Cooling device for domain controller, domain controller and vehicle
By using winding aluminum or copper cooling medium pipes and heat exchange plates in the domain controller, combined with a thermal interface material layer, the problems of heavy weight and uneven cooling of liquid-cooled flow channels are solved, achieving lightweight and efficient and uniform heat dissipation effects.
Patent Information
- Application Number
- CN202422375990.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-09-29
AI Technical Summary
The liquid cooling channels of existing domain controllers are heavy, costly, and exhibit uneven cooling, making it difficult to meet the demands for fast, efficient, and uniform heat dissipation of multiple chips.
A winding aluminum or copper cooling medium pipe and an aluminum or copper heat exchange plate are used, combined with a thermal interface material layer, connected by welding or gluing to achieve a lightweight design, and heat exchange is achieved through direct contact with the chip through the boss.
The domain controller achieves lightweight, low-cost, efficient and uniform heat dissipation, ensuring stable operation of each chip.
Smart Images
Figure CN223379349U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a cooling device, in particular to a cooling device used for a domain controller. Background Art
[0002] With the development of domain controllers, more and more domain controllers require the integration of multiple chips. Therefore, how to quickly and evenly dissipate heat from the multiple chips in the domain controller to meet the chip operating temperature requirements and ensure the stable operation of the domain controller has become particularly important.
[0003] Currently, the mainstream cooling method for domain controllers is channel-type liquid cooling. This type of liquid cooling channel is relatively heavy because the die-cast channel housing, produced through friction stir welding, occupies a large area, has a high density, and has thick walls. Furthermore, the friction stir welding process increases the cost of this process.
[0004] In addition, for domain controllers with multiple chips, this liquid-cooled flow channel also has the problem of uneven cooling. Utility Model Content
[0005] One of the purposes of the present invention is to provide a cooling device for a domain controller, which has a simple structure and is lightweight, and can cool and dissipate heat for multiple chips quickly, efficiently, and evenly.
[0006] In order to achieve the above objectives, the present invention proposes a cooling device for a domain controller, which includes:
[0007] a cooling medium pipeline having a cooling medium inlet and a cooling medium outlet;
[0008] The heat exchange plate has one side connected to the cooling medium pipeline for heat exchange, and the other side has a plurality of bosses, each of which is used to be connected to each cooled element of the domain controller for heat exchange.
[0009] Furthermore, in the cooling device described in the present invention, the cooling medium pipeline extends in a meandering manner.
[0010] Furthermore, in the cooling device described in the present invention, the cooling medium pipeline is U-shaped.
[0011] Furthermore, in the cooling device described in the present invention, the cooling medium pipeline is an aluminum pipeline, an aluminum alloy pipeline or a copper pipeline.
[0012] Furthermore, in the cooling device described in the present invention, the heat exchange plate is an aluminum heat exchange plate, an aluminum alloy heat exchange plate or a copper heat exchange plate.
[0013] Furthermore, in the cooling device described in the present invention, one side of the heat exchange plate is in contact with and connected to the cooling medium pipeline by welding.
[0014] Furthermore, in the cooling device described in the present invention, the top surface area of the boss is adapted to the surface area of the cooled element.
[0015] Furthermore, in the cooling device described in the present invention, a thermal interface material layer is provided between the boss and the cooled component, and is directly in contact with the boss and the cooled component respectively.
[0016] Another object of the present utility model is to provide a domain controller, which includes a housing and a printed circuit board arranged in the housing, wherein a plurality of chips are provided on the printed circuit board. The domain controller also includes a cooling device as described above, wherein each boss of the cooling device is respectively connected to each chip serving as a cooled element for heat exchange.
[0017] Another object of the present invention is to provide a vehicle having the domain controller as described above.
[0018] The cooling device of the utility model has a simple structure and is light in weight, and can cool and dissipate heat to multiple chips quickly, efficiently and evenly at the same time. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 A schematic structural diagram of the cooling device of the present invention in one embodiment is shown.
[0020] Figure 2 The structure of the heat exchange plate of the cooling device described in the utility model is shown in one embodiment.
[0021] Figure 3 A schematic diagram of the cooling device of the present invention installed in a domain controller in one embodiment is shown from a frontal perspective.
[0022] Figure 4 A schematic diagram of the cooling device of the present invention installed in a domain controller in one embodiment is shown from an attached perspective.
[0023] Figure 5 A schematic diagram of the split structure of the domain controller described in the present utility model in one embodiment is shown. DETAILED DESCRIPTION
[0024] The cooling device, domain controller and vehicle described in the present invention will be further explained and illustrated below in conjunction with the drawings and specific embodiments of the specification. However, such explanation and illustration do not constitute an undue limitation on the technical solution of the present invention.
[0025] Currently, the mainstream cooling method for domain controllers is channel-type liquid cooling. This type of liquid-cooled channel is relatively heavy because the die-cast channel housing, produced through friction stir welding, occupies a large area, has a high density, and has thick walls. Furthermore, the friction stir welding process increases the cost of this type of channel. Furthermore, for domain controllers with multiple chips, this type of liquid-cooled channel can also suffer from uneven cooling.
[0026] Based on this, the present invention proposes a cooling device for a domain controller in one embodiment, aiming to solve the above-mentioned problem.
[0027] Figure 1 A schematic structural diagram of the cooling device of the present invention in one embodiment is shown.
[0028] Figure 2 The structure of the heat exchange plate of the cooling device described in the utility model is shown in one embodiment.
[0029] like Figure 1 and Figure 2 As shown, in some embodiments, the cooling device may include a cooling medium pipe 310 and a heat exchange plate 320. The cooling medium pipe 310 has a cooling medium inlet 3101 and a cooling medium outlet 3102, thereby forming a cooling medium flow path within its cavity. One side 3203 (e.g., the upper surface) of the heat exchange plate 320 is connected to the cooling medium pipe 310 for heat exchange. The other side 3204 (e.g., the lower surface) of the heat exchange plate 320 has several bosses 3201, each of which is used to connect to a cooled element of the domain controller for heat exchange.
[0030] In some more specific embodiments, the top surface area of the boss 3201 is adapted to the surface area of the cooled component. For example, when the boss contacts the corresponding chips of the domain controller, the top surface area of each boss 3201 (i.e., the area of the contact surface with the chip) is substantially consistent with the surface area of the chip it contacts. This arrangement can ensure optimal cooling while taking into account a streamlined and lightweight design. In this way, Figure 2 It can be seen that the larger boss 3201 can be used to contact the main chip with a larger surface area, while the other smaller bosses 3201 are in contact with other smaller chips on the domain controller PCB board.
[0031] In some more specific embodiments, in order to increase the length of the cooling medium flow path, the cooling medium pipeline can be extended in a meandering manner, that is, it can have multiple curved pipe sections and straight pipe sections.
[0032] In addition, in some other more specific embodiments, in order to further simplify the structure of the cooling device and reduce the weight of the cooling device, the cooling medium pipe 310 can also be set as follows: Figure 1 U-shape shown.
[0033] Furthermore, to further reduce the weight of the cooling medium pipe, the cooling medium pipe can also be constructed as an aluminum pipe or an aluminum alloy pipe or other similar lightweight material pipe. Similarly, the heat exchange plate can also be constructed as an aluminum heat exchange plate or an aluminum alloy heat exchange plate for the purpose of weight reduction.
[0034] In other embodiments, to achieve better heat exchange, the cooling medium pipes can be constructed as copper pipes or other similar highly thermally conductive materials. Similarly, the heat exchange plates can be constructed as copper heat exchange plates or other similarly highly thermally conductive materials. Due to the heavy weight of copper, to achieve lightweighting, the present invention can reduce the wall thickness of the cooling medium pipes and / or the thickness of the heat exchange plates when using copper pipes and / or copper heat exchange plates.
[0035] In some more specific embodiments, one side 3203 of the heat exchange plate 320 is in contact with and connected to the cooling medium pipe 310 by welding. Since welding achieves connection through molten welding material, the contact and connection between one side 3203 of the heat exchange plate and the cooling medium pipe by welding can further improve the heat exchange effect between the heat exchange plate 320 and the cooling medium pipe 310.
[0036] Of course, in other optional embodiments, one side 3203 of the heat exchange plate 320 may also be connected to the cooling medium pipe 310 by gluing.
[0037] like Figure 3 As shown, in some preferred embodiments, to further improve heat exchange efficiency, a thermal interface material layer 5 may be provided between the boss 3201 of the heat exchange plate 320 and the cooled component (e.g., chip 401). The upper and lower surfaces of the thermal interface material layer 5 are directly in contact with the boss 3201 and the cooled component, respectively. In this embodiment, the provision of the thermal interface material layer 5 can reduce the contact thermal resistance between the boss 3201 and the cooled component, thereby improving the efficiency of heat transfer.
[0038] In some more specific embodiments, the thermal interface material can be aluminum oxide, silicon nitride, aluminum nitride, and graphene or similar materials.
[0039] In this way, if Figure 4As shown, the cooling medium F enters from the cooling medium inlet 3101 of the cooling medium pipe 310 and flows out from the cooling medium outlet 3102, and exchanges heat with the heat exchange plate 320 in the process. The heat exchange plate 320 cools the various cooled components on the printed circuit board 4 of the domain controller through the various bosses 3201 provided on its lower surface, thereby ensuring that each cooling object is cooled simultaneously on the basis of simplifying and lightweighting the cooling device, avoiding the phenomenon of uneven and asynchronous cooling of multiple cooling objects.
[0040] It should be noted that, in the present invention, the cooling medium F can be a liquid cooling medium, such as water, oil or other coolants, or a gaseous cooling medium, such as dry ice.
[0041] In one embodiment, the present invention further provides a domain controller.
[0042] Figure 5 A schematic diagram of the split structure of the domain controller described in the present utility model in one embodiment is shown.
[0043] like Figure 5 As shown, in some embodiments, the domain controller includes a housing, a printed circuit board 4 disposed in the housing, and the cooling device 3 as described above.
[0044] In some more specific embodiments, in order to facilitate assembly, the housing may include an upper shell 1 and a lower shell 2. After the upper shell 1 and the lower shell 2 are snapped together, they are locked by multiple bolts 6 to form an inner cavity that can accommodate the cooling device 3 and the printed circuit board 4.
[0045] Two semicircular notches 101 and 102 are provided on the side of the upper shell 1, and another two semicircular notches 201 and 202 are also provided on the side of the lower shell 2, so that the cooling medium inlet 3101 and the cooling medium outlet 3102 of the cooling medium pipe 310 can extend from the shell, thereby being connected to the cooling medium supply and exhaust pipelines respectively, for example, respectively connected to the cooling medium supply and exhaust pipelines of the vehicle.
[0046] like Figure 2 、 Figure 3 and Figure 5 As shown, a plurality of through holes 3202 may be opened on the heat exchange plate 320 , and the cooling device 3 may be fixedly connected to the upper shell 1 by passing bolts 6 through the through holes 3202 , thereby being firmly disposed in the shell.
[0047] like Figure 3 and Figure 5As shown, the printed circuit board 4 is fixedly connected to the lower housing 2 via bolts 6, thereby being securely positioned within the housing. Multiple chips 401 to be cooled are mounted on the printed circuit board 4. Multiple bosses 3201 of varying sizes are provided on the other side of the heat exchange plate 320 to cool each chip 401.
[0048] In a more preferred embodiment, the top surface of the boss 3201 is bonded to the upper surface of the chip 401 on the printed circuit board 4 via the thermal interface material layer 5 .
[0049] In this way, the cooling medium F enters the cooling device 3 through the cooling medium inlet 3101 of the cooling medium pipe 310, thereby transferring the heat dissipated from each chip 401 to the cooling medium through the thermal interface material layer 5 and the cooling device 3, and then the cooling medium after absorbing heat is discharged through the cooling medium outlet 3102 of the cooling medium pipe 310.
[0050] In this way, the requirements for lightweight, intensive and low-cost cooling devices in domain controllers, especially low-power domain controllers, can be met, while also ensuring uniform heat dissipation and stable operation of each chip in the domain controller, especially the low-power domain controller.
[0051] In one embodiment, the present invention further provides a vehicle having the domain controller as described above. Since the present invention does not improve other components of the vehicle, the other components of the vehicle will not be described in detail here.
[0052] It should be noted that the existing technology in the scope of protection of the present utility model is not limited to the embodiments given in the present utility model documents. All existing technologies that do not contradict the solutions of the present utility model, including but not limited to prior patent documents, prior public publications, prior public uses, etc., can be included in the scope of protection of the present utility model.
[0053] In addition, the combination of the various technical features in this case is not limited to the combination described in the claims of this case or the combination described in the specific embodiments. All technical features recorded in this case can be freely combined or combined in any way unless there is a contradiction between them.
[0054] It should also be noted that the above-listed embodiments are merely specific embodiments of the present invention. Obviously, the present invention is not limited to the above-listed embodiments, and similar variations or modifications that can be directly derived from or easily conceived by those skilled in the art based on the disclosure of the present invention are intended to fall within the scope of protection of the present invention.
Claims
1. A cooling device for a domain controller, characterized in that: include: A cooling medium pipe (310) having a cooling medium inlet (3101) and a cooling medium outlet (3102); The heat exchange plate (320) has one side (3203) connected to a cooling medium pipe for heat exchange, and the other side (3204) has a plurality of bosses (3201), each of which is used to be connected to each cooled element of the domain controller for heat exchange.
2. The cooling device according to claim 1, wherein The cooling medium pipe (310) extends in a meandering manner.
3. The cooling device according to claim 1, wherein The cooling medium pipeline (310) is U-shaped.
4. The cooling device according to claim 1, wherein The cooling medium pipeline (310) is an aluminum pipeline, an aluminum alloy pipeline or a copper pipeline.
5. The cooling device according to claim 1, wherein The heat exchange plate (320) is an aluminum heat exchange plate, an aluminum alloy heat exchange plate, or a copper heat exchange plate.
6. The cooling device according to claim 1, wherein One side (3203) of the heat exchange plate is in contact with and connected to the cooling medium pipeline by welding.
7. The cooling device according to claim 1, wherein The top surface area of the boss (3201) is adapted to the surface area of the cooled element.
8. The cooling device according to any one of claims 1 to 7, characterized in that: A heat-conducting interface material layer (5) is provided between the boss and the cooled element and is directly in contact with the boss and the cooled element respectively.
9. A domain controller comprising a housing and a printed circuit board (4) disposed in the housing, wherein the printed circuit board is provided with a plurality of chips (401), characterized in that: The domain controller further comprises a cooling device (3) as claimed in any one of claims 1 to 8, wherein each boss (3201) of the cooling device is respectively connected to each chip (401) as a cooled element for heat exchange.
10. A vehicle, characterized in that: It has a domain controller as claimed in claim 9.