Liquid cooling heat dissipation assembly and electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of heat dissipation, and discloses a liquid cooling heat dissipation assembly and electronic equipment, the liquid cooling heat dissipation assembly comprises a base body and a flow guide part, the base body is provided with a groove, the flow guide part is arranged in the groove and seals a notch of the groove, the flow guide part is provided with multiple layers of flow channels, the multiple layers of flow channels are arranged in the depth direction of the groove, and the flow guide part is arranged in the groove. The cooling liquid in the groove flows into the first-layer flow channel from the input end of the first-layer flow channel and takes away heat of the first heating device, so that the temperature of the cooling liquid at the output end of the first-layer flow channel is higher than that of the cooling liquid at the input end of the first-layer flow channel; and when the cooling liquid flows in the next-layer flow channel, heat transfer is carried out between the cooling liquid and the cooling liquid located in the first-layer flow channel currently, so that the temperature difference of the cooling liquid in the first-layer flow channel is reduced, and the output end of the tail-layer flow channel is used for outputting the cooling liquid to the groove. Through the mode, heat dissipation of the first heating device is more uniform, and the overall heat dissipation effect of the electronic equipment is better.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of heat dissipation technology, and more particularly to a liquid cooling heat dissipation component and an electronic device. Background Art

[0002] As the power of power modules in electronic devices continues to increase, the heat generated by power modules is increasing. Conventional air cooling methods are no longer able to meet the heat dissipation requirements of power modules. Since liquid cooling has better heat dissipation efficiency than air cooling, it is becoming increasingly widely used in power module heat dissipation design.

[0003] The main body of an existing liquid-cooled radiator is generally a rectangular parallelepiped structure. After being attached to a power module on a circuit board, it removes heat from the power module through the coolant flowing inside. However, a power module on a circuit board typically includes multiple electronic components. When the coolant transfers heat to the previous electronic component, the coolant temperature rises. The temperature difference between the increased coolant temperature and the next electronic component decreases, which reduces the heat transfer rate between the coolant and the next electronic component. This results in different heat transfer rates between the electronic components and the coolant in the power module. In other words, some electronic components dissipate heat faster, while others dissipate heat slower, which in turn affects the overall heat dissipation of the power module. Utility Model Content

[0004] In view of the above problems, the embodiments of the present application provide a liquid cooling heat dissipation assembly and an electronic device for solving the problem that the different heat transfer rates between electronic components and coolant affect the overall heat dissipation effect of the power module.

[0005] According to one aspect of an embodiment of the present application, a liquid cooling heat dissipation component is provided, which includes: a base body and a guide member; a groove is provided on the base body, and the groove is used for cooling liquid to flow through; the guide member is arranged in the groove and the notch of the groove is closed, and the side of the guide member facing away from the base body is used to fit with the first heating device on the circuit board, and the guide member is provided with a multi-layer flow channel, and the multi-layer flow channels are arranged along the depth direction of the groove; in the multi-layer flow channel, the input end of the first layer flow channel and the output end of the tail layer flow channel are respectively connected to the internal space of the groove, so that the cooling liquid entering the groove flows out from the first layer flow channel. The input end of the channel flows into the first-layer channel and takes away the heat of the first heating device through the wall of the guide member. The coolant enters the next-layer channel through the output end of the first-layer channel. When the coolant enters the next-layer channel and flows in the next-layer channel, heat is transferred with the coolant currently in the first-layer channel through the wall between the first-layer channel and the next-layer channel, so that the temperature difference between the coolant at the input end of the first-layer channel and the coolant at the output end of the first-layer channel is reduced. The output end of the tail-layer channel is used for the coolant to flow back and forth between the multi-layer channels along the extension direction of the guide member and then be output to the groove.

[0006] In an optional manner, a heat dissipation portion is provided inside each layer of the multi-layer flow channel, and the heat dissipation portion is provided along the extension direction of the flow channel.

[0007] In an optional embodiment, the guide member also includes a baffle, the multi-layer flow channel runs through the guide member, and the baffle covers between the output end of the previous layer of flow channel and the input end of the next layer of flow channel in the multi-layer flow channel, so that the coolant output from the output end of the previous layer of flow channel enters the next layer of flow channel from the input end of the next layer of flow channel under the obstruction of the baffle.

[0008] In an optional manner, a through hole is opened on the baffle, and the through hole is used for a fastener to pass through and be fixedly connected to the guide member, so as to fix the baffle and the guide member.

[0009] In an optional manner, a heat dissipation surface is formed on a side of the base facing the guide member at positions other than the groove, and the heat dissipation surface is used to fit with at least part of the other heating components on the circuit board except the first heating component; a heat dissipation channel is provided on a side of the base facing away from the guide member, and the input end of the heat dissipation channel is connected to the groove, so that when the coolant flowing out of the groove flows through the heat dissipation channel, the heat of at least part of the other heating components is taken away through the heat dissipation surface.

[0010] In an optional manner, the coolant in the groove enters the groove from one end of the groove and is output to the heat dissipation channel from the opposite other end. The guide member fits against the bottom of the groove, and the number of layers of the multi-layer flow channel is an odd number, so that the multi-layer flow channel transports the coolant from one end of the groove to the other end of the groove.

[0011] In an optional manner, a first positioning portion is provided on the guide member, and a second positioning portion is provided at the notch of the groove. The second positioning portion is used to cooperate with the first positioning portion and limit the angle at which the guide member enters the groove, so that the input end of the first layer of the flow channel in the multi-layer flow channel is oriented toward the end where the coolant enters the groove after the guide member enters the groove.

[0012] In an optional embodiment, the height of the first heating device is lower than the height of at least some of the other heating devices; a boss is provided on one side of the base, and a groove is opened on the boss so that the guide member fits with the first heating device when the heat dissipation surface fits with at least some of the other heating devices; the thickness of the bottom wall of the groove is equal to the thickness of the base.

[0013] In an optional manner, the base body is surrounded on all sides facing the air guide member to form a limiting wall, and a heat dissipation cavity is formed inside the limiting wall. The heat dissipation cavity is used to accommodate the circuit board.

[0014] According to another aspect of an embodiment of the present application, an electronic device is provided, comprising: a circuit board and a liquid-cooled heat dissipation assembly as described above, wherein a first heating device is provided on the circuit board, and the liquid-cooled heat dissipation assembly is used to be bonded to the first heating device for heat dissipation.

[0015] In the embodiment of the present application, a groove is provided on the base, and a guide member provided with a multi-layer flow channel is provided in the groove, so that the coolant flowing in the groove enters the flow channel of the guide member and flows through the wall of the guide member to take away the heat generated by the first heating device, so that the first heating device can obtain efficient heat dissipation. In addition, the multi-layer flow channel in the guide member is serpentine, so that the coolant in the first layer of flow channel can enter the next layer of flow channel after absorbing the heat of the first heating device, and exchange heat with the coolant currently located in the first layer of flow channel through the wall between the next layer of flow channel and the first layer of flow channel, so that the temperature difference between the coolant at the input end of the first layer of flow channel and the coolant at the output end of the first layer of flow channel is reduced, thereby enabling the first heating device that is in contact with the guide member to obtain more uniform heat dissipation, avoiding a large temperature difference between the circuit board and the first heating device, and improving the stability of the electronic device.

[0016] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0018] Figure 1 A perspective view of a liquid cooling and heat dissipation assembly provided by a novel embodiment of this experiment is shown;

[0019] Figure 2 A three-dimensional diagram of the base body of the liquid cooling and heat dissipation assembly provided by the novel embodiment of this experiment is shown;

[0020] Figure 3 A schematic cross-sectional structure diagram of some components of the electronic device provided by the novel embodiment of this experiment along the extension direction of the flow guide is shown;

[0021] Figure 4 A schematic diagram of the exploded structure of some components of the electronic device provided by the novel embodiment of the present invention is shown;

[0022] Figure 5A schematic diagram of the exploded structure of some components of the electronic device provided by the novel embodiment of this experiment is shown from another perspective;

[0023] Figure 6 A schematic diagram of the cross-sectional structure of some components of the electronic device provided by the novel embodiment of this experiment along the width direction of the flow guide is shown;

[0024] Figure 7 A partial exploded view of a flow guide in a liquid cooling and heat dissipation assembly provided by a novel embodiment of this experiment is shown;

[0025] Figure 8 A three-dimensional view of the base body of the liquid cooling and heat dissipation assembly provided by the novel embodiment of this experiment is shown from another angle;

[0026] Figure 9 A three-dimensional diagram of some components of an electronic device provided by a novel embodiment of this experiment is shown.

[0027] The accompanying drawings in the specific implementation manner are as follows:

[0028] 100. Liquid cooling component; 200. Circuit board;

[0029] 110, base; 120, flow guide; 130, liquid inlet; 140, liquid outlet; 150, cover plate;

[0030] 111, groove; 112, heat dissipation surface; 113, heat dissipation channel; 114, boss; 115, heightening groove; 116, limiting wall; 117, heat dissipation cavity;

[0031] 1111, notch; 1112, second positioning portion; 1113, mounting portion;

[0032] 1131, channel;

[0033] 121, flow channel; 122, heat dissipation portion; 123, baffle; 124, guide groove; 125, fastener; 126, fixing hole; 127, first positioning portion;

[0034] 1211, first layer flow channel; 1212, tail layer flow channel;

[0035] 1231, through hole;

[0036] 210. First heating device; 220. Other heating devices. DETAILED DESCRIPTION

[0037] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0039] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0040] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0041] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0042] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0043] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0044] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0045] In electronic devices, corresponding functions are achieved by integrating electronic devices and circuit structures on circuit boards. The base of the liquid-cooled radiator is generally attached to the heating device on the circuit board. The heat emitted by the heating device is first transferred to the base, and then the heat on the base is taken away by the coolant flowing in the flow channel inside the base, thereby achieving cooling and heat dissipation of the heating device.

[0046] However, when the heat output of the heat generating device being heat-transferred by the coolant is close to that of the heat generating device, the coolant's temperature directly affects its cooling capacity. Coolant with a lower temperature can absorb more heat from the heat generating device, while coolant with a higher temperature can only absorb a smaller amount of heat from the heat generating device. As the coolant transfers heat with the heat generating device, its temperature continues to rise, causing the coolant at the flow channel outlet to be higher than that at the flow channel inlet. This allows the coolant at the flow channel inlet to absorb more heat, while the coolant at the flow channel outlet can only absorb a smaller amount of heat.

[0047] On the basis of the above, if the volume of the heating device attached to the liquid-cooled radiator is relatively large and the heat generated at each position of the heating device is similar, a large temperature difference will occur between the position near the flow channel inlet and the position near the flow channel outlet on the heating device, thereby causing the material of the heating device to creep and causing changes in the internal stress of the heating device, resulting in damage such as material breakage or small cracks in the heating device, and even causing the heating device to fail. In addition, if there are multiple heating devices attached to the liquid-cooled radiator on the circuit board, and they are all the same devices or the heat generated by them is similar, a large temperature difference will occur between the heating device near the flow channel inlet and the heating device near the flow channel outlet, thereby causing a large temperature difference at different positions on the circuit board, which will cause uneven expansion of the circuit board, thereby causing seesaw, affecting the use of electronic components on the circuit board, and the coolant at the flow channel outlet can absorb less heat, which will also cause the heating device located at the flow channel outlet to not be effectively dissipated, affecting the overall heat dissipation effect of the electronic equipment.

[0048] Based on this, the embodiment of the present application proposes a liquid-cooled heat dissipation component. By setting a groove on the base (that is, the main body of the liquid-cooled heat dissipation component) and setting a guide member with multiple flow channels in the groove, the guide member can be in close contact with the heating device, so that the coolant flowing in the groove enters the flow channel on the guide member and takes away the heat of the heating device through the wall of the guide member when flowing in the flow channel. In addition, the multiple flow channels in the guide member are arranged along the depth direction of the groove and are serpentine-shaped, so that the coolant can flow back and forth between the multiple flow channels along the extension direction of the guide member, and the coolant in each flow channel will transfer heat to each other during the flow process, the temperature difference of the coolant in the guide member is reduced, and the heat that can be absorbed by the coolant at each position in the guide member is similar, so that the heating device on the circuit board that is in contact with the guide member can dissipate heat evenly, which can not only improve the overall heat dissipation effect of the electronic device, but also effectively reduce the temperature difference at different positions of the circuit board or the heating device, making the electronic device more stable.

[0049] Specifically, the coolant enters the first-layer channel from its input end within the multi-layer channel. As it flows through the first-layer channel, it removes heat from the heat-generating components through the walls of the flow guide, causing the temperature of the coolant at the output end of the first-layer channel to be higher than that at the input end. The coolant then enters the next-layer channel from its output end and, as it flows through the next-layer channel, transfers heat with the coolant currently within the first-layer channel. The heat transfer rate of the coolant at the input end of the first-layer channel is higher than that of the coolant at the output end, reducing the temperature difference between the coolant at the input end and the coolant at the output end. This also reduces the difference in the amount of heat that can be absorbed by the coolant at each location within the first-layer channel.

[0050] See also Figures 1 to 3 , Figure 1 FIG2 shows a three-dimensional diagram of a liquid cooling heat dissipation assembly provided by a novel embodiment of the present invention. Figure 2 A three-dimensional diagram of the base body of the liquid cooling heat dissipation assembly provided by the novel embodiment of this experiment is shown. Figure 3 A schematic diagram of the cross-sectional structure of some components of the electronic device provided by the new experimental embodiment along the extension direction of the guide member is shown.

[0051] like Figure 1 and Figure 2 As shown, the liquid cooling heat dissipation assembly 100 includes a base 110 and a guide 120. The base 110 is provided with a groove 111 for the coolant to flow through. The guide 120 is disposed in the groove 111 and closes the notch 1111 of the groove 111.

[0052] like Figure 3As shown in the cross-sectional structure in , the side of the guide member 120 facing away from the base 110 is used to fit with the first heating device 210 on the circuit board 200, and the guide member 120 is provided with a multi-layer flow channel 121, and the multi-layer flow channel 121 is arranged along the depth direction of the groove 111. In the multi-layer flow channel 121, the input end of the first layer flow channel 1211 and the output end of the tail layer flow channel 1212 are respectively connected to the internal space of the groove 111, so that the coolant entering the groove 111 flows into the first layer flow channel 1211 from the input end, and takes away the heat of the first heating device 210 through the wall of the guide member 120, so that the temperature of the coolant at the output end of the first layer flow channel 1211 is higher than the temperature of the coolant at the input end of the first layer flow channel 1211, and the coolant enters the next layer flow channel (i.e. Figure 3 M flow channel in the).

[0053] like Figure 3 As shown, when the coolant entering the next layer of flow channels flows within the next layer of flow channels, heat is transferred to the coolant currently in the first layer of flow channels 1211 through the wall between the first layer of flow channels 1211 and the next layer of flow channels. The heat transfer rate of the coolant at the input end of the first layer of flow channels 1211 is higher than the heat transfer rate of the coolant at the output end of the first layer of flow channels 1211, thereby reducing the temperature difference between the coolant at the input end of the first layer of flow channels 1211 and the coolant at the output end of the first layer of flow channels 1211. The output end of the tail layer of flow channels 1212 is used for the coolant to flow back and forth between the multi-layer flow channels 121 along the extension direction of the guide member 120, and then output to the groove 111.

[0054] The circuit board 200 can be placed upright or inverted, and the heat generated by the first heating device 210 during operation of the guide member 120 can be first transferred to the guide member 120 by attaching the guide member 120 in the groove 111 to the first heating device 210 on the circuit board 200. The circuit board 200 is shown in an inverted manner in the accompanying drawings. The coolant in the first layer of flow channel 1211 in the multi-layer flow channel 121 on the guide member 120 transfers heat with the guide member 120 during the flow process, so that the heat on the guide member 120 is transferred to the coolant and carried away by the coolant, thereby achieving cooling and heat dissipation of the first heating device 210 on the circuit board 200.

[0055] In addition, if Figure 3As shown, the multi-layer flow channels 121 provided on the guide member 120 are arranged along the direction indicated by the double arrow Z in the figure and are serpentine-shaped. The coolant flows in the flow channel 121 along the direction indicated by the dotted arrow, and flows back and forth between the multi-layer flow channels 121 along the direction indicated by the double arrow X, that is, after the coolant enters the first-layer flow channel 1211 from the input end A of the first-layer flow channel, it flows back and forth in a Z shape between the multi-layer flow channels 121, so that the coolant after absorbing heat in the first-layer flow channel 1211 will enter the next-layer flow channel from the output end of the first-layer flow channel 1211, and transfers heat with the coolant currently located in the first-layer flow channel 1211 during the flow in the next-layer flow channel.

[0056] Since the coolant at the input end of the first-layer flow channel 1211 has not yet transferred heat with the first heating device 210, the temperature of the coolant is relatively low, which will cause a large temperature difference between the coolant in the next-layer flow channel and the coolant currently located at the input end of the first-layer flow channel 1211. The temperature of the coolant at the output end of the first-layer flow channel 1211 will rise after absorbing the heat of the first heating device 210, making the temperature difference between the coolant in the next-layer flow channel and the coolant at the output end of the first-layer flow channel 1211 relatively small. The temperature difference is the driving force of heat transfer, which determines the speed at which heat is transferred from one object to another. The greater the temperature difference, the faster the heat transfer rate. Therefore, the heat exchange rate of the coolant at the input end of the first-layer flow channel 1211 will be higher than the heat exchange rate of the coolant at the output end of the first-layer flow channel 1211.

[0057] In this way, the temperature difference between the coolant at the input end of the first-layer flow channel 1211 and the coolant at the output end of the first-layer flow channel 1211 can be reduced, thereby reducing the difference in heat that can be absorbed by the coolant at each position in the first-layer flow channel 1211. The first heating device 210 that is in contact with the guide member 120 can dissipate heat evenly, avoiding a large temperature difference between the circuit board 200 and the first heating device 210.

[0058] Among them, such as Figure 3 As shown, the channel 121 closest to the first heating device 210 in the multi-layer channel 121 is the first-layer channel 1211, the channel 121 farthest from the first heating device 210 is the tail-layer channel 1212, and the channel 121 adjacent to the first-layer channel 1211 is the next-layer channel of the first-layer channel 1211. In the embodiment of the present application, as an example, the guide member 120 is provided with three layers of channels 121, as shown in FIG. Figure 3 As shown, after the guide member 120 is arranged in the groove 111, among the multi-layer flow channels 121, the flow channel 121 located at the groove mouth is the first-layer flow channel 1211, the flow channel 121 located at the bottom of the groove is the tail-layer flow channel 1212, and the flow channel 121 of the middle layer (i.e., the M flow channel) is the next layer of flow channel of the first-layer flow channel 1211.

[0059] Specifically, after the coolant enters the first-layer flow channel 1211 from the input end A of the first-layer flow channel 1211, it absorbs the heat of the first heating device 210 while flowing along the direction indicated by the dotted arrow to the output end B of the first-layer flow channel 1211 and outputs from the output end B to the input end C of the M flow channel; then, the coolant enters the M flow channel from the input end C of the M flow channel, and flows along the direction indicated by the dotted arrow to the output end D of the M flow channel, and then outputs from the output end D of the M flow channel to the input end E of the tail-layer flow channel 1212; finally, after the coolant enters the tail-layer flow channel 1212 from the input end E of the tail-layer flow channel 1212, it flows along the direction indicated by the dotted arrow to the output end F of the tail-layer flow channel 1212, and then outputs from the output end F of the tail-layer flow channel 1212 to the groove 111.

[0060] In some embodiments of the present application, a method for installing the liquid cooling heat dissipation assembly 100 when the circuit board 200 is inverted is provided. Figure 4 and Figure 5 , Figure 4 The following is a schematic diagram of the exploded structure of some components of the electronic device provided by the new embodiment of the experiment, Figure 5 A schematic diagram of the exploded structure of some components in the electronic device provided by the new embodiment of this experiment is shown from another perspective. As shown in the figure, a groove 111 is provided on the upward side of the base 110, and the guide member 120 is placed downwardly into the groove 111. The upward side of the guide member 120 is used to fit with the first heating device 210 inverted on the circuit board 200.

[0061] The base 110 is provided with a liquid inlet 130 and a liquid outlet 140, which are respectively used to connect to the coolant input pipe and the coolant output pipe in the electronic device to realize the input and output of the coolant in the base 110, and the coolant will flow through the groove 111 when flowing in the base 110.

[0062] Specifically, when only the groove 111 is provided on the base 110, the liquid inlet 130 and the liquid outlet 140 can be disposed on the sidewalls of the groove 111, so that the coolant directly enters the groove 111 from the liquid inlet 130 and is directly discharged from the liquid outlet 140 on the groove 111. When the base 110 has other heat dissipation channels in addition to the groove 111, after the groove 111 is connected to the other heat dissipation channels, the liquid inlet 130 and the liquid outlet 140 only need to be connected directly or indirectly to the groove 111 to allow the coolant to flow within the groove 111. Furthermore, when the first heating device 210 is a device with relatively high heat generation, such as a power module or a magnetic element, these devices require higher heat dissipation. The liquid inlet 130 can be set on the side wall of the groove 111, so that the coolant with lower temperature that just enters the base 110 from the liquid inlet 130 can enter the groove 111 at the first time and contact the guide member 120 to take away more heat from the guide member 120, thereby achieving more efficient heat dissipation for the first heating device 210.

[0063] To prevent the coolant in the groove 111 from leaking and affecting the circuit board, after the guide 120 is installed in the groove 111, the notch 1111 of the groove 111 needs to be sealed. The guide 120 and the base 110 can be sealed by welding, filling with sealant or adhesive, interposing a gasket or sealing ring, etc. In the embodiment of the present application, as an example, the guide 120 and the base 110 can be fixedly connected by welding. Specifically, after the guide 120 is placed in the groove 111, the side of the guide 120 is welded to the surface at the notch 1111.

[0064] The liquid-cooled heat dissipation assembly 100 provided in the above embodiment is configured by setting a groove 111 on the base 110, and setting a flow guide 120 provided with a multi-layer flow channel 121 in the groove 111, so that the cooling liquid flowing in the groove 111 enters the flow channel 121 of the flow guide 120 and flows through the wall of the flow guide 120 to carry away the heat generated by the first heating device 210, so that the first heating device 210 can obtain efficient heat dissipation. In addition, the multi-layer flow channel 121 in the guide member 120 is serpentine-shaped, so that the coolant in the first-layer flow channel 1211 can enter the next-layer flow channel after absorbing the heat of the first heating device 210, and exchange heat with the coolant currently located in the first-layer flow channel 1211 through the wall between the next-layer flow channel and the first-layer flow channel 1211, so that the temperature difference between the coolant at the input end of the first-layer flow channel 1211 and the coolant at the output end of the first-layer flow channel 1211 is reduced, thereby enabling the first heating device 210 that is in contact with the guide member 120 to obtain more uniform heat dissipation, avoiding a large temperature difference between the circuit board 200 and the first heating device 210, and improving the stability of the electronic device.

[0065] In order to dissipate heat more fully and efficiently for the first heating element 210, the present application further proposes an implementation method. Figure 6 and Figure 7 , Figure 6 The figure shows a schematic cross-sectional structure diagram of some components of the electronic device provided by the new embodiment of the present invention along the width direction of the guide member. Figure 7 A partial exploded view of the guide member in the liquid cooling heat dissipation assembly provided by the new embodiment of the present experiment is shown. As shown in the figure, a heat dissipation portion 122 is provided inside each layer of the multi-layer flow channel 121, and the heat dissipation portion 122 is provided along the extension direction of the flow channel 121 (the direction indicated by the double arrow X in the figure).

[0066] Specifically, the heat dissipation portion 122 and the guide member 120 can be an integrated structure, and the flow channel 121 can be divided into multiple channels with smaller diameters, so that the heat of the first heating device 210 can be quickly transferred to the wall of the guide member 120 and the heat dissipation portion 122, and the coolant can better flow through the channels between adjacent heat dissipation portions 122, thereby making sufficient contact and heat transfer with the surface of the heat dissipation portion 122.

[0067] The heat dissipation portion 122 increases the contact area between the coolant and the guide member 120, allowing the coolant to more fully absorb the heat from the guide member 120 and improve the heat dissipation efficiency of the first heating element 210. Furthermore, by arranging the heat dissipation portion 122 along the extension direction of the guide member 120, the heat dissipation portion 122 can also guide the flow of the coolant to a certain extent, thereby accelerating the flow rate of the coolant in the flow channel 121 and further improving the heat dissipation efficiency.

[0068] For ease of processing, the flow guide 120 is typically produced using injection molding. However, when the multi-layer flow channel 121 has more than two layers, to control the serpentine flow of the coolant in the flow channel 121, the ends of the middle flow channel 121 are sealed so that they do not communicate with the groove 111, and only communicate with each other within the flow guide 120. This makes it difficult to remove the mold used to form the flow channel 121 from the flow guide 120 after injection molding the flow guide 120. Therefore, to facilitate the processing of the flow guide 120, the flow channel 121 can be passed through the flow guide 120, and then by abutting the ends of the flow guide 120 against the sidewalls of the groove 111, the coolant in the previous layer of flow channel 121 is blocked by the sidewalls of the groove 111 when it flows to the ends of the flow channel 121, and enters the next layer of flow channel 121.

[0069] However, when the guide member 120 abuts against the side wall of the groove 111, friction will be generated on the guide member 120. When installing or removing the guide member 120, the friction will hinder the movement of the guide member 120 in the groove 111. Therefore, in order to make the installation of the guide member 120 more convenient, the present application further proposes an embodiment, see Figure 3 and Figure 7 The guide member 120 also includes a baffle 123. The multi-layer flow channel 121 passes through the guide member 120. The baffle 123 covers between the output end of the previous layer of flow channel 121 and the input end of the next layer of flow channel 121 in the multi-layer flow channel 121, so that the coolant output from the output end of the previous layer of flow channel 121 enters the next layer of flow channel 121 from the input end of the next layer of flow channel 121 under the obstruction of the baffle 123.

[0070] The baffle 123 can be fixedly connected to the guide member 120 by screw fastening, laser welding, brazing, glue bonding, etc. In the embodiment of the present application, as an example, Figure 7 As shown, the positions where the output end of the previous layer of flow channel 121 and the input end of the next layer of flow channel 121 on the guide member 120 are located will be recessed inside the guide member 120 to form a guide groove 124. After the baffle 123 is connected to the guide member 120, the groove mask of the guide groove 124 will be covered, so that the flow channels 121 are interconnected through the guide groove 124. At the same time, the baffle 123 can also prevent the coolant in the flow channel 121 from flowing to the outside of the flow guide member 120.

[0071] Specifically, if Figure 3 As shown, when the coolant in the first-layer flow channel 1211 flows to the output end B, it is blocked by the baffle 123 and cannot continue to flow forward. Instead, it changes its flow direction in the guide groove 124 and enters the M flow channel from the input end C of the M flow channel. Similarly, when the coolant in the M flow channel flows to the output end D, the coolant is also blocked by the baffle 123 and cannot continue to flow forward. Instead, it changes its flow direction in the guide groove 124 and enters the tail-layer flow channel 1212 from the input end E of the tail-layer flow channel 1212.

[0072] By setting a baffle 123 to block between the output end of the previous layer of flow channel 121 and the input end of the next layer of flow channel 121, the coolant output from the previous layer of flow channel 121 can be blocked by the baffle 123 and enter the next layer of flow channel 121 without being blocked by the side wall of the groove 111. A certain space can be left between the guide member 120 and the side wall of the groove 111, so that when the guide member 120 is installed or removed, no friction will be generated to hinder the movement of the guide member 120 in the groove 111, and the installation and removal of the guide member 120 will be more convenient.

[0073] In order to better dissipate heat for the first heating element 210, the flow rate of the coolant in the flow channel 121 is usually increased to improve the heat dissipation efficiency. However, the coolant with a faster flow rate will also have a greater impact on the baffle 123, which will easily cause the connection between the baffle 123 and the guide member 120 to loosen or disconnect, thereby causing the baffle 123 to be unable to block the coolant output from the previous layer of flow channel 121, and a large amount of coolant can directly leak from the previous layer of flow channel 121 into the groove 111. In particular, the coolant output from the first layer of flow channel 1211 cannot normally enter the next layer of flow channel to exchange heat with the coolant currently in the first layer of flow channel 1211, and thus cannot effectively reduce the temperature difference between the coolant at the output end and the coolant at the input end of the first layer of flow channel 1211.

[0074] Based on the above problems, in order to make the connection between the baffle 123 and the guide member 120 more stable, the present application further proposes an embodiment, see Figure 7 As shown in the figure, a through hole 1231 is opened on the baffle 123, and the through hole 1231 is used for the fastener 125 to pass through and be fixedly connected to the guide member 120, so as to fix the baffle 123 to the guide member 120.

[0075] Specifically, a fixing hole 126 can be provided on the guide member 120. The fixing hole 126 can be a through hole or a blind hole. After the fastener 125 passes through the through hole 1231, it enters the fixing hole 126 and is fixedly connected to the fixing hole 126. The fixing hole 126 can be a threaded hole, and the fastener 125 can be a screw, a screw, or other components. Furthermore, since the guide member 120 is located in the groove 111, even if a small amount of coolant leaks from the flow channel 121 into the groove 111, it will not affect the circuit board 200. Therefore, the baffle 123 does not need to be sealed with the guide member 120. In order to speed up the installation of the baffle 123, the baffle 123 can also have only two through holes 1231, so that only two fasteners 125 need to be installed when installing the baffle 123. In addition, in addition to being provided on the same side as shown in the figure, the two through holes 1231 can also be provided diagonally.

[0076] The above embodiment provides a through hole 1231 on the baffle 123 and uses fasteners 125 to fix the baffle 123 and the guide member 120, so that the connection between the two is more secure, and when the baffle 123 becomes loose due to the impact of the coolant for a long time, the baffle and the guide member 120 can be quickly re-tightened by the fasteners 125.

[0077] In addition to the first heating element 210, the circuit board 200 generally has other heating elements 220. Therefore, in order to better dissipate heat from the heating elements on the circuit board 200, the present application further proposes an embodiment, see Figure 4 、 Figure 5 、 Figure 6 and Figure 8 , Figure 8 A three-dimensional view of the base in the liquid-cooled heat dissipation assembly provided by the new embodiment of the present experiment is shown from another angle. As shown in the figure, a heat dissipation surface 112 is formed at other positions of the base 110 facing the air guide 120 except the groove 111. The heat dissipation surface 112 is used to fit with at least some of the other heating components 220 on the circuit board 200 except the first heating component 210. A heat dissipation channel 113 is provided on the side of the base 110 facing away from the air guide 120. The input end of the heat dissipation channel 113 is connected to the groove 111, so that when the coolant flowing out of the groove 111 flows through the heat dissipation channel 113, the heat of at least some of the other heating components 220 is taken away through the heat dissipation surface 112.

[0078] like Figure 6 As shown, the heat dissipation surface 112 of the base 110 facing the air guide 120 is in contact with at least part of the other heating components 220, so that the heat generated by the other heating components 220 is conducted to the base 110 through the heat dissipation surface 112. A heat dissipation channel 113 is provided on the other side of the base 110. When the coolant flows through the heat dissipation channel 113, it will exchange heat with the base 110, thereby taking away the heat on the base 110.

[0079] Specifically, in Figure 3 and Figure 8 In the specific embodiment shown, there is a channel 1131 between the groove 111 and the heat dissipation channel 113, and the cooling liquid flows along the multi-layer flow channel 121 between the guide member 120. Figure 3 After flowing in the direction indicated by the dotted arrow in the figure, it is output from the output end F of the tail layer flow channel 1212, enters the heat dissipation channel 113 through the channel 1131, and flows along the heat dissipation channel 113. Figure 8 The liquid flows in the direction indicated by the dashed arrow in FIG. Furthermore, the heat dissipation channel 113 extends in a serpentine shape to fully expand the coolant flow path, allowing the coolant to fully remove heat transferred from the heat dissipation surface 112 to various parts of the base 110. Furthermore, the liquid-cooled heat dissipation assembly 100 also includes a cover plate 150, which is disposed on the side of the base 110 facing away from the flow guide 120 and seals the heat dissipation channel 113 to prevent coolant leakage therein.

[0080] Specifically, the heat dissipation surface 112 can be flush with the surface of the guide member 120 that contacts the first heating element 210. In this case, the thickness of the base 110 where the heat dissipation surface 112 is located is relatively large, or the depth of the heat dissipation channel 113 is the same as the depth of the groove 111. Of course, the heat dissipation surface 112 can also be lower than the surface of the guide member 120 that contacts the first heating element 210. Accordingly, the heat dissipation channel 113 can be flush with or lower than the bottom of the groove 111, and the channel 1131 can be arranged at an angle or vertically downward to ensure smooth flow of the coolant at the junction of the groove 111 and the heat dissipation channel 113.

[0081] By forming a heat dissipation surface 112 on the base 110 in addition to the groove 111, the heat generated by at least some of the other heating components 220 on the circuit board 200, except for the first heating component 210, can be transferred to the base 110 through the heat dissipation surface 112. A heat dissipation channel 113 is provided on the other side of the base 110, so that the coolant can carry away the heat from the base 110 when flowing in the heat dissipation channel 113, thereby achieving efficient heat dissipation of at least some of the other heating components 220 and improving the heat dissipation efficiency of the circuit board 200. On this basis, the heat dissipation channel 113 and the heat dissipation surface 112 that is bonded to the other heating components 220 are respectively located on opposite sides of the base 110. Therefore, if the heat dissipation channel 113 leaks, the impact on the circuit board 200 can be minimized.

[0082] The position where the groove 111 on the base 110 is located dissipates heat for the first heating device 210 through the guide member 120 in the groove 111, and the bottom of the groove 111 does not contact the heating device on the circuit board 200. If there is also a part of the heat dissipation channel 113 at the position where the bottom of the groove 111 is located, then this part of the heat dissipation channel 113 will not only fail to effectively take away the heat generated by the heating device, but will also make the length of the heat dissipation channel 113 longer, resulting in an increase in the flow resistance of the coolant in the heat dissipation channel 113, and then causing the flow rate of the coolant to decrease, affecting the heat dissipation efficiency of the circuit board 200.

[0083] In order to further dissipate heat more fully and efficiently for other heating components 220 on the circuit board 200, a shorter heat dissipation channel 113 can be set on the base 110 only at one end of the groove 111 where the coolant is output to guide the coolant to the heat dissipation channels 113 at other positions on the base 110 except the groove 111, and a coolant outlet can be set on the groove 111 near the heat dissipation channel 113 so that the groove 111 and the heat dissipation channel 113 are connected. At this time, there will be a certain distance between the inlet and outlet of the coolant on the groove 111. When the outlet and inlet of the coolant on the groove 111 are located on the same side, if the ends of the flow channels 121 on the guide member 120 are relatively close to the inlet of the coolant on the groove 111, although the coolant can directly enter the flow channels 121 on the guide member 120 after entering the groove, the coolant needs to flow a certain distance within the groove 111 after exiting the flow channels 121 on the guide member 120 before exiting the coolant outlet on the groove 111 to the heat dissipation channel 113. If the ends of the flow channels 121 on the guide member 120 are relatively close to the outlet of the coolant on the groove 111, the coolant needs to flow a certain distance after entering the groove 111 before entering the flow channels 121 on the guide member 120. Regardless of which arrangement is used, the distance the coolant needs to flow increases, causing the coolant to experience greater flow resistance, thereby affecting the overall heat dissipation effect of the liquid-cooled heat dissipation assembly 100 on the circuit board 200.

[0084] Therefore, under the premise of not affecting the heat dissipation effect of the liquid cooling heat dissipation component 100 on the circuit board 200 as a whole, in order to make the coolant better dissipate the heat of other heating components 220 on the circuit board 200 more fully and efficiently, the present application further proposes an embodiment. Figure 3 and Figure 8 As shown in the figure, the coolant in the groove 111 enters the groove 111 from one end of the groove 111 and is output to the heat dissipation channel 113 from the other opposite end. The guide member 120 is in contact with the bottom of the groove 111. The number of layers of the multi-layer flow channel 121 is an odd number, so that the multi-layer flow channel 121 transports the coolant from one end of the groove 111 to the other end of the groove 111.

[0085] like Figure 6As shown, the bottom of the guide member 120 fits in contact with the bottom of the groove 111, allowing the bottom of the groove 111 to serve as a support for the guide member 120, preventing the guide member 120 from being suspended in the air and enhancing the stability of the guide member 120. In this case, the coolant can only be output to the heat dissipation channel 113 from the same end of the groove 111, regardless of which end of the flow channel 121 on the guide member 120 it is output from. Furthermore, the coolant inlet and outlet on the groove 111 are respectively positioned at both ends of the groove 111. This allows the coolant to enter the groove 111 and flow to the other end of the groove 111 before it can be output from the groove 111 to the heat dissipation channel 113. In this case, the coolant must pass through the guide member 120 and come into contact with the guide member 120, allowing the coolant to exchange heat with the guide member 120 and remove heat from the guide member 120. Since the bottom of the guide member 120 fits with the bottom of the groove 111, the coolant in the groove 111 can only flow from one end of the groove 111 to the other end of the groove 111 through the flow channel 121 on the guide member 120. Therefore, the flow channel 121 on the guide member 120 is not only multi-layered, but also the number of layers needs to be an odd number.

[0086] Specifically, in the embodiment of the present application, as an example, Figure 3 As shown, the guide member 120 has three layers of flow channels 121, that is, the guide member 120 has a first layer flow channel 1211, an intermediate layer flow channel 121 (M flow channel) and a tail layer flow channel 1212. After the coolant enters the groove 111, it enters the first layer flow channel 1211 from the input end A of the first layer flow channel 1211 and flows to the end of the groove 111 where the coolant outlet is located, that is, the output end B of the first layer flow channel 1211. Then, the coolant is blocked from entering the M flow channel from the input end C of the M flow channel and flows to the end of the groove 111 where the coolant inlet is located, that is, the output end D of the M flow channel. Finally, the coolant is blocked from entering the tail layer flow channel 1212 from the input end E of the tail layer flow channel 1212 and flows to the end of the groove 111 where the coolant outlet is located, that is, the output end F of the tail layer flow channel 1212, and then output from the coolant outlet on the groove 111 to the heat dissipation channel 113. As shown Figure 8 As shown, after the coolant enters the heat dissipation channel 113, it flows directly to other places on the base 110 except the location of the groove 111 through the heat dissipation channel 113 located at the tail of the groove 111, and heat exchange occurs on the base 110, taking away the heat from other heating components 220 that is conducted to the base 110 through the heat dissipation surface 112.

[0087] By setting the inlet and outlet of the coolant at both ends of the groove 111, after the coolant enters the groove 111, if it is to be output from the outlet on the groove 111 to the heat dissipation channel 113, it must pass through the guide member 120, so that the coolant in the groove 111 can exchange heat with the guide member 120, thereby effectively improving the utilization rate of the coolant. In addition, by setting the number of layers of the multi-layer flow channel 121 on the guide member 120 to an odd number, the input end of the first-layer flow channel 1211 and the output end of the tail-layer flow channel 1212 are respectively located at the two ends of the guide member 120. In this way, the two ends of the guide member 120 can be respectively close to the inlet and outlet of the coolant on the groove 111, so that the coolant can directly enter the first-layer flow channel 1211 on the guide member 120 after entering the groove 111 from the inlet on the groove 111. After the coolant is output from the tail-layer flow channel 1212 on the guide member 120, it can be directly output from the outlet on the groove 111 to the heat dissipation channel 113, effectively shortening the flow path of the coolant and improving the overall heat dissipation efficiency of the liquid-cooled heat dissipation component 100 for the circuit board 200.

[0088] In order to make the installation of the guide member 120 more convenient, the present application further proposes an embodiment, such as Figure 2 、 Figure 4 and Figure 5 As shown, a first positioning portion 127 is provided on the guide member 120, and a second positioning portion 1112 is provided at the notch 1111 of the groove 111. The second positioning portion 1112 is used to cooperate with the first positioning portion 127 and limit the angle at which the guide member 120 enters the groove 111, so that the input end of the first layer flow channel 1211 in the multi-layer flow channel 121 is oriented towards the end where the coolant enters the groove 111 after the guide member 120 enters the groove 111.

[0089] The edge of the input end of the first layer flow channel 1211 on the flow guide 120 extends outward to form a first positioning portion 127 (such as Figure 4 and Figure 5 As shown), a second positioning portion 1112 is formed on one end of the groove 111 where the liquid inlet 130 is provided (as shown Figure 2 and Figure 5 As shown), Figure 5 As shown, when the guide member 120 is placed downwardly into the groove 111, the first positioning portion 127 covers the second positioning portion 1112, allowing the guide member 120 to close the notch 1111 of the groove 111. At this time, the input end of the first-layer flow channel 1211 on the guide member 120 is oriented toward the end of the groove 111 where the liquid inlet 130 is located, allowing the coolant to flow from the liquid inlet 130 into the groove 111 and then directly into the first-layer flow channel 1211 from the input end.

[0090] Of course, the inner wall of the groove 111 can also be extended inward to form a protrusion, which is used as the second positioning portion 1112, and an opening is set on the guide member 120, which is used as the first positioning portion 127. When installing the guide member 120, the protrusion on the side wall of the groove 111 is inserted into the opening on the guide member 120, so that the input end of the first layer flow channel 1211 on the guide member 120 is facing the end of the groove 111 where the liquid inlet 130 is located.

[0091] It should be noted that the first positioning portion 127 and the second positioning portion 1112 are used to cooperate with each other when installing the guide member 120, so that the input end of the first-layer flow channel 1211 on the guide member 120 is oriented toward the end of the groove 111 where the coolant enters, so that the coolant enters the groove 111 and directly enters the first-layer flow channel 1211 through the input end of the first-layer flow channel 1211. Therefore, in addition to setting the first positioning portion 127 at the end of the guide member 120 where the output end of the first-layer flow channel 1211 is located, it can also be set at other locations on the guide member 120. In this case, the second positioning portion 1112 also needs to be set at other corresponding locations on the groove 111. As long as the guide member 120 can align the input end of the first-layer flow channel 1211 with the end of the groove 111 where the coolant enters when the guide member 120 is in the groove 111, it will be sufficient.

[0092] The above embodiment sets a first positioning portion 127 on the guide member 120 and sets a second positioning portion 1112 in the groove 111, so that after the guide member 120 is installed inside the groove 111 according to the first positioning portion 127 and the second positioning portion 1112, the input end of the first layer flow channel 1211 on the guide member 120 can be oriented towards the end of the groove 111 where the coolant enters, so that the coolant enters the groove 111 and directly passes through the input end of the first layer flow channel 1211 and then into the guide member 120, thereby quickly completing the installation of the guide member 120.

[0093] like Figure 4 As shown, the first heating element 210 and other heating elements 220 included on the circuit board 200 have different heights, and the height of the first heating element 210 is generally lower than that of the other heating elements 220. If the surface of the guide member 120 that contacts the first heating element 210 is flush with the heat dissipation surface 112, then after the heat dissipation surface 112 contacts at least part of the other heating elements 220, the first heating element 210 will not be able to contact the guide member 120, thereby causing the liquid cooling heat dissipation assembly 100 to be unable to dissipate heat from the first heating element 210.

[0094] Based on the above problems, the present application further proposes an embodiment, such as Figure 6As shown, a boss 114 is provided on one side of the base 110, and a groove 111 is opened on the boss 114 so that the guide member 120 is in contact with the first heating device 210 when the heat dissipation surface 112 is in contact with at least part of the other heating devices 220, and the thickness of the bottom wall of the groove 111 is equal to the thickness of the base 110.

[0095] In this embodiment, by providing a boss 114 on the base 110 and a groove 111 on the boss 114, a height difference exists between the plane of the flow guide 120 that is used to mate with the first heating device 210 and the heat dissipation surface 112. When the heat dissipation surface 112 mates with at least part of the other heating devices 220, the flow guide 120 can mate with the first heating device 210, thereby enabling the flow guide 120 to better mate with the first heating device 210. In addition, the thickness of the bottom wall of the groove 111 is equal to the thickness of the base 110, thereby avoiding problems such as uneven filling, uneven internal stress caused by differences in solidification time, and difficulty in controlling process parameters (e.g., pressure, speed, temperature, etc.) when the base 110 is produced by injection molding, die casting, etc.

[0096] In addition, when the depth of the groove 111 is shallow and the height of the boss 114 is high, as shown in FIG. Figure 3 and Figure 4 As shown, a raised groove 115 can be formed on the other side of the boss 114 away from the groove 111 and recessed toward the groove 111, so that the thickness of the groove bottom of the groove 111 (i.e., the groove bottom of the raised groove 115) is the same as the thickness of the base 110. On the one hand, the difficulty of production such as injection molding and die casting of the base 110 is reduced. On the other hand, it can also save material costs and reduce the overall weight of the liquid-cooled heat dissipation component 100.

[0097] In order to reliably protect the circuit board 200, the present application further proposes an embodiment, specifically combining Figure 1 and Figure 9 , Figure 9 A three-dimensional diagram of some components of the electronic device provided by the new embodiment of this experiment is shown, and the figure shows the structure after the circuit board 200 and the liquid cooling heat dissipation component 100 are assembled. As shown in the figure, the base 110 is surrounded by a limiting wall 116 on the side facing the air guide member 120, and a heat dissipation cavity 117 is formed inside the limiting wall 116. The heat dissipation cavity 117 is used to accommodate the circuit board 200.

[0098] In this embodiment, limiting walls 116 are provided around the side of the base 110 facing the guide member 120, so that a heat dissipation cavity 117 for accommodating the circuit board 200 is formed inside the limiting walls 116. On the one hand, the limiting walls 116 can provide a certain degree of protection for the circuit board 200. On the other hand, the heat generated by the circuit board 200 can be well controlled within the heat dissipation cavity 117. Then, through heat transfer between the air in the heat dissipation cavity 117, the limiting walls 116, the base 110 and the internal coolant, more heat generated by the circuit board 200 as a whole can be transferred to the coolant and the heat can be taken away by the coolant.

[0099] On the basis of setting the limiting wall 116, in order to achieve a better water and electricity isolation effect, this application further proposes an implementation method, please continue to refer to Figure 9 As shown in the figure, the liquid inlet 130 and the liquid outlet 140 are arranged on the outside of the limiting wall 116, and the liquid inlet 130 and the liquid outlet 140 are used to connect to the external coolant pipeline (not shown) on the outside of the limiting wall 116.

[0100] By arranging the liquid inlet 130 and the liquid outlet 140 on the limiting wall 116 and connecting them to the external coolant pipeline on the outside of the limiting wall 116, the space where the external coolant pipeline is located and the connection between the external liquid cooling pipeline and the liquid inlet 130 and the liquid outlet 140 are separated from the heat dissipation cavity 117 where the circuit board 200 is located, forming a water and electricity isolation structure. Therefore, when the external coolant pipeline leaks or the connection between the external coolant pipeline and the liquid inlet 130 or the liquid outlet 140 leaks, it will not have a significant impact on the circuit board 200, thereby ensuring the stability and reliability of the operation of the circuit board 200.

[0101] In addition, in order to ensure the tightness of the first heating element 210 and the guide member 120, the present application further proposes an implementation method, please refer to Figure 1 As shown in the figure, the surface at the notch of the groove 111 is flush with the plane on the guide member 120 for fitting with the first heating device 210, and the surface at the notch of the groove 111 is provided with a mounting portion 1113, which is used to be fixedly connected to the first heating device 210 so that the first heating device 210 is fitted and fixed to the guide member 120.

[0102] like Figure 1 As shown in , the mounting portion 1113 can be a threaded hole, and the threaded fastener passes through the mounting hole on the first heating device 210 and is fixedly connected to the threaded hole to press and fix the first heating device 210 on the guide member 120, ensuring that the heat generated by the first heating device 210 can be efficiently transferred to the guide member 120.

[0103] According to another aspect of the embodiment of the present application, an electronic device is provided. Figure 5 and Figure 9 As shown in the figure, the electronic device includes a circuit board 200 and any of the liquid-cooling heat dissipation components 100 described above. A first heating device 210 is provided on the circuit board 200, and the liquid-cooling heat dissipation component 100 is used to fit with the first heating device 210 for heat dissipation.

[0104] The electronic device provided in the embodiment of the present application dissipates heat from the first heating device 210 on the circuit board 200 by adopting the liquid cooling heat dissipation assembly 100 provided in any of the above embodiments, thereby meeting the uniform heat dissipation requirements of the first heating device 210 and improving the reliability of the operation of the first heating device 210.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A liquid cooling heat dissipation component, characterized in that: The liquid cooling heat dissipation assembly comprises: a base body and a flow guide; The base is provided with a groove, and the groove is used for cooling liquid to flow through; The guide member is disposed in the groove and closes the notch of the groove. The side of the guide member facing away from the base is used to fit with the first heating device on the circuit board. The guide member is provided with multiple flow channels, which are arranged along the depth direction of the groove. In the multi-layer flow channel, the input end of the first-layer flow channel and the output end of the tail-layer flow channel are respectively connected to the internal space of the groove, so that the coolant entering the groove flows from the input end of the first-layer flow channel into the first-layer flow channel and removes the heat of the first heating element through the wall of the guide member. The coolant enters the next-layer flow channel through the output end of the first-layer flow channel; When the coolant entering the next layer of flow channel flows in the next layer of flow channel, heat is transferred to the coolant currently in the first layer of flow channel through the wall between the first layer of flow channel and the next layer of flow channel, so that the temperature difference between the coolant at the input end of the first layer of flow channel and the coolant at the output end of the first layer of flow channel is reduced; The output end of the tail layer flow channel is used for the coolant to flow back and forth between the multi-layer flow channels along the extension direction of the flow guide and then be output to the groove.

2. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: A heat dissipation portion is provided inside each layer of the multi-layer flow channel, and the heat dissipation portion is provided along the extension direction of the flow channel.

3. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: The guide member also includes a baffle, the multi-layer flow channel runs through the guide member, and the baffle covers between the output end of the previous layer of flow channel and the input end of the next layer of flow channel in the multi-layer flow channel, so that the coolant output from the output end of the previous layer of flow channel enters the next layer of flow channel from the input end of the next layer of flow channel under the obstruction of the baffle.

4. The liquid cooling heat dissipation assembly according to claim 3, characterized in that: The baffle is provided with a through hole, and the through hole is used for a fastener to pass through and be fixedly connected to the guide member, so as to fix the baffle and the guide member.

5. The liquid cooling heat dissipation assembly according to any one of claims 1 to 4, characterized in that: A heat dissipation surface is formed on a side of the base body facing the guide member at positions other than the groove, and the heat dissipation surface is used to fit with at least part of the other heat-generating components on the circuit board except the first heat-generating component; A heat dissipation channel is provided on the side of the base away from the guide member, and the input end of the heat dissipation channel is connected to the groove, so that when the coolant flowing out of the groove flows through the heat dissipation channel, it takes away the heat of at least part of the other heating components through the heat dissipation surface.

6. The liquid cooling heat dissipation assembly according to claim 5, characterized in that: The coolant in the groove enters the groove from one end of the groove and is output to the heat dissipation channel from the other opposite end. The guide member is in contact with the bottom of the groove, and the number of layers of the multi-layer flow channel is an odd number, so that the multi-layer flow channel transports the coolant from one end of the groove to the other end of the groove.

7. The liquid cooling heat dissipation assembly according to claim 6, characterized in that: A first positioning portion is provided on the guide member, and a second positioning portion is provided at the notch of the groove. The second positioning portion is used to cooperate with the first positioning portion and limit the angle at which the guide member enters the groove, so that the input end of the first layer of the flow channel in the multi-layer flow channel is oriented towards the end of the groove where the coolant enters after the guide member enters the groove.

8. The liquid cooling heat dissipation assembly according to claim 5, characterized in that: The height of the first heating device is lower than the height of at least part of the other heating devices; A boss is provided on one side of the base, and the groove is provided on the boss, so that the guide member is in contact with the first heating device when the heat dissipation surface is in contact with at least part of the other heating devices; The thickness of the bottom wall of the groove is equal to the thickness of the base.

9. The liquid cooling heat dissipation assembly according to claim 5, characterized in that: The base body is surrounded on one side of the guide member to form a limiting wall, and a heat dissipation cavity is formed inside the limiting wall. The heat dissipation cavity is used to accommodate the circuit board.

10. An electronic device, characterized in that: The electronic device comprises: a circuit board and a liquid-cooling heat dissipation assembly as described in any one of claims 1 to 9, wherein a first heating device is provided on the circuit board, and the liquid-cooling heat dissipation assembly is used to be attached to the first heating device for heat dissipation.

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