Heat dissipation device and electronic equipment

Abstract

The embodiment of the utility model discloses a heat dissipation device and electronic equipment, the heat dissipation device comprises a heat dissipation module and a second liquid cooling plate which are arranged in parallel in a cooling liquid loop, the heat dissipation module comprises at least two first liquid cooling plates which are arranged side by side and are communicated in series, each first liquid cooling plate comprises a liquid cooling flow channel with a liquid inlet and a liquid outlet, and the liquid cooling flow channel is communicated with the liquid inlet. The liquid inlet of the first liquid cooling plate located at one end is communicated with the first liquid inlet pipe, the liquid outlet or the liquid inlet of the first liquid cooling plate located at the other end is communicated with the first liquid return pipe, and the other liquid outlets and liquid inlets, every two adjacent liquid outlets and every two adjacent liquid inlets are communicated in a staggered series connection mode through connecting pipes. The adjacent first liquid cooling plates in the heat dissipation device are connected in series and communicated through the staggered holes of the connecting pipes, so that the bending radius and operability of the connecting pipes are increased, the flow resistance is reduced, and the heat dissipation capability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of communication equipment, in particular to a heat dissipation device and electronic equipment. Background Art

[0002] As demand for high-density, high-performance optical modules continues to grow in data centers and high-performance computing, heat dissipation has become a key factor limiting equipment performance. Traditional air cooling methods are insufficient for high-power density optical modules, while liquid cooling, with its superior heat dissipation performance, has gradually become the mainstream trend in the industry. However, in practical applications, especially in high-density installation environments, multiple liquid cooling plates for multiple optical modules often need to be installed closely side by side to maximize chassis space utilization.

[0003] Currently, adjacent liquid inlets and outlets between adjacent liquid cooling plates are typically connected in series via connecting pipes. Due to the small size of optical modules, and to save space, the inlets and outlets of the liquid cooling plates are typically designed to be compact. This results in a very small bending radius for the connecting pipes between adjacent liquid cooling plates. This not only increases the difficulty of installing the connecting pipes, but also increases water flow resistance due to the sharp bend angle, affecting cooling efficiency and even risking damage to the connecting pipes. Utility Model Content

[0004] In view of this, an embodiment of the present invention provides a heat dissipation device and an electronic device, which increases the bending radius and operability of the connecting pipes, reduces the flow resistance, and improves the heat dissipation capacity by connecting the connecting pipes in an interlaced series manner.

[0005] In a first aspect, an embodiment of the present utility model provides a heat dissipation device, wherein the heat dissipation device includes at least one group of heat dissipation modules and a second liquid-cold plate, the first liquid inlet pipe and the first liquid return pipe of the heat dissipation module are connected to the cold distribution unit through the first liquid separator and the second liquid separator to form a first cooling liquid circuit, the second liquid inlet pipe and the second liquid return pipe of the second liquid-cold plate are connected to the cold distribution unit through the first liquid separator and the second liquid separator to form a second cooling liquid circuit, the second cooling liquid circuit is arranged in parallel with the first cooling liquid circuit, the heat dissipation module includes at least two first liquid-cold plates arranged side by side, each first liquid-cold plate includes a liquid-cooling flow channel having a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are arranged on a first side surface of the first liquid-cold plate and are respectively close to the two side edges, and the liquid inlet and the liquid outlet of two adjacent first liquid-cold plates are arranged adjacent to each other;

[0006] Among them, the liquid inlet of the first liquid cooling plate located at one end of the heat dissipation module is connected to the first liquid inlet pipe, and the liquid outlet or liquid inlet of the first liquid cooling plate located at the other end is connected to the first liquid return pipe, and among all the other liquid outlets and liquid inlets, two adjacent liquid outlets and two adjacent liquid inlets are connected in series through connecting pipes.

[0007] Optionally, the heat dissipation module includes an even number of the first liquid cooling plates, and the liquid inlets of the two first liquid cooling plates located at both ends are respectively connected to the first liquid inlet pipe and the first liquid return pipe, and among all the other liquid outlets and liquid inlets, two adjacent liquid outlets and two adjacent liquid inlets are respectively connected in series through the connecting pipes.

[0008] Optionally, the heat dissipation module includes an odd number of the first liquid cooling plates, the liquid inlet of the first liquid cooling plate located at one end is connected to the first liquid inlet pipe, the liquid outlet of the first liquid cooling plate located at the other end is connected to the first liquid return pipe, and among all the other liquid outlets and liquid inlets, two adjacent liquid outlets and two adjacent liquid inlets are connected in series in an alternating manner through the connecting pipes.

[0009] Optionally, the liquid inlet is equipped with a liquid inlet joint, and the liquid outlet is equipped with a liquid outlet joint, and the liquid inlet joint and the liquid outlet joint are respectively connected to the first liquid inlet pipe or the first liquid return pipe or the connecting pipe.

[0010] Optionally, a first connecting block is installed outside the liquid inlet, the first connecting block is provided with a first mounting through-hole, a first guide channel is formed between the first connecting block and the first liquid cooling plate, the first mounting through-hole and the liquid inlet are respectively connected to the openings at both ends of the first guide channel, and the first mounting through-hole and the liquid inlet are staggered and not opposite;

[0011] A second connecting block is installed on the outside of the liquid outlet, and the second connecting block is provided with a second mounting through hole. A second guide channel is formed between the second connecting block and the first liquid cooling plate. The second mounting through hole and the liquid outlet are respectively connected to the openings at both ends of the second guide channel, and the second mounting through hole and the liquid outlet are staggered and not opposite.

[0012] Optionally, the first guide channel and the second guide channel extend in the height direction or in the length direction, the first mounting through hole and the liquid inlet are staggered and not opposite in the height direction or in the length direction, and the second mounting through hole and the liquid outlet are staggered and not opposite in the height direction or in the length direction.

[0013] Optionally, the first guide channel and the second guide channel are L-shaped channels or obliquely extended channels, the first mounting through hole and the liquid inlet are obliquely staggered and not opposite, and the second mounting through hole and the liquid outlet are obliquely staggered and not opposite.

[0014] Optionally, the first liquid cooling plate is provided with a first fluid groove, the first fluid groove is located outside the liquid inlet, and the liquid inlet is connected to one end of the first fluid groove; the first connecting block is provided with a second fluid groove, the second fluid groove is located on one side of the first mounting through hole, and one end of the second fluid groove is connected to the first mounting through hole, and the first fluid groove and the second fluid groove are engaged to form the first guide channel;

[0015] The first liquid cooling plate is provided with a third fluid groove, which is located on the outside of the liquid outlet, and the liquid outlet is connected to one end of the third fluid groove. The second connecting block is provided with a fourth fluid groove, which is located on one side of the second mounting through hole, and one end of the fourth fluid groove is connected to the second mounting through hole. The third fluid groove and the fourth fluid groove are buckled together to form the second guide channel.

[0016] Optionally, the heat dissipation device includes multiple groups of heat dissipation modules arranged side by side, and the first liquid inlet pipes and first liquid return pipes of the multiple groups of heat dissipation modules are respectively connected to the cold distribution unit through the first liquid distributor and the second liquid distributor to form multiple first cooling liquid circuits arranged in parallel.

[0017] Optionally, a main liquid inlet pipe is connected between the first liquid distributor and the cold distribution unit, and a main liquid return pipe is connected between the second liquid distributor and the cold distribution unit.

[0018] In a second aspect, an embodiment of the present invention provides an electronic device, which includes a chassis and a heat dissipation device as described in the first aspect, wherein at least two optical module groups and electronic devices are arranged in the chassis, the first liquid cooling plate is connected to the optical module groups in a one-to-one correspondence, and the second liquid cooling plate is connected to the electronic device.

[0019] Optionally, the electronic device further includes a shielding cage and a radiator snap-fit ​​structure arranged above the shielding cage, the radiator snap-fit ​​structure includes a first snap-fit ​​member and a second snap-fit ​​member that are snap-fitted together to form a accommodating space, the first snap-fit ​​member is snap-fitted to the shielding cage, the first liquid cooling plate is installed in the accommodating space, and the optical module group is installed in the shielding cage.

[0020] The heat dissipation device of the present invention embodiment includes a heat dissipation module and a second liquid cooling plate arranged in parallel with a coolant circuit. The heat dissipation module includes at least two first liquid cooling plates arranged side by side and connected in series. Each first liquid cooling plate includes a liquid cooling channel having a liquid inlet and a liquid outlet. The liquid inlet of the first liquid cooling plate at one end is connected to the first liquid inlet pipe, and the liquid outlet or liquid inlet of the first liquid cooling plate at the other end is connected to the first liquid return pipe. Among all the other liquid outlets and liquid inlets, two adjacent liquid outlets and two adjacent liquid inlets are connected in series via connecting pipes. The staggered series connection between adjacent first liquid cooling plates in the heat dissipation device via connecting pipes increases the bending radius and operability of the connecting pipes, reduces flow resistance, and improves heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0022] Figure 1 This is a schematic diagram of the framework of the heat dissipation device according to an embodiment of the present utility model;

[0023] Figure 2 This is a structural diagram of the connection between the first liquid cooling plate, the liquid inlet joint, and the liquid outlet joint in one embodiment of the present invention;

[0024] Figure 3 This is a structural diagram of the connection between the first liquid cooling plate, the first connecting block and the second connecting block in another embodiment of the present invention;

[0025] Figure 4 It is a structural schematic diagram of a heat dissipation device according to another embodiment of the present invention;

[0026] Figure 5 This is a schematic structural diagram of a first liquid cooling plate according to another embodiment of the present invention;

[0027] Figure 6 This is a structural diagram of a first communication block in another embodiment of the present invention;

[0028] Figure 7 This is a structural diagram of a second communication block in another embodiment of the present invention;

[0029] Figure 8 This is a cross-sectional view of the connection between the first liquid cooling plate, the first connecting block and the second connecting block in another embodiment of the present invention;

[0030] Figure 9 This is a structural diagram of a heat dissipation device according to another embodiment of the present invention;

[0031] Figure 10This is a structural schematic diagram of a first liquid cooling plate according to another embodiment of the present invention;

[0032] Figure 11 This is a structural diagram of a first communication block according to another embodiment of the present invention;

[0033] Figure 12 This is a structural diagram of a second communication block according to another embodiment of the present invention;

[0034] Figure 13 This is a cross-sectional view of the connection between the first liquid cooling plate, the first connecting block and the second connecting block in another embodiment of the present invention;

[0035] Figure 14 It is a structural diagram of an electronic device according to an embodiment of the present utility model.

[0036] Reference numerals:

[0037] 100-heat dissipation module; 1-first liquid cooling plate; 11-liquid inlet; 12-liquid outlet; 13-liquid cooling channel; 14-first fluid groove; 15-third fluid groove; 2-first liquid inlet pipe; 3-first liquid return pipe; 4-connecting pipe; 5-liquid inlet connector; 6-liquid outlet connector; 7-first connecting block; 71-first mounting hole; 72-second fluid groove; 7a-first guide channel; 8-second connecting block; 81-second mounting hole; 82-fourth fluid groove; 8a-second guide channel; 9-first liquid distributor; 10-second liquid distributor; 101-second liquid inlet pipe; 102-second liquid return pipe; 103-main liquid inlet pipe; 104-main liquid return pipe; 105-second liquid cooling plate; 200-cold distribution unit. DETAILED DESCRIPTION

[0038] The present application is described below based on the following embodiments, but the present application is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without the description of these details. To avoid obscuring the essence of the present application, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0039] Furthermore, persons of ordinary skill in the art will appreciate that the figures provided herein are for illustration purposes only and are not necessarily drawn to scale.

[0040] Unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," and the like should be interpreted broadly. For example, they may refer to fixed or detachable connections, or integration; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0041] Unless the context clearly requires otherwise, words like “include”, “comprising” and the like throughout this application should be interpreted as including rather than exclusive or exhaustive; that is, as meaning “including but not limited to”.

[0042] In the description of this application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance. In addition, in the description of this application, unless otherwise specified, "plurality" means two or more.

[0043] Figure 1 Schematic diagram of the heat dissipation device of the embodiment of the present application. Figure 1 As shown, the heat dissipation device includes at least one group of heat dissipation modules 100. Each group of heat dissipation modules 100 includes at least two first liquid cooling plates 1 arranged side by side. All first liquid cooling plates 1 in each group of heat dissipation modules 100 are connected in series. Each first liquid cooling plate 1 includes a liquid cooling channel 13 having a liquid inlet 11 and a liquid outlet 12. The liquid inlet 11 and the liquid outlet 12 are arranged on a first side surface of the first liquid cooling plate 1 and are respectively close to the two side edges. The first side surface refers to the side surface of one side of the first liquid cooling plate 1 along the width direction. Since all the first liquid cooling plates 1 are arranged side by side, the liquid inlets 11 and the liquid outlet 12 in each group of heat dissipation modules 100 are arranged in a staggered order, that is, starting from one side, the order is liquid inlet 11, liquid outlet 12, liquid inlet 11, liquid outlet 12. This ensures that the liquid inlet 11 of one of the adjacent first liquid cooling plates 1 is arranged adjacent to the liquid outlet 12 of another first liquid cooling plate 1, with a relatively short distance between them.

[0044] like Figure 1As shown, the liquid inlet 11 of the first liquid cooling plate 1 at one end of each heat dissipation module 100 is connected to the first liquid inlet pipe 2, and the liquid outlet 12 or liquid inlet 11 of the first liquid cooling plate 1 at the other end is connected to the first liquid return pipe 3. Among all the other liquid outlets 12 and liquid inlets 11 in the heat dissipation module 100, two adjacent liquid outlets 12 and two adjacent liquid inlets 11 are connected in staggered series through connecting pipes 4, that is, staggered hole series. Staggered series connection and staggered hole series connection refer to the presence of a liquid inlet 11 between two liquid outlets 12 (non-adjacent) connected at both ends of the connecting pipe 4 or a liquid outlet 12 between two liquid inlets 11 (non-adjacent). The staggered hole series connection between adjacent first liquid cooling plates 1 in each heat dissipation module 100 can increase the bending radius of the connecting pipe 4, reduce the difficulty of installing the connecting pipe 4 and the first liquid cooling plate 1, reduce flow resistance, and improve the cooling effect.

[0045] The port at which the first liquid cooling plate 1 at the other end is connected to the first liquid return pipe 3 depends on the number of first liquid cooling plates 1 in each heat dissipation module 100. Specifically, when the heat dissipation module 100 includes an even number of first liquid cooling plates 1, the first liquid inlet pipe 2 and the first liquid return pipe 3 are respectively connected to the liquid inlets 11 of the two first liquid cooling plates 1 at the two ends. Among all the other liquid outlets 12 and liquid inlets 11, two adjacent liquid outlets 12 and two adjacent liquid inlets 11 are connected in series via a connecting pipe 4, as shown in FIG. Figure 1 When the heat dissipation module 100 includes an odd number of first liquid cooling plates 1, the liquid inlet 11 of the first liquid cooling plate 1 at one end is connected to the first liquid inlet pipe 2, and the liquid outlet 12 of the first liquid cooling plate 1 at the other end is connected to the first liquid return pipe 3. Among all the other liquid outlets 12 and liquid inlets 11, two adjacent liquid outlets 12 and two adjacent liquid inlets 11 are connected in series via a connecting pipe 4, as shown in FIG. Figure 1 shown.

[0046] In the embodiment of the present application, the heat dissipation device may include multiple groups of heat dissipation modules 100, and the first liquid cooling plates 1 in the multiple groups of heat dissipation modules 100 are connected in series in the above-mentioned staggered manner to form a circuit. Among them, the first liquid inlet pipes 2 and the first liquid return pipes 3 of the multiple groups of heat dissipation modules 100 are connected to the cooling distribution unit 200 through the first liquid distributor 9 and the second liquid distributor 10 respectively to form multiple first cooling liquid circuits arranged in parallel, such as Figure 1 The main liquid inlet pipe 103 is connected between the first liquid distributor 9 and the cooling distribution unit 200, and the main liquid return pipe 104 is connected between the second liquid distributor 10 and the cooling distribution unit 200. Figure 1 shown.

[0047] The first liquid separator 9 and the second liquid separator 10 have multiple liquid inlets and liquid return ports, and the first liquid separator 9 and the second liquid separator 10 are used to divert the coolant to form multiple parallel circuits. The parallel arrangement of multiple first coolant circuits means that in a liquid cooling system, multiple first coolant circuits are independently connected to the same cold distribution unit 200, and each first coolant circuit can be cooled independently without being affected by other circuits, which can effectively improve the heat dissipation efficiency. In an optional embodiment, the main liquid inlet pipe 103 and the main liquid return pipe 104 can be connected to the cold distribution unit 200 respectively through quick connectors. Among them, the quick connector is pluggable and connected to the cold distribution unit 200, making the installation of the heat dissipation device more convenient.

[0048] Among them, the number of first liquid cooling plates 1 in each group of heat dissipation modules 100 can be the same or different, and the number of heat dissipation modules 100 and the number of first liquid cooling plates 1 in each group of heat dissipation modules 100 are determined according to the product specifications of the optical module. In the embodiment of the present application, multiple groups and multiple refer to two or more. Preferably, multiple groups of heat dissipation modules 100 are arranged side by side inside an electronic device. Side-by-side arrangement means arranging them in the same direction inside an electronic device or on a panel to achieve high-density installation and efficient management, which helps to optimize the space utilization inside the device and facilitates subsequent maintenance and upgrades. In addition, multiple groups of heat dissipation modules 100 can also be set in corresponding positions according to specific needs.

[0049] like Figure 1 As shown, the heat dissipation device may further include a second liquid cold plate 105, and the second liquid cold plate 105 may also be connected to the cold distribution unit 200 through the above-mentioned first liquid distributor 9 and the second liquid distributor 10 to form a second coolant circuit. The second coolant circuit is arranged in parallel with the first coolant circuit to improve the heat dissipation efficiency. Specifically, the first liquid distributor 9 is connected to the second liquid cold plate 105 through the second liquid inlet pipe 101, and the second liquid distributor 10 is connected to the second liquid cold plate 105 through the second liquid return pipe 102. The coolant flows out of the cold distribution unit 200 through the main liquid inlet pipe 103 and the first liquid distributor 9, enters the second liquid inlet pipe 101, and flows into the second liquid cold plate 105, then flows out of the second liquid cold plate 105 through the second liquid return pipe 102 to the second liquid distributor 10, and returns to the cold distribution unit 200 through the main liquid return pipe 104.

[0050] In one embodiment, the liquid inlet 11 of the first liquid cooling plate 1 is provided with a liquid inlet connector 5, and the liquid outlet 12 is provided with a liquid outlet connector 6. Figure 2As shown. The liquid inlet connector 5 and the liquid outlet connector 6 are directly connected to the first liquid inlet pipe 2 or the first liquid return pipe 3 or the connecting pipe 4 respectively. The liquid inlet connector 5 and the liquid outlet connector 6 will not change the outflow direction of the coolant. The liquid inlet connector 5 and the liquid outlet connector 6 are used to ensure that the connection between the pipeline and the first liquid cooling plate 1 is both fast and reliable, while preventing leakage and ensuring that the system can operate stably for a long time. Among them, common types of liquid inlet connector 5 and liquid outlet connector 6 include quick plug-in connectors, threaded connectors, ferrule connectors, crimp connectors, and flange connectors. The selection of connectors depends on the type of coolant, working pressure, temperature range, connection frequency, etc. Among them, the second liquid cooling plate 105, the first liquid distributor 9, the second liquid distributor 10, etc. can also be connected to the pipeline through the above-mentioned connectors.

[0051] In another embodiment, a first connecting block 7 is installed outside the liquid inlet 11 of the first liquid cooling plate 1, and a second connecting block 8 is installed at the liquid outlet 12 of the first liquid cooling plate 1. Figure 3 、 Figure 4 and Figure 9 The first connecting block 7 is provided with a first mounting through hole 71, and the second connecting block 8 is provided with a second mounting through hole 81. Figure 3 、 Figure 11 and Figure 12 After the first connecting block 7 is connected to the outside of the liquid inlet 11 of the first liquid cooling plate 1, a first guide channel 7a is formed between the first connecting block 7 and the first liquid cooling plate 1. The first mounting through hole 71 and the liquid inlet 11 are respectively connected to the openings at both ends of the first guide channel 7a, so that the first mounting through hole 71 and the liquid inlet 11 are staggered and not opposite to each other. Figure 8 As shown. Preferably, the first mounting through hole 71 and the liquid inlet 11 are respectively connected vertically to the first guide channel 7a. Among them, the first mounting through hole 71 is connected to the corresponding pipeline, which can be connected by a joint. After the second connecting block 8 is connected to the outside of the liquid outlet 12 of the first liquid cooling plate 1, a second guide channel 8a is formed between the second connecting block 8 and the first liquid cooling plate 1, and the second mounting through hole 81 and the liquid outlet 12 are respectively connected to the two end openings of the second guide channel 8a, so that the second mounting through hole 81 and the liquid outlet 12 are staggered and not opposite, as shown in FIG. Figure 8 As shown. Preferably, the second mounting hole 81 and the liquid outlet 12 are respectively connected vertically to the second guide channel 8a. The second mounting hole 81 is connected to the corresponding pipeline, which can be connected via a joint. The first guide channel 7a and the second guide channel 8a are smooth channels to reduce the flow resistance of the coolant. Their smoothness can be adjusted as required.

[0052] The phrase "the first mounting hole 71 and the liquid inlet 11 are staggered and not opposite to each other" means that the first mounting hole 71 and the liquid inlet 11 can be staggered in the vertical direction (i.e., height direction / up and down) and / or in the horizontal direction (i.e., length direction / left and right) so that they are not opposite to each other. The phrase "the second mounting hole 81 and the liquid outlet 12 are staggered and not opposite to each other" means that the second mounting hole 81 and the liquid outlet 12 can be staggered in the vertical direction (i.e., height direction / up and down) and / or in the horizontal direction (i.e., length direction / left and right) so that they are not opposite to each other.

[0053] In the embodiment of the present application, the first liquid cooling plate 1 is provided with a first fluid groove 14, the first fluid groove 14 is located outside the liquid inlet 11, and the liquid inlet 11 is connected to one end of the first fluid groove 14, the first liquid cooling plate 1 is provided with a third fluid groove 15, the third fluid groove 15 is located outside the liquid outlet 12, and the liquid outlet 12 is connected to one end of the third fluid groove 15, as shown in FIG. Figure 5 and Figure 10 The first connecting block 7 is provided with a second fluid groove 72, which is located on one side of the first mounting through hole 71, and one end of the second fluid groove 72 is connected to the first mounting through hole 71, as shown. Figure 6 and Figure 11 The second connecting block 8 is provided with a fourth fluid groove 82, which is located on one side of the second mounting through hole 81, and one end of the fourth fluid groove 82 is connected to the second mounting through hole 81, as shown. Figure 7 and Figure 12 As shown. The first fluid groove 14 and the second fluid groove 72 are completely symmetrical, and the third fluid groove 15 and the fourth fluid groove 82 are completely symmetrical. After the first connecting block 7, the second connecting block 8 and the first liquid cooling plate 1 are connected, the first fluid groove 14 and the second fluid groove 72 are buckled to form the first guide channel 7a, and the third fluid groove 15 and the fourth fluid groove 82 are buckled to form the second guide channel 8a. Figure 8 and Figure 13 The formation method of the first guide channel 7a and the second guide channel 8a is convenient for processing and operation.

[0054] In one embodiment, the first guide channel 7a and the second guide channel 8a extend in the height direction or in the length direction, so that the first mounting through hole 71 and the liquid inlet 11 are staggered in the height direction or in the length direction (horizontal direction) and are not opposite, and the second mounting through hole 81 and the liquid outlet 12 are staggered in the height direction or in the length direction and are not opposite. Figure 10-12 They are schematic structural diagrams of the first liquid cooling plate, the first connecting block 7, and the second connecting block 8, respectively, wherein the first fluid groove 14, the third fluid groove 15, the second fluid groove 72, and the fourth fluid groove 82 extend in the height direction. Figure 13This is a schematic diagram of the first and second guide channels 7a, 8a extending in the height direction, wherein the first mounting hole 71 and the liquid inlet 11 are staggered in the height direction. The structure of the first and second guide channels 7a, 8a extending in the length direction is not shown, but the arrangement is basically similar to the above-mentioned embodiment. Whether the first mounting hole 71 and the liquid inlet 11, and the second mounting hole 81 and the liquid outlet 12 are staggered in the length direction or in the height direction depends on the space in front of the first liquid cooling plate.

[0055] In another embodiment, the first guide channel 7a and the second guide channel 8a are L-shaped channels or obliquely extending channels. This allows the first mounting hole 71 and the liquid inlet 11 to be diagonally offset, rather than opposite, and the second mounting hole 81 and the liquid outlet 12 to be diagonally offset, rather than opposite. Diagonally offset, rather than opposite, includes diagonally offset upward or diagonally offset downward, meaning that the two are offset in both height and horizontal directions. Diagonally offset, rather than opposite, can meet installation space requirements. Figure 5-Figure 7 They are structural schematic diagrams of the first liquid cooling plate, the first connecting block 7, and the second connecting block 8, respectively, wherein the first fluid groove 14, the third fluid groove 15, the second fluid groove 72, and the fourth fluid groove 82 are L-shaped grooves, and their two ends are staggered in the height direction and the length direction.

[0056] The heat dissipation module in the heat dissipation device of the embodiment of the present application includes at least two first liquid cooling plates arranged side by side and connected in series. The liquid inlet of the first liquid cooling plate at one end is connected to the first liquid inlet pipe, and the liquid outlet or liquid inlet of the first liquid cooling plate at the other end is connected to the first liquid return pipe. Among all the other liquid outlets and liquid inlets, staggered hole connection is achieved between two adjacent liquid outlets and between two adjacent liquid inlets through connecting pipes, thereby increasing the bending radius and operability of the connecting pipes, reducing flow resistance, and improving heat dissipation capacity.

[0057] Figure 14 : This is a schematic diagram of the structure of an electronic device according to an embodiment of the present application. The electronic device includes a chassis and a heat dissipation device according to the above embodiment, wherein an optical module group is disposed within the chassis. Each optical module group may include multiple optical modules. The heat dissipation device may be installed within the chassis to dissipate heat and cool the heat-generating components within the chassis. The number of first liquid cooling plates 1 in the heat dissipation device is the same as the number of optical module groups, and a first liquid cooling plate 1 is connected above each optical module group to improve heat dissipation capacity through liquid cooling.

[0058] In a specific embodiment, a plurality of optical module groups can be arranged side by side at one end of a chassis, and a corresponding plurality of first liquid cooling plates can be installed side by side above the corresponding optical module groups, which can maximize the utilization of chassis space and at the same time minimize the temperature inside the chassis. Each optical module group is installed side by side in a corresponding shielding cage, and the first liquid cooling plate 1 is connected to the top of the shielding cage through a radiator snap-fit ​​structure, thereby dissipating heat and cooling the optical modules in the shielding cage. The radiator snap-fit ​​structure includes a first snap-fit ​​part and a second snap-fit ​​part that snap together to form an accommodating space. The first snap-fit ​​part can also be snap-fitted with the shielding cage. The first liquid cooling plate 1 is installed in the accommodating space to form a whole, which is easy to disassemble and install.

[0059] The chassis is also equipped with electronic devices such as processors, chips, and circuit boards. The second liquid cooling plate 105 in the heat dissipation device is connected to the electronic devices and is used to dissipate heat and cool the electronic devices. In the present application, the chassis is configured as an upper and lower two-layer structure through a partition, wherein the heat dissipation device can be arranged in the upper layer, making the heat dissipation device smaller and thinner, and can be more easily installed in electronic equipment with a high density of electronic devices, making the electronic equipment as a whole thinner and smaller. The lower space of the chassis can be provided with a fan lamp heat dissipation structure to dissipate heat for other electronic devices in the chassis.

[0060] In the heat dissipation device of the electronic device in the embodiment of the present application, adjacent first liquid cooling plates are connected in series through staggered holes of connecting pipes, which increases the bending radius and operability of the connecting pipes, reduces flow resistance, and improves heat dissipation capacity.

[0061] The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application. Persons skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application are intended to be within the scope of protection of the present application.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device comprises at least one group of heat dissipation modules (100) and a second liquid cooling plate (105); a first liquid inlet pipe (2) and a first liquid return pipe (3) of the heat dissipation module (100) are connected to a cooling distribution unit (200) via a first liquid distributor (9) and a second liquid distributor (10) to form a first cooling liquid circuit; a second liquid inlet pipe (101) and a second liquid return pipe (102) of the second liquid cooling plate (105) are connected to the cooling distribution unit (200) via the first liquid distributor (9) and the second liquid distributor (10) to form a second cooling liquid circuit; the second cooling liquid circuit is arranged in parallel with the first cooling liquid circuit; The heat dissipation module (100) comprises at least two first liquid cooling plates (1) arranged side by side, each first liquid cooling plate (1) comprising a liquid cooling channel (13) having a liquid inlet (11) and a liquid outlet (12), the liquid inlet (11) and the liquid outlet (12) being arranged on a first side surface of the first liquid cooling plate (1) and close to two side edges, respectively, and the liquid inlet (11) and the liquid outlet (12) of two adjacent first liquid cooling plates (1) being arranged adjacent to each other; The liquid inlet (11) of the first liquid cooling plate (1) at one end of the heat dissipation module (100) is connected to the first liquid inlet pipe (2), and the liquid outlet (12) or liquid inlet (11) of the first liquid cooling plate (1) at the other end is connected to the first liquid return pipe (3). Among all the other liquid outlets (12) and liquid inlets (11), two adjacent liquid outlets (12) and two adjacent liquid inlets (11) are connected in series via connecting pipes (4).

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation module (100) comprises an even number of the first liquid cooling plates (1), the liquid inlets (11) of the two first liquid cooling plates (1) located at both ends are respectively connected to the first liquid inlet pipe (2) and the first liquid return pipe (3), and all the other liquid outlets (12) and the liquid inlets (11) are connected in series via the connecting pipes (4) between two adjacent liquid outlets (12) and between two adjacent liquid inlets (11).

3. The heat dissipation device according to claim 1, wherein: The heat dissipation module (100) comprises an odd number of the first liquid cooling plates (1), wherein the liquid inlet (11) of the first liquid cooling plate (1) at one end is connected to the first liquid inlet pipe (2), and the liquid outlet (12) of the first liquid cooling plate (1) at the other end is connected to the first liquid return pipe (3), and among all the other liquid outlets (12) and the liquid inlets (11), two adjacent liquid outlets (12) and two adjacent liquid inlets (11) are connected in series via the connecting pipes (4).

4. The heat dissipation device according to any one of claims 1 to 3, characterized in that: The liquid inlet (11) is equipped with a liquid inlet joint (5), and the liquid outlet (12) is equipped with a liquid outlet joint (6). The liquid inlet joint (5) and the liquid outlet joint (6) are respectively connected to the first liquid inlet pipe (2) or the first liquid return pipe (3) or the connecting pipe (4).

5. The heat dissipation device according to any one of claims 1 to 3, characterized in that: A first connecting block (7) is installed outside the liquid inlet (11), the first connecting block (7) is provided with a first mounting through hole (71), a first guide channel (7a) is formed between the first connecting block (7) and the first liquid cooling plate (1), the first mounting through hole (71) and the liquid inlet (11) are respectively connected to the openings at both ends of the first guide channel (7a), and the first mounting through hole (71) and the liquid inlet (11) are staggered and not opposite; A second connecting block (8) is installed outside the liquid outlet (12), the second connecting block (8) is provided with a second mounting through hole (81), a second guide channel (8a) is formed between the second connecting block (8) and the first liquid cooling plate (1), the second mounting through hole (81) and the liquid outlet (12) are respectively connected to the openings at both ends of the second guide channel (8a), and the second mounting through hole (81) and the liquid outlet (12) are staggered and not opposite.

6. The heat dissipation device according to claim 5, characterized in that: The first guide channel (7a) and the second guide channel (8a) extend in the height direction or in the length direction, the first mounting through hole (71) and the liquid inlet (11) are staggered and not opposite in the height direction or in the length direction, and the second mounting through hole (81) and the liquid outlet (12) are staggered and not opposite in the height direction or in the length direction.

7. The heat dissipation device according to claim 5, characterized in that: The first guide channel (7a) and the second guide channel (8a) are L-shaped channels or obliquely extending channels; the first mounting through hole (71) and the liquid inlet (11) are obliquely staggered and not opposite; and the second mounting through hole (81) and the liquid outlet (12) are obliquely staggered and not opposite.

8. The heat dissipation device according to claim 5, characterized in that: The first liquid cooling plate (1) is provided with a first fluid groove (14), the first fluid groove (14) is located outside the liquid inlet (11), and the liquid inlet (11) is connected to one end of the first fluid groove (14), the first connecting block (7) is provided with a second fluid groove (72), the second fluid groove (72) is located on one side of the first mounting through hole (71), and one end of the second fluid groove (72) is connected to the first mounting through hole (71), and the first fluid groove (14) and the second fluid groove (72) are buckled to form the first guide channel (7a); The first liquid cooling plate (1) is provided with a third fluid groove (15), the third fluid groove (15) is located outside the liquid outlet (12), and the liquid outlet (12) is connected to one end of the third fluid groove (15), the second connecting block (8) is provided with a fourth fluid groove (82), the fourth fluid groove (82) is located on one side of the second mounting through hole (81), and one end of the fourth fluid groove (82) is connected to the second mounting through hole (81), and the third fluid groove (15) and the fourth fluid groove (82) are engaged to form the second guide channel (8a).

9. The heat dissipation device according to claim 1, wherein: The heat dissipation device comprises a plurality of groups of heat dissipation modules (100) arranged side by side, wherein the first liquid inlet pipes (2) and the first liquid return pipes (3) of the plurality of heat dissipation modules (100) are respectively connected to the cooling distribution unit (200) through a first liquid distributor (9) and a second liquid distributor (10) to form a plurality of first cooling liquid circuits arranged in parallel.

10. The heat dissipation device according to claim 1, wherein: A main liquid inlet pipe (103) is connected between the first liquid distributor (9) and the cold distribution unit (200), and a main liquid return pipe (104) is connected between the second liquid distributor (10) and the cold distribution unit (200).

11. An electronic device, characterized in that: The electronic device comprises a chassis and a heat dissipation device as described in any one of claims 1 to 10, wherein at least two optical module groups and electronic devices are arranged in the chassis, the first liquid cooling plate (1) is connected to the optical module groups in a one-to-one correspondence, and the second liquid cooling plate (105) is connected to the electronic devices.

12. The electronic device according to claim 11, wherein: The electronic device further comprises a shielding cage and a heat sink fastening structure arranged above the shielding cage, the heat sink fastening structure comprising a first fastening member and a second fastening member which are fastened together to form an accommodation space, the first fastening member being engaged with the shielding cage, the first liquid cooling plate (1) being installed in the accommodation space, and the optical module group being installed in the shielding cage.

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