Feeding device for wafer transfer equipment
By designing a combination of wafer tray, substrate loading track and wafer transfer mechanism, automatic loading of wafer transfer equipment is realized, which solves the problems of slow speed and low efficiency of manual loading in the existing technology and improves the efficiency and stability of wafer transfer and soldering.
Patent Information
- Application Number
- CN202421517324.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-29
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-06-29
AI Technical Summary
The conventional wafer transfer equipment has a low degree of automation, slow manual loading speed, low efficiency, and cumbersome operation, especially during the screen printing and die bonding process of the carrier, which requires frequent tool replacement.
A loading device including a wafer tray, a substrate loading track and a wafer transfer mechanism was designed. The circumferential swing arm and vacuum nozzle of the wafer transfer mechanism were used to realize the automatic transfer of wafers. The heating track and the heat insulation track were combined to perform the substrate loading and soldering operations. The positioning accuracy was improved by the X-axis and Y-axis moving structures, and the movable base and cylinder were used to prevent the solder paste from falling.
It realizes the rapid and automatic transfer and soldering of wafers, improves the loading efficiency, reduces the tediousness of manual operation, and ensures the stability of solder paste and stable operation of equipment.
Smart Images
Figure CN223379515U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor production equipment, in particular to a loading device for wafer transfer equipment. Background Art
[0002] Surface Mount Technology (SMT) refers to a series of processes based on printed circuit boards (PCBs). The basic process elements of SMT include: screen printing (or dispensing), placement (or curing), reflow soldering, cleaning, testing, and rework.
[0003] Among them, the existing screen printing and placement processes both involve the loading of carriers and wafers. In the carrier loading process, it is generally carried out by manual transfer, and the carrier is placed on the operating table by manual handling, so that the carrier is handled, and the degree of automation is relatively low; in the wafer loading process, the wafer is generally carried by a wafer tray, and the process of transferring the wafer from the wafer tray to the carrier is the wafer transfer process;
[0004] Manual loading and bonding in the surface mount process has the problems of slow speed, low efficiency and low degree of automation. In addition, in the silk screen bonding of the carrier, manual transfer of the wafer and soldering bonding require frequent manual tool changes, which makes the operation very cumbersome. Utility Model Content
[0005] In view of the technical defects existing in the background technology, the present invention proposes a loading device for wafer transfer equipment, which solves the above technical problems and meets the actual needs. The specific technical solution is as follows:
[0006] A loading device for a wafer transfer device comprises a wafer tray, a substrate loading track and a wafer transfer mechanism. The substrate loading track is provided with a cover plate, a heating track and a heat-insulating track in order from top to bottom. A wafer tray is provided on the side of the substrate loading track, and a wafer transfer mechanism is provided above the wafer tray.
[0007] The cover plate includes a first cover plate and a second cover plate arranged along the length direction of the substrate feeding track, a gap is reserved between the ends of the first cover plate and the second cover plate, thereby forming a feeding port, the length direction of the feeding port is aligned with the width direction of the substrate feeding track, and the first cover plate has a concave surface at one end facing the feeding port;
[0008] The wafer transfer mechanism is provided with a circumferential swing arm and a circumferential driving mechanism for driving the circumferential swing arm to rotate circumferentially above the wafer tray, and a vacuum suction nozzle is provided at the end of the circumferential swing arm.
[0009] As an improvement to the above solution, a tray bracket is connected to the side of the wafer tray, and an X-axis moving structure and a Y-axis moving structure are provided at the bottom of the tray bracket. The X-axis moving structure is parallel to the conveying direction of the substrate loading track.
[0010] As an improvement of the above-mentioned solution, a placement area is provided on the upper surface of the wafer tray, and the wafer tray is composed of an annular portion with an opening and a locking assembly arranged at the opening position. The annular portion is circularly surrounded to form the placement area, and the ends of the annular portion are provided with a first connecting block and a second connecting block extending toward the outside of the annular portion at corresponding opening positions, and a locking assembly is passed through the first connecting block and the second connecting block.
[0011] As an improvement to the above solution, a plurality of track brackets are provided at the bottom of the insulation track, and an opening is provided at a position of the heating track corresponding to the reserved gap between the first cover plate and the second cover plate, thereby forming a first heating track and a second heating track.
[0012] As an improvement to the above solution, the upper end surface of the first heating track is provided with a protrusion 1 extending along the X-axis direction, and the protrusion 1 is arranged at equal intervals along the width direction of the first heating track. The bottom end surface of the first cover plate is provided with a downwardly protruding lower edge 1 corresponding to the outer side of the protrusion 1, and the height dimension of the lower edge 1 is greater than the height dimension of the protrusion 1, thereby forming a gap between the first cover plate and the protrusion 1 for accommodating the passage of materials.
[0013] As an improvement to the above solution, the upper end of the second heating track is provided with a second protrusion extending along the X-axis direction, and the second protrusion is arranged at equal intervals along the width direction of the second heating track. The bottom end surface of the second cover plate is provided with a downwardly protruding lower edge corresponding to the outer side of the second protrusion, and the height dimension of the second lower edge is greater than the height dimension of the second protrusion, thereby forming a gap between the second cover plate and the second protrusion for accommodating the passage of materials.
[0014] As an improvement of the above solution, an opening 2 is provided below the thermal insulation track corresponding to the opening 1, and a movable base is provided below the substrate loading track corresponding to the loading port. A cylinder with an output end facing upward is provided at the bottom end of the movable base, and the movable base extends upward through the opening 2 to the opening 1.
[0015] As an improvement to the above solution, an air channel is formed between two adjacent protrusions, and a heating chamber extending to the bottom of the air channel is provided on the side of the substrate loading track away from the wafer tray, and an air hole is provided between the heating chamber and the air channel.
[0016] As an improvement to the above-mentioned solution, a traction device is provided at the rear end of the substrate loading track in the transmission direction, and the traction device includes traction brackets arranged at both ends of the substrate loading track and a traction wheel arranged along the width direction of the substrate loading track. A connecting rod is provided between the traction wheel and the traction bracket, and the traction wheel is abutted and aligned with the outermost protrusion 2 of the second heating track.
[0017] The beneficial effects of the present invention are as follows: the substrate after screen printing of solder paste is loaded through the substrate loading track, an air flow channel is provided in the heating track to prevent the solder paste from falling due to excessive temperature inside the track, the driving mechanism drives the circumferential swing arm to drive the vacuum suction nozzle to transfer the wafer horizontally from the wafer tray to the substrate, the wafer is attached to the substrate through the loading port, and a concave surface is reserved at one end of the first cover plate facing the loading port for the swing of the circumferential swing arm, the transfer speed of the wafer is faster and more efficient, the loading of the substrate and the wafer are completed respectively through the cooperation of the substrate loading track and the chip transfer mechanism, and the soldering mounting between the wafer and the substrate is completed through the heating track. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic diagram of the overall structure of the feeding device of the present utility model.
[0019] Figure 2 This is a schematic diagram of the substrate feeding track structure of the present utility model.
[0020] Figure 3 This is a schematic diagram of the heating track structure of the present utility model.
[0021] Figure 4 This is a schematic structural diagram of the wafer tray of the present invention.
[0022] Figure 5 This is an exploded schematic diagram of the thickness direction structure of the substrate feeding track of the present invention.
[0023] Figure 6 for Figure 2 Schematic diagram of the structure of part A.
[0024] Figure 7 for Figure 4 Schematic diagram of the structure of part B.
[0025] Wherein: wafer tray 1, placement area 11, wafer plate 12, rubber ring 121, ring portion 13, first connecting block 131, second connecting block 132, locking assembly 14, threaded column 141, through hole 142, screw 143, substrate loading track 2, cover plate 21, first cover plate 211, bottom edge 1 212, second cover plate 213, bottom edge 2 214, concave surface 215, heating track 22, opening 1 221, first heating track 222, protrusion 1 223 , second heating track 224, second bump 225, insulation track 23, loading port 24, movable base 25, cylinder 26, air flow channel 27, heating chamber 28, air hole 29, chip transfer mechanism 3, circumferential swing arm 31, circumferential drive mechanism 32, vacuum suction nozzle 33, tray bracket 4, X-axis moving structure 5, Y-axis moving structure 6, track bracket 7 traction device 8, traction bracket 801, traction wheel 802, connecting rod 803, substrate 9, edge material 901. DETAILED DESCRIPTION
[0026] The following describes the implementation of the present invention in conjunction with the accompanying drawings and relevant embodiments. The implementation of the present invention is not limited to the following embodiments, and the present invention involves relevant necessary components in this technical field, which should be regarded as common knowledge in this technical field and can be known and mastered by technical personnel in this technical field.
[0027] like Figures 1 to 7 As shown, a loading device for a wafer transfer device includes a wafer tray 1, a substrate loading track 2, and a wafer transfer mechanism 3. The substrate loading track 2 is provided with a cover plate 21, a heating track 22, and a heat insulation track 23 in order from top to bottom. The wafer tray 1 is provided on the side of the substrate loading track 2, and the wafer transfer mechanism 3 is provided above the wafer tray 1.
[0028] The cover plate 21 includes a first cover plate 211 and a second cover plate 213 arranged along the length direction of the substrate loading track 2. A gap is reserved between the ends of the first cover plate 211 and the second cover plate 213 to form a loading port 24. The length direction of the loading port 24 is aligned with the width direction of the substrate loading track 2.
[0029] like Figure 1As shown, in the structure of the wafer transfer mechanism 3 of the present invention, the wafer transfer mechanism 3 is provided with a circumferential swing arm 31 and a circumferential drive mechanism 32 for driving the circumferential swing arm 31 to rotate circumferentially above the wafer tray 1, and a vacuum suction nozzle 33 is provided at the end of the circumferential swing arm 31. The wafer transfer mechanism 3 is also provided with a linear drive mechanism for driving the circumferential swing arm 31 to move up and down. The circumferential drive mechanism 32 and the linear drive mechanism are one of the drive structures in the existing well-known technology, which are respectively used to drive the circumferential swing arm 31 to rotate horizontally 180° and to drive the adjustment of the horizontal height of the circumferential swing arm 31 to realize the transfer operation of transferring the wafer from the wafer tray 1 to the substrate. The first cover plate 211 is provided with a concave surface 215 at one end facing the loading port 24, and the concave surface 215 reserves rotation space for the circumferential swing arm 31, thereby reducing the horizontal movement process of the circumferential swing arm 31.
[0030] like Figure 1 、 Figure 4 and Figure 7 As shown, in the structure of the wafer tray 1 of the present invention, the wafer tray 1 is circular, and a placement area 11 is provided on the upper surface of the wafer tray 1. The placement area 11 is used to place a wafer plate 12 that carries wafers. The wafer tray 1 is composed of an annular portion 13 with an opening and a locking assembly 14 arranged at the opening position. The annular portion 13 is circular and surrounds the placement area 11. The wafer plate 12 is placed in the placement area 11. A rubber ring 121 is provided around the outer edge of the wafer plate 12. The annular portion 13 surrounds the outer edge of the wafer plate 12, and the wafer plate 12 is clamped by the locking assembly 14.
[0031] Furthermore, it should be noted that the annular portion 13 on the wafer tray 1 has an opening, and the end of the annular portion 13 is provided with a first connecting block 131 and a second connecting block 132 extending toward the outside of the annular portion 13 at a position corresponding to the opening. A locking assembly 14 is provided between the first connecting block 131 and the second connecting block 132. The first connecting block 131 is fixedly connected to the tray bracket 4. A threaded column 141 is provided on the end surface of the first connecting block 131 facing the second connecting block 132, and a through hole 142 is provided on the second connecting block 132 corresponding to the length direction of the threaded column 141.
[0032] It should be noted that, when in use, the threaded column 141 on the first connecting block 131 is aligned with the through hole 142 on the second connecting block 132, and the end of the threaded column 141 is passed along the through hole 142 to the other side end face of the second connecting block 132, and a screw part 143 is provided from the other side end face of the second connecting block 132 and is sleeved on the threaded column 141. By screwing the screw part 143, the first connecting block 131 and the second connecting block 132 are locked, and at the same time, the annular portion 13 is controlled to tighten and clamp the wafer plate 12, so as to fix the wafer plate 12.
[0033] Furthermore, in the above scheme, a tray support 4 is connected to the side of the wafer tray 1, and the wafer tray 1 is fixedly connected to the tray support 4 through the first connecting block 131. The bottom of the tray support 4 is provided with an X-axis moving structure 5 and a Y-axis moving structure 6. The X-axis moving structure 5 is parallel to the conveying direction of the substrate loading track 2. The X-axis moving structure 5 and the Y-axis moving structure 6 are both slide rail drive devices commonly used in the prior art. The X-axis moving structure 5 and the Y-axis moving structure 6 are respectively provided with a first slide rail extending along the X-axis direction and a second slide rail extending along the Y-axis direction. The first slide rail is parallel to the length direction of the substrate loading track 2, and the second slide rail is arranged on the first slide rail. The tray support 4 is arranged on the second slide rail. When it is necessary to control the wafer tray 1 to move along the Y-axis, the tray support 4 is driven by an external drive motor to move along the length direction of the second slide rail. When it is necessary to control the wafer tray 1 to move along the X-axis, the second slide rail and the tray support 4 are driven by an external drive motor to move toward the length direction of the first slide rail.
[0034] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 5 and Figure 6 In the structure of the heat-insulating track 23, the substrate feeding track 2 is provided with a cover plate 21, a heating track 22 and a heat-insulating track 23 in order from top to bottom. A plurality of track brackets 7 are provided at the bottom of the heat-insulating track 23. No fixed connection is used between the heat-insulating track 23 and the track bracket 7. A clamp-shaped opening is provided at the top of the track bracket 7. The substrate feeding track 2 is directly placed in the clamp-shaped opening on the track bracket 7. The non-fixed connection between the substrate feeding track 2 and the track bracket 7 can effectively ensure that the track will not be deformed due to thermal expansion and contraction, and the structure is more stable.
[0035] Furthermore, in the above scheme, the cover plate 21 includes a first cover plate 211 and a second cover plate 213 arranged along the length direction of the substrate feeding track 2, a gap is reserved between the ends of the first cover plate 211 and the second cover plate 213, thereby forming a feeding port 24, and the heating track 22 is provided with an opening 221 at a position corresponding to the reserved gap between the first cover plate 211 and the second cover plate 213, thereby separating the first heating track 222 and the second heating track 224, the first cover plate 211 and the second cover plate 213 respectively corresponding to the positions of the first heating track 222 and the second track, the wafer feeding port 24 is provided at the connection position between the first cover plate 211 and the second cover plate 213, and the wafer is placed on the substrate 9 from the feeding port 24 through the wafer transfer mechanism 3;
[0036] It should be noted that the first cover plate 211 is buckled onto the first heating track 222. Specifically, the upper end surface of the first heating track 222 is provided with a protrusion 223 extending along the X-axis direction, that is, the protrusion 223 extends along the length direction of the first heating track 222, and three protrusions 223 are arranged at equal intervals along the width direction of the first heating track 222. The bottom end surface of the first cover plate 211 is provided with a downwardly protruding lower edge 212 corresponding to the outer side of the protrusion 223. The height dimension of the lower edge 212 is greater than the height dimension of the protrusion 223, so that a gap for accommodating the passage of materials is formed between the first cover plate 211 and the protrusion 223 after being buckled.
[0037] It should be noted that the second cover plate 213 is buckled onto the second heating track 224. Specifically, the upper end of the second heating track 224 is provided with a second protrusion 225 extending along the X-axis direction, that is, the second protrusion 225 extends along the length direction of the second heating track 224, and three second protrusions 225 are arranged at equal intervals along the width direction of the second heating track 224. The bottom end surface of the second cover plate 213 is provided with a downwardly protruding lower edge 214 corresponding to the outer side of the second protrusion 225. The height dimension of the second lower edge 214 is greater than the height dimension of the second protrusion 225, thereby forming a gap between the second cover plate 213 and the second protrusion 225 to accommodate the passage of materials.
[0038] It should be noted that the bump 1 223 and the bump 2 225 are aligned in a straight line, there are three bumps 1 223, and edge materials 901 are respectively provided on both sides of the width direction of the substrate 9 and the central axis position. The edge materials 901 of the substrate 9 are aligned with the bump 1 223 and the bump 2 225. The soldering position of the substrate 9 is between the two adjacent edge materials 901, that is, the soldering position of the substrate 9 is aligned directly above the air flow channel 27, which can achieve a better preheating effect. In the event of solder paste dripping, the solder paste will drip into the air flow channel 27, and will not affect the flatness of the surface of the bump 1 223 and the bump 2 225, thereby affecting the transportation of the substrate 9.
[0039] It should be noted that a traction device 8 is provided at the rear end of the substrate loading track 2 in the transmission direction, and the traction device 8 includes a traction bracket 801 arranged at both ends of the substrate loading track 2 and a traction wheel 802 arranged along the width direction of the substrate loading track 2. A connecting rod 803 is provided between the traction wheel 802 and the traction bracket 801. The traction wheel 802 is abutted and aligned with the outermost protrusion 225 of the second heating track 224. In use, the side materials 901 on both sides of the substrate 9 are clamped between the traction wheel 802 and the protrusion 225, and the substrate 9 is pulled forward and transported to the detection mechanism by the rotation of the traction wheel 802.
[0040] In the structure of the loading port 24 of the present invention, the insulation track 23 is provided with an opening 2 below the opening 1 221, and the opening 1 221 is aligned with the opening 2. A movable base 25 is provided below the substrate loading track 2 at a position corresponding to the loading port 24. The bottom end of the movable base 25 is provided with a cylinder 26 with an output end facing upward. The movable base 25 extends upward through the opening 2 to the opening 1 221. During use, when the chip transfer mechanism 3 transfers the wafer to the soldering position of the substrate 9, the bonding process between the wafer and the substrate 9 is likely to cause the solder paste to fall. It is difficult to clean the internal solder paste with the traditional integrated track, especially corresponding to the loading port 24 position. The present application sets the movable base 25, lifts the movable base 25 by the cylinder 26 and moves it upward to bond with the substrate 9, so that the solder paste falls on the movable base 25. The movable base 25 can be cleaned by disassembling the movable base 25.
[0041] It should be noted that an air channel 27 is formed between two adjacent protrusions 1 223 and two adjacent protrusions 2 225, and a heating chamber 28 extending to the bottom of the air channel 27 is provided on the side of the substrate loading track 2 away from the wafer tray 1, and an air hole 29 is provided between the heating chamber 28 and the air channel 27, and the heat in the heating chamber 28 is conducted to the air channel 27 through the through hole 142.
[0042] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.
Claims
1. A loading device for a wafer transfer device, characterized in that: The invention comprises a wafer tray (1), a substrate loading track (2) and a wafer transfer mechanism (3), wherein the substrate loading track (2) is provided with a cover plate (21), a heating track (22) and a heat insulation track (23) in order from top to bottom, a wafer tray (1) is provided on the side of the substrate loading track (2), and a wafer transfer mechanism (3) is provided above the wafer tray (1); The cover plate (21) comprises a first cover plate (211) and a second cover plate (213) arranged along the length direction of the substrate feeding track (2); a gap is reserved between the ends of the first cover plate (211) and the second cover plate (213), thereby forming a feeding port (24); the length direction of the feeding port (24) is aligned with the width direction of the substrate feeding track (2); and a concave surface (215) is provided at one end of the first cover plate (211) facing the feeding port (24); The wafer transfer mechanism (3) is provided with a circumferential swing arm (31) and a circumferential drive mechanism (32) for driving the circumferential swing arm (31) to rotate circumferentially above the wafer tray (1), and a vacuum suction nozzle (33) is provided at the end of the circumferential swing arm (31).
2. The loading device for wafer transfer equipment according to claim 1, characterized in that: A tray support (4) is connected to the side of the wafer tray (1), and an X-axis moving structure (5) and a Y-axis moving structure (6) are provided at the bottom of the tray support (4). The X-axis moving structure (5) is parallel to the conveying direction of the substrate loading track (2).
3. The loading device for wafer transfer equipment according to claim 2, characterized in that: The upper surface of the wafer tray (1) is provided with a placement area (11), and the wafer tray (1) is composed of an annular portion (13) with an opening and a locking assembly (14) arranged at the opening position. The annular portion (13) is circularly arranged to form the placement area (11), and the end of the annular portion (13) is provided with a first connecting block (131) and a second connecting block (132) extending toward the outside of the annular portion (13) at the corresponding opening position, and the locking assembly (14) is passed between the first connecting block (131) and the second connecting block (132).
4. The loading device for wafer transfer equipment according to claim 1, characterized in that: A plurality of track brackets (7) are provided at the bottom of the heat-insulating track (23), and an opening (221) is provided at a position of the heating track (22) corresponding to the reserved gap between the first cover plate (211) and the second cover plate (213), thereby forming a first heating track (222) and a second heating track (224).
5. The loading device for wafer transfer equipment according to claim 4, characterized in that: The upper end surface of the first heating track (222) is provided with a protrusion 1 (223) extending along the X-axis direction, and the protrusion 1 (223) is arranged at equal intervals along the width direction of the first heating track (222). The bottom end surface of the first cover plate (211) is provided with a downwardly protruding lower edge 1 (212) corresponding to the outer side of the protrusion 1 (223), and the height dimension of the lower edge 1 (212) is greater than the height dimension of the protrusion 1 (223), thereby forming a gap between the first cover plate (211) and the protrusion 1 (223) for accommodating the passage of materials.
6. The loading device for wafer transfer equipment according to claim 4, characterized in that: The upper end of the second heating track (224) is provided with a second protrusion (225) extending along the X-axis direction, and the second protrusion (225) is arranged at equal intervals along the width direction of the second heating track (224). The bottom end surface of the second cover plate (213) is provided with a second lower edge (214) protruding downwardly corresponding to the outer side of the second protrusion (225), and the height dimension of the second lower edge (214) is greater than the height dimension of the second protrusion (225), thereby forming a gap between the second cover plate (213) and the second protrusion (225) for accommodating the passage of materials.
7. The loading device for wafer transfer equipment according to claim 4, characterized in that: An opening 2 is provided below the heat-insulating track (23) corresponding to the opening 1 (221), and a movable base (25) is provided below the substrate loading track (2) at a position corresponding to the loading port (24). A cylinder (26) with an output end facing upward is provided at the bottom end of the movable base (25), and the movable base (25) extends upward through the opening 2 to the opening 1 (221).
8. The loading device for wafer transfer equipment according to claim 5, characterized in that: An air flow channel (27) is formed between two adjacent protrusions (223), and a heating chamber (28) extending to the bottom of the air flow channel (27) is provided on the side of the substrate loading track (2) away from the wafer tray (1), and an air hole (29) is provided between the heating chamber (28) and the air flow channel (27).
9. The loading device for wafer transfer equipment according to claim 6, characterized in that: A traction device (8) is provided at the rear end of the substrate loading track (2) in the transmission direction. The traction device (8) comprises traction brackets (801) arranged at both ends of the substrate loading track (2) and a traction wheel (802) arranged along the width direction of the substrate loading track (2). A connecting rod (803) is provided between the traction wheel (802) and the traction bracket (801). The traction wheel (802) is aligned with the outermost protrusion 2 (225) of the second heating track (224).