Circuit board gold plating system

Abstract

The utility model relates to the technical field of circuit boards, in particular to a circuit board gold plating system. The gold plating tank is used for containing gold plating liquid. And the hanging rack is at least partially and movably arranged above the gold plating tank, and the hanging rack is used for connecting a circuit board. The recovery device comprises a two-fluid nozzle and a pipeline. The pipeline extends in the length direction of the gold plating groove. The two-fluid nozzle is communicated with the pipeline and can spray gas-liquid mixed fluid to the circuit board. According to the recycling device, the gas-liquid mixed fluid can be sprayed to the circuit board connected to the hanging frame through the two fluid nozzles. Water drops can be formed after the gas-liquid mixed fluid is sprayed to the circuit board, so that the gold plating liquid remaining on the circuit board can be driven to flow downwards along the circuit board and then returns to the gold plating tank, and recovery of the gold plating liquid is completed.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board gold plating system. Background Art

[0002] Circuit boards are crucial electronic components, serving as the electrical connections between electronic components. During the PCB manufacturing process, gold plating is necessary to enhance their wear and corrosion resistance, as well as their connectivity. During the PCB gold plating process, a rack holding the PCBs is placed in a plating tank for gold plating. Once the plating is complete, the rack is removed.

[0003] In the related art, excess gold plating liquid is consumed during the process of lifting the rack. Utility Model Content

[0004] The main purpose of the utility model is to provide a circuit board gold plating system to reduce the loss of gold plating liquid during the process of raising the hanger.

[0005] To achieve the above-mentioned purpose, the present invention proposes a circuit board gold plating system, comprising:

[0006] Gold plating tank, used to contain gold plating liquid;

[0007] a hanger, at least partially movably disposed above the gold plating tank, the hanger being used to connect to the circuit board, and the hanger being capable of moving from a first height to a second height to lift the circuit board;

[0008] The recovery device includes a two-fluid nozzle and a pipeline, wherein the pipeline extends along the length direction of the gold plating tank, the two-fluid nozzle is connected to the pipeline, and the two-fluid nozzle can spray a gas-liquid mixed fluid onto the circuit board.

[0009] The circuit board gold plating system according to the embodiment of the present application has at least the following beneficial effects:

[0010] In the embodiments of the present application, the circuit board gold plating system includes a recovery device that can spray a gas-liquid mixture onto the circuit board connected to the rack via a two-fluid nozzle. When the gas-liquid mixture is sprayed onto the circuit board, it forms water droplets, which can drive the gold plating liquid remaining on the circuit board to flow downward along the circuit board and then back to the gold plating tank, completing the recovery of the gold plating liquid. Furthermore, the ambient temperature of the circuit board gold plating system is relatively high, and the liquid in the gold plating tank is prone to evaporation, which affects the concentration of the gold plating liquid. The recovery device sprays the gas-liquid mixture to replenish the gold plating liquid in the gold plating tank, and the replenishment method has a high degree of automation.

[0011] In some embodiments, when the rack is located at the second height, the recovery device is located on a side of the rack facing the gold plating tank.

[0012] In some embodiments, along the vertical direction, the distance between the recovery device and the gold plating tank ranges from 15 cm to 20 cm.

[0013] In some embodiments, the spraying direction of the two-fluid nozzle is inclined downward.

[0014] In some embodiments, the angle between the spraying direction of the two-fluid nozzle and the horizontal plane is in the range of 25° to 45°.

[0015] In some embodiments, there are multiple two-fluid nozzles, and the multiple two-fluid nozzles are spaced apart along the length direction of the pipe, and the distance between two adjacent two-fluid nozzles ranges from 11 cm to 13 cm.

[0016] In some embodiments, there are multiple recovery devices, and at least two of the recovery devices are located on both sides of the rack along the width direction of the gold plating tank.

[0017] In some embodiments, along the width direction of the gold plating tank, the distance between the two-fluid nozzle and the hanger ranges from 8 cm to 12 cm.

[0018] In some embodiments, the vertical movement speed of the rack is configured to be 20 cm / s to 22 cm / s.

[0019] In some embodiments, the recovery device also includes a first valve and a second valve, the pipeline has a liquid inlet channel and an air inlet channel, the first valve and the second valve are respectively arranged in the liquid inlet channel and the air inlet channel, when the first valve and the second valve are both in an open state, the two-fluid nozzle can spray a gas-liquid mixed fluid, when the first valve is in a closed state and the second valve is in an open state, the two-fluid nozzle can spray gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0021] Figure 1 This is a simplified structural diagram of a circuit board gold plating system according to an embodiment of the present application;

[0022] Figure 2 This is a simplified structural diagram of a circuit board gold plating system according to an embodiment of the present application.

[0023] Description of Figure Numbers:

[0024] 100. Gold plating tank; 200. Hanging rack; 300. Circuit board; 400. Recovery device; 410. Two-fluid nozzle; 420. Pipeline.

[0025] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0026] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions.

[0028] In the description of the embodiments of this application, the technical terms "first," "second," "third," etc. are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise specifically defined.

[0029] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0030] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0031] In the description of the embodiments of the present application, the orientations or positional relationships indicated by technical terms such as "top", "bottom", "upper", and "lower" are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed, operated, or used in a specific orientation. Therefore, they cannot be understood as limitations on the embodiments of the present application.

[0032] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0033] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the technical term "contact" should be understood in a broad sense, and can be direct contact, contact through an intermediate medium layer, contact with essentially no interaction force between the two contacting parties, or contact with interaction force between the two contacting parties.

[0034] In related art, a gold plating tank is filled with gold plating liquid, and a circuit board is connected to a hanger, enabling it to be moved vertically relative to the tank. After the circuit board is plated, the hanger moves the circuit board out of the tank. During this process, the gold plating liquid may adhere to the surface of the circuit board, resulting in loss of the gold plating liquid and increased manufacturing costs.

[0035] In an embodiment of the present application, the gold plating system of the circuit board 300 is provided with a recovery device 400, which can spray a gas-liquid mixed fluid to the circuit board 300 through a two-fluid nozzle 410, thereby recovering the gold plating liquid remaining on the circuit board 300 into the gold plating tank 100.

[0036] On the one hand, this application provides a circuit board 300 gold plating system, see Figure 1 and Figure 2The gold plating system for the circuit board 300 includes a gold plating tank 100, a hanger 200 and a recovery device 400. The gold plating tank 100 is used to contain the gold plating liquid. The hanger 200 is at least partially movably arranged above the gold plating tank 100, and the hanger 200 is used to connect the circuit board 300. The hanger 200 can move from a first height to a second height to lift the current board. The recovery device 400 includes a two-fluid nozzle 410 and a pipe 420. The pipe 420 extends along the length direction of the gold plating tank 100. The two-fluid nozzle 410 is connected to the pipe 420, and the two-fluid nozzle 410 can spray a gas-liquid mixed fluid onto the circuit board 300.

[0037] The gold plating solution refers to a solution containing gold elements, and the gold plating solution can plate part of the structure of the circuit board 300 with gold.

[0038] Exemplarily, the circuit board 300 is detachably connected to the hanger 200 , and the circuit board 300 can be removed from the hanger 200 after the gold plating operation is completed.

[0039] For example, the liquid in the pipe 420 is pure water or distilled water. Fewer impurities in the liquid can reduce the gold plating effect on the circuit board 300 during the spraying process and the impact of the liquid flowing back into the gold plating tank 100 on the gold plating solution.

[0040] For example, the length direction of the gold plating tank 100 is as follows: Figure 2 The direction indicated by the arrow R2.

[0041] In the embodiment of the present application, the circuit board 300 gold plating system includes a recovery device 400, which can spray a gas-liquid mixed fluid onto the circuit board 300 connected to the rack 200 through a two-fluid nozzle 410. After the gas-liquid mixed fluid is sprayed onto the circuit board 300, it forms water droplets, which can drive the gold plating liquid remaining on the circuit board 300 to flow downward along the circuit board 300 and then return to the gold plating tank 100, completing the recovery of the gold plating liquid. Furthermore, the ambient temperature of the circuit board 300 gold plating system is relatively high, and the liquid in the gold plating tank 100 is prone to evaporation, thereby affecting the concentration of the gold plating liquid. The recovery device 400 sprays the gas-liquid mixed fluid to replenish the gold plating liquid in the gold plating tank 100, and the water replenishment method has a high degree of automation.

[0042] In one embodiment, please refer to Figure 1 and Figure 2 When the rack 200 is located at the second height, the recovery device 400 is located on the side of the rack 200 facing the gold plating tank 100 .

[0043] Exemplarily, when the rack 200 is located at the second height, the recovery device 400 is located below the rack 200 .

[0044] For example, the up and down directions are as follows Figure 1The direction indicated by the arrow R1.

[0045] In the embodiment of the present application, the recovery device 400 is located on the side of the rack 200 facing the gold plating tank 100. As the rack 200 moves the circuit board 300, the two-fluid nozzle 410 can spray from the top to the bottom of the circuit board 300. The surface of the circuit board 300 can be sprayed with the gas-liquid mixed fluid more completely, thereby improving the recovery effect of the recovery device 400.

[0046] It is understood that the embodiments of the present application do not limit the positional relationship between the recovery device 400 and the rack 200. For example, when the rack 200 is at the second height, the recovery device 400 is located on the side of the rack 200 facing away from the gold plating tank 100, and the two-fluid nozzle 410 is tilted downward to spray the circuit board 300.

[0047] In one embodiment, please refer to Figure 1 In the vertical direction, the distance between the recovery device 400 and the gold plating tank 100 ranges from 15 cm to 20 cm.

[0048] Exemplarily, along the vertical direction, the distance between the recovery device 400 and the gold plating tank 100 is 15 cm, 16 cm, 17 cm, 18 cm, 19 cm or 20 cm.

[0049] It is understandable that the distance between the recovery device 400 and the gold plating tank 100 can be measured with a ruler under normal temperature and pressure.

[0050] For example, in the vertical direction, the distance between the recovery device 400 and the gold plating tank 100 is as follows: Figure 1 Medium size D1 shown.

[0051] In the solution of the embodiment of the present application, along the vertical direction, the distance between the recovery device 400 and the gold plating tank 100 is within an appropriate range to take into account the recovery effect of the recovery device 400 and reduce the extent to which the circuit board 300 causes the gold plating liquid to contaminate the recovery device 400 during the lifting process of the circuit board 300.

[0052] It is understandable that the embodiments of the present application do not limit the distance between the recovery device 400 and the gold plating tank 100 in the vertical direction.

[0053] In one embodiment, please refer to Figure 1 , the spraying direction of the two-fluid nozzle 410 is inclined downward.

[0054] In the embodiment of the present application, the spray direction of the two-fluid nozzle 410 is tilted downward. When the two-fluid nozzle 410 sprays the gas-liquid mixture, the liquid, upon contacting the circuit board 300, flows smoothly toward the gold plating tank 100 under the influence of gravity. This downward spray direction reduces upward splashing of the liquid, which can cause residual gold plating liquid on the circuit board 300 to permeate the environment.

[0055] It is understood that the embodiments of the present application do not limit the arrangement of the spraying direction of the two-fluid nozzle 410. For example, the spraying direction of the two-fluid nozzle 410 can be arranged horizontally.

[0056] In one embodiment, please refer to Figure 1 The angle between the spraying direction of the two-fluid nozzle 410 and the horizontal plane is in the range of 25° to 45°.

[0057] Exemplarily, the angle between the spraying direction of the two-fluid nozzle 410 and the horizontal plane is 25°, 30°, 35°, 40° or 45°.

[0058] For example, the angle between the spray direction of the two-fluid nozzle 410 and the horizontal plane is as follows: Figure 1 As shown in the middle angle θ1.

[0059] It is understandable that the angle between the spraying direction of the two-fluid nozzle 410 and the horizontal plane can be measured by a protractor under normal temperature and pressure.

[0060] In the solution of the embodiment of the present application, the angle between the spraying direction of the two-fluid nozzle 410 and the horizontal plane is within an appropriate range, which can ensure that the gas-liquid mixed fluid sprayed by the two-fluid nozzle 410 can act better on the circuit board 300 and the degree of splashing of the fluid after impacting the circuit board 300 is relatively small.

[0061] It is understandable that the embodiments of the present application do not limit the size of the angle between the spraying direction of the two-fluid nozzle 410 and the horizontal plane.

[0062] In one embodiment, please refer to Figure 2 There are multiple two-fluid nozzles 410, and the multiple two-fluid nozzles 410 are arranged at intervals along the length direction of the pipeline 420. The distance between two adjacent two-fluid nozzles 410 ranges from 11 cm to 13 cm.

[0063] Exemplarily, the distance between two adjacent two-fluid nozzles 410 is 11 cm, 12 cm, or 13 cm.

[0064] It is understandable that the distance between two adjacent two-fluid nozzles 410 can be measured using a ruler under normal temperature and pressure.

[0065] For example, the distance between two adjacent two-fluid nozzles 410 is as follows: Figure 2 Medium size D2 shown.

[0066] In the embodiment of the present application, multiple two-fluid nozzles 410 are spaced apart along the length of the pipe 420. These nozzles 410 can spray a wide circuit board 300 or multiple circuit boards 300 arranged side by side at once, resulting in a high recovery efficiency for the recovery device 400. Furthermore, the spacing between two adjacent two-fluid nozzles 410 is within an appropriate range, ensuring both the recovery efficiency of the two-fluid nozzles 410 and the spraying area of ​​the two-fluid nozzles 410.

[0067] It is understood that the embodiments of the present application do not limit the number of the two-fluid nozzles 410. For example, the number of the two-fluid nozzles 410 can be single.

[0068] In one embodiment, please refer to Figure 1 There are multiple recovery devices 400 , and at least two recovery devices 400 are located on both sides of the rack 200 along the width direction of the gold plating tank 100 .

[0069] Exemplarily, along the width direction of the gold plating tank 100 , the circuit board 300 is located between the two recovery devices 400 , and the two recovery devices 400 are arranged in parallel.

[0070] For example, the width direction of the gold plating tank 100 is as follows: Figure 1 The direction indicated by the arrow R3.

[0071] In the embodiment of the present application, at least two recovery devices 400 are located on either side of the rack 200 along the width of the gold plating tank 100. The recovery devices 400 can spray the two large surfaces of the circuit board 300, thereby flushing as much gold plating liquid as possible from the circuit board 300 into the gold plating tank 100.

[0072] It is understood that the embodiments of the present application do not limit the number of the recovery device 400. For example, the number of the recovery device 400 can be single, and the rack 200 can be rotated so that the recovery device 400 sprays two large surfaces of the circuit board 300.

[0073] In one embodiment, please refer to Figure 1 Along the width direction of the gold plating tank 100 , the distance between the two-fluid nozzle 410 and the rack 200 ranges from 8 cm to 12 cm.

[0074] For example, along the width direction of the gold plating tank 100 , the distance between the two-fluid nozzle 410 and the rack 200 is 8 cm, 9 cm, 10 cm, 11 cm or 12 cm.

[0075] It is understandable that the distance between the two-fluid nozzle 410 and the rack 200 can be measured with a ruler under normal temperature and pressure.

[0076] For example, the distance between the two fluids and the rack 200 is as follows: Figure 1 Medium size D3 shown.

[0077] In the embodiment of the present application, the gas-liquid mixed fluid diffuses through the two-fluid nozzle 410 to spray the circuit board 300. The closer the distance between the two-fluid nozzle 410 and the rack 200, the greater the impact of the fluid on the circuit board 300. The spacing between the two-fluid nozzle 410 and the rack 200 within an appropriate range ensures a balanced spray area for the two-fluid nozzle 410 and a high impact on the circuit board 300.

[0078] It is understandable that the embodiments of the present application do not limit the spacing between the two-fluid nozzles 410 and the racks 200 along the width direction of the gold plating tank 100 .

[0079] In one embodiment, the vertical movement speed of the rack 200 is configured to be 20 cm / s to 22 cm / s.

[0080] Exemplarily, the moving speed of the rack 200 in the vertical direction is configured to be 20 cm / s, 21 cm / s or 22 cm / s.

[0081] In the solution of the embodiment of the present application, the moving speed of the rack 200 in the vertical direction can take into account both the recycling effect of the recycling device 400 and the processing efficiency of the gold plating system of the circuit board 300 within an appropriate range.

[0082] It is understandable that the embodiments of the present application do not limit the moving speed of the rack 200 in the vertical direction.

[0083] In one embodiment, the recovery device 400 also includes a first valve and a second valve, the pipeline 420 has a liquid inlet channel and an air inlet channel, the first valve and the second valve are respectively arranged in the liquid inlet channel and the air inlet channel, when the first valve and the second valve are both in the open state, the two-fluid nozzle 410 can spray a gas-liquid mixed fluid, when the first valve is in the closed state and the second valve is in the open state, the two-fluid nozzle 410 can spray gas.

[0084] For example, when the rack 200 moves from the first height to the second height, it passes through a third height, which is between the first height and the second height. When the rack 200 passes through the third height, the first valve is controlled to close, so that the two-fluid nozzle 410 sprays gas, thereby blowing the liquid on the circuit board 300 into the gold plating tank 100.

[0085] In the embodiment of the present application, the recovery device 400 is equipped with a first valve and a second valve to control the liquid inlet and air inlet, respectively. After the rack 200 moves to a certain height, the first valve is closed, so that the two-fluid nozzle 410 only sprays air. This allows the liquid on the circuit board 300 to be blown into the gold plating tank 100 as much as possible, reducing the amount of liquid remaining on the circuit board 300 and further minimizing gold plating liquid loss.

[0086] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of protection.

Claims

1. A circuit board gold plating system, characterized in that: include: Gold plating tank, used to contain gold plating liquid; a hanger, at least partially movably disposed above the gold plating tank, the hanger being used to connect to the circuit board, and the hanger being capable of moving from a first height to a second height to lift the circuit board; The recovery device includes a two-fluid nozzle and a pipeline, wherein the pipeline extends along the length direction of the gold plating tank, the two-fluid nozzle is connected to the pipeline, and the two-fluid nozzle can spray a gas-liquid mixed fluid onto the circuit board.

2. The circuit board gold plating system according to claim 1, characterized in that: When the rack is located at the second height, the recovery device is located on a side of the rack facing the gold plating tank.

3. The circuit board gold plating system according to claim 1, characterized in that: In the vertical direction, the distance between the recovery device and the gold plating tank ranges from 15 cm to 20 cm.

4. The circuit board gold plating system according to any one of claims 1 to 3, characterized in that: The spraying direction of the two-fluid nozzle is inclined downward.

5. The circuit board gold plating system according to claim 4, characterized in that: The angle between the spraying direction of the two-fluid nozzle and the horizontal plane is in the range of 25° to 45°.

6. The circuit board gold plating system according to any one of claims 1 to 3, characterized in that: There are multiple two-fluid nozzles, and the multiple two-fluid nozzles are arranged at intervals along the length direction of the pipeline. The distance between two adjacent two-fluid nozzles ranges from 11 cm to 13 cm.

7. The circuit board gold plating system according to any one of claims 1 to 3, characterized in that: There are multiple recovery devices, and at least two of the recovery devices are located on both sides of the rack along the width direction of the gold plating tank.

8. The circuit board gold plating system according to any one of claims 1 to 3, characterized in that: Along the width direction of the gold plating tank, the distance between the two-fluid nozzle and the hanger ranges from 8 cm to 12 cm.

9. The circuit board gold plating system according to any one of claims 1 to 3, characterized in that: The moving speed of the hanger in the vertical direction is configured to be 20 cm / s~22 cm / s.

10. The circuit board gold plating system according to any one of claims 1 to 3, characterized in that: The recovery device also includes a first valve and a second valve. The pipeline has a liquid inlet channel and an air inlet channel. The first valve and the second valve are respectively arranged in the liquid inlet channel and the air inlet channel. When the first valve and the second valve are both in an open state, the two-fluid nozzle can spray a gas-liquid mixed fluid. When the first valve is in a closed state and the second valve is in an open state, the two-fluid nozzle can spray gas.

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