. The limiting wheel 22 provides movable limiting support for the movable ring 18 through the limiting groove 21. The movable ring 18 drives the clamping block 26 and the semiconductor wafer to rotate, so that the semiconductor wafer contacts the gas more evenly, thereby improving its drying effect, and completing the use of the clamping device for the semiconductor cleaning machine.

Claims

1. A clamping device for a semiconductor cleaning machine, comprising a liquid collecting tank (1) and a supporting frame (2), characterized in that: The top of the liquid collecting box (1) is provided with a support frame (2), an integrated frame (6) is provided inside the support frame (2), a movable ring (18) is movably provided inside the integrated frame (6), a limiting groove (21) is provided on the side wall of the movable ring (18), four groups of limiting wheels (22) with equal spacing are movably provided inside the integrated frame (6) around the limiting groove (21), and the limiting wheels (22) are slidably connected to the limiting groove (21), four groups of clamping cylinders (23) with equal spacing are provided on one side of the movable ring (18), a gear ring (17) is provided on the other side of the movable ring (18), and a waterproof motor (1) is provided inside the integrated frame (6) on one side of the gear ring (17). 9), the output end of the waterproof motor (19) is equipped with a driving gear (20), and the driving gear (20) and the gear ring (17) are meshed with each other, the output end of the clamping cylinder (23) is equipped with a clamping push arm (24), and the end of the clamping push arm (24) away from the clamping cylinder (23) is equipped with a clamping frame (25), the interior of the clamping frame (25) is slidably equipped with a clamping block (26), one side of the clamping block (26) is equipped with multiple groups of springs (9) with equal spacing, and the springs (9) are connected to the clamping frame (25), the inner wall of the support frame (2) is symmetrically equipped with an air pipe (5), and the side wall of the air pipe (5) is equipped with multiple groups of air holes (8) with equal spacing.

2. The clamping device for a semiconductor cleaning machine according to claim 1, characterized in that: A transverse moving frame (3) is installed on the top end of the supporting frame (2), and the transverse moving frame (3) is slidably connected to the supporting frame (2).

3. The clamping device for a semiconductor cleaning machine according to claim 2, characterized in that: A first motor (12) is installed on the side wall of the transverse moving frame (3), and a first gear (10) is installed on the output end of the first motor (12).

4. The clamping device for a semiconductor cleaning machine according to claim 3, characterized in that: A transverse rack (11) is installed on the outer wall of the support frame (2) on one side of the first gear (10), and the first gear (10) and the transverse rack (11) are meshed with each other.

5. The clamping device for a semiconductor cleaning machine according to claim 2, characterized in that: A vertical moving frame (4) is provided on one side of the horizontal moving frame (3), and the vertical moving frame (4) is slidably connected to the horizontal moving frame (3).

6. The clamping device for a semiconductor cleaning machine according to claim 5, characterized in that: A second motor (13) is installed on the side wall of the vertical moving frame (4), and a second gear (14) is installed on the output end of the second motor (13).

7. The clamping device for a semiconductor cleaning machine according to claim 6, characterized in that: A vertical rack (7) is installed on the side wall of the transverse movable frame (3) on one side of the second gear (14), and the second gear (14) and the vertical rack (7) are meshed with each other.

8. The clamping device for a semiconductor cleaning machine according to claim 5, characterized in that: Two groups of first electric push rods (15) are installed inside the vertical moving frame (4), and the output ends of the first electric push rods (15) are all installed with first push arms (16), and the first push arms (16) are connected to the integrated frame (6).

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