Packaging structure for radio frequency chip

Abstract

The utility model discloses a packaging structure for a radio frequency chip, which relates to the technical field of chip packaging and comprises a shell, a chip main body arranged in the shell, a heat conducting plate fixedly embedded upwards at the bottom end of the shell, and a heat conducting attaching layer arranged between the chip main body and the heat conducting plate and used for connection and attachment, and the bottom end of the heat conducting plate is exposed out of the shell. The bottom end of the shell is provided with a heat passing channel communicating the surface of the heat conducting plate with the outside of the shell, and a heat conducting thin layer attached to the heat conducting plate is fixedly arranged in the heat passing channel in an attached mode. A plurality of groups of heat passing channels are uniformly distributed on the periphery of the shell; pins are fixedly embedded into the bottom end of the periphery of the shell; the plurality of groups of heat passing channels are not communicated and contacted with the pins; the LED lamp has the advantages that the heat passing channel is arranged at the bottom end of the shell, the heat conducting plate is communicated with the outer side of the shell through the heat passing channel so as to enlarge the heat dissipation space, and meanwhile, the heat conducting thin layer is fixedly arranged on the inner wall of the heat passing channel so that heat at the heat conducting plate can be directly conducted out so as to enhance the heat dissipation capacity.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, and more specifically to a packaging structure for a radio frequency chip. Background Art

[0002] RF chip packaging is a special packaging technology for radio frequency (RF) integrated circuits, designed to optimize the chip's electrical performance and ensure signal integrity, while also considering factors such as thermal management, mechanical strength, and environmental protection.

[0003] The existing RF chip package [as shown in the publication (announcement) number: CN212303644U, a microwave RF chip packaging structure] uses "thermal conductive adhesive and thermal conductive pad" to conduct heat to the outside such as the circuit board for heat dissipation to protect the chip. At the same time, the "top surface of the thermal conductive pad is higher than the top surface of the microwave RF chip" to provide a height difference after installation and fixation. The height difference space is used to increase the heat dissipation surface, but the increased heat dissipation surface is only for heat conduction and heat dissipation by the external space generated by it, which has the disadvantage of low efficiency. Utility Model Content

[0004] The purpose of the present invention is to provide a packaging structure for a radio frequency chip in order to solve the above technical problems.

[0005] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0006] The utility model proposes a packaging structure for a radio frequency chip, comprising a shell, a chip body built into the shell, a heat conducting plate fixedly embedded upward at the bottom end of the shell, and a heat conducting attachment layer connected and bonded between the chip body and the heat conducting plate. The bottom end of the heat conducting plate is exposed outside the shell, and a heat path connecting the surface of the heat conducting plate and the outside of the shell is provided at the bottom end of the shell, and a heat conducting thin layer bonded and bonded to the heat conducting plate is fixed in the heat path.

[0007] As a preferred technical solution of the present invention, the heat paths are provided in multiple groups and are evenly distributed around the outer periphery of the shell.

[0008] As a preferred technical solution of the present invention, a pin is fixedly embedded in the bottom end of the outer periphery of the shell.

[0009] As a preferred technical solution of the present invention, the pins are provided in multiple groups and are evenly distributed around the outer periphery of the housing.

[0010] As a preferred technical solution of the present invention, the multiple groups of heat paths are not in communication with or in contact with the pins.

[0011] As a preferred technical solution of the present invention, the plurality of groups of pins are respectively electrically connected to the chip body through wiring, and the wiring is arranged in the housing.

[0012] As a preferred technical solution of the present invention, the heat conducting plate and the bottom ends of the plurality of groups of pins are respectively fixed with welding layers.

[0013] The beneficial effects of the utility model are as follows:

[0014] By setting a heat channel at the bottom of the shell, the heat channel connects the heat conducting plate and the outside of the shell to increase the heat dissipation space. At the same time, a heat conducting thin layer is fixed on the inner wall of the heat channel to directly conduct heat from the heat conducting plate to enhance the heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of the utility model;

[0016] Figure 2 yes Figure 1 A schematic structural diagram of a front view section;

[0017] Figure 3 yes Figure 1 Another schematic diagram of the structure of the front view section.

[0018] Reference numerals: housing 1, chip body 2, heat conducting plate 3, heat conducting attachment layer 4, heat path 5, pin 6, connection 7, soldering layer 8, heat conducting thin layer 9. DETAILED DESCRIPTION

[0019] like Figures 1-3 As shown, the utility model proposes: a packaging structure for a radio frequency chip, comprising a housing 1, a chip body 2 built into the housing 1, a heat conducting plate 3 fixedly embedded upward at the bottom end of the housing 1 (the heat conducting plate 3 can be made of copper, etc.), and a heat conducting attachment layer 4 (the heat conducting attachment layer 4 can be a heat conducting adhesive layer, etc.) connected and bonded between the chip body 2 and the heat conducting plate 3;

[0020] The bottom end of the heat conducting plate 3 is exposed outside the housing 1. Figure 1 As shown, the heat generated by the chip body 2 is transferred to the heat conducting plate 3 through the heat conducting attachment layer 4 and is discharged at the bottom end of the heat conducting plate 3;

[0021] The bottom end of the housing 1 is provided with a heat channel 5 connecting the surface of the heat conducting plate 3 with the outside of the housing 1. A heat conducting thin layer 9 is fixedly provided in the heat channel 5 and adhered to the heat conducting plate 3 (the heat conducting thin layer 9 is made of aluminum or copper, etc., and the surface is further wrapped with a tin layer on one side);

[0022] There are multiple heat paths 5 and they are evenly distributed around the outer periphery of the housing 1 (e.g. Figure 1 、 3As shown, multiple groups of heat paths 5 are arranged in a ring around the bottom periphery of the housing 1, and there is a distance between the heat paths 5 of each group. By increasing the space area for heat conduction outward and arranging them evenly, the overall heat dissipation is uniformly improved;

[0023] Among them, a pin 6 is fixedly embedded at the bottom of the outer periphery of the shell 1 (the material of the pin 6 is copper, etc., and the surface is further wrapped with a tin or nickel layer on one side);

[0024] There are multiple groups of pins 6 and they are evenly distributed around the outer periphery of the housing 1 (such as Figure 1 、 3 As shown, the pins 6 are arranged in a ring-shaped manner in multiple groups at the periphery of the bottom end of the housing 1, and there is a spacing between the pins 6 in each group);

[0025] At the same time, the plurality of pins 6 are electrically fixedly connected to the chip body 2 through the wiring 7, and the wiring 7 is provided in the housing 1 (the material of the wiring 7 is aluminum or copper, etc., to electrically connect and fix the chip body 2 and the pins 6). Each of the plurality of pins 6 is connected to the chip body 2 using a set of wiring 7.

[0026] The bottom ends of the heat conducting plate 3 and the plurality of pins 6 are respectively fixed with a soldering layer 8 (the material of the soldering layer 8 is tin, etc.);

[0027] Among them, the multiple groups of heat paths 5 are not connected to the pins 6 (such as Figure 1 As shown, the heat channel 5 is embedded upward at the bottom of the housing 1, and the embedded position does not expose the pin 6. At this time, the thermal conductive layer 9 provided will not electrically affect the use of the pin 6. At the same time, the housing 1 has a good wrapping performance for the pin 6, and the structure using the pin 6 has strong stability and a simple structure. The method of forming the housing 1 is almost the same as the original manufacturing process, and the manufacturing is simple.

[0028] like Figure 1 As shown, the pins 6 and the heat paths 5 are arranged around the outer shell 1 and are staggered in sequence, which can provide uniform heat dissipation.

[0029] According to the above, when in use, the RF chip is aligned with the soldering position on the circuit board using the pins 6 in the package structure, and is fixed using the soldering layer 8. The chip body 2 is electrically connected to the circuit board through the wiring 7, the pins 6 and the soldering layer 8 in sequence for electrical connection and use;

[0030] When the chip body 2 generates heat during use, the heat is transferred to the circuit board through the thermal conductive attachment layer 4, the thermal conductive plate 3, and the soldering layer 8 in sequence for heat dissipation. During this process, the thermal runner 5 connects the thermal conductive plate 3 and the outer side of the shell 1 to increase the heat dissipation space. At the same time, a thermal conductive thin layer 9 is fixed on the inner wall of the thermal runner 5 to directly conduct the heat from the thermal conductive plate 3 to enhance the heat dissipation capacity.

[0031] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, from all perspectives, the embodiments should be regarded as illustrative and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and range of equivalents of the claims be included in the present invention. Any reference signs in the claims should not be construed as limiting the claim to which they relate.

[0032] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A packaging structure for a radio frequency chip, comprising a housing (1), a chip body (2) built into the housing (1), a heat conducting plate (3) fixedly embedded upwardly at the bottom end of the housing (1), and a heat conducting attachment layer (4) connected and bonded between the chip body (2) and the heat conducting plate (3), wherein the bottom end of the heat conducting plate (3) is exposed outside the housing (1), and is characterized in that: The bottom end of the shell (1) is provided with a heat path (5) connecting the surface of the heat conducting plate (3) and the outside of the shell (1), and a heat conducting thin layer (9) in contact with the heat conducting plate (3) is fixed in the heat path (5).

2. The radio frequency chip packaging structure according to claim 1, wherein: There are multiple groups of hot runners (5) which are evenly distributed around the outer periphery of the housing (1).

3. The packaging structure for a radio frequency chip according to claim 2, characterized in that: A pin (6) is fixedly embedded at the bottom of the outer periphery of the housing (1).

4. The radio frequency chip packaging structure according to claim 3, characterized in that: There are multiple groups of pins (6) which are evenly distributed around the outer periphery of the housing (1).

5. The radio frequency chip packaging structure according to claim 4, characterized in that: The plurality of heat paths (5) are not in contact with the pins (6).

6. The radio frequency chip packaging structure according to claim 5, characterized in that: The plurality of groups of pins (6) are electrically fixedly connected to the chip body (2) through wiring (7), and the wiring (7) is arranged in the housing (1).

7. The radio frequency chip packaging structure according to claim 6, characterized in that: The bottom ends of the heat conducting plate (3) and the plurality of groups of pins (6) are respectively fixed with welding layers (8).

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