Thin film probe card horizontal adjusting device

Abstract

The utility model relates to the technical field of horizontal adjustment, in particular to a horizontal adjustment device for a film probe card. Comprising a supporting seat, a supporting block, a detection table, an observation assembly, supporting frames, an electric sliding table and the like, the supporting seat is connected with the supporting block, the supporting block is connected with the detection table, the rear side of the supporting seat is connected with the observation assembly in a screw mode, and telescopic rods of two electric push rods are connected with the supporting frames. The two supporting frames are connected with electric sliding tables through screws. Movement of the probe body is observed and controlled in real time through the observation assembly, accurate contact of the probe body is ensured, when a semiconductor is locally uneven, the electric push rod is started, when the surface of the semiconductor is sunken downwards, a telescopic rod of the electric push rod moves downwards for adjustment, and when the surface of the semiconductor protrudes upwards, the telescopic rod of the electric push rod moves upwards for adjustment. And parts such as the support frame, the electric sliding table and the detector are driven to move synchronously so as to compensate the unevenness of the surface and ensure that a probe always keeps good contact with a test point.

Description

Technical Field

[0001] The utility model relates to the technical field of level adjustment, in particular to a thin film probe card level adjustment device. Background Art

[0002] Thin film probe cards are a key component in semiconductor testing, mainly used to test the electrical performance of integrated circuit chips during the wafer manufacturing process. Thin film probe cards are designed to test the electrical characteristics of each chip before the wafer is cut into individual chips. This test is called wafer-level testing, also known as wafer probing or wafer testing.

[0003] When adjusting the thin film probe card horizontally, some devices can only move upward or left and right, but not both at the same time. The thin film probe card can only be adjusted in a single direction, and effective contact between the probe and the chip surface is difficult to ensure. If there is local unevenness on the chip surface or the probe position needs fine-tuning, the adjustment in a single direction cannot meet the requirements of precise alignment. The lack of multi-directional adjustment function means that the probe card may not be able to be accurately aligned with the test point, which directly affects the test accuracy. The thin film probe card cannot be flexibly adjusted, and it may not be possible to form effective contact between the probe and the chip surface, resulting in the inability to guarantee the test accuracy of the probe card.

[0004] In summary, there is an urgent need for a thin film probe card level adjustment device that can be adjusted in multiple directions to solve the above problems. Utility Model Content

[0005] In order to overcome the disadvantage that the thin film probe card can only be adjusted in a single direction and effective contact between the probe and the chip surface is difficult to ensure, the utility model provides a thin film probe card horizontal adjustment device that can be adjusted in multiple directions.

[0006] The technical implementation plan of the present utility model is: a thin film probe card horizontal adjustment device, including a support seat, a support block, a detection platform, an observation component, a support frame, an electric slide, a detector, a probe body, an electric push rod and a dust cover, the support seat is connected to the support block, the support block is connected to the detection platform, the rear side of the support seat is connected to the observation component by means of screws, the left and right sides of the support seat are connected to the dust cover, the interior of the two dust cover are installed with electric push rods, the telescopic rods of the two electric push rods are connected to the support frame, the two support frames are connected to the electric slide by means of screws, the two sliders on the two electric slides are connected to the detector by screws, and the four detectors are connected to the probe body.

[0007] Optionally, it also includes a scanner, a display screen and a controller. The scanners are symmetrically installed on the front, back, left and right sides of the support block. The display screen is connected to the support block by screws. The controller is installed on the front side of the support block, and the scanner, display screen and controller are electrically connected to each other.

[0008] Optionally, it also includes a support box, a connecting pipe, a dust collection shell, a pull-out box, a motor, fan blades and a protective net. The right side of the support seat is connected to the support box, the rear side of the support block is connected to the dust collection shell by screws, a connecting pipe is connected between the dust collection shell and the support box, a pull-out box is slidably connected to the support box, a motor is installed on the side away from the support box, the fan blades are connected to the output shaft of the motor, and the rear side of the support box is connected to the protective net.

[0009] Optionally, a protective shell is further included, and the rear side of the support seat is connected to the protective shell.

[0010] Optionally, a protective shell is further included, and the outer sides of the four scanners are connected to the protective shell by screws.

[0011] Optionally, anti-slip strips are also included, and three anti-slip strips are connected to the testing platform.

[0012] Compared with the existing technology, the utility model has the following advantages: 1. The movement of the probe body is observed and controlled in real time through the observation component to ensure its accurate contact. When the semiconductor is locally uneven, the electric push rod is started. When the semiconductor surface is concave, the telescopic rod of the electric push rod moves downward for adjustment. When the semiconductor surface is convex upward, the telescopic rod of the electric push rod moves upward for adjustment, driving the support frame, electric slide, detector and other components to move synchronously to compensate for the unevenness of the surface and ensure that the probe always maintains good contact with the test point.

[0013] 2. By turning on the scanner to operate, the scanner can monitor the moving distance of the slider on the electric slide and the lifting distance of the telescopic rod of the electric push rod. The data collected by the scanner will be transmitted to the controller, and the controller will then send this data to the display screen, and observe the data displayed on the display screen.

[0014] 3. By starting the output shaft of the motor to rotate and drive the fan blades to operate, airflow is generated, and the dust in the probe area is sucked into the dust collection housing. The dust enters the support box through the connecting pipe with the airflow and finally falls into the pull-out box. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model.

[0016] Figure 2 It is a three-dimensional cross-sectional view of the support base, detection platform and observation assembly of the utility model.

[0017] Figure 3 This is a three-dimensional cross-sectional view of the electric slide, detector and probe body of the utility model.

[0018] Figure 4 It is a three-dimensional cross-sectional view of the scanner, display screen and controller of the utility model.

[0019] Figure 5 It is a three-dimensional cross-sectional view of the connecting pipe, dust collection shell and pull-out box of the utility model.

[0020] Figure 6 This is a three-dimensional cross-sectional view of the motor, fan blades and protective net of the utility model.

[0021] The meaning of the reference numerals in the figure: 1: support base, 2: support block, 3: detection table, 4: observation component, 5: support frame, 6: electric slide, 7: detector, 701: probe body, 8: electric push rod, 9: dustproof cover, 10: scanner, 11: display screen, 12: controller, 13: support box, 14: connecting pipe, 15: dust suction shell, 16: pull-out box, 17: motor, 18: fan blade, 19: protective net, 20: protective shell, 21: protective shell, 22: anti-slip strip. DETAILED DESCRIPTION

[0022] To make the objectives, technical solutions, and advantages of the present invention more clearly apparent, the present invention will be further described in detail below with reference to the accompanying drawings. It is hereby stated that any directional terms such as "up," "down," "left," "right," "front," "back," "inside," and "outside" that appear or will appear in this document are based solely on the accompanying drawings and are not intended to limit the present invention.

[0023] Example 1

[0024] Thin film probe card leveling device, such as Figure 1-Figure 5 As shown, it includes a support base 1, a support block 2, a detection table 3, an observation component 4, a support frame 5, an electric slide 6, a detector 7, a probe body 701, an electric push rod 8 and a dustproof shell 9. The support base 1 is fixedly connected to the support block 2, and the support block 2 is fixedly connected to the detection table 3 for placing semiconductors. The rear side of the support base 1 is connected to the observation component 4 for observing semiconductors by screws. The left and right sides of the support base 1 are fixedly connected to the dustproof shell 9, and the interiors of the two dustproof shells 9 are installed with electric push rods 8 with adjustable heights. The telescopic rods of the two electric push rods 8 are fixedly connected to the support frame 5, and the two support frames 5 are connected to the electric slide 6 by screws. The two sliders on the two electric slides 6 are connected to the detector 7 by screws, and the four detectors 7 are fixedly connected to the probe body 701.

[0025] When it is necessary to test the electrical characteristics of a semiconductor, the staff first places the semiconductor on the test table 3 and contacts the probe body 701 with the surface of the semiconductor to perform an electrical characteristics test. However, during the test, the probe body 701 may not be aligned with the test point of the semiconductor or the semiconductor may be locally uneven, which will affect the contact quality between the probe body 701 and the semiconductor surface. The staff uses the observation component 4 to monitor the contact between the probe body 701 and the semiconductor surface. When the probe body 701 is not in accurate contact with the semiconductor test point, the staff starts the electric slide 6. The slider on the electric slide 6 drives the detector 7 and the probe body 701 to move back and forth to adjust the test alignment between the probe body 701 and the semiconductor. Point contact position, and the staff can observe and control the movement of the probe body 701 in real time through the observation component 4 to ensure its accurate contact. When the semiconductor is locally uneven, the staff starts the electric push rod 8. When the semiconductor surface is concave, the telescopic rod of the electric push rod 8 moves downward for adjustment. When the semiconductor surface is convex upward, the telescopic rod of the electric push rod 8 moves upward for adjustment, thereby driving the support frame 5, the electric slide 6, the detector 7 and other components to move synchronously to compensate for the unevenness of the surface, ensuring that the probe always maintains good contact with the test point, and adjusting the position of the thin film probe card can achieve more accurate testing, ensure the validity and reliability of the test results, and protect the semiconductor and the probe body 701 from damage.

[0026] Example 2

[0027] On the basis of Example 1, Figure 4 As shown, it also includes a scanner 10, a display screen 11 and a controller 12. The scanner 10 is symmetrically installed on the front, back, left and right sides of the support block 2. The display screen 11 is connected to the support block 2 by screws. The controller 12 is installed on the front side of the support block 2, and the scanner 10, the display screen 11 and the controller 12 are electrically connected to each other.

[0028] In order to ensure that the position of the probe body 701 moves more accurately, the staff can turn on the scanner 10 to operate. The scanner 10 can monitor the moving distance of the slider on the electric slide 6 and the lifting distance of the telescopic rod of the electric push rod 8. The data collected by the scanner 10 will be transmitted to the controller 12, and the controller 12 will send this data to the display screen 11. By observing the data displayed on the display screen 11, the staff can further control the operation of the electric slide 6 and the electric push rod 8.

[0029] like Figure 5 and Figure 6As shown, it also includes a support box 13, a connecting pipe 14, a dust collection shell 15, a pull-out box 16, a motor 17, fan blades 18 and a protective net 19. The right side of the support base 1 is fixedly connected to the support box 13, and the rear side of the support block 2 is connected to the dust collection shell 15 by screws. A connecting pipe 14 for collecting dust is fixedly connected between the dust collection shell 15 and the support box 13. A pull-out box 16 for storing dust is slidably connected to the support box 13. A motor 17 is installed on the side away from the support box 13. The fan blades 18 are fixedly connected to the output shaft of the motor 17, and the protective net 19 is fixedly connected to the rear side of the support box 13.

[0030] When the thin film probe card is used to test the electrical performance of the semiconductor, dust or particulate pollution may be generated. The staff can start the motor 17. The output shaft of the motor 17 rotates to drive the fan blades 18 to operate, generating airflow to suck the dust in the probe area into the dust collection shell 15. Then, the dust enters the support box 13 through the connecting pipe 14 with the airflow, and finally falls into the pull-out box 16, thereby falling into the pull-out box 16. The protective net 19 can be used to block larger particles and prevent dust from escaping from the support box 13. When the pull-out box 16 is filled with a certain amount of dust, the staff can pull the pull-out box 16 outward to collect or clean the dust in the pull-out box 16. When there is no need to clean the dust, the staff can turn off the motor 17.

[0031] like Figure 5 As shown, a protective shell 20 is also included. The rear side of the support base 1 is fixedly connected with the protective shell 20. The protective shell 20 can completely cover the motor 17 to prevent the motor 17 from being damaged.

[0032] like Figure 4 As shown, a protective shell 21 is also included. The outer sides of the four scanners 10 are connected to the protective shell 21 by screws. The protective shell 21 can protect the scanner 10 and prevent the operation of the scanner 10 from being affected by dust when the scanner 10 is working.

[0033] like Figure 2 As shown, anti-slip strips 22 are also included. Three anti-slip strips 22 are fixedly connected to the testing platform 3. The anti-slip strips 22 can effectively prevent unnecessary movement of the semiconductor by increasing surface friction.

[0034] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A thin film probe card level adjustment device, characterized by: The invention comprises a support base (1), a support block (2), a detection platform (3), an observation component (4), a support frame (5), an electric slide (6), a detector (7), a probe body (701), an electric push rod (8) and a dustproof shell (9), wherein the support base (1) is connected to the support block (2), the support block (2) is connected to the detection platform (3), the rear side of the support base (1) is connected to the observation component (4) by means of screws, the left and right sides of the support base (1) are connected to the dustproof shell (9), the electric push rods (8) are installed inside the two dustproof shells (9), the telescopic rods of the two electric push rods (8) are connected to the support frame (5), the two support frames (5) are connected to the electric slide (6) by means of screws, the two sliders on the two electric slides (6) are connected to the detector (7) by means of screws, and the four detectors (7) are connected to the probe body (701).

2. The thin film probe card level adjustment device according to claim 1, wherein: The invention also includes a scanner (10), a display screen (11) and a controller (12), wherein the scanner (10) is symmetrically mounted on the front, back, left and right sides of the support block (2), the display screen (11) is connected to the support block (2) by screws, the controller (12) is mounted on the front side of the support block (2), and the scanner (10), the display screen (11) and the controller (12) are electrically connected to each other.

3. The thin film probe card level adjustment device according to claim 2, wherein: The utility model also includes a support box (13), a connecting pipe (14), a dust collection shell (15), a pull-out box (16), a motor (17), a fan blade (18) and a protective net (19); the right side of the support seat (1) is connected to the support box (13); the rear side of the support block (2) is connected to the dust collection shell (15) by means of screws; the connecting pipe (14) is connected between the dust collection shell (15) and the support box (13); the pull-out box (16) is slidably connected to the support box (13); the motor (17) is installed on the side away from the support box (13); the fan blade (18) is connected to the output shaft of the motor (17); and the rear side of the support box (13) is connected to the protective net (19).

4. The thin film probe card level adjustment device according to claim 3, wherein: It also includes a protective shell (20), and the rear side of the support seat (1) is connected to the protective shell (20).

5. The thin film probe card level adjustment device according to claim 4, wherein: It also includes a protective shell (21), and the outer sides of the four scanners (10) are connected to the protective shell (21) by means of screws.

6. The thin film probe card level adjustment device according to claim 5, wherein: It also includes anti-slip strips (22), and three of the anti-slip strips (22) are connected to the detection platform (3).

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