Shell and electronic equipment

Abstract

The utility model discloses a shell and electronic equipment, and belongs to the technical field of display. The shell comprises a supporting plate, a frame body and a conductive bonding part. The conductive bonding part in the shell can be respectively bonded with the frame body and the first conductive layer in the supporting plate, so that the supporting plate can be grounded through the frame body through the conductive bonding part, the frame body and the supporting plate do not need to be electrically connected by adopting a welding mode, static electricity introduced by the supporting plate can be introduced into the frame body through the conductive bonding part, and the static electricity is prevented from entering the frame body. Therefore, the probability that static electricity is introduced into the supporting plate is low, and then it can be guaranteed that the static electricity does not interfere with an antenna in the electronic equipment easily. Besides, the supporting plate body in the supporting plate is of the plate-shaped structure supported by the carbon fiber material, so that the grounding effect of the supporting plate through the frame body is good on the premise that the overall thickness of the electronic equipment is small, and the reliability of the electronic equipment is high.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a housing and an electronic device. Background Art

[0002] With the development of display technology, the demand and application scope of electronic devices are constantly expanding. Common electronic devices include mobile phones, televisions, tablets, laptops and monitors.

[0003] An electronic device typically includes a display module and a midframe. The midframe typically includes a support plate and an annular frame. The display module is assembled on the frame, and the support plate supports the display module and other components (e.g., the battery) in the electronic device. The support plate is typically made of a metal alloy such as stainless steel or aluminum alloy.

[0004] However, the support plate formed from metal alloys is relatively thick, resulting in a thicker overall electronic device. Furthermore, the support plate and the annular frame are typically connected by welding, which often results in poor solder joints, leading to lower reliability of the midframe. Utility Model Content

[0005] The present invention provides a housing and an electronic device. The present invention can solve the problem of low reliability of electronic devices. The technical solution is as follows:

[0006] In one aspect, a housing is provided, comprising: a support plate, a frame, and a conductive adhesive portion;

[0007] The support plate comprises: a support plate body, and a first conductive layer and a second conductive layer located on both sides of the support plate body;

[0008] The frame is connected to the support plate, and the first conductive layer is closer to the frame than the second conductive layer;

[0009] The conductive adhesive portion is located between the frame and the first conductive layer, and is respectively adhered to the frame and the first conductive layer.

[0010] Optionally, the frame has a supporting groove on the side facing the support plate, at least a portion of the conductive adhesive portion is located in the supporting groove to be bonded to the frame, and the conductive adhesive portion is bonded to the first conductive layer at the edge of the support plate on the side facing away from the supporting groove.

[0011] Optionally, the frame further has a first connection hole, and the edge of the support plate has a second connection hole connected to the first connection hole;

[0012] The shell further includes a conductive connector for connecting the first connection hole and the second connection hole, wherein the conductive connector contacts the frame in the first connection hole and contacts a side of the second conductive layer away from the support plate body.

[0013] Optionally, the conductive connecting member includes: a connecting rod body and an abutment portion, one end of the connecting rod body passes through the second connecting hole and is connected to the first connecting hole, the abutment portion is connected to the other end of the second connecting hole, and the abutment portion is in contact with the side of the second conductive layer away from the support plate body.

[0014] Optionally, the housing includes a plurality of the conductive adhesive portions and a plurality of the conductive connecting members;

[0015] The plurality of conductive adhesive portions and the plurality of conductive connecting members are respectively distributed on two opposite sides of the frame.

[0016] Optionally, the shell further includes: an adhesive layer located between the frame and the first conductive layer; the adhesive layer is ring-shaped and adhered to the frame and the first conductive layer respectively.

[0017] Optionally, an orthographic projection of the adhesive layer on the frame does not overlap with an orthographic projection of the conductive adhesive portion on the frame.

[0018] Optionally, the support plate further includes: a conductive connection portion connected to the outer edge of the support plate body, the conductive connection portion is distributed around the support plate body, and a portion of the conductive connection portion is connected to the first conductive layer, and another portion of the conductive connection portion is connected to the second conductive layer.

[0019] Optionally, the support plate body is a plate-shaped structure made of carbon fiber material.

[0020] On the other hand, an electronic device is provided, comprising: a housing, and a display module connected to the housing, wherein the housing is any of the above-mentioned housings.

[0021] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0022] Because the conductive adhesive portion in the housing can be bonded to the first conductive layer in the frame and the support plate, respectively, the support plate can be grounded through the frame via the conductive adhesive portion. This eliminates the need to electrically connect the frame and the support plate by welding. Static electricity introduced by the support plate can be introduced into the frame via the conductive adhesive portion, thereby reducing the probability of static electricity being introduced by the support plate, thereby ensuring that static electricity is less likely to interfere with the antenna in the electronic device. Furthermore, because the support plate body in the support plate is a plate-like structure supported by carbon fiber material, the grounding effect of the support plate through the frame can be improved while ensuring the overall thickness of the electronic device is relatively thin, thereby ensuring the high reliability of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 This is a schematic diagram of the exploded structure of a shell provided in an embodiment of the present application;

[0025] Figure 2 yes Figure 1 A schematic cross-sectional view of the support plate at AA' is shown;

[0026] Figure 3 This is a schematic diagram of a partial structure of a frame provided in an embodiment of the present application;

[0027] Figure 4 This is a schematic diagram of the exploded structure of another shell provided in an embodiment of the present application;

[0028] Figure 5 This is a schematic diagram of the exploded structure of another shell provided in an embodiment of the present application;

[0029] Figure 6 yes Figure 1 Another cross-sectional schematic diagram of the support plate at AA' is shown. DETAILED DESCRIPTION

[0030] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0031] Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the exploded structure of a shell provided in an embodiment of the present application. Figure 2 yes Figure 1 The housing 000 may include: a support plate 100 , a frame 200 and a conductive adhesive portion 300 .

[0032] The support plate 100 in the housing 000 may include a support plate body 101, and a first conductive layer 102 and a second conductive layer 103 located on either side of the support plate body 101. The support plate 100 may support the display module and functional components of the electronic device. For example, the functional components of the electronic device may include a battery, a speaker, or a circuit board.

[0033] It should be noted that the support plate body 101 in the support plate 100 can be a plate-like structure supported by a carbon fiber material. Here, since carbon fiber material has the advantages of high strength and thin thickness, for example, when the support plate body 101 is made of carbon fiber material, the overall thickness of the support plate 100 can range from 0.1 mm to 0.2 mm. Therefore, when the material of the support plate body 101 in the support plate 100 is selected from carbon fiber material, it can be ensured that the support plate 100 has a good support effect on the display module and functional components of the electronic device, thereby ensuring that the overall thickness of the electronic device is relatively thin.

[0034] The frame 200 in the housing 000 can be annular, and the support plate 100 can be connected to one side of the frame 200. The frame 200 and the support plate 100 can form a cabin for carrying functional components. Here, the first conductive layer 102 in the support plate 100 can be closer to the frame 200 than the second conductive layer 103.

[0035] The conductive adhesive portion 300 in the housing 000 can be located between the frame 200 and the first conductive layer 102 in the support plate 100, and can be bonded to the frame 200 and the first conductive layer 102, respectively. That is, one side of the conductive adhesive portion 300 can be bonded to the frame 200, and the other side of the conductive adhesive portion 300 can be bonded to the first conductive layer 102 in the support plate 100. Here, the conductive adhesive portion 300 can electrically connect the first conductive layer 102 in the support plate 100 to the frame 200, thereby allowing the support plate 100 to be grounded through the frame 200.

[0036] It should be noted that in related art, the middle frame of an electronic device typically includes a support plate and an annular frame. The support plate is typically formed from a metal alloy such as stainless steel or aluminum alloy. Support plates formed from metal alloys are typically thicker, which can easily lead to a thicker overall thickness of the electronic device.

[0037] Furthermore, static electricity is easily introduced into the support plate, which can significantly reduce the radiation effect of the antenna in the electronic device. Therefore, the support plate and the annular frame are typically connected by welding, allowing the support plate to be grounded through the frame to prevent static electricity from interfering with the antenna in the electronic device. However, welding between the support plate and the annular frame often results in poor solder joints, which reduces the reliability of the midframe.

[0038] To this end, in the embodiment of the present application, since the conductive adhesive portion 300 in the shell 000 can be respectively bonded to the frame 200 and the first conductive layer 102 in the support plate 100, the support plate 100 can be grounded through the frame 200 through the conductive adhesive portion 300. In this way, there is no need to use welding to electrically connect the frame 200 and the support plate 100. The static electricity introduced by the support plate 100 can be introduced into the frame 200 through the conductive adhesive portion 300, so that the probability of static electricity being introduced into the support plate 100 can be reduced, thereby ensuring that static electricity is not likely to interfere with the antenna in the electronic device.

[0039] In addition, since the support plate body 101 in the support plate 100 is a plate-like structure supported by carbon fiber material, the grounding effect of the support plate 100 through the frame 200 can be better while ensuring the overall thickness of the electronic device is relatively thin, thereby ensuring the high reliability of the electronic device.

[0040] In summary, the embodiment of the present application provides a shell, comprising: a support plate, a frame and a conductive adhesive portion. Since the conductive adhesive portion in the shell can be bonded to the first conductive layer in the frame and the support plate respectively, the support plate can be grounded through the frame through the conductive adhesive portion. In this way, there is no need to electrically connect the frame and the support plate by welding. The static electricity introduced by the support plate can be introduced into the frame through the conductive adhesive portion, thereby reducing the probability of static electricity introduced by the support plate, thereby ensuring that static electricity is not likely to interfere with the antenna in the electronic device. In addition, since the support plate body in the support plate is a plate-like structure supported by carbon fiber material, the grounding effect of the support plate through the frame can be better while ensuring that the overall thickness of the electronic device is thin, thereby ensuring that the reliability of the electronic device is high.

[0041] In the examples of this application, please refer to Figure 3 , Figure 3This is a schematic diagram of a partial structure of a frame provided in an embodiment of the present application. The frame 200 in the housing 000 may have a bearing groove U on the side facing the support plate 100. At least a portion of the conductive adhesive portion 300 in the housing 000 may be located within the bearing groove U to bond with the frame 200. The side of the conductive adhesive portion 300 facing away from the bearing groove U may bond with the first conductive layer 102 in the support plate 100 at an edge of the support plate 100.

[0042] In this way, it can be ensured that the carrying groove U in the frame 200 and at least part of the conductive adhesive portion 300 distributed in the carrying groove U will not occupy too much space in the frame 200, thereby ensuring a high space utilization rate of the frame 200.

[0043] In the examples of this application, please refer to Figure 4 , Figure 4 Schematic diagram of the exploded structure of another housing provided by an embodiment of the present application. The frame 200 in the housing 000 may further have a first connection hole 200a, and the edge of the support plate 100 in the housing 000 may have a second connection hole 100a that communicates with the first connection hole 200a in the frame 200.

[0044] The housing 000 may further include a conductive connector 400 for connecting the first connection hole 200a in the frame 200 and the second connection hole 100a in the support plate 100. The conductive connector 400 may contact the frame 200 within the first connection hole 200a. The conductive connector 400 may also contact the side of the second conductive layer 103 facing away from the support plate body 101. For example, the conductive connector 400 may include a conductive screw.

[0045] In this case, not only can the frame 200 and the support plate 100 be locked together through the conductive connector 400 so that the frame 200 and the support plate 100 can be stably connected together, but the second conductive layer 103 in the support plate 100 can also be electrically connected to the frame 200 through the conductive connector 400, so that the support plate 100 can be grounded through the frame 200. In this way, static electricity introduced by the support plate 100 can be introduced into the frame 200 through the conductive connector 400, thereby reducing the probability of static electricity being introduced by the support plate 100, and thus ensuring that static electricity is unlikely to interfere with the antenna in the electronic device.

[0046] In this application, if Figure 4As shown, the conductive connector 400 in the housing 000 may include a connecting rod 401 and an abutting portion 402. One end of the connecting rod 401 in the conductive connector 400 may pass through the second connecting hole 100a in the support plate 100 and connect to the first connecting hole 200a in the frame 200. The abutting portion 402 in the conductive connector 400 may connect to the other end of the second connecting hole 100a in the support plate 100. The abutting portion 402 in the conductive connector 400 may also contact a side of the second conductive layer 103 in the support plate 100 that faces away from the support plate body 101.

[0047] In this case, the static electricity introduced by the support plate 100 can be introduced into the frame 200 in the shell 000 through the abutment portion 402 in the conductive connector 400 and the connecting rod body 401 in sequence, so that the static electricity is not likely to interfere with the antenna in the electronic device.

[0048] In the embodiment of the present application, the housing 000 may include multiple conductive adhesive portions 300 and multiple conductive connectors 400. The multiple conductive adhesive portions 300 and the multiple conductive connectors 400 may be respectively distributed on opposite sides of the frame 200. Thus, the coordinated action of the multiple conductive adhesive portions 300 and the multiple conductive connectors 400 ensures a high degree of reliability in grounding the support plate 100 through the frame 200.

[0049] In this way, the static electricity introduced by the support plate 100 can be introduced into the frame 200 as much as possible through the multiple conductive adhesive parts 300 and the multiple conductive connectors 400 in the shell 000, thereby making the probability of the support plate 100 introducing static electricity lower, and further ensuring that static electricity is not likely to interfere with the antenna in the electronic device.

[0050] Here, since the multiple conductive adhesive parts 300 and the multiple conductive connectors 400 can be respectively distributed on the two opposite sides of the frame 200, it can be ensured that the multiple conductive adhesive parts 300 and the multiple conductive connectors 400 will not interfere with each other, thereby ensuring that the reliability of the shell 000 is high.

[0051] In the examples of this application, please refer to Figure 5 , Figure 5: is a schematic diagram of the exploded structure of another shell provided in an embodiment of the present application. The shell 000 may further include: an adhesive layer 500 located between the frame 200 and the first conductive layer 102. The adhesive layer 500 in the shell 000 may be annular, and the adhesive layer 500 may be bonded to the frame 200 and the first conductive layer 102 in the support plate 100, respectively. That is, one side of the adhesive layer 500 may be bonded to the frame 200, and the other side of the adhesive layer 500 may be bonded to the first conductive layer 102 in the support plate 100. In this way, the frame 200 and the support plate 100 may be bonded together through the adhesive layer 500, so that the connection between the frame 200 and the support plate 100 is more stable.

[0052] In this application, if Figure 5 As shown, the orthographic projection of the adhesive layer 500 in the housing 000 on the frame 200 may not overlap with the orthographic projection of the conductive adhesive portion 300 in the housing 000 on the frame 200. In this way, while ensuring a good bonding effect of the adhesive layer 500 in the housing 000, it is unlikely that the adhesive layer 500 in the housing 000 and the conductive adhesive portion 300 in the housing 000 will interfere with each other.

[0053] In the examples of this application, please refer to Figure 6 , Figure 6 yes Figure 1 Another schematic cross-sectional view of the support plate at line AA' is shown. The support plate 100 in the housing 000 may further include a conductive connection portion 104 connected to the outer edge of the support plate body 101. The conductive connection portion 104 may be distributed around the support plate body 101 in the support plate 100, and a portion of the conductive connection portion 104 may be connected to the first conductive layer 102 in the support plate 100, while another portion of the conductive connection portion 104 may be connected to the second conductive layer 103 in the support plate 100.

[0054] It should be noted that a portion of the conductive connection portion may be formed simultaneously with the first conductive layer 102 in the support plate 100 , and another portion of the conductive connection portion may be formed simultaneously with the second conductive layer 103 in the support plate 100 .

[0055] In summary, the embodiment of the present application provides a shell, comprising: a support plate, a frame and a conductive adhesive portion. Since the conductive adhesive portion in the shell can be bonded to the first conductive layer in the frame and the support plate respectively, the support plate can be grounded through the frame through the conductive adhesive portion. In this way, there is no need to electrically connect the frame and the support plate by welding. The static electricity introduced by the support plate can be introduced into the frame through the conductive adhesive portion, thereby reducing the probability of static electricity introduced by the support plate, thereby ensuring that static electricity is not likely to interfere with the antenna in the electronic device. In addition, since the support plate body in the support plate is a plate-like structure supported by carbon fiber material, the grounding effect of the support plate through the frame can be better while ensuring that the overall thickness of the electronic device is thin, thereby ensuring that the reliability of the electronic device is high.

[0056] The present application also provides an electronic device, which can be any product or component with a display function, such as a mobile phone, tablet computer, television, advertising machine, display screen, digital photo frame, or vehicle-mounted terminal. The electronic device can include a housing and a display module connected to the housing. The housing in the electronic device can be any of the housings described in the above embodiments.

[0057] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0058] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A housing, characterized in that: include: A support plate (100), a frame (200) and a conductive adhesive portion (300); The support plate (100) comprises: a support plate body (101), and a first conductive layer (102) and a second conductive layer (103) located on both sides of the support plate body (101); The frame (200) is connected to the support plate (100), and the first conductive layer (102) is closer to the frame (200) than the second conductive layer (103); The conductive bonding portion (300) is located between the frame (200) and the first conductive layer (102), and is bonded to the frame (200) and the first conductive layer (102) respectively.

2. The housing according to claim 1, wherein: The frame (200) has a bearing groove (U) on one side facing the support plate (100), at least a portion of the conductive adhesive portion (300) is located in the bearing groove (U) to be bonded to the frame (200), and the conductive adhesive portion (300) is bonded to the first conductive layer (102) at an edge of the support plate (100) on a side facing away from the bearing groove (U).

3. The housing according to claim 1, wherein: The frame (200) further has a first connection hole (200a), and the edge of the support plate (100) has a second connection hole (100a) in communication with the first connection hole (200a); The shell further comprises: a conductive connector (400) for connecting the first connection hole (200a) and the second connection hole (100a), wherein the conductive connector (400) contacts the frame (200) in the first connection hole (200a), and the conductive connector (400) also contacts the side of the second conductive layer (103) facing away from the support plate body (101).

4. The housing according to claim 3, wherein: The conductive connecting member (400) comprises: a connecting rod body (401) and an abutting portion (402), one end of the connecting rod body (401) passes through the second connecting hole (100a) and is connected to the first connecting hole (200a), the abutting portion (402) is connected to the other end of the second connecting hole (100a), and the abutting portion (402) is in contact with a side of the second conductive layer (103) facing away from the support plate body (101).

5. The housing according to claim 3, wherein: The housing comprises a plurality of the conductive bonding portions (300) and a plurality of the conductive connecting members (400); The plurality of conductive adhesive portions (300) and the plurality of conductive connecting members (400) are respectively distributed on two opposite sides of the frame (200).

6. The housing according to any one of claims 1 to 5, characterized in that: The shell further comprises: an adhesive layer (500) located between the frame (200) and the first conductive layer (102); the adhesive layer (500) is annular, and the adhesive layer (500) is respectively bonded to the frame (200) and the first conductive layer (102).

7. The housing according to claim 6, wherein: The orthographic projection of the adhesive layer (500) on the frame (200) does not overlap with the orthographic projection of the conductive adhesive portion (300) on the frame (200).

8. The housing according to any one of claims 1 to 5, characterized in that: The support plate (100) further comprises: a conductive connection portion (104) connected to the outer edge of the support plate body (101), the conductive connection portion (104) being distributed around the support plate body (101), and a portion of the conductive connection portion (104) being connected to the first conductive layer (102), and another portion of the conductive connection portion (104) being connected to the second conductive layer (103).

9. The housing according to any one of claims 1 to 5, characterized in that: The support plate body (101) is a plate-shaped structure made of carbon fiber material.

10. An electronic device, characterized in that: The invention comprises: a shell, and a display module connected to the shell, wherein the shell is the shell according to any one of claims 1 to 9.

Images