Heat dissipation structure for gallium nitride-based high-power chip

Abstract

The utility model discloses a heat dissipation structure for a gallium nitride-based high-power chip, which belongs to the technical field of semiconductor devices and comprises a mounting plate, a heat conduction assembly and a heat dissipation assembly. The mounting plate is used for mounting the gallium nitride-based high-power chip; the heat-conducting assembly comprises a heat-conducting block and a heat-conducting cover plate; the bottom of the heat conduction block is in direct contact with the gallium nitride-based high-power chip; a plurality of vertical honeycomb-shaped channels are arranged in the heat conduction block, and the honeycomb-shaped channels are filled with a cooling medium; the top ends and the bottom ends of the plurality of honeycomb-shaped channels are converged into a total channel, and a total channel outlet and a total channel inlet both penetrate out of one side part of the heat conduction block; the heat conduction cover plate is detachably installed above the heat conduction block and used for sealing the honeycomb-shaped channel, and a positioning column matched with the honeycomb-shaped channel is arranged at the bottom of the heat conduction cover plate and used for preventing the cooling medium from overflowing; the heat dissipation assembly is connected with the heat conduction assembly and used for heat dissipation of the gallium nitride-based high-power chip. And the heat dissipation requirement of a gallium nitride-based high-power chip under a high-power condition can be met.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor devices, and in particular relates to a heat dissipation structure for a gallium nitride-based high-power chip. Background Art

[0002] Gallium nitride (GaN)-based high-power chips are widely used in RF amplifiers, power electronics, and other fields due to their excellent performance, such as high electron mobility and high breakdown voltage. However, GaN-based chips generate a large amount of heat under high-power operating conditions. If heat is not dissipated promptly and effectively, it may lead to chip performance degradation, reduced reliability, and even failure.

[0003] While common heat dissipation structures, such as traditional metal heat sinks, heat pipes, or fan cooling, can alleviate heat accumulation to some extent, their efficiency is limited at high power densities and they struggle to meet the cooling requirements of GaN-based chips under extreme conditions. Therefore, a new heat dissipation structure is needed to improve the heat dissipation efficiency of GaN-based high-power chips and ensure their stable operation under high-power conditions.

[0004] In view of the deficiencies in the prior art, the present invention provides a heat dissipation structure for a gallium nitride-based high-power chip, aiming to solve the above-mentioned problems. Utility Model Content

[0005] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a heat dissipation structure for gallium nitride-based high-power chips, which can meet the heat dissipation requirements of gallium nitride-based high-power chips under high power conditions.

[0006] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0007] A heat dissipation structure for a gallium nitride-based high-power chip, comprising:

[0008] Mounting plate for mounting gallium nitride-based high-power chips;

[0009] A heat-conducting assembly, comprising a heat-conducting block and a heat-conducting cover plate;

[0010] The bottom of the heat conducting block is in direct contact with the gallium nitride-based high-power chip; a plurality of vertical honeycomb channels are provided inside the heat conducting block, and the honeycomb channels are filled with a cooling medium; the top and bottom ends of the plurality of honeycomb channels converge into a main channel, and the main channel outlet and main channel inlet both pass through a side of the heat conducting block;

[0011] The heat-conducting cover plate is detachably mounted on top of the heat-conducting block to seal the honeycomb channel. Positioning posts adapted to the honeycomb channel are provided at the bottom of the heat-conducting cover plate to prevent overflow of the cooling medium, thereby ensuring the stability and safety of the heat dissipation system.

[0012] The heat dissipation component is connected to the heat conduction component and is used for dissipating heat of gallium nitride-based high-power chips.

[0013] Preferably, the cooling medium is a fluorinated liquid.

[0014] Preferably, it also includes a micro cooling pump, which is used to drive the cooling medium to circulate in the honeycomb channel, the inlet of the micro cooling pump is connected to the outlet of the main channel, and the outlet of the micro cooling pump is connected to the inlet of the main channel.

[0015] Preferably, the heat dissipation assembly includes a heat sink group and a heat dissipation fan group, the heat sink includes side heat sinks and top heat sinks, and the heat dissipation fan group includes side heat dissipation fans and top heat dissipation fans; the side heat sinks are installed on the remaining three side portions of the heat conductive block, the side heat dissipation fans are installed on the side heat sinks, the top heat sink is installed on the top of the heat conductive cover plate, and a cylindrical groove is opened on the top heat sink, and the top heat dissipation fan is installed in the cylindrical groove of the top heat sink.

[0016] Preferably, the heat conducting block and the heat conducting cover plate are made of copper.

[0017] Preferably, a protective plate is further included, which is arranged between the heat-conducting component and the mounting plate, and an opening adapted to the size of the gallium nitride-based high-power chip is opened in the middle of the protective plate.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The utility model increases the heat exchange area inside the heat conductive block by providing a plurality of vertical honeycomb channels, so that the cooling medium can more effectively absorb the heat generated by the chip.

[0020] 2. The present invention selects fluorinated liquid as the cooling medium and introduces a micro-cooling pump, so that the cooling medium forms a closed-loop circulation in the honeycomb channel, continuously extracting heat from the gallium nitride power chip. In addition, the fluorinated liquid has good chemical stability and low toxicity, has little impact on the environment, and meets modern environmental protection requirements.

[0021] 3. The utility model provides a cylindrical groove on the top heat sink, and installs the top heat dissipation fan in it, which effectively increases the heat dissipation area and can quickly dissipate heat to the environment. In addition, the arrangement of the side heat sink and the top heat sink realizes all-round heat dissipation of the heat conductive block, reduces the generation of hot spots, and improves the heat dissipation uniformity of the entire system.

[0022] 4. The utility model designs the heat-conducting cover plate into a detachable mode, so that maintenance personnel can easily check the remaining amount of fluorinated liquid to ensure that the cooling medium in the heat dissipation system is sufficient, or it is convenient for maintenance personnel to replace other cooling media to meet different heat dissipation requirements or improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural diagram of the present utility model.

[0024] Figure 2 It is a front view of the present utility model.

[0025] Figure 3 It is a top view of the present utility model.

[0026] Figure 4 It is a structural schematic diagram of the honeycomb channel of the present utility model.

[0027] Figure 5 It is a structural schematic diagram of the heat-conducting cover plate of the present utility model.

[0028] Figure 6 It is a structural schematic diagram of the protective plate and gallium nitride-based high-power chip of the utility model.

[0029] Among them: 1. Mounting plate; 2. Heat-conducting assembly; 201. Heat-conducting block; 201a. Honeycomb channel; 201b. Main channel outlet; 201c. Main channel inlet; 202. Heat-conducting cover; 202a. Positioning column; 3. Heat dissipation assembly; 301. Heat sink group; 301a. Side heat sink; 301b. Top heat sink; 302. Cooling fan group; 302a. Side cooling fan; 302b. Top cooling fan; 4. Micro cooling pump; 5. Protective plate; 6. GaN-based high-power chip. DETAILED DESCRIPTION

[0030] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are not intended to limit the scope of protection of the present invention.

[0031] In the description of the present invention, it should be understood that the terms "center," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0032] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0033] refer to Figures 1-6 This embodiment provides a heat dissipation structure for a gallium nitride-based high-power chip, comprising: a mounting plate 1 for mounting a gallium nitride-based high-power chip 6; a heat-conducting assembly 2, comprising a heat-conducting block 201 and a heat-conducting cover plate 202; the bottom of the heat-conducting block 201 being in direct contact with the gallium nitride-based high-power chip 6; a plurality of vertical honeycomb channels 201a defined within the heat-conducting block 201, each filled with a cooling medium; specifically, a fluorinated liquid; the top and bottom ends of the plurality of honeycomb channels 201a converge into a central channel, with a central channel outlet 201b and a central channel inlet 201c both extending from a side of the heat-conducting block 201; the heat-conducting cover plate 202 being detachably mounted above the heat-conducting block 201 to seal the honeycomb channels 201a; and positioning posts 202a adapted to the honeycomb channels 201a are provided at the bottom of the heat-conducting cover plate 202 to prevent overflow of the cooling medium, thereby ensuring the stability and safety of the heat dissipation system. Heat dissipation assembly 3 is connected to heat conduction assembly 2 and is used to dissipate heat from gallium nitride-based high-power chip 6. Specifically, in this embodiment, the heat conduction block 201 and heat conduction cover plate 202 are made of copper, and their surfaces are polished to ensure close contact with the gallium nitride-based high-power chip 6 and reduce thermal resistance.

[0034] In order to allow the cooling medium to form a closed-loop circulation in the honeycomb channel 201a and continuously extract heat from the gallium nitride power chip, this embodiment is also provided with a micro cooling pump 4, which is used to drive the cooling medium to circulate in the honeycomb channel 201a. The inlet of the micro cooling pump 4 is connected to the main channel outlet 201b, and the outlet of the micro cooling pump 4 is connected to the main channel inlet 201c.

[0035] In order to achieve all-round heat dissipation of the heat-conducting block 201, the heat dissipation component 3 of this embodiment includes a heat sink group 301 and a heat dissipation fan group 302, the heat sink group 301 includes side heat sinks 301a and top heat sinks 301b, and the heat dissipation fan group 302 includes side heat dissipation fans 302a and top heat dissipation fans 302b; the side heat sinks 301a are installed on the remaining three sides of the heat-conducting block 201, the side heat dissipation fans 302a are installed on the side heat sinks 301a, and the top heat sink 301b is installed on the top of the heat-conducting cover plate 202, and a cylindrical groove is opened on the top heat sink 301b, and the top heat dissipation fan 302b is installed in the cylindrical groove of the top heat sink 301b.

[0036] In order to prevent the gallium nitride-based high-power chip 6 from being damaged during the installation process, this embodiment also has a protective plate 5, which is arranged between the heat-conducting component 2 and the mounting plate 1, and an opening adapted to the size of the gallium nitride-based high-power chip 6 is opened in the middle of the protective plate 5.

[0037] It should be noted that the thickness of the protection plate 5 is the same as the thickness of the gallium nitride-based high-power chip 6 .

[0038] Heat dissipation principle and process:

[0039] 1. Chip installation: The GaN-based high-power chip 6 is installed on the mounting plate 1, which is the starting point of the heat dissipation structure. The heat generated by the GaN-based high-power chip 6 during operation needs to be effectively dissipated.

[0040] 2. Function of the heat conducting component 2: The heat conducting component 2 consists of a heat conducting block 201 and a heat conducting cover plate 202, which together form a channel for heat exchange between the chip and the outside world.

[0041] The bottom of the heat-conducting block 201 is in direct contact with the gallium nitride-based high-power chip 6 so as to conduct away the heat generated by the chip.

[0042] The heat conducting block 201 is internally designed with a plurality of vertical honeycomb channels 201 a , which increase the surface area of ​​the heat conducting block 201 and improve the heat conduction efficiency.

[0043] The honeycomb channel 201a is filled with a cooling medium, preferably a fluorinated liquid, which has high thermal conductivity and good chemical stability and can effectively absorb and conduct heat.

[0044] 3. Circulation of cooling medium:

[0045] The bottom ends of the multiple honeycomb channels 201a converge into a main channel to form a flow path for the cooling medium.

[0046] The micro cooling pump 4 drives the cooling medium to circulate in the honeycomb channel, thereby enhancing the heat dissipation effect.

[0047] The total channel outlet 201b passes through one side of the heat conductive block 201 and is connected to the inlet of the micro cooling pump 4. The total channel inlet 201c also passes through one side of the heat conductive block 201 and is connected to the outlet of the micro cooling pump 4, forming a closed loop for the flow of cooling medium.

[0048] 4. Functions of the heat-conducting cover plate 202:

[0049] The heat-conducting cover plate 202 is detachably mounted on the top of the heat-conducting block 201 to seal the honeycomb channel 201a, thereby preventing the cooling medium from overflowing and allowing maintenance personnel to easily check the remaining amount of fluorinated liquid to ensure that there is sufficient cooling medium in the heat dissipation system.

[0050] A positioning column 202a adapted to the honeycomb channel is provided at the bottom of the heat-conducting cover plate 202 to further prevent the cooling medium from overflowing.

[0051] 5. Heat dissipation function of heat dissipation component 3:

[0052] The heat dissipation component 3 is connected to the heat conduction component 2 and is responsible for dissipating the heat conducted by the heat conduction block 201 to the environment.

[0053] The heat dissipation assembly 3 includes a heat sink group 301 and a heat dissipation fan group 302 , which improves the heat dissipation efficiency by increasing the heat dissipation area and enhancing the air flow.

[0054] The heat sink assembly 301 includes side heat sinks 301 a and top heat sinks 301 b , which are mounted at corresponding positions on the heat conducting block 201 and the heat conducting cover plate 202 .

[0055] The cooling fan group 302 includes a side cooling fan 302a and a top cooling fan 302b, which are correspondingly installed on the heat sink group 301 to accelerate heat dissipation by forced convection.

[0056] 6. Comprehensive heat dissipation effect:

[0057] The side heat sink 301 a and the side heat dissipation fan 302 a are responsible for dissipating heat from the side of the heat conducting block 201 .

[0058] The top heat sink 301b and the top heat dissipation fan 302b are responsible for dissipating heat from the top of the heat-conducting cover plate 202. The cylindrical groove on the top heat sink 301b provides an installation space for the top heat dissipation fan 302b, thereby enhancing the heat dissipation capacity of the top.

[0059] In summary, the entire heat dissipation system quickly conducts and dissipates the heat generated by GaN-based high-power chips through various methods such as heat conduction, heat exchange, and forced convection, ensuring that the chips operate at a safe temperature and improving the stability and service life of the chips.

[0060] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A heat dissipation structure for gallium nitride-based high-power chips, characterized in that: include: A mounting plate (1) for mounting a gallium nitride-based high-power chip (6); A heat-conducting assembly (2), comprising a heat-conducting block (201) and a heat-conducting cover plate (202); The bottom of the heat conducting block (201) is in direct contact with the gallium nitride-based high-power chip (6); a plurality of vertical honeycomb channels (201a) are provided inside the heat conducting block (201), and the honeycomb channels (201a) are filled with a cooling medium; the top and bottom ends of the plurality of honeycomb channels (201a) converge into a main channel, and the main channel outlet (201b) and the main channel inlet (201c) both pass through a side of the heat conducting block (201); The heat-conducting cover plate (202) is detachably mounted above the heat-conducting block (201) and is used to close the honeycomb channel (201a). A positioning column (202a) adapted to the honeycomb channel (201a) is provided at the bottom of the heat-conducting cover plate (202) to prevent the cooling medium from overflowing. The heat dissipation component (3) is connected to the heat conduction component (2) and is used for dissipating heat from the gallium nitride-based high-power chip (6).

2. The heat dissipation structure for gallium nitride-based high-power chips according to claim 1, characterized in that: The cooling medium is fluorinated liquid.

3. The heat dissipation structure for gallium nitride-based high-power chips according to claim 2, characterized in that: The invention also includes a micro cooling pump (4), which is used to drive the cooling medium to circulate in the honeycomb channel (201a), the inlet of the micro cooling pump (4) is connected to the outlet (201b) of the main channel, and the outlet of the micro cooling pump (4) is connected to the inlet (201c) of the main channel.

4. The heat dissipation structure for gallium nitride-based high-power chips according to claim 1, characterized in that: The heat dissipation assembly (3) comprises a heat dissipation fin group (301) and a heat dissipation fan group (302); the heat dissipation fin group (301) comprises side heat dissipation fins (301a) and top heat dissipation fins (301b); the heat dissipation fan group (302) comprises side heat dissipation fans (302a) and top heat dissipation fans (302b); the side heat dissipation fins (301a) are mounted on the remaining three side portions of the heat conduction block (201); the side heat dissipation fans (302a) are mounted on the side heat dissipation fins (301a); the top heat dissipation fins (301b) are mounted on the top of the heat conduction cover plate (202); a cylindrical groove is provided on the top heat dissipation fin (301b); and the top heat dissipation fan (302b) is mounted in the cylindrical groove of the top heat dissipation fin (301b).

5. The heat dissipation structure for gallium nitride-based high-power chips according to claim 1, characterized in that: The heat-conducting block (201) and the heat-conducting cover plate (202) are made of copper.

6. The heat dissipation structure for gallium nitride-based high-power chips according to claim 1, characterized in that: It also includes a protective plate (5), which is arranged between the heat-conducting component (2) and the mounting plate (1), and an opening adapted to the size of the gallium nitride-based high-power chip (6) is provided in the middle of the protective plate (5).

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