Internal cooling device for power module, power module and electrical system

Abstract

The utility model relates to an internal cooling device for a power module, a power module and an electrical system. There is provided an internal cooling device for a power module, including: a top insulator formed by integral processing, including: a top cover; the at least one first heat conduction piece is arranged on the inner side surface of the top cover and extends in the direction perpendicular to the inner side surface of the top cover; the bottom insulating part is formed through integral processing, and comprises a box body which is composed of a bottom cover and a plurality of side walls surrounding the bottom cover; the at least one second heat conduction piece is arranged on the inner side surface of the bottom cover and extends in the direction perpendicular to the inner side surface of the bottom cover; wherein the top insulating part and the bottom insulating part are assembled together in a manner that the inner side surface of the top cover and the inner side surface of the bottom cover face each other, so as to form a cavity which can be used for accommodating cooling liquid.

Description

Technical Field

[0001] The present disclosure relates to an internal cooling device for a power module, a manufacturing method thereof, a power module, and an electrical system. Background Art

[0002] Traditional internal cooling systems for power modules are typically made of metal materials with good thermal conductivity. The chip is attached to a copper-clad ceramic substrate, which is in turn attached to the internal cooling system, providing indirect cooling for the chip. However, such internal cooling systems have numerous drawbacks, including poor heat dissipation, complex manufacturing processes, and difficulty in achieving electrical isolation.

[0003] Therefore, there is a need for an improved internal cooling device for a power module and a method of manufacturing the same. Summary of the Invention

[0004] One of the objectives of the present disclosure is to provide an improved internal cooling device for a power module and a manufacturing method thereof, an improved power module, and an improved electrical system.

[0005] According to one aspect of the present disclosure, an internal cooling device for a power module is provided, comprising: a top insulating member formed by integral processing, comprising: a top cover; and at least one first heat conductive member disposed on the inner side surface of the top cover and extending in a direction perpendicular to the inner side surface of the top cover; and a bottom insulating member formed by integral processing, comprising: a box body consisting of a bottom cover and a plurality of side walls surrounding the bottom cover; and at least one second heat conductive member disposed on the inner side surface of the bottom cover and extending in a direction perpendicular to the inner side surface of the bottom cover; wherein the top insulating member and the bottom insulating member are assembled together in a manner that the inner side surface of the top cover and the inner side surface of the bottom cover face each other, so as to form a cavity capable of accommodating a cooling liquid.

[0006] According to one or more embodiments of the present disclosure, the at least one first heat conducting member and the at least one second heat conducting member are arranged alternately, so that the heat conducting members are spaced a certain distance apart from each other in the cavity.

[0007] According to one or more embodiments of the present disclosure, the multiple side walls of the bottom insulating member are formed with sealing edges at the positions where they contact the top cover of the top insulating member, and the sealing edges can fit tightly with the edges of the top cover to achieve sealing of the cavity.

[0008] According to one or more embodiments of the present disclosure, the internal cooling device further includes: a liquid inlet formed in the top cover of the top insulating member, wherein the cooling liquid flows into the cavity through the liquid inlet, and a liquid outlet formed in the top cover of the top insulating member or in the bottom cover of the bottom insulating member, wherein the cooling liquid flows out of the cavity through the liquid outlet.

[0009] According to one or more embodiments of the present disclosure, the internal cooling device also includes one or all of the following: a first metal layer, which is arranged on the outer surface of the top cover of the top insulating member, and the first metal layer is used to attach the first chip; and a second metal layer, which is arranged on the outer surface of the bottom cover of the bottom insulating member, and the second metal layer is used to attach the second chip.

[0010] According to one or more embodiments of the present disclosure, the at least one first heat conductor and the at least one second heat conductor include one or more of the following: a cylindrical heat conductor, an elliptical cylinder heat conductor, a rectangular cylinder heat conductor, a regular polygonal cylinder heat conductor, an irregular cylinder heat conductor, and a conical heat conductor; the attachment includes using electrically conductive and / or thermally conductive materials to join together by sintering or welding; the first chip and / or the second chip include a power chip; the first metal layer is formed on the outer surface of the top cover of the top insulating member by sintering, brazing, soldering or solidification; and / or the second metal layer is formed on the outer surface of the bottom cover of the bottom insulating member by sintering, brazing, soldering or solidification.

[0011] According to another aspect of the present disclosure, a power module is provided, comprising the internal cooling device as described above.

[0012] According to one or more embodiments of the present disclosure, the internal cooling device includes a first metal layer arranged on the outer side surface of the top cover of the top insulating member and a second metal layer arranged on the outer side surface of the bottom cover of the bottom insulating member; and the power module further includes: a first chip attached to the first metal layer, the first chip being electrically coupled through the first metal layer and at least one of a conductive column, a conductive sheet and a conductive wire; and a second chip attached to the second metal layer, the second chip being electrically coupled through the second metal layer and at least one of a conductive column, a conductive sheet and a conductive wire; wherein the first metal layer and the second metal layer are also attached to leads extending beyond the internal cooling device.

[0013] According to one aspect of the present disclosure, an electrical system includes the power module as described above.

[0014] According to another aspect of the present disclosure, a method for manufacturing an internal cooling device for a power module is provided, comprising the following steps: forming a top insulating member by integral processing, the top insulating member comprising: a top cover; and at least one first heat conductive member disposed on the inner side surface of the top cover and extending in a direction perpendicular to the inner side surface of the top cover; forming a bottom insulating member by integral processing, the bottom insulating member comprising: a box body consisting of a bottom cover and a plurality of side walls surrounding the bottom cover; and at least one second heat conductive member disposed on the inner side surface of the bottom cover and extending in a direction perpendicular to the inner side surface of the bottom cover; and assembling the top insulating member and the bottom insulating member together in a manner that the inner side surface of the top cover and the inner side surface of the bottom cover face each other, so as to form a cavity capable of accommodating a cooling liquid.

[0015] According to one or more embodiments of the present disclosure, the manufacturing method also includes performing one or all of the following steps before assembling the top insulating member and the bottom insulating member together: forming a first metal material layer on the outer surface of the top cover of the top insulating member and molding the first metal material layer to form a first metal layer for attaching a first chip; and forming a second metal material layer on the outer surface of the bottom cover of the bottom insulating member and molding the second metal material layer to form a second metal layer for attaching a second chip.

[0016] According to one or more embodiments of the present disclosure, the manufacturing method further includes performing the following steps before assembling the top insulating member and the bottom insulating member together: forming a liquid inlet and a liquid outlet in the first metal layer and the top cover of the top insulating member; or forming a liquid inlet in the first metal layer and the top cover of the top insulating member, and forming a liquid outlet in the bottom cover of the bottom insulating member, wherein the cooling liquid flows into the cavity through the liquid inlet and flows out of the cavity through the liquid outlet.

[0017] According to one or more embodiments of the present disclosure, the at least one first heat conducting member and the at least one second heat conducting member are arranged alternately, so that the heat conducting members are spaced a certain distance apart from each other in the cavity.

[0018] According to one or more embodiments of the present disclosure, the multiple side walls of the bottom insulating member are formed with sealing edges at the positions where they contact the top cover of the top insulating member, and the sealing edges can fit tightly with the edges of the top cover to achieve sealing of the cavity.

[0019] According to one or more embodiments of the present disclosure, the at least one first heat conductor and the at least one second heat conductor include one or more of the following: a cylindrical heat conductor, an elliptical cylinder heat conductor, a rectangular cylinder heat conductor, a regular polygonal cylinder heat conductor, an irregular cylinder heat conductor, and a conical heat conductor; the attachment includes using electrically conductive and / or thermally conductive materials to join together by sintering or welding; the first chip and / or the second chip include a power chip; the first metal material layer is formed on the outer surface of the top cover of the top insulating member by sintering, brazing, soldering or solidification; and / or the second metal material layer is formed on the outer surface of the bottom cover of the bottom insulating member by sintering, brazing, soldering or solidification.

[0020] Other features and advantages of the present disclosure will become more apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0022] The present disclosure can be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0023] Figure 1A Schematically shows a cross-sectional view of an internal cooling device for a power module according to an embodiment of the present disclosure;

[0024] Figure 1B Schematically shows Figure 1A A cross-sectional view of a top insulating member of an internal cooling device;

[0025] Figure 1C Schematically shows Figure 1A A cross-sectional view of a bottom insulating member of an internal cooling device;

[0026] Figure 2A Schematically shows a cross-sectional view of an internal cooling device according to an embodiment of the present disclosure, wherein the liquid inlet and the liquid outlet are located on the same side;

[0027] Figure 2B Schematically shows a cross-sectional view of an internal cooling device according to an embodiment of the present disclosure, wherein a liquid inlet and a liquid outlet are located on opposite sides;

[0028] Figure 3A Schematically shows a structural diagram of a power module including an internal cooling device according to an embodiment of the present disclosure;

[0029] Figure 3B Shown Figure 3ASchematic diagram of the structure of the power module before being packaged;

[0030] Figure 3C Shown Figure 3A A schematic side view of the structure of the power module before being packaged;

[0031] Figure 4 An exemplary flow chart showing a method for manufacturing an internal cooling device for a power module according to an embodiment of the present disclosure;

[0032] Figures 5A to 5G Schematically shows the Figure 4 A schematic structural diagram of a device corresponding to some steps of the method shown.

[0033] Note that in the embodiments described below, the same reference numerals are sometimes used in common across different drawings to denote the same parts or parts having the same functions, and their repeated descriptions are omitted. In some cases, similar reference numerals and letters are used to denote similar items, so once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0034] For ease of understanding, the positions, sizes, and ranges of various structures shown in the drawings and the like may not represent actual positions, sizes, and ranges, etc. Therefore, the present disclosure is not limited to the positions, sizes, and ranges disclosed in the drawings and the like. DETAILED DESCRIPTION

[0035] In traditional power modules, the chip is attached to a copper-clad ceramic substrate, which is further attached to an internal cooling device made of metal materials, thereby achieving indirect cooling of the chip. After research, the inventors of this application found that such an internal cooling device and power module have many drawbacks that need to be improved.

[0036] First, the heat dissipation path from the chip to the copper-clad ceramic substrate and then to the internal cooling device includes multiple alternating metal material layers and ceramic material layers, and there are also multiple attachment material layers (for example, an attachment material layer that attaches the substrate to the internal cooling device, an attachment material layer that attaches the chip to the substrate, etc.). These factors result in a long heat dissipation path and low heat dissipation efficiency. Furthermore, assembling the chip, the copper-clad ceramic substrate, and the internal cooling device together requires more process steps, which will increase the manufacturing time and cost of the power module. In addition, the chip needs to be completely electrically insulated from the internal cooling device. Although the use of metal materials to manufacture the internal cooling device can fully utilize the thermal conductivity of the metal material, it cannot avoid the difficulties in electrical isolation caused by the electrical conductivity of the metal material.

[0037] In response to the above problems, the inventors of the present application have proposed an internal cooling device for a power module, a manufacturing method thereof, and a corresponding new technical solution for the power module to overcome some or all of the above shortcomings.

[0038] Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present disclosure, its application, or use. That is, the structures and methods herein are presented in an exemplary manner to illustrate different embodiments of the structures and methods of the present disclosure. However, those skilled in the art will understand that these are merely exemplary embodiments of the present disclosure that can be implemented, and are not exhaustive.

[0039] In all examples shown and discussed here, unless otherwise specifically stated, the relative arrangement, numerical expression and numerical value of the parts and steps set forth in these embodiments do not limit the scope of the present disclosure. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as restriction. Therefore, other examples of exemplary embodiments can have different values. In addition, the accompanying drawings need not be drawn to scale, and some features may be amplified to illustrate the details of specific components.

[0040] Technologies, methods, and apparatus known to ordinary technicians in the relevant field may not be discussed in detail, but where appropriate, such technologies, methods, and apparatus should be considered part of the authorization specification.

[0041] Figure 1A A cross-sectional view schematically illustrates an internal cooling device 100 for a power module according to an embodiment of the present disclosure.

[0042] like Figure 1A As shown in , the internal cooling device 100 according to an embodiment of the present disclosure may include a top insulating member 110 formed by an integral process and a bottom insulating member 120 formed by an integral process.

[0043] Figure 1B Schematically shows Figure 1A A cross-sectional view of the top insulating member 110 of the internal cooling device 100. Figure 1B As shown, the top insulating member 110 may include a top cover 112 and at least one first heat conducting member 116. The first heat conducting member 116 is disposed on the inner surface of the top cover 112 and extends in a direction perpendicular to the inner surface of the top cover 112.

[0044] Figure 1C Schematically shows Figure 1A sectional view of the bottom insulating member 120 of the internal cooling device 100. Figure 1CAs shown in , the bottom insulator 120 may include: a box body consisting of a bottom cover 122 and a plurality of side walls 124 surrounding the bottom cover, and at least one second heat conductor 126. The second heat conductor 126 is provided on the inner surface of the bottom cover 122 and extends in a direction perpendicular to the inner surface of the bottom cover 122. The first heat conductor 116 and the second heat conductor 126 can increase the contact area between the coolant and the internal cooling device 100, promote more sufficient heat exchange between the two, and thus improve the heat dissipation effect of the cooling device. The top insulator 110 and the bottom insulator 120 may be made of any suitable insulating material, which may include, for example, insulating ceramic materials.

[0045] Continue to refer Figure 1A In the internal cooling device 100, the top insulating member 110 and the bottom insulating member 120 can be assembled together with the inner surface of the top cover 112 and the inner surface of the bottom cover 122 facing each other, thereby forming a cavity capable of containing coolant. In this cavity, at least one first heat conductive member 116 and at least one second heat conductive member 126 can be arranged in a staggered manner, such that each heat conductive member in the cavity is spaced a certain distance apart. The staggered arrangement of the heat conductive members allows the coolant to flow in the winding cavity and fully contact each heat conductive member, thereby fully absorbing heat from the heat conductive members and improving heat dissipation efficiency.

[0046] Those skilled in the art will understand that although Figures 1A to 1C The number, shape and arrangement of the first heat conductor 116 and the second heat conductor 126 are shown in the figure, but this is not intended to constitute any limitation. First, the number of the first heat conductor 116 and the second heat conductor 126 can be arbitrarily set according to the application needs. Further, the first heat conductor 116 and the second heat conductor 126 can adopt any shape, in particular a shape suitable for increasing the contact area with the coolant, including but not limited to one or more of the following: a cylindrical heat conductor, an elliptical cylinder heat conductor, a rectangular cylinder heat conductor, a regular polygonal cylinder heat conductor, an irregular cylinder heat conductor, a cone heat conductor, etc. In addition, the first heat conductor 116 and the second heat conductor 126 can also adopt any arrangement that is staggered with each other, in particular an arrangement that is suitable for promoting the flow of the coolant and sufficient contact between the coolant and the heat conductor.

[0047] In some embodiments, the multiple side walls 124 of the bottom insulating member 120 may be formed with sealing edges 128 at the locations where they contact the top cover 112 of the top insulating member 110. The sealing edges 128 protrude relative to the side walls 124 so that they can closely mate with the edges of the top cover 112 to achieve sealing of the cavity. When the sealing edges 128 are mated with the edges of the top cover 112, a waterproof adhesive layer may be applied to the seam between the two to achieve sufficient sealing of the cavity. The provision of the sealing edges 128 significantly reduces the area of ​​the seam region between the top and bottom insulating members relative to conventional internal cooling devices, thereby improving the sealing performance of the internal cooling device of the present application.

[0048] The internal cooling device 100 according to an embodiment of the present disclosure may further include a liquid inlet and a liquid outlet, through which the cooling liquid flows into the cavity and out of the cavity through the liquid outlet. The liquid inlet and the liquid outlet may be arranged on the top surface and / or the bottom surface of the internal cooling device 100 as required. For example, Figure 2A A cross-sectional view of an internal cooling device 100 according to an embodiment of the present disclosure is schematically shown, wherein the liquid inlet 150 and the liquid outlet 160 are both formed in the top cover 112 of the top insulating member 110. For another example, Figure 2B A cross-sectional view of an internal cooling device 100 according to an embodiment of the present disclosure is schematically shown, wherein the liquid inlet 150 is formed in the top cover 112 of the top insulating member 110 and the liquid outlet 160 is formed in the bottom cover 122 of the bottom insulating member 120.

[0049] Continue to refer Figure 1A According to an embodiment of the present disclosure, the internal cooling device 100 may further include: a first metal layer 130 disposed on the outer surface of the top cover 112 of the top insulating member 110, the first metal layer 130 being used for attaching a first chip (not shown); and / or a second metal layer 140 disposed on the outer surface of the bottom cover 122 of the bottom insulating member 120, the second metal layer 140 being used for attaching a second chip (not shown). In some embodiments, the internal cooling device 100 may include only the first metal layer 130; in other embodiments, the internal cooling device 100 may include only the second metal layer 140; in yet other embodiments, the internal cooling device 100 may include both the first metal layer 130 and the second metal layer 140.

[0050] In the embodiments of the present disclosure, "attachment" refers to, for example, bonding to each other through electrically conductive and / or thermally conductive materials, and can be performed through processes such as sintering or welding. For example, a first chip (not shown) can be attached to the first metal layer 130 through an electrically conductive and thermally conductive attachment material layer (not shown). For another example, a second chip (not shown) can be attached to the second metal layer 140 through an electrically conductive and thermally conductive attachment material layer (not shown).

[0051] In some embodiments, the first chip and / or the second chip may include a power chip.

[0052] In some embodiments, the first metal layer 130 can be formed on the outer surface of the top cover 112 of the top insulating member 110 by sintering, brazing, soldering or curing; and / or, the second metal layer 140 can be formed on the outer surface of the bottom cover 122 of the bottom insulating member 120 by sintering, brazing, soldering or curing.

[0053] Figure 3A Schematically shows a structural diagram of a power module 200 including an internal cooling device according to an embodiment of the present disclosure; Figure 3B Shown Figure 3A A schematic structural diagram of the power module 200 before being packaged; and Figure 3C Shown Figure 3A A schematic side view of the structure of the power module 200 before being packaged. Figure 3A , Figure 3B and Figure 3C The various components of the power module 200 in FIG. 1 are not yet covered by the packaging material layer, so that the various components therein are clearly shown.

[0054] like Figure 3B and Figure 3C As shown, according to an embodiment of the present disclosure, the power module 200 may include: Figure 1AThe internal cooling device 100 shown in FIG. 1 may include a first metal layer 130 disposed on the outer surface of a top cover of a top insulating member and a second metal layer 140 disposed on the outer surface of a bottom cover of a bottom insulating member. The power module 200 may further include a first chip 210 attached to the first metal layer 130 and a second chip 220 attached to the second metal layer 140. The first chip 210 may be electrically coupled via the first metal layer 130 and at least one of a conductive pillar 230, a conductive sheet 240, and a conductive wire 250. Similarly, the second chip 220 may be electrically coupled via the second metal layer 120 and at least one of a conductive pillar 230, a conductive sheet 240, and a conductive wire 250. The first and second metal layers 130, 140 may also be attached to leads 260 extending beyond the internal cooling device 100. In a preferred embodiment, the conductive sheet 240 may include a copper sheet or the like.

[0055] Those skilled in the art will understand that although Figure 3B and Figure 3C The number, distribution, shape, and size of the first chip 210, the second chip 220, the conductive pillars 230, the conductive sheets 240, the conductive wires 250, and the leads 260 are schematically shown. This is merely for the purpose of presenting the various components as comprehensively as possible within the same set of figures and is not intended to constitute any limitation. The power module according to the embodiments of the present disclosure may include the aforementioned components in any number, distribution, shape, and size.

[0056] Compared to conventional internal cooling devices and power modules, the internal cooling device 100 and the power module 200 according to embodiments of the present disclosure achieve numerous improvements.

[0057] First of all, the internal cooling device of the present application has significantly improved heat dissipation efficiency. Traditional internal cooling devices are usually made of metal materials, and the chip needs to be indirectly mounted on the internal cooling device through a copper-clad ceramic substrate (the substrate is composed of ceramic material and a copper layer attached to both sides thereof). In contrast, the internal cooling device of the present application innovatively uses an integrated processing technology to form a top insulating member and a bottom insulating member and then assembles them, so that the chip can be directly attached to the internal cooling device through a metal layer provided on the outer surface of the top and bottom insulating members. On the one hand, this design shortens the heat dissipation path, so that the heat generated by the chip can be more directly conducted to the internal cooling device; on the other hand, it reduces the switching between different material layers, thereby significantly improving the cooling efficiency of the internal cooling device. In addition, directly attaching the chip to the internal cooling device also simplifies the assembly process steps of each component, thereby optimizing the manufacturing process of the power module and reducing production costs.

[0058] Furthermore, the power module using the internal cooling device of the present application is more compact in area and volume than the traditional power module, which promotes the miniaturization of the power module. On the one hand, the improvement in cooling efficiency enables the internal cooling device of the present application to attach chips of larger area on the same unit cooling area, thereby reducing the overall area of ​​the power module; on the other hand, the top insulating member and the bottom insulating member not only assume the cooling function, but also can serve as the attachment substrate of the chip, so there is no need to use a copper-clad ceramic substrate, which significantly reduces the thickness of the power module and further promotes the miniaturization process of the power module. In addition, the liquid inlet and outlet of the internal cooling device of the present application (and its corresponding power module) can be arranged on one side of the upper surface or on both sides of the upper and lower surfaces. This design enables the sides of multiple power modules to fit tightly together, thereby achieving more compact integration or installation, further reducing the volume of the product.

[0059] In addition, the internal cooling device of the present application has excellent sealing effect and electrical isolation performance, and is not easy to corrode and erode. As mentioned above, the internal cooling device of the present application is composed of a top insulating part and a bottom insulating part formed by an integrated process. The joint area of ​​these two integrally formed components is greatly reduced compared to the traditional internal cooling device, thereby achieving a better sealing effect for the coolant. Furthermore, since the internal cooling device of the present application is made of insulating material (for example, insulating ceramic material), it not only has a good electrical isolation effect, but also has excellent corrosion and erosion resistance.

[0060] The following combination Figure 4 as well as Figures 5A to 5G A method for manufacturing an internal cooling device for a power module according to an embodiment of the present disclosure is described. Figure 4 FIG. 1 shows an exemplary flow chart of a method 300 for manufacturing an internal cooling device for a power module according to an embodiment of the present disclosure. Figures 5A to 5G Schematically shows the Figure 4 The schematic diagram of the structure of the device corresponding to some steps of the method shown. Figure 4 as well as Figures 5A to 5G The described method 300 for manufacturing an internal cooling device for a power module can be used to manufacture the internal cooling device 100 described according to the aforementioned embodiment of the present disclosure, and thus the aforementioned corresponding description of the power module 100 is also applicable here.

[0061] like Figure 4 As shown, the method 300 for manufacturing an internal cooling device for a power module according to an embodiment of the present disclosure may include step S310 , step S330 , and step S350 .

[0062] At step S310 , the top insulating member 110 is formed by an integral process. Figure 5A and Figure 5B 1 and 2 show a schematic top view and a schematic bottom view of the top insulating member 110, respectively. Figure 5A and Figure 5B As shown, the top insulating member 110 may include: a top cover 112 ; and a plurality of first heat conducting members 116 disposed on the inner surface of the top cover 112 and extending in a direction perpendicular to the inner surface of the top cover 112 .

[0063] At step S330 , the bottom insulating member 120 is formed by an integral process. Figure 5D and Figure 5E 1 and 2 show a schematic top view and a schematic bottom view of the bottom insulating member 120, respectively. Figure 5D and Figure 5E As shown, the bottom insulating member 120 may include: a box body composed of a bottom cover 122 and a plurality of side walls 124 surrounding the bottom cover 122; and a plurality of second heat conducting members 126 provided on the inner surface of the bottom cover 122 and extending in a direction perpendicular to the inner surface of the bottom cover 122.

[0064] At step S350 , the top insulator 110 and the bottom insulator 120 are assembled together with the inner surface of the top cover 112 and the inner surface of the bottom cover 122 facing each other to form a cavity capable of containing cooling liquid. Figure 5G FIG. 1 shows a schematic structural diagram of the assembled internal cooling device 100 .

[0065] In some embodiments, the method 300 for manufacturing an internal cooling device for a power module may further optionally include performing one or both of steps S320 and S340 before assembling the top insulating member and the bottom insulating member together (step S350 ).

[0066] like Figure 4 As shown, at step S320 , a first metal material layer is formed on the outer surface of the top cover 112 of the top insulating member 110 and is subjected to a molding process to form a first metal layer 130 for attaching the first chip. Figure 5C A schematic top view of the top insulating member 110 with the first metal layer 130 is shown.

[0067] In some embodiments, the first metal material layer may be formed on the outer side surface of the top cap 112 of the top insulation member 110 by sintering, brazing, soldering, or curing.

[0068] At step S340 , a second metal material layer is formed on the outer surface of the bottom cover 122 of the bottom insulating member 120 and is subjected to a molding process to form a second metal layer 140 for attaching a second chip. Figure 5FA bottom view of the bottom insulating member 120 with the second metal layer 140 is shown.

[0069] In some embodiments, the second metal material layer is formed on the outer side surface of the bottom cover of the bottom insulator by sintering, brazing, soldering, or curing.

[0070] In some embodiments, the first chip and / or the second chip may include a power chip.

[0071] Figure 4 Steps S320 and S340 shown in dashed boxes are optional steps, i.e., the method may include or exclude these steps. For example, the manufacturing method 300 for an internal cooling device for a power module may include only step S320 but not step S340, may include only step S340 but not step S320, or may include both steps S320 and S340.

[0072] Those skilled in the art will understand that although Figure 4 The flowchart depicts a specific order in which the steps are performed, but the order can be changed without departing from the scope of the present disclosure. Some of the steps depicted can be performed in parallel or in a different order that does not substantially affect the functionality of the process. For example, the bottom insulator (step S330) can be formed first and then the top insulator (step S310) can be formed, or the formation of the top insulator (step S310) and the formation of the bottom insulator (step S330) can be performed in parallel, and so on. For another example, the formation of the first metal layer (step S320) and the formation of the second metal layer (step S340) can be performed after the formation of the top insulator (step S310) and the formation of the bottom insulator (step S330), or the two steps of forming the top insulator (step S310) and forming the first metal layer (step S320) can be performed in parallel with the two steps of forming the bottom insulator (step S330) and forming the second metal layer (step S340), and so on.

[0073] In some embodiments, the plurality of first heat conducting members 116 and the plurality of second heat conducting members 126 may be staggered so that the heat conducting members are spaced apart from each other by a certain distance in the cavity.

[0074] In some embodiments, as Figure 5D As shown, a plurality of side walls 124 of the bottom insulating member 120 are formed with sealing edges 128 at positions where the side walls 124 contact the top cover of the top insulating member. The sealing edges 128 can closely cooperate with the edges of the top cover to achieve sealing of the cavity.

[0075] In some embodiments, the manufacturing method 300 for an internal cooling device for a power module may further include: forming a liquid inlet and a liquid outlet in the top cover of the first metal layer and the top insulating member; or forming a liquid inlet in the top cover of the first metal layer and the top insulating member and forming a liquid outlet in the bottom cover of the second metal layer and the bottom insulating member. Cooling liquid flows into the cavity through the liquid inlet and flows out of the cavity through the liquid outlet. Figure 5C An embodiment is shown in which the liquid inlet 150 and the liquid outlet 160 are both formed in the first metal layer 130 and the cap 112 of the top insulator.

[0076] In some embodiments, the first heat conductor 116 and the second heat conductor 126 include one or more of the following: a cylindrical heat conductor, an elliptical cylindrical heat conductor, a rectangular cylindrical heat conductor, a regular polygonal cylindrical heat conductor, an irregular cylindrical heat conductor, a conical heat conductor, and the like.

[0077] The present application also contemplates an electrical system that may include a power module according to any embodiment of the present disclosure. For example, the electrical system may include, for example, an inverter, a new energy vehicle, a wind power system, a solar power generation system, an energy storage system, or any other device or system requiring the power module of the present disclosure.

[0078] As used herein, the word "chip" includes, but is not limited to, a die or a bare die.

[0079] The terms "front," "back," "top," "bottom," "above," "below," and the like, if any, in the specification and claims, are used for descriptive purposes and are not necessarily intended to describe invariant relative positions. It is understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the disclosure described herein, for example, are capable of operation in other orientations than those illustrated or otherwise described herein.

[0080] As used herein, the word "exemplary" means "serving as an example, instance, or illustration," rather than as a "model" to be precisely copied. Any implementation described as exemplary is not necessarily to be construed as preferred or advantageous over other implementations. Furthermore, the present disclosure is not to be bound by any expressed or implied theory presented in the preceding technical field, background, summary, or detailed description.

[0081] As used herein, the term "substantially" is intended to encompass any minor variations due to design or manufacturing imperfections, device or component tolerances, environmental influences, and / or other factors. The term "substantially" also allows for deviations from a perfect or ideal condition due to parasitic effects, noise, and other practical considerations that may be present in actual implementations.

[0082] In addition, the foregoing description may have referred to elements or nodes or features being "connected" or "coupled" together. As used herein, unless expressly stated otherwise, "connected" means that one element / node / feature is directly connected (or directly communicates) with another element / node / feature, electrically, mechanically, logically, or otherwise. Similarly, unless expressly stated otherwise, "coupled" means that one element / node / feature can be mechanically, electrically, logically, or otherwise connected to another element / node / feature, directly or indirectly, to allow interaction, even if the two features may not be directly connected. In other words, "coupled" is intended to encompass both direct and indirect connections of elements or other features, including connections utilizing one or more intermediate elements.

[0083] Additionally, terms such as "first," "second," and the like may also be used herein for reference purposes only and are not intended to be limiting. For example, the terms "first," "second," and other numerical terms referring to structures or elements do not imply a sequence or order unless the context clearly indicates otherwise.

[0084] It should also be understood that when the term “include / comprises” is used in this document, it indicates the presence of the specified features, integers, steps, operations, units and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, units and / or components and / or their combinations.

[0085] In this disclosure, the term "provide" is used in a broad sense to cover all ways of obtaining an object, and thus "providing an object" includes but is not limited to "purchasing", "preparing / manufacturing", "arranging / setting up", "installing / assembling", and / or "ordering" an object, etc.

[0086] Those skilled in the art will appreciate that the boundaries between the above-mentioned operations are merely illustrative. Multiple operations can be combined into a single operation, a single operation can be distributed among additional operations, and operations can be performed at least partially overlapping in time. Moreover, alternative embodiments can include multiple instances of specific operations, and the order of operations can be changed in various other embodiments. However, other modifications, variations, and replacements are also possible. Therefore, this specification and the accompanying drawings should be considered illustrative, not restrictive.

[0087] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. The various embodiments disclosed herein may be combined in any manner without departing from the spirit and scope of the present disclosure. It should also be understood by those skilled in the art that various modifications may be made to the embodiments without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. An internal cooling device for a power module, characterized in that: include: The top insulating member formed by one-piece processing includes: Top cover; and at least one first heat conducting member, disposed on the inner surface of the top cover and extending in a direction perpendicular to the inner surface of the top cover; and The bottom insulating member formed by one-piece processing includes: a box body, consisting of a bottom cover and a plurality of side walls surrounding the bottom cover; and at least one second heat conducting member, disposed on the inner surface of the bottom cover and extending in a direction perpendicular to the inner surface of the bottom cover; The top insulating member and the bottom insulating member are assembled together in a manner that the inner side surface of the top cover and the inner side surface of the bottom cover face each other, so as to form a cavity capable of containing cooling liquid.

2. The internal cooling device according to claim 1, characterized in that in: The at least one first heat conducting member and the at least one second heat conducting member are arranged in a staggered manner, so that the heat conducting members are spaced apart from each other by a certain distance in the cavity.

3. The internal cooling device according to claim 1, characterized in that in: The plurality of side walls of the bottom insulating member are formed with sealing edges at positions where the side walls contact the top cover of the top insulating member. The sealing edges can be tightly matched with edges of the top cover to achieve sealing of the cavity.

4. The internal cooling device according to claim 1, characterized in that Also includes: a liquid inlet formed in the top cover of the top insulating member, wherein cooling liquid flows into the cavity through the liquid inlet, and A liquid outlet is formed in the top cover of the top insulating member or in the bottom cover of the bottom insulating member, wherein the cooling liquid flows out of the cavity through the liquid outlet.

5. The internal cooling device according to any one of claims 1 to 4, characterized in that Also includes one or all of the following: a first metal layer disposed on an outer side surface of the top cover of the top insulating member, the first metal layer being used for attaching a first chip; and A second metal layer is disposed on an outer surface of the bottom cover of the bottom insulating member, and the second metal layer is used for attaching a second chip.

6. The internal cooling device according to claim 5, characterized in that in: The at least one first heat-conducting member and the at least one second heat-conducting member include one or more of the following: a cylindrical heat-conducting member, an elliptical cylindrical heat-conducting member, a rectangular cylindrical heat-conducting member, a regular polygonal cylindrical heat-conducting member, an irregular cylindrical heat-conducting member, and a conical heat-conducting member; The attachment includes bonding together by sintering or welding using electrically and / or thermally conductive materials; The first chip and / or the second chip include a power chip; The first metal layer is formed on the outer side surface of the top cover of the top insulating member by sintering, brazing, soldering or curing; and / or The second metal layer is formed on the outer side surface of the bottom cover of the bottom insulator by sintering, brazing, soldering, or curing.

7. A power module, characterized in that: Comprising an internal cooling device according to any one of claims 1 to 6.

8. The power module according to claim 7, It is characterized in that wherein the internal cooling device comprises a first metal layer provided on an outer side surface of the top cover of the top insulating member and a second metal layer provided on an outer side surface of the bottom cover of the bottom insulating member; and Wherein, the power module further includes: a first chip attached to the first metal layer, the first chip being electrically coupled via the first metal layer and at least one of a conductive pillar, a conductive sheet, and a conductive wire; and a second chip attached to the second metal layer, the second chip being electrically coupled via the second metal layer and at least one of a conductive pillar, a conductive sheet, and a conductive wire; Wherein, the first metal layer and the second metal layer are further attached to leads extending beyond the internal cooling device.

9. An electrical system, characterized in that: Comprising the power module according to any one of claims 7 to 8.

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