Power conversion device

Abstract

The utility model provides a power conversion device. The power conversion equipment comprises a circuit board, a magnetic device assembly, a heat conduction pad and a shell, wherein the circuit board, the magnetic device assembly and the heat conduction pad are accommodated in the shell. The magnetic device assembly is installed on the circuit board, the magnetic device assembly comprises a magnetic device, a heat dissipation shell and pouring sealant, part of the magnetic device is contained in a cavity of the heat dissipation shell, and the pouring sealant is filled in a gap between the magnetic device and the inner side wall of the cavity of the heat dissipation shell. In addition, the heat conduction pad is located on the side, away from the circuit board, of the magnetic device assembly and located between the heat dissipation shell and the shell, and the heat conduction pad is in heat conduction contact with the heat dissipation shell and the shell. By adopting the heat dissipation scheme provided by the utility model, the temperature of the onboard magnetic device can be effectively reduced, and the temperature influence on other devices around can be reduced, so that the service life and the operation reliability of the onboard magnetic device and other devices around the onboard magnetic device can be prolonged, and the operation reliability of the power conversion equipment can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of energy, in particular to a power conversion device. Background Art

[0002] As a magnetic device, the inductor is a key component used to realize the function of the power conversion equipment. The inductor mainly includes a magnetic core and a winding. During the operation of the inductor, a large current usually passes through the inductor, thereby generating a large amount of heat. If the heat cannot be dissipated in time, it will affect the normal operation of the inductor and even cause damage to the inductor. In addition, for the on-board inductor, since it is installed on the circuit board and there are other low-temperature specification devices installed on the circuit board around it. The heat generated by the inductor will bake these low-temperature specification devices, causing these low-temperature specification devices to run at high temperatures, thereby affecting their service life. Therefore, how to achieve effective heat dissipation of these high-heat-generating on-board magnetic devices while reducing their thermal impact on other surrounding devices has become a difficult problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0003] The utility model provides a power conversion device, which can realize effective heat dissipation of the onboard magnetic device while reducing its thermal impact on other surrounding devices, thereby facilitating the improvement of the operational reliability of the power conversion device.

[0004] The utility model provides a power conversion device, the heat dissipation structure includes a circuit board, a magnetic device assembly, a thermal pad and a shell, and the circuit board, the magnetic device assembly and the thermal pad are accommodated in the shell. The magnetic device assembly is installed on the circuit board, and the magnetic device assembly includes a magnetic device, a heat dissipation shell and a potting compound. Part of the magnetic device is accommodated in the cavity of the heat dissipation shell, and the potting compound fills the gap between the magnetic device and the inner wall of the cavity of the heat dissipation shell, which can help increase the heat exchange area between the magnetic device and the heat dissipation shell, so as to improve the heat conduction efficiency from the magnetic device to the heat dissipation shell. In addition, the thermal pad is located on the side of the magnetic device assembly away from the circuit board, and the thermal pad is located between the heat dissipation shell and the shell. The thermal pad is in thermal contact with the heat dissipation shell and the shell, and the surface of the shell away from the thermal pad has a first heat dissipation fin, so that the heat generated by the magnetic device is conducted to the heat dissipation shell and then further conducted to the shell through the thermal pad, so as to achieve efficient heat dissipation of the magnetic device through the shell. It can be seen that, by adopting the design scheme of the power conversion device provided by the present invention, by using the potting glue to fill the gap between the magnetic device and the inner wall of the cavity of the heat dissipation shell, the heat exchange area between the magnetic device and the heat dissipation shell can be effectively increased, thereby facilitating the improvement of the heat conduction efficiency from the magnetic device to the heat dissipation shell, which is conducive to improving the heat conduction efficiency from the magnetic device assembly to the outer shell, so as to improve the heat dissipation performance of the magnetic device. In addition, since at least part of the magnetic device is housed in the heat dissipation shell, the heat dissipation shell can be used to thermally isolate the magnetic device, thereby reducing the diffusion of heat from the magnetic device to other surrounding devices, thereby reducing the thermal impact of the magnetic device on other surrounding devices. Therefore, by adopting the heat dissipation scheme provided by the present invention, the temperature of the onboard magnetic device itself can be effectively reduced, and the temperature impact on other surrounding devices can also be reduced, which is conducive to extending the service life and operational reliability of the onboard magnetic device and other surrounding devices, thereby facilitating the improvement of the operational reliability of the power conversion device.

[0005] In one possible implementation of the present invention, one end of the heat sink includes an opening that faces the circuit board, thereby increasing the effectiveness of the heat sink's thermal isolation of the magnetic device and reducing the impact of the magnetic device on other surrounding devices.

[0006] In addition, the heat sink housing includes one or more ribs housed within the cavity of the heat sink housing, and the potting compound surrounds the ribs. The ribs have a greater thermal conductivity than the potting compound, allowing heat transferred from the magnetic device to the potting compound to be transferred through the ribs to the inner wall of the heat sink housing, and then dissipated through the heat sink housing. This improves the efficiency of heat transfer from the magnetic device to the heat sink housing, thereby achieving efficient heat dissipation of the magnetic device.

[0007] In one possible implementation of the present invention, the magnetic device includes a magnetic core and a winding, the winding including a connected winding portion and a wire connector, the winding portion being wound around the magnetic core, and the wire connector being connected to a circuit board. In addition, the potting compound wraps at least a portion of the winding portion, and the potting compound wraps at least a portion of the magnetic core. Using the heat dissipation solution provided by the present invention, heat conduction paths can be formed between the winding and the heat dissipation shell, and between the magnetic core and the heat dissipation shell, respectively. This helps to improve the heat conduction efficiency from the magnetic device to the heat dissipation shell, thereby improving the heat dissipation performance of the magnetic device.

[0008] Furthermore, the magnetic core may include two cover plates and two magnetic columns, the two cover plates being arranged opposite each other, the two magnetic columns being arranged side by side between the two cover plates, and each magnetic column being fixedly connected to the two cover plates. Furthermore, the magnetic device may include two windings, the winding portions of the two windings being wound around the two magnetic columns in a one-to-one correspondence. Based on this, at least one partition rib may be inserted between the winding portions of the two windings. This allows heat from the winding portions to be quickly transferred to the partition rib and then dissipated through the heat dissipation shell, which helps to improve the heat conduction efficiency from the windings to the heat dissipation shell, thereby improving the heat dissipation performance of the magnetic device.

[0009] In one possible implementation of the present invention, the difference d in the minimum gap between the outer contour of the portion of the wrapping portion wrapped around the potting compound and the inner wall of the heat sink housing satisfies the following: 0 ≤ d ≤ 2 mm. This reduces the thickness of the potting compound between the outer contour of the magnetic component and the inner wall of the heat sink housing cavity, which helps reduce potting compound usage. This reduces the thermal resistance between the magnetic component and the heat sink housing, ensuring the heat dissipation performance of the magnetic component while also lowering costs.

[0010] In one possible implementation of the present invention, the magnetic device assembly includes at least two magnetic devices, each of which is at least partially contained within a cavity of a heat sink housing. Furthermore, at least one barrier rib is interposed between two adjacent magnetic devices. This allows heat generated by the two adjacent magnetic devices to be conducted to other portions of the heat sink housing via the barrier rib, thereby achieving efficient heat dissipation for each magnetic device while minimizing mutual influence between the adjacent magnetic devices.

[0011] In a possible implementation of the present invention, the heat dissipation housing may further include second heat dissipation fins, which are arranged on the outer side wall of the heat dissipation housing, so as to increase the heat dissipation area of ​​the heat dissipation housing and thus improve the heat dissipation efficiency of the magnetic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A schematic structural diagram of a photovoltaic inverter provided in an embodiment of the present utility model;

[0013] Figure 2 A schematic diagram of a heat dissipation structure of a traditional board-mounted inductor provided in an embodiment of the present utility model;

[0014] Figure 3 A schematic diagram of the structure of a power conversion device provided by an embodiment of the present utility model;

[0015] Figure 4 for Figure 3 A schematic structural diagram of a magnetic device in the power conversion device shown;

[0016] Figure 5 Another structural diagram of a power conversion device provided by an embodiment of the present utility model;

[0017] Figure 6 Another structural diagram of a power conversion device provided by an embodiment of the present utility model;

[0018] Figure 7 Another structural schematic diagram of the power conversion device provided in an embodiment of the utility model.

[0019] Reference numerals:

[0020] 1-housing; 11-first heat sink; 2-circuit board; 3-inductor; 4-thermal pad; 5-heat sink; 6-magnetic device assembly;

[0021] 61-magnetic device; 611-magnetic core; 6111-cover plate; 6112-magnetic column; 612-winding; 6121-winding part; 6122-wire connector; 62-heat sink;

[0022] 621 - opening; 622 - partition rib; 623 - second heat dissipation fin; 63 - potting glue. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be understood as being limited to the embodiments described herein. The same figure marks in the figures represent the same or similar structures, and thus their repeated descriptions will be omitted. The words expressing position and direction described in the embodiments of the present invention are all explained using the accompanying drawings as examples, but changes can be made as needed, and the changes made are all included in the scope of protection of the present invention. The drawings of the embodiments of the present invention are only used to illustrate the relative position relationship, and they do not represent the true proportions.

[0024] It should be noted that the following description sets forth specific details to facilitate understanding of the present invention. However, the present invention can be implemented in a variety of other ways than those described herein, and those skilled in the art may make similar generalizations without violating the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0025] In the present invention, the specific type of onboard magnetic device is not limited. Exemplary magnetic devices include inductors and other magnetic devices that use the principle of electromagnetic induction to achieve their functions. To facilitate understanding of the onboard magnetic devices provided by the present invention, the following is an introduction using inductors as an example. Inductors can be used in scenarios such as energy storage systems, photovoltaic power generation systems, photovoltaic storage systems, or charging networks. Exemplary inductors can be used in power conversion equipment such as uninterruptible power supplies (UPS) and photovoltaic inverters.

[0026] Taking the application of inductors in photovoltaic inverters as an example, Figure 1 This is a schematic diagram of the structure of a photovoltaic inverter provided by an embodiment of the present invention. The photovoltaic inverter includes a housing 1 and a circuit board 2 and an inductor 3 contained in the housing 1. The inductor 3 is mounted on the circuit board 2 and realizes electrical connection between the inductor 3 and the circuit board 2. Figure 1 As shown, in order to realize the function of photovoltaic inverter, other components are also installed on the circuit board 2, and the other components are arranged around the inductor 3. Figure 1 It can be seen that the embodiment of the present application is suitable for the circuit board 2 to be upside down in the housing 1, and most of the components on the circuit board 2 are arranged on a side close to the bottom shell of the photovoltaic inverter.

[0027] Since a large current usually flows through the inductor 3 during operation, the inductor 3 generates a large amount of heat. To ensure the normal operation of the inductor 3 , a heat dissipation structure is usually designed for the inductor 3 . Figure 2 This is a schematic diagram of a heat dissipation structure of a traditional board-mounted inductor provided in an embodiment of the present utility model. In order to achieve heat dissipation of the inductor 3, as shown in FIG. Figure 2 As shown, the heat dissipation structure includes a thermal pad 4 and a heat sink 5. The thermal pad 4 is located on the side of the inductor 3 away from the circuit board 2 and is in thermal contact with the windings of the inductor 3. Furthermore, the thermal pad 4 and the heat sink 5 are in thermal contact, so that the heat generated by the inductor 3 can be transferred to the heat sink 5 through the thermal pad 4, thereby dissipating the heat of the inductor 3.

[0028] However, if Figure 2As shown, since the contact area between the winding of inductor 3 and thermal pad 4 is small, and there is only one heat conduction path between the inductor 3 and the thermal pad 4, and the heat generated by the inductor 3 during operation is relatively large, the heat dissipation efficiency between the inductor 3 and the thermal pad 4 is low when this heat dissipation solution is adopted. This cannot ensure that the heat generated by the inductor 3 can be dissipated in a timely manner, thereby affecting the operational reliability of the inductor 3. In addition, the heat generated by the inductor 3 will diffuse to the surrounding area, causing some low-temperature specification components around the inductor 3 to be baked, causing these low-temperature specification components to operate at high temperatures, thereby shortening their service life. Therefore, achieving effective heat dissipation of magnetic components that generate a large amount of heat, such as the inductor 3, plays a key role in the reliable operation of power conversion equipment.

[0029] In view of this, the power conversion device provided by the present invention improves the heat dissipation performance of the onboard magnetic device by increasing the contact area between the magnetic device and the heat-conducting structure. This improves the operational reliability of the onboard magnetic device while reducing the impact on the temperature of surrounding low-temperature devices, thereby improving the operational reliability of the power conversion device. To facilitate understanding of the solution provided by the present invention, it is described in detail below with reference to specific embodiments.

[0030] Reference Figure 3 , Figure 3 A schematic diagram of the structure of a power conversion device provided in an embodiment of the present invention. The power conversion device includes a circuit board 2, a magnetic device assembly 6, a thermal pad 4, and a housing 1. The magnetic device assembly 6 is mounted on the circuit board 2. In this embodiment of the present invention, the magnetic device assembly 6 includes a magnetic device 61 and a heat sink 62, with at least a portion of the magnetic device 61 housed within the cavity of the heat sink 62.

[0031] In addition, the heat dissipation shell 62 may be a shell structure having an opening 621 at one end, so as to facilitate the assembly of the magnetic device 61 and the heat dissipation shell 62. Figure 3 As shown, the opening 621 of the heat dissipation shell 62 is set towards the circuit board 2, so that the heat dissipation shell 62 can play a role in thermal isolation of the magnetic component 61, thereby reducing the heat diffused from the magnetic component 61 to the surroundings, thereby reducing the impact of the magnetic component 61 on the temperature of other surrounding components.

[0032] In this utility model, if Figure 3As shown, the magnetic device assembly 6 also includes a potting compound 63, which fills the gap between the magnetic device 61 and the inner wall of the cavity of the heat dissipation shell 62, and the potting compound 63 wraps at least a portion of the magnetic device 61. In a specific implementation, since the magnetic device 61 includes a magnetic core 611 and a winding 612, the winding 612 is wound on the magnetic core 611. In an embodiment of the present utility model, the winding 612 can be divided into a winding portion 6121 and a wire connector 6122, and the winding portion 6121 is wound on the magnetic core 611. The wire connector 6122 is connected to the circuit board 2 to achieve a fixed connection between the magnetic device assembly 6 and the circuit board 2 while achieving an electrical connection between the magnetic device 61 and the circuit board 2.

[0033] It is worth mentioning that in the embodiment of the present invention, the wire connector 6122 can be used as a pin of the magnetic device 61 to be directly connected to the circuit board 2.

[0034] exist Figure 3 In the embodiment shown, the potting compound 63 completely wraps the winding portion 6121 of the winding 612, so that the contact area between the potting compound 63 and the winding 612 is larger, which is conducive to improving the heat conduction efficiency between the winding 612 and the potting compound 63, so that the heat generated by the winding 612 can be quickly transferred to the heat dissipation shell 62 through the potting compound 63, so as to be dissipated through the heat dissipation shell 62.

[0035] In addition, it is understood that, in a possible embodiment of the present invention, the potting glue 63 can also wrap at least a portion of the magnetic core 611, for example, Figure 3 In the embodiment shown, the magnetic core 611 is completely contained within the cavity of the heat sink 62, and the potting compound 63 completely encapsulates the magnetic core 611. This allows the heat generated by the magnetic core 611 to be transferred to the potting compound 63, and then to the heat sink 62 for dissipation.

[0036] It can be seen that by adopting the heat dissipation solution provided by the present invention, the gap between the inner wall of the cavity of the magnetic component 61 and the heat dissipation shell 62 is filled with the potting glue 63, which can effectively increase the heat exchange area between the magnetic component 61 and the heat dissipation shell 62, and there are multiple heat conduction paths between the magnetic component 61 and the heat dissipation shell 62, such as the winding 612 to the heat dissipation shell 62 and the magnetic core 611 to the heat dissipation shell 62, which is beneficial to improve the heat conduction efficiency from the magnetic component 61 to the heat dissipation shell 62, so as to improve the heat dissipation performance of the magnetic component 61.

[0037] The present invention does not limit the specific type of the potting glue 63. Exemplary types include epoxy resin potting glue, silicone rubber potting glue, polyurethane potting glue, or UV potting glue. As long as it can achieve heat conduction between the magnetic device 61 and the heat dissipation shell 62 and limit the position of the magnetic device 61 in the cavity of the heat dissipation shell 62, it will be sufficient.

[0038] You can continue to refer to Figure 3 In the present invention, the shape of the cavity of the heat dissipation shell 62 is similar to the outer contour of the winding portion 6121 of the winding 612, so that the difference d of the minimum gap between the outer contour of the winding portion 6121 and the inner wall of the cavity of the heat dissipation shell 62 satisfies: 0≤d≤2mm, for example, it can be 0.3mm, 0.4mm, 1mm or 1.5mm, so that the thickness of the potting compound 63 filled between the outer contour of the magnetic component 61 and the inner wall of the cavity of the heat dissipation shell 62 is relatively small, which is conducive to reducing the material used for the potting compound 63, thereby reducing the thermal resistance between the magnetic component 61 and the heat dissipation shell 62, ensuring the heat dissipation performance of the magnetic component 61, and reducing costs.

[0039] You can continue to refer to Figure 3 The heat dissipation shell 62 also includes one or more partition ribs 622, which are housed in the cavity of the heat dissipation shell 62 and connected to the inner wall of the cavity of the heat dissipation shell 62. In addition, the potting compound 63 wraps around the one or more partition ribs 622, so that the heat conducted from the magnetic device 61 to the potting compound 63 can be conducted to the inner wall of the heat dissipation shell 62 through each partition rib 622, and then dissipated through the heat dissipation shell 62. Since the thermal conductivity of the one or more partition ribs 622 is greater than the thermal conductivity of the potting compound, it is beneficial to improve the efficiency of heat conduction from the magnetic device 61 to the inner wall of the heat dissipation shell 62, thereby improving the heat dissipation efficiency of the magnetic device 61.

[0040] It can be understood that the heat dissipation shell 62 adopts the above-mentioned design including the partition rib 622, which is conducive to increasing the contact area between the potting compound 63 and the heat dissipation shell 62, thereby helping to improve the heat conduction efficiency between the heat conducted from the magnetic device 61 to the potting compound 63 and the heat dissipation shell 62, thereby improving the heat dissipation performance of the magnetic device 61.

[0041] In the embodiment of the present invention, the heat dissipation shell 62 can be an integrally formed structure, which can reduce the thermal resistance between the ribs 622 and other parts of the heat dissipation shell 62, thereby improving the heat dissipation performance of the heat dissipation shell 62. In addition, the material of the heat dissipation shell 62 can be, but is not limited to, DC01, DC03, or other materials, and is not specifically limited in the embodiment of the present invention.

[0042] In order to understand the relative position relationship between the ribs and the magnetic components, please refer to Figure 4 , Figure 4 for Figure 3A schematic diagram of the structure of a magnetic device in a power conversion device is shown. The magnetic core 611 of the magnetic device 61 may include two cover plates 6111 and two magnetic pillars 6112, wherein the two cover plates 6111 are arranged opposite each other, the two magnetic pillars 6112 are arranged side by side between the two cover plates 6111, and each magnetic pillar 6112 is fixedly connected to the two cover plates 6111. In addition, the magnetic device 61 includes two windings 612, and the winding portions 6121 of the two windings 612 are wound around the two magnetic pillars 6112 in a one-to-one correspondence.

[0043] Refer to Figure 3 and Figure 4 At least one spacer rib 622 is inserted between the winding portions 6121 of the two windings 612. This allows the heat from the winding portions 6121 to be quickly transferred to the spacer rib 622 and then dissipated through the heat dissipation housing 62, which helps improve the heat conduction efficiency from the windings 612 to the heat dissipation housing 62, thereby improving the heat dissipation performance of the magnetic device 61.

[0044] You can continue to refer to Figure 3 The thermal pad 4 is located on the side of the magnetic device assembly 6 away from the circuit board 2. The thermal pad 4 is located between the heat sink 62 and the housing 1, and the thermal pad 4 is in thermal contact with the heat sink 62 and the housing 1. This allows the heat transferred from the magnetic device 61 to the heat sink 62 to be further transferred to the housing 1 through the thermal pad 4, and then diffused through the housing 1 to the outside of the power conversion device, thereby achieving efficient heat dissipation of the magnetic device 61.

[0045] In the present invention, the thermal pad 4 can be, for example, thermal conductive gel or thermal conductive silicone grease, or other thermal conductive interface materials with good thermal conductivity, which are not listed here one by one.

[0046] In addition, in this application, the heat dissipation principle can be used to achieve heat dissipation. Figure 3 As shown, the side surface of the housing 1 away from the thermal pad 4 may also include first heat dissipation fins 11 to enhance heat dissipation by increasing the heat dissipation area. It will be appreciated that the size and number of the first heat dissipation fins 11 can be adjusted based on the specific heat dissipation requirements of the magnetic device 61. Furthermore, when the housing 1 includes multiple first heat dissipation fins 11, the spacing between adjacent first heat dissipation fins 11 can also be adjusted based on the specific heat dissipation requirements of the magnetic device 61.

[0047] It is understandable that, in practical applications, the power conversion device may further include a fan ( Figure 3 (not shown), the fan can be arranged outside the housing 1. In this way, by directing the air outlet of the fan toward the outer surface of the housing 1, the flow rate of the air flowing through the outer surface of the housing 1 is accelerated, thereby improving the heat dissipation efficiency of the housing 1, and further achieving efficient heat dissipation of the magnetic device 61.

[0048] Figure 5 This is another structural diagram of the power conversion device provided by the embodiment of the utility model. Figure 5 As shown, the heat dissipation housing 62 further includes second heat dissipation fins 623, which are disposed on the outer sidewall of the heat dissipation housing 62. This increases the heat dissipation area of ​​the heat dissipation housing 62, thereby further improving the heat dissipation performance of the magnetic device 61. The size and number of the second heat dissipation fins 623 can be set according to the specific heat dissipation requirements of the magnetic device 61. Furthermore, when the heat dissipation housing 62 includes multiple second heat dissipation fins 623, the spacing between two adjacent second heat dissipation fins 623 can also be adjusted according to the specific heat dissipation requirements of the magnetic device 61.

[0049] Figure 5 Other parts of the power conversion equipment shown can refer to Figure 3 The embodiment shown is configured so as not to be described in detail here.

[0050] It is understandable that based on the design principle of the heat dissipation structure of the onboard magnetic device provided by the present invention, a series of variations of the heat dissipation structure can be made according to the heat dissipation requirements of the magnetic device in the actual application scenario. Figure 6 , Figure 6 Another structural diagram of the power conversion device provided by the embodiment of the utility model. Figure 3 and Figure 5 The embodiment shown is different in that Figure 6 In the embodiment, the winding portion 6121 of the winding 612 of the magnetic device 61 and a portion of the magnetic core 611 are accommodated in the cavity of the heat sink housing 62, and the potting compound 63 wraps around the portion of the winding 6121 of the winding 612. Furthermore, the potting compound 63 may also wrap around a portion of the magnetic core 611. Compared with the prior art, this embodiment effectively increases the heat exchange area between the heat sink housing 62 and the magnetic device 61 and increases the heat conduction path, thereby achieving efficient heat dissipation of the magnetic device 61. Furthermore, the heat sink housing 62 can also achieve thermal isolation of the magnetic device 61, thereby reducing the impact of the magnetic device 61 on other surrounding devices.

[0051] Figure 6 Other parts of the power conversion equipment shown can refer to Figure 3 or Figure 5 The embodiment shown is configured so as not to be described in detail here.

[0052] By adopting the heat dissipation solution provided by the present invention, the maximum temperature gain of the magnetic device 61 itself can reach 10°C to 18°C, while the temperature gain of the components located near the magnetic device 61 can reach 1.9°C to 2.5°C. In other words, the heat dissipation solution provided by the embodiment of the present invention can effectively reduce the temperature of the onboard magnetic device itself while also reducing the temperature impact on other surrounding components, thereby helping to extend the service life of the onboard magnetic device and other surrounding components.

[0053] In the above description, each magnetic device assembly 6 includes one magnetic device 61. In other embodiments of the present invention, each magnetic device assembly 6 may include at least two magnetic devices 61. Figure 7 , Figure 7 This is another structural diagram of the power conversion device provided by the embodiment of the utility model. For the convenience of explanation, Figure 7 In this embodiment, the magnetic device assembly 6 includes two magnetic devices 61, each of which is at least partially contained within the cavity of the heat sink 62. This effectively saves the cost of the potting compound 63 and the heat sink 62.

[0054] In addition, it is understandable that based on Figure 7 The heat dissipation structure shown is arranged in such a way that at least one partition rib 622 can be inserted between two adjacent magnetic devices 61, so that the heat generated by the two adjacent magnetic devices 61 can be conducted to other parts of the heat dissipation shell 62 through the partition rib 622, thereby achieving efficient heat dissipation of each magnetic device 61 while reducing the mutual influence between the two adjacent magnetic devices 61.

[0055] Figure 7 The other parts of the power conversion device shown in FIG. 1 can be arranged with reference to any of the above embodiments. In addition, when the magnetic device assembly 6 includes more than two magnetic devices 61, the magnetic device assembly 6 includes two or more magnetic devices 61. Figure 7 The configuration of the power conversion device shown is similar and will not be described in detail here.

[0056] It is understandable that the above only introduces some possible configurations of the power conversion device provided by the present invention and the heat dissipation effects that can be achieved. On this basis, the heat dissipation structure can also be adaptively modified according to the heat dissipation needs in actual application scenarios. For example, heat dissipation can be achieved using the liquid cooling principle. In actual applications, a liquid cooling radiator can be provided on the outer surface of the housing 1 or a part of the housing 1 structure can be provided as a liquid cooling radiator to achieve heat dissipation through the circulation of liquid. They will not be introduced one by one here, but they should all be understood to fall within the scope of protection of the present invention.

[0057] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A power conversion device, characterized in that: The device comprises a circuit board, a magnetic device assembly, a thermal pad, and a housing. The circuit board, the magnetic device assembly, and the thermal pad are accommodated in the housing. The magnetic device assembly is mounted on the circuit board. The thermal pad is located on a side of the magnetic device assembly away from the circuit board. The magnetic device assembly includes at least one magnetic device, a heat dissipation shell and a potting compound, wherein at least a portion of the magnetic device is accommodated in a cavity of the heat dissipation shell, and the potting compound fills a gap between the magnetic device and an inner sidewall of the cavity of the heat dissipation shell; The thermal pad is located between the heat dissipation shell and the outer shell, and the thermal pad is in thermal contact with the heat dissipation shell and the outer shell; a first heat dissipation fin is provided on a side surface of the outer shell away from the thermal pad.

2. The power conversion device according to claim 1, wherein: One end of the heat dissipation shell includes an opening, and the opening is arranged toward the circuit board.

3. The power conversion device according to claim 1 or 2, characterized in that: The heat dissipation shell includes one or more partition ribs, the one or more partition ribs are accommodated in the cavity of the heat dissipation shell, and the potting glue wraps the one or more partition ribs.

4. The power conversion device according to claim 3, wherein: The magnetic device includes a magnetic core and at least one winding, the winding includes a connected winding portion and a wire joint, the winding portion is wound around the magnetic core, and the wire joint is connected to the circuit board; the potting compound wraps at least a portion of the winding portion, and the potting compound wraps at least a portion of the magnetic core.

5. The power conversion device according to claim 4, wherein: The magnetic core includes two cover plates and two magnetic columns, the two cover plates are arranged opposite to each other, the two magnetic columns are arranged side by side between the two cover plates, and each of the magnetic columns is fixedly connected to the two cover plates; the at least one winding includes two windings, and the winding parts of the two windings are wound around the two magnetic columns in a one-to-one correspondence; at least one partition rib is inserted between the winding parts of the two windings.

6. The power conversion device according to claim 4 or 5, characterized in that: The difference d of the minimum gaps at each location between the outer contour of the portion of the wrapping portion wrapped around the potting compound and the inner sidewall of the heat dissipation shell satisfies the following: 0≤d≤2mm.

7. The power conversion device according to claim 3, wherein: The at least one magnetic device includes at least two magnetic devices, at least a portion of each of the at least two magnetic devices is accommodated in the cavity of the heat dissipation shell; and at least one partition rib is inserted between two adjacent magnetic devices.

8. The power conversion device according to claim 1 or 2, characterized in that: The heat dissipation shell further includes second heat dissipation fins, which are arranged on the outer side wall of the heat dissipation shell.

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