Cooling equipment for lead-free reflow soldering

Abstract

The utility model relates to the field of reflow soldering cooling, in particular to cooling equipment for lead-free reflow soldering, which comprises a rack, a reflow soldering conveying line and a cooling conveying line which are used for horizontally conveying circuit boards are respectively arranged at two ends of the rack, and a first cylinder is fixed on the inner wall of the bottom of the rack and positioned in the middle of the reflow soldering conveying line. A first air cylinder is fixed to the middle of the cooling conveying line, a fixing plate is fixed to the output end of the first air cylinder, an electric heating aluminum plate with a built-in electric heating wire is fixed to the top of the fixing plate, and a second air cylinder is fixed to the position, located in the middle of the cooling conveying line, of the inner wall of the bottom of the rack. The circuit board is conveyed along the reflow soldering conveying line and the cooling conveying line, conveying is stable, the electric heating aluminum plate is driven by the first air cylinder to rapidly heat the circuit board, the semiconductor chilling plate is driven by the second air cylinder to make contact with the circuit board, and cooling is rapid.

Description

Technical Field

[0001] The utility model relates to the field of reflow soldering cooling, in particular to a cooling device for lead-free reflow soldering. Background Art

[0002] Reflow soldering is a surface mount soldering technique used to attach electronic components to circuit boards. Reflow soldering involves precisely controlling the temperature profile, causing the solder paste to undergo a phase transition from melting to cooling, resulting in a reliable solder joint. The process is divided into four temperature zones: a preheating zone (60–130°C), a soaking zone (120–160°C), a reflow zone (with a peak temperature determined by the solder paste and higher than the soaking zone), and a cooling zone.

[0003] Traditional reflow soldering uses a tin-lead alloy, while lead-free reflow soldering utilizes lead-free solder, with the mainstream alloy typically being SAC (Sn-Ag-Cu). Lead-free reflow soldering places stringent requirements on cooling equipment due to its higher soldering temperatures (peak temperature approximately 235–260°C) and narrower process window. The cooling rate directly impacts solder joint strength, structural density, and product reliability.

[0004] Existing lead-free reflow soldering, such as the Chinese utility model patent CN208961169U, uses water cooling for cooling, which takes up a large space. In addition, the span between the reflow zone and the cooling zone is large, and the cooling equipment needs to be connected to the unloading conveyor belt of the reflow zone. The transportation process in the middle is long and cannot be cooled in time.

[0005] Therefore, it is necessary to provide a new lead-free reflow soldering cooling device to solve the above technical problems. Utility Model Content

[0006] In order to solve the above technical problems, the utility model provides a cooling device for lead-free reflow soldering, including a frame, wherein both ends of the frame are respectively provided with a reflow soldering conveyor line and a cooling conveyor line for horizontally conveying circuit boards, a first cylinder is fixed on the inner wall of the bottom of the frame located in the middle of the reflow soldering conveyor line, a fixing plate is fixed on the output end of the first cylinder, an electric heating aluminum plate with a built-in heating wire is fixed on the top of the fixing plate, a second cylinder is fixed on the inner wall of the bottom of the frame located in the middle of the cooling conveyor line, the output end of the second cylinder is fixedly connected to a mounting seat, and a semiconductor refrigeration plate is fixed on the top of the mounting seat.

[0007] Preferably, the reflow soldering conveyor line and the cooling conveyor line each include two sets of conveyor belt groups, and the two sets of conveyor belt groups are respectively arranged inside both sides of the frame, the conveyor belt group includes two conveying devices arranged up and down, the conveying device includes a driving pulley and a driven pulley rotatably connected to the inner wall of the frame, and the driving pulley and the driven pulley are connected by belt transmission, and a channel for conveying circuit boards is provided between the two belts of the same conveyor belt group, the driving pulley and the driven pulley are fixedly connected to the driving pulley and the driven pulley opposite to them by a connecting rod, an electric motor is fixed on the frame, the output end of the motor is fixedly connected to one of the driving pulleys of one of the conveyor belt groups, and the two driving pulley ends of the other conveyor belt group are fixed with gears, and the two gears mesh with each other.

[0008] Preferably, a first photoelectric sensor and a second photoelectric sensor are respectively installed on the frame facing the reflow conveyor line and the cooling conveyor line, and a controller is installed on the frame, and the controller is electrically connected to the first photoelectric sensor and the second photoelectric sensor, the first cylinder and the second cylinder.

[0009] Preferably, the semiconductor refrigeration plate and the electric heating aluminum plate are both in a horizontal state.

[0010] Preferably, the frame has a U-shaped structure.

[0011] Compared with related technologies, the cooling equipment for lead-free reflow soldering provided by the utility model has the following beneficial effects: by placing the circuit board in the channel between the two belts and combining it with the drive of the electric motor, the circuit board is transported along the reflow soldering conveyor line and the cooling conveyor line, and the transportation is relatively smooth. The first cylinder drives the electric heating aluminum plate to quickly heat the circuit board, and the second cylinder drives the semiconductor refrigeration plate to contact the circuit board, so that the temperature drops relatively quickly. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the overall structure of the cooling equipment for lead-free reflow soldering provided by the utility model;

[0013] Figure 2 This is a schematic diagram of the installation positions of the semiconductor refrigeration plate and the electric heating aluminum plate provided by the utility model.

[0014] Numbers in the figure: 1. Frame; 2. Reflow soldering conveyor line; 3. Cooling conveyor line; 4. First cylinder; 5. Fixing plate; 6. Electric heating aluminum plate; 7. Second cylinder; 8. Mounting seat; 9. Semiconductor refrigeration plate; 10. Conveyor belt group; 11. Conveying device; 12. Driving pulley; 13. Driven pulley; 14. Belt; 15. Connecting rod; 16. Motor; 17. Gear; 18. First photoelectric sensor; 19. Second photoelectric sensor; 20. Controller. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0016] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0017] See also Figures 1 to 2 The embodiment of the present invention provides a cooling device for lead-free reflow soldering, comprising a frame 1, wherein both ends of the frame 1 are respectively provided with a reflow soldering conveyor line 2 and a cooling conveyor line 3 for horizontally conveying circuit boards, a first cylinder 4 is fixed on the bottom inner wall of the frame 1 at the middle of the reflow soldering conveyor line 2, a fixing plate 5 is fixed on the output end of the first cylinder 4, an electric heating aluminum plate 6 with a built-in heating wire is fixed on the top of the fixing plate 5, a second cylinder 7 is fixed on the bottom inner wall of the frame 1 at the middle of the cooling conveyor line 3, the output end of the second cylinder 7 is fixedly connected to a mounting base 8, and a semiconductor refrigeration plate 9 is fixed on the top of the mounting base 8.

[0018] The reflow soldering conveyor line 2 and the cooling conveyor line 3 each include two groups of conveyor belt groups 10, and the two groups of conveyor belt groups 10 are respectively arranged inside both sides of the frame 1, and the conveyor belt group 10 includes two conveying devices 11 arranged up and down, and the conveying device 11 includes a driving pulley 12 and a driven pulley 13 rotatably connected to the inner wall of the frame 1, and the driving pulley 12 and the driven pulley 13 are connected by a belt 14 for transmission. A channel for conveying circuit boards is provided between the two belts 14 of the same conveyor belt group 10, and the driving pulley 12 and the driven pulley 13 are fixedly connected to the driving pulley 12 and the driven pulley 13 opposite to them through a connecting rod 15. A motor 16 is fixed on the frame 1, and the output end of the motor 16 is fixedly connected to one of the driving pulleys 12 of one of the conveyor belt groups 10, and the ends of the two driving pulleys 12 of the other conveyor belt group 10 are fixed with gears 17, and the two gears 17 are meshed with each other.

[0019] A first photoelectric sensor 18 and a second photoelectric sensor 19 are respectively installed on the frame 1 opposite the reflow conveyor line 2 and the cooling conveyor line 3. A controller 20 is installed on the frame 1, and the controller 20 is electrically connected to the first photoelectric sensor 18 and the second photoelectric sensor 19, the first cylinder 4 and the second cylinder 7.

[0020] The semiconductor refrigeration plate 9 and the electric heating aluminum plate 6 are both in a horizontal state, and are in good contact with the circuit board, which is convenient for heating and cooling.

[0021] The frame 1 is in a U-shaped structure. Combined with the arrangement of the connecting rod 15, the frame is relatively stable.

[0022] Working principle: The motor 16 drives the active pulley 12 to rotate, and the four belts 14 of the two conveyor belt groups 10 are synchronously transmitted in combination with the setting of the connecting rod 15, gear 17 and belt 14. The two ends of the circuit board are set in the channel between the two belts 14 and are transported forward by the belt 14;

[0023] When the first photoelectric sensor 18 detects the circuit board, the controller 20 controls the motor 16 to stop rotating, the reflow soldering conveyor line 2 stops conveying forward, and the first cylinder 4 drives the fixed plate 5 and the electric heating aluminum plate 6 to rise, so that the electric heating aluminum plate 6 contacts the circuit board and heats the circuit board;

[0024] Subsequently, it is transported to the cooling conveyor line 3 through the flow soldering conveyor line 2. When the second photoelectric sensor 19 detects the circuit board, the controller 20 controls the motor 16 to stop rotating, the cooling conveyor line 3 stops conveying forward, and the second cylinder 7 drives the mounting seat 8 and the semiconductor refrigeration plate 9 to rise, so that the semiconductor refrigeration plate 9 contacts the circuit board to cool the circuit board.

[0025] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A cooling device for lead-free reflow soldering, characterized in that: The invention comprises a frame (1), wherein two ends of the frame (1) are respectively provided with a reflow soldering conveyor line (2) and a cooling conveyor line (3) for horizontally conveying circuit boards; a first cylinder (4) is fixed on the inner wall of the bottom of the frame (1) in the middle of the reflow soldering conveyor line (2); a fixing plate (5) is fixed on the output end of the first cylinder (4); an electric heating aluminum plate (6) with a built-in electric heating wire is fixed on the top of the fixing plate (5); a second cylinder (7) is fixed on the inner wall of the bottom of the frame (1) in the middle of the cooling conveyor line (3); the output end of the second cylinder (7) is fixedly connected to a mounting seat (8); a semiconductor cooling plate (9) is fixed on the top of the mounting seat (8).

2. The cooling device for lead-free reflow soldering according to claim 1, characterized in that: The reflow soldering conveyor line (2) and the cooling conveyor line (3) both include two conveyor belt groups (10), and the two conveyor belt groups (10) are respectively arranged inside the two sides of the frame (1), the conveyor belt group (10) includes two conveying devices (11) arranged up and down, the conveying device (11) includes a driving pulley (12) and a driven pulley (13) rotatably connected to the inner wall of the frame (1), and the driving pulley (12) and the driven pulley (13) are connected by a belt (14) for transmission, and the two belts (14) of the same conveyor belt group (10) are connected by a belt (14) for transmission. ) is provided between the driving pulley (12) and the driven pulley (13) for conveying circuit boards, the driving pulley (12) and the driven pulley (13) are fixedly connected to the driving pulley (12) and the driven pulley (13) facing each other through a connecting rod (15), a motor (16) is fixed on the frame (1), the output end of the motor (16) is fixedly connected to one of the driving pulleys (12) of one of the conveyor belt groups (10), and gears (17) are fixed to the ends of the two driving pulleys (12) of the other conveyor belt group (10), and the two gears (17) are meshed with each other.

3. The cooling device for lead-free reflow soldering according to claim 2, characterized in that: A first photoelectric sensor (18) and a second photoelectric sensor (19) are respectively installed on the frame (1) facing the reflow soldering conveyor line (2) and the cooling conveyor line (3); a controller (20) is installed on the frame (1); and the controller (20) is electrically connected to the first photoelectric sensor (18), the second photoelectric sensor (19), the first cylinder (4), and the second cylinder (7).

4. The cooling device for lead-free reflow soldering according to claim 1, wherein: The semiconductor refrigeration plate (9) and the electric heating aluminum plate (6) are both in a horizontal state.

5. The cooling device for lead-free reflow soldering according to claim 1, characterized in that: The frame (1) is in a U-shaped structure.

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