Grinding device and chemical mechanical grinding equipment

Abstract

The grinding device comprises a grinding table, a grinding pad and a liquid supply assembly, a plurality of liquid outlet holes are formed in the top face of the grinding table at intervals, the grinding pad is arranged on the top face of the grinding table, a plurality of penetrating holes are formed in the grinding pad in a penetrating mode, and the penetrating holes and the liquid outlet holes are arranged in a one-to-one correspondence mode. And the through holes are communicated with the corresponding liquid outlet holes. The liquid supply assembly is connected with the multiple liquid outlet holes and used for providing grinding liquid for the multiple liquid outlet holes, and the grinding liquid flows out of the different penetrating holes and flows to different areas of the surface of the grinding pad. Grinding liquid is provided for the liquid outlets through the liquid supply assembly, flows through the liquid outlets and the penetrating holes respectively and then flows out to different areas of the surface of the grinding pad, and the grinding liquid can be provided for the different areas of the surface of the grinding pad independently. And under the rotating action of the grinding table, the grinding liquid can be quickly diffused on the surface of the grinding pad, so that the distribution uniformity of the grinding liquid is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a grinding device and chemical mechanical grinding equipment. Background Art

[0002] Chemical Mechanical Polishing (CMP) equipment is a critical component of semiconductor wafer production. CMP, a process combining chemical etching and mechanical removal, is the only mechanical process capable of achieving global surface planarization. CMP equipment consists of a polishing unit and a cleaning unit. The polishing unit, comprising a polishing disc, polishing pad, polishing head, and polishing disc, works together to provide a stable process environment for the wafer. The cleaning unit cleans the wafer, removing residual surface particles and reaction complexes. The wafer is then dried before leaving the machine. The polishing unit is the most important component, as it is the site where global wafer surface planarization occurs.

[0003] The uniformity of slurry distribution significantly impacts the effectiveness of chemical mechanical polishing. Uneven slurry distribution can easily negatively impact wafer yield. In existing CMP equipment, the slurry nozzle is located above the polishing pad. This nozzle can only deliver slurry to a localized area on the pad surface, where it then relies on centrifugal force to disperse it. While this method is simple, the slurry distribution uniformity is often low. Furthermore, with this slurry supply mode, a large amount of slurry is directly ejected and does not participate in polishing, resulting in significant waste.

[0004] In view of this, it is necessary to provide a polishing device and a chemical mechanical polishing equipment to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a grinding device for improving the problem of low uniformity of grinding liquid distribution in the existing chemical mechanical grinding.

[0006] The utility model provides a grinding device, comprising: a grinding table, a grinding pad and a liquid supply component;

[0007] The top surface of the grinding table is provided with a plurality of liquid outlet holes at intervals;

[0008] The polishing pad is arranged on the top surface of the polishing table, and a plurality of through-holes are provided through the polishing pad, and the through-holes are arranged in a one-to-one correspondence with the liquid outlet holes, and the through-holes are connected to the corresponding liquid outlet holes;

[0009] The liquid supply components are respectively connected to the plurality of liquid outlet holes, and are used to respectively provide polishing liquid to the plurality of liquid outlet holes. The polishing liquid flows out from different perforations and flows to different areas of the polishing pad surface.

[0010] The beneficial effect of the grinding device provided by the present invention is that: by providing a plurality of liquid outlet holes on the grinding table and a plurality of perforations on the grinding pad, and by providing grinding liquid to the plurality of liquid outlet holes through the liquid supply assembly, the grinding liquid flows through the plurality of liquid outlet holes and the plurality of perforations, and then flows out to different areas of the surface of the grinding pad, thereby providing grinding liquid separately to different areas of the surface of the grinding pad. Under the action of the rotation of the grinding table, the grinding liquid can be quickly diffused on the surface of the grinding pad, thereby improving the uniformity of the distribution of the grinding liquid on the surface of the grinding pad.

[0011] In a possible embodiment, the liquid supply assembly includes a main pipeline and a plurality of branch pipelines arranged at intervals on the main pipeline, and each branch pipeline is provided with a valve;

[0012] The grinding device further includes a controller, which is respectively connected to each of the valves for control.

[0013] Its beneficial effect is that: according to the distribution of the polishing liquid on the surface of the polishing pad, each valve is individually controlled by the controller, and the flow rate of the polishing liquid in each branch pipeline can be individually controlled, thereby ensuring that the polishing liquid can be evenly distributed on the surface of the polishing pad.

[0014] In a possible embodiment, the grinding device further includes an angle sensor provided on the grinding table, wherein the angle sensor is used to detect a rotation angle of the grinding table;

[0015] The controller is connected to the angle sensor, and is further used to control and adjust the opening and closing of the valve according to the rotation angle of the grinding table and the position of the grinding head.

[0016] The beneficial effect is that the controller can determine the relative position between the grinding head and the grinding pad by using the angle sensor to detect the rotation angle of the grinding table in real time. The controller dynamically adjusts the opening and closing states of each valve based on the relative position between the two, ensuring that the appropriate amount of grinding fluid is always present under the grinding head and that the grinding fluid is evenly distributed, thereby ensuring the grinding quality of the wafer.

[0017] In a possible embodiment, the controller includes:

[0018] a data processing module connected to the angle sensor, the data processing module being configured to obtain an open area on the grinding table corresponding to a specified range based on the rotation angle of the grinding table, wherein the specified range is a range pre-set based on the position of the grinding head, and the grinding head is located within the specified range;

[0019] The control and regulation module is connected to the data processing module and each valve respectively. The control and regulation module is used to control the valves on the branch pipelines in the currently open area to open and the valves on the branch pipelines in other areas to close according to the data sent in real time by the data processing module.

[0020] Its beneficial effect is that: the position of the currently open area is judged in real time by the data processing module, and the valve on the branch pipeline of the currently open area is controlled to open according to the currently open area, that is, it is ensured that there is always an appropriate amount of grinding fluid under the wafer to ensure that the wafer is effectively ground. At the same time, the valves on the branch pipelines of the remaining areas except the currently open area are closed, which can reduce the waste of grinding fluid.

[0021] In a possible embodiment, the controller further includes:

[0022] A parameter adjustment module is connected to the data processing module, and is used for feedback-adjusting the processing parameters according to the grinding quality of the wafer, wherein the processing parameters include the specified range.

[0023] The beneficial effect is that the size of the specified range is adjusted by feedback according to the grinding quality of the wafer, thereby ensuring that the wafer has better grinding quality.

[0024] In a possible embodiment, the grinding device further includes a driving member connected to the grinding head, wherein the driving member is used to drive the grinding head to rotate;

[0025] The parameter adjustment module is also connected to the grinding head and the driving member respectively. The process parameters also include the pressure parameters of the grinding head on the wafer, the rotation speed of the grinding table, the rotation speed of the grinding head, and the position of the grinding head.

[0026] In a possible embodiment, the designated range is fan-shaped, the center of the designated range is the center of the polishing pad, and the radius of the designated range is equal to the radius of the polishing pad.

[0027] Its beneficial effect is that the size of the specified range is set according to the size of the polishing pad, so that during the rotation of the polishing table, the perforations on the polishing pad located within the radial direction range of the polishing head orientation can always provide polishing fluid, ensuring that there is sufficient polishing fluid for polishing within the contact range between the polishing pad and the wafer.

[0028] In a possible embodiment, the central angle of the designated range is in the range of 105°-190°.

[0029] The beneficial effect is that, by reasonably setting the center angle of the circle within the specified range according to actual process conditions, it is possible to ensure that the wafer achieves good grinding quality and grinding efficiency while saving the amount of grinding liquid used.

[0030] In a possible embodiment, the liquid outlet holes are in several groups;

[0031] Each group of the liquid outlet holes is distributed in a ring array, and several groups of the liquid outlet holes are distributed at intervals along the radial direction of the grinding table; or

[0032] Each group of the liquid outlet holes is distributed in a linear array, and several groups of the liquid outlet holes are distributed at intervals.

[0033] The beneficial effect is that by reasonably setting the arrangement mode and arrangement density of the liquid outlet holes, the wafer grinding quality and grinding efficiency can be improved, and the amount of grinding liquid used can be saved.

[0034] The utility model also provides a chemical mechanical polishing device, comprising: a polishing device and a polishing head as in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a cross-sectional view of a grinding device according to the present invention in one embodiment.

[0036] Figure 2 This is a schematic diagram of another embodiment of the grinding device of the present invention.

[0037] Figure 3 This is a logic block diagram of the controller, angle sensor, grinding head, valve, and driving component in the grinding device of the present invention.

[0038] Figure 4 It is a top view of the grinding head and grinding pad in the grinding device of the present invention.

[0039] Figure 5 It is a top view of a grinding table in a grinding device of the present invention in a specific embodiment.

[0040] Figure 6 It is a top view of the grinding table in the grinding device of the present invention in another specific embodiment.

[0041] Explanation of the accompanying reference numerals: 110, grinding table; 111, liquid outlet; 120, grinding pad; 121, perforation; 130, liquid supply component; 131, main line; 132, branch line; 133, valve; 140, controller; 141, data processing module; 142, control and adjustment module; 150, angle sensor; 143, parameter adjustment module; 200, grinding head; 300, drive member. DETAILED DESCRIPTION

[0042] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0043] In view of the problems existing in the prior art, the embodiments of the present invention provide a grinding device. Figure 1 This is a cross-sectional view of a grinding device according to the present invention in one embodiment. Figure 2 This is a schematic diagram of another embodiment of the grinding device of the present invention, see Figure 1 and Figure 2 The polishing device includes a polishing table 110, a polishing pad 120, and a liquid supply assembly 130. The top surface of the polishing table 110 is provided with a plurality of liquid outlet holes 111 at intervals. The polishing pad 120 is provided on the top surface of the polishing table 110. The polishing pad 120 is provided with a plurality of through-holes 121 extending therethrough. The through-holes 121 are provided in a one-to-one correspondence with the liquid outlet holes 111, and the through-holes 121 are connected to the corresponding liquid outlet holes 111. The liquid supply assembly 130 is connected to each of the liquid outlet holes 111 and is used to supply polishing liquid to each of the liquid outlet holes 111. The polishing liquid flows out from different through-holes 121 and flows to different areas on the surface of the polishing pad 120.

[0044] Compared to the prior art method in which the polishing liquid nozzle can only deliver the polishing liquid to a local area on the surface of the polishing pad 120 and then rely on centrifugal force to disperse it, in this embodiment, a plurality of liquid outlet holes 111 are provided on the polishing table 110, and a plurality of corresponding through-holes 121 are also provided on the polishing pad 120. The polishing liquid is supplied to the plurality of liquid outlet holes 111 by the liquid supply assembly 130. The polishing liquid can be diverted to the plurality of liquid outlet holes 111 located in different areas of the polishing table 110, and then further flows through the liquid outlet holes 111 to the corresponding through-holes 121, so that the polishing liquid can be delivered to different areas on the polishing pad 120. Under the action of the rotation of the polishing table 110, the polishing liquid distributed in different areas of the surface of the polishing pad 120 can quickly diffuse outward from the surface of the polishing pad 120, so that the polishing liquid can be widely spread on the surface of the polishing pad 120, thereby greatly improving the uniformity of the distribution of the polishing liquid. The uniform distribution of the grinding fluid will also improve the grinding quality of the wafer, thereby reducing rework and scrap caused by uneven grinding, thereby improving the yield of the wafer, improving production efficiency, and reducing production costs.

[0045] In one embodiment, see Figure 2The liquid supply assembly 130 includes a main line 131 and a plurality of branch lines 132 spaced apart on the main line 131. Each branch line 132 is provided with a valve 133. The grinding device further includes a controller 140, which is controlled and connected to each valve 133. In this embodiment, a separate valve 133 is provided for each branch line 132. The controller 140 controls each valve 133 individually to adjust the opening of the valve 133, thereby accurately and individually controlling the flow of the grinding liquid in each branch line 132. This means that according to different grinding processes and the current distribution of the grinding liquid on the surface of the grinding pad 120, the grinding liquid can be accurately distributed to different areas of the surface of the grinding pad 120 to ensure that the grinding liquid is evenly distributed on the entire surface of the grinding pad 120, thereby avoiding the problem of local over-grinding or local under-grinding on the wafer.

[0046] In a specific embodiment, Figure 3 This is a logic block diagram of the controller, angle sensor, grinding head, valve, and drive element in the grinding device of the present invention. Figure 3 The grinding device also includes an angle sensor 150 provided on the grinding table 110. The angle sensor 150 is used to detect the rotation angle of the grinding table 110. The controller 140 is connected to the angle sensor 150. The controller 140 is also used to control the opening and closing of the regulating valve 133 according to the rotation angle of the grinding table 110 and the position of the grinding head 200. In this embodiment, the rotation angle of the grinding table 110 is detected in real time by the angle sensor 150. The controller 140 adjusts the distribution of the grinding liquid in different areas of the surface of the grinding pad 120 by adjusting each valve 133 according to the relative position relationship between the grinding head 200 and the grinding pad 120, thereby ensuring the uniformity of the distribution of the grinding liquid under the wafer, thereby ensuring uniform grinding of the wafer surface and improving the wafer yield. At the same time, it can also reduce the waste of grinding liquid and reduce production costs.

[0047] In a preferred embodiment, Figure 4 This is a top view of the grinding head and grinding pad in the grinding device of the present invention, combined with Figure 3 and Figure 4The controller 140 includes: a data processing module 141, which is connected to the angle sensor 150. The data processing module 141 is used to obtain an open area corresponding to a specified range on the grinding table 110 based on the rotation angle of the grinding table 110, wherein the specified range is a range pre-set according to the position of the grinding head 200, and the grinding head 200 is located within the specified range; a control and adjustment module 142, which is respectively connected to the data processing module 141 and each valve 133. The control and adjustment module 142 is used to control the valve 133 on the branch pipeline 132 of the current open area to open and the valve 133 on the branch pipeline 132 of the remaining areas to close based on the data sent in real time by the data processing module 141. As the grinding table 110 rotates, the open area on the grinding pad 120 corresponding to the specified range also changes continuously. The control and adjustment module 142 controls the opening and closing of all valves 133 in real time.

[0048] In one embodiment, see Figure 4 , the designated range is in the shape of a sector, the center of the designated range is the center of the polishing pad 120, and the radius of the designated range is equal to the radius of the polishing pad 120. The designated range is a sector-shaped shape defined based on the center of the polishing pad 120 and the radius of the polishing pad 120. The designated range of the sector can correspond to a local area from the center of the polishing pad 120 to the edge of the polishing pad 120. Since the polishing head 200 is located within the designated range of the sector, during the rotation of the polishing table 110, all the through-holes 121 in the local area from the center of the polishing pad 120 to the edge of the polishing pad 120 are provided with polishing liquid, ensuring that there is sufficient polishing liquid in the local area and that the polishing liquid can be evenly distributed, thereby ensuring the polishing quality of the wafer.

[0049] In a specific embodiment, the central angle of the specified range is in the range of 105°-190°. If the specified range is set too large, although the wafer can be effectively ground under sufficient grinding liquid, the amount of grinding liquid used will be too large, resulting in a waste of grinding liquid. In this solution, a reasonable range of the specified range, that is, the central angle of the specified range, is set according to the actual process conditions. The specified range can ensure that the wafer achieves good grinding quality and grinding efficiency while reducing the amount of grinding liquid used, thereby reducing production costs.

[0050] See also Figure 4, which will be explained below with reference to specific examples. The azimuth positions of 0°, 90°, 180°, and 270° are defined in the circumferential direction, and the specified range is 90°-225°. The center angle of the specified range is 135°, and the grinding head 200 is located within the range of 90°-225°. It should be noted that the angles here can be understood as positioning positions at different orientations within the spatial range. The azimuth positions of each angle and the position of the grinding head 200 can also be flexibly set according to the actual process and are not limited here.

[0051] Combine Figure 2 and Figure 4 During grinding, the data processing module 141 detects the open areas within the range of 90°-225° on the current grinding table 110 in real time based on the rotation angle of the grinding table 110. The control and adjustment module 142 opens the valves 133 on the branch pipes 132 in the open areas within the range of 90°-225°, while closing the valves 133 on the branch pipes 132 in the remaining areas. It can be understood that for the area below the current grinding head 200 and the portion of the grinding pad 120 surrounding the current grinding head 200, the controller 140 can control the valves 133 corresponding to these open areas to open to supply grinding fluid, while closing the valves 133 in the other areas to prevent grinding fluid from being supplied. This can avoid the waste of grinding fluid caused by all the perforations 121 discharging fluid at the same time, thereby reducing production costs. Moreover, because the grinding fluid is supplied through multiple perforations 121 in the open areas, the uniformity of wafer grinding is ensured, thereby improving the grinding quality of the wafer.

[0052] In one embodiment, see Figure 3 The controller 140 also includes: a parameter adjustment module 143, which is connected to the data processing module 141, the grinding head 200 and the driving member 300. The parameter adjustment module 143 is used to feedback and adjust the processing parameters according to the grinding quality of the wafer, wherein the process parameters include a specified range.

[0053] The parameter adjustment module 143 will store the process parameters for each wafer processing. The parameter adjustment module 143 can feedback and adjust the relevant process parameters through analysis of the wafer grinding quality, and perform parameter tuning to obtain better wafer grinding quality and determine the process parameters that are more suitable for a certain processing technology. Taking the specified range as an example, the specified range directly affects the uniformity and adequacy of the grinding of the wafer surface. When the parameter adjustment module 143 finds through analysis that the current specified range is too small, the size of the specified range will be increased. Wafer grinding is performed according to the adjusted process parameters and the wafer grinding quality is analyzed. According to the analysis results, the size of the specified range is adjusted again until good wafer grinding quality is obtained, and the corresponding process parameters are stored.

[0054] In a specific embodiment, see Figure 3 The grinding device further includes a driving member 300 connected to the grinding head 200, and the driving member 300 is used to drive the grinding head 200 to rotate. The driving member 300 can be a motor, a rotary cylinder, etc. The parameter adjustment module 143 is also connected to the grinding head 200 and the driving member 300 respectively. The process parameters also include the pressure parameter of the grinding head 200 on the wafer, the rotation speed of the grinding table 110, the rotation speed of the grinding head 200, and the position of the grinding head 200.

[0055] In a specific embodiment, Figure 5 This is a top view of the grinding table 110 in a specific embodiment of the grinding device of the present invention, see Figure 5 The liquid outlet holes 111 are arranged in a plurality of groups, each group of liquid outlet holes 111 being arranged in a circular array, with the center of the circular array being the center of the polishing pad 120. The plurality of groups of liquid outlet holes 111 are spaced apart along the radial direction of the polishing table 110, i.e., the plurality of groups of liquid outlet holes 111 arranged in a circular array are arranged in concentric rings to cover the entire surface of the polishing pad 120. Each area of ​​the polishing pad 120 can be individually supplied with polishing liquid. By properly setting the arrangement and density of the liquid outlet holes 111, the wafer polishing quality and efficiency can be improved, and the amount of polishing liquid used can be reduced.

[0056] In another specific embodiment, Figure 6 This is a top view of the grinding table 110 in another embodiment of the grinding device of the present invention, see Figure 6 The liquid outlet holes 111 are arranged in a plurality of groups, each group of liquid outlet holes 111 being arranged in a linear array. The plurality of liquid outlet holes 111 are spaced apart to cover the entire surface of the polishing pad 120. Each area of ​​the polishing pad 120 can be individually supplied with polishing liquid. By properly configuring the arrangement and density of the liquid outlet holes 111, wafer polishing quality and efficiency can be improved, while also saving on polishing liquid usage.

[0057] The present invention further provides a chemical mechanical polishing device, comprising: a polishing device as in any of the above embodiments and a polishing head 200 .

[0058] The technical effects of the grinding device and chemical mechanical grinding equipment of the present invention are explained in detail below.

[0059] 1. By providing a plurality of liquid outlets 111 on the grinding table 110 and corresponding perforations 121 on the grinding pad 120, the liquid supply assembly 130 can supply grinding liquid to each of these liquid outlets 111. As the grinding table 110 rotates, the grinding liquid can quickly diffuse across the surface of the grinding pad 120. The grinding liquid can be evenly distributed across the surface of the grinding pad 120, ensuring that all areas of the wafer receive sufficient grinding liquid during the grinding process, ensuring grinding uniformity and thus improving grinding quality. By precisely controlling the flow and distribution of the grinding liquid, grinding liquid waste can be reduced and grinding efficiency can be improved.

[0060] 2. Each branch line 132 of the liquid supply assembly 130 is equipped with a valve 133, which is individually controlled by the controller 140. During the rotation of the grinding table 110, the rotation angle of the grinding table 110 is detected in real time by the angle sensor 150. The controller 140 dynamically adjusts the opening and closing states of each valve 133 based on the rotation angle of the grinding table 110 and the position of the grinding head 200, ensuring that an appropriate amount of grinding liquid is always present under the grinding head 200. As the grinding table 110 rotates, the controller 140 can adjust the supply of grinding liquid in real time to ensure that the distribution of the grinding liquid on the grinding pad 120 always meets the process requirements.

[0061] 3. Controller 140, which includes a data processing module 141 and a control and adjustment module 142, can determine the current open area position in real time and control the opening and closing of valve 133 as needed. By precisely controlling the opening and closing of valve 133, the polishing liquid can be more evenly distributed on the polishing pad 120, thereby improving the polishing quality of the wafer.

[0062] 4. The parameter adjustment module 143 can adjust the processing parameters according to the wafer grinding quality feedback, thereby continuously optimizing the grinding process and improving the uniformity and grinding efficiency of the wafer grinding.

[0063] 5. According to the size of the polishing pad 120 and the process requirements, the size and shape of the specified range are reasonably set to ensure that the wafer achieves good polishing quality and polishing efficiency while saving the use of polishing fluid and reducing production costs.

[0064] 6. By properly arranging the outlet holes 111, the polishing liquid can be more evenly distributed on the polishing pad 120, thereby improving the polishing quality. In addition, the proper arrangement of the outlet holes 111 can accelerate the diffusion of the polishing liquid and improve polishing efficiency. By optimizing the arrangement and density of the outlet holes 111, the amount of polishing liquid used can be reduced while maintaining polishing quality.

[0065] In the description of the present invention, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0066] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0067] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, unless otherwise specified, "plurality" means two or more.

[0068] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the claims. Furthermore, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meanings understood by persons of ordinary skill in the art to which the present invention pertains.

Claims

1. A grinding device, characterized in that: include: Polishing table, polishing pad and fluid supply assembly; The top surface of the grinding table is provided with a plurality of liquid outlet holes at intervals; The polishing pad is arranged on the top surface of the polishing table, and a plurality of through-holes are provided through the polishing pad, and the through-holes are arranged in a one-to-one correspondence with the liquid outlet holes, and the through-holes are connected to the corresponding liquid outlet holes; The liquid supply components are respectively connected to the plurality of liquid outlet holes, and are used to respectively provide polishing liquid to the plurality of liquid outlet holes. The polishing liquid flows out from different perforations and flows to different areas of the polishing pad surface.

2. The grinding device according to claim 1, characterized in that The liquid supply assembly includes a main pipeline and a plurality of branch pipelines arranged at intervals on the main pipeline, and each branch pipeline is provided with a valve; The grinding device further includes a controller, which is respectively connected to each of the valves for control.

3. The grinding device according to claim 2, characterized in that Also included is an angle sensor provided on the grinding table, the angle sensor being used to detect the rotation angle of the grinding table; The controller is connected to the angle sensor, and is further used to control and adjust the opening and closing of the valve according to the rotation angle of the grinding table and the position of the grinding head.

4. The grinding device according to claim 3, characterized in that The controller includes: a data processing module connected to the angle sensor, the data processing module being configured to obtain an open area on the grinding table corresponding to a specified range based on the rotation angle of the grinding table, wherein the specified range is a range pre-set based on the position of the grinding head, and the grinding head is located within the specified range; The control and regulation module is connected to the data processing module and each valve respectively. The control and regulation module is used to control the valves on the branch pipelines in the currently open area to open and the valves on the branch pipelines in other areas to close according to the data sent in real time by the data processing module.

5. The grinding device according to claim 4, characterized in that The controller further includes: A parameter adjustment module is connected to the data processing module, and is used for feedback-adjusting the processing parameters according to the grinding quality of the wafer, wherein the processing parameters include the specified range.

6. The grinding device according to claim 5, characterized in that Also included is a driving member connected to the grinding head, the driving member being used to drive the grinding head to rotate; The parameter adjustment module is also connected to the grinding head and the driving member respectively. The process parameters also include the pressure parameters of the grinding head on the wafer, the rotation speed of the grinding table, the rotation speed of the grinding head, and the position of the grinding head.

7. The grinding device according to claim 4, characterized in that The designated range is fan-shaped, the center of the designated range is the center of the polishing pad, and the radius of the designated range is equal to the radius of the polishing pad.

8. The grinding device according to claim 7, characterized in that The central angle of the designated range is in the range of 105°-190°.

9. The grinding device according to any one of claims 2 to 8, characterized in that The liquid outlet holes are divided into several groups; Each group of the liquid outlet holes is distributed in a ring array, and several groups of the liquid outlet holes are distributed at intervals along the radial direction of the grinding table; or Each group of the liquid outlet holes is distributed in a linear array, and several groups of the liquid outlet holes are distributed at intervals.

10. A chemical mechanical polishing device, characterized in that: include: The grinding device and grinding head according to any one of claims 1 to 9.

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