Wafer clamping mechanism and wafer cleaning device

Abstract

The utility model belongs to the technical field of semiconductor equipment, and discloses a wafer clamping mechanism and a wafer cleaning device, the wafer clamping mechanism comprises clamping assemblies and a driving assembly, and at least two clamping assemblies enclose a clamping space; each clamping assembly comprises a mounting plate, the mounting plate is provided with a clamping shaft which can move along the direction of clamping or loosening the wafer, the mounting plate is provided with a screwing piece and a locking piece, the screwing piece is screwed on the mounting plate, the screwing piece can be close to or far away from the clamping shaft, and the locking piece can lock or loosen the clamping shaft relative to the mounting plate; the output end of the driving assembly is connected with the mounting plate, the driving assembly drives the clamping shafts to be close to or far away from each other so as to change the size of the clamping space, the wafer cleaning device comprises the cleaning roller and the wafer clamping mechanism, the cleaning roller is rotationally arranged in the clamping space, and the screwed screwing piece pushes the clamping shafts to move, so that adjustment is more accurate, and the wafer clamping mechanism is more convenient to use. And excessive adjustment deviation is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a wafer clamping mechanism and a wafer cleaning device. Background Art

[0002] Wafer cleaning is to completely remove the processing particles or chemical sticky substances on the wafer to meet the ultra-clean level requirements of the chip factory.

[0003] When removing debris from a wafer, the wafer needs to be fixed. Existing technologies use clamping shafts that can move closer or further apart for clamping and fixing. However, before normal use or after long-term use, the clamping force of the clamping shafts needs to be fine-tuned to avoid large deviations in the clamping force that affect the clamping effect. Traditional technologies use direct adjustments using a driver that drives the clamping shafts closer or further apart, resulting in inaccurate clamping force adjustment and still large deviations. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer clamping mechanism and a wafer cleaning device to solve the problem of large deviation in clamping force adjustment.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] A wafer clamping mechanism comprising:

[0007] A clamping assembly, wherein at least two of the clamping assemblies enclose a clamping space to clamp a wafer; each clamping assembly includes a mounting plate, a clamping shaft movable in the direction of clamping or releasing the wafer is provided on the mounting plate, a screw and a locking member are provided on the mounting plate, the screw is screwed on the mounting plate, the screw can approach or move away from the clamping shaft, and when the screw approaches the clamping shaft, the screw can push the clamping shaft to move in the direction of clamping the wafer,

[0008] The locking member is capable of locking or releasing the clamping shaft relative to the mounting plate;

[0009] A driving assembly, wherein the output end of the driving assembly is connected to the mounting plate, and the driving assembly drives the clamping shafts to move closer to or away from each other so as to change the size of the clamping space.

[0010] In some embodiments, the clamping assembly further includes a movable plate, the clamping shaft is disposed on the movable plate, the screwing member can abut against the movable plate, and the movable plate and the mounting plate can be locked by the locking member.

[0011] In some embodiments, the mounting plate includes a first plate and a second plate, the output end of the driving assembly is connected to the first plate, the movable plate is arranged on the first plate, the second plate is detachably arranged on the first plate, the second plate is provided with a screw hole, and the screwing member is screwed into the screw hole.

[0012] In some embodiments, the second plate is L-shaped.

[0013] In some embodiments, a long hole is provided on the movable plate, a locking hole is provided on the first plate, and the locking member locks the movable plate through the long hole and the locking hole.

[0014] In some embodiments, one of the first plate or the movable plate is provided with scale lines distributed along the direction of clamping or releasing the wafer.

[0015] In some embodiments, the other of the first plate or the movable plate is provided with an indicator mark that matches the scale line.

[0016] In some embodiments, the clamping assembly also includes a rotary driving member, which is arranged on the movable plate. The output end of the rotary driving member is connected to the clamping shaft to drive the clamping shaft to rotate along its own axis. A placement hole is opened on the first plate for the rotary driving member to pass through, and the size of the placement hole is larger than the size of the rotary driving member.

[0017] In some embodiments, the driving assembly includes a base, on which a movable driving member and a guide rail extending along the direction of clamping or releasing the wafer are provided. The output end of the movable driving member is connected to the mounting plate, and the mounting plate is slidably connected to the guide rail.

[0018] A wafer cleaning device is also provided, which includes a cleaning roller and the wafer clamping mechanism as described above, wherein the cleaning roller is rotatably arranged in the clamping space.

[0019] Beneficial effects of the utility model:

[0020] When adjusting, first unlock the locking piece to allow the clamping shaft and the mounting plate to move relative to each other. Then, by screwing the screw piece that is threaded with the mounting plate, the screw piece pushes the clamping shaft to move, thereby causing the clamping shaft to move slowly and adjusting the clamping force of the clamping shaft. The above-mentioned screw connection method can make the adjustment more precise. During the adjustment process, the clamping shaft is not easy to move too much, so that there will be no excessive adjustment deviation. In addition, the screw connection form of the screw piece also has self-locking performance, thereby preventing the clamping shaft from retreating, making the clamping force adjustment more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1It is a schematic diagram of the wafer clamping mechanism of the utility model;

[0022] Figure 2 It is a schematic diagram of the clamping assembly in the present utility model;

[0023] Figure 3 It is a partial exploded view of the clamping assembly in the utility model.

[0024] In the picture:

[0025] 1. Clamping assembly; 11. Mounting plate; 111. First plate; 112. Second plate; 113. Mounting hole; 12. Clamping shaft; 13. Screw member; 14. Locking member; 15. Moving plate; 151. Long hole; 16. Scale mark; 17. Indicator mark; 18. Rotary drive member;

[0026] 2. Driving assembly; 21. Base; 22. Moving driving member; 23. Guide rail;

[0027] 3. Cleaning roller. DETAILED DESCRIPTION

[0028] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0029] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0030] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0031] In the description of this embodiment, the terms "upper," "lower," "left," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0032] like Figures 1 to 3 As shown, the present application provides a wafer clamping mechanism, which includes a clamping component 1 and a driving component 2, at least two clamping components 1 enclose a clamping space to be able to clamp the wafer; each clamping component 1 includes a mounting plate 11, and the mounting plate 11 is provided with a clamping shaft 12 that can move along the direction of clamping or releasing the wafer, and the mounting plate 11 is provided with a screw 13 and a locking component 14, the screw 13 is screwed on the mounting plate 11, and the screw 13 can approach or move away from the clamping shaft 12. When the screw 13 approaches the clamping shaft 12, the screw 13 can push the clamping shaft 12 to move in the direction of clamping the wafer, and the locking component 14 can lock or release the clamping shaft 12 relative to the mounting plate 11; the output end of the driving component 2 is connected to the mounting plate 11, and the driving component 2 drives the clamping shafts 12 to approach or move away from each other to be able to change the size of the clamping space.

[0033] Before use, it is only necessary to drive the mounting plate 11 to the set position to be clamped through the driving component 2, and then the clamping force of the clamping shaft 12 can be adjusted (it only needs to be adjusted once). When adjusting, first release the lock of the locking piece 14 to allow the clamping shaft 12 and the mounting plate 11 to move relative to each other, and then screw the screw piece 13 screwed to the mounting plate 11 to push the screw piece 13 to move the clamping shaft 12, so that the clamping shaft 12 moves slowly and the clamping force of the clamping shaft 12 is adjusted; the above-mentioned screw connection method can make the adjustment more precise, and the clamping shaft 12 is not easy to move too much during the adjustment process, so that there will be no excessive adjustment deviation. In addition, the screw connection form of the screw piece 13 also has a self-locking performance, so it can avoid the retreat of the clamping shaft 12, making the clamping force adjustment more accurate.

[0034] It should be noted that the number of the clamping assemblies 1 can be set in different forms. In the current embodiment, two opposite groups of clamping assemblies 1 are provided. Each mounting plate 11 can be provided with a plurality of clamping shafts 12 that are spaced apart.

[0035] like Figure 2 and Figure 3As shown, in some embodiments, in order to facilitate the movement and locking of the clamping shaft 12, the clamping assembly 1 further includes a movable plate 15, on which the clamping shaft 12 is disposed, and a screwing member 13 can abut against the movable plate 15, thereby pushing the movable plate 15 to move, thereby driving the clamping shaft 12 to move, and the movable plate 15 and the mounting plate 11 are locked by a locking member 14 to determine the relative position of the clamping shaft 12 on the mounting plate 11. Further, in order to facilitate the installation of the screwing member 13, the mounting plate 11 includes a first plate 111 and a second plate 112, the movable plate 15 is disposed on the first plate 111, the output end of the drive assembly 2 is connected to the first plate 111, the second plate 112 is detachably disposed on the first plate 111, the second plate 112 is provided with a screw hole, the screwing member 13 is screwed into the screw hole, and can then abut against the movable plate 15 by rotating the screwing member 13. Exemplarily, the screwing member 13 can be any one of a screw, a bolt, or a screw. In the current embodiment, the second plate 112 is L-shaped. The second plate 112 can also be detachably connected to the first plate 111 by screws or bolts, or connected to the second plate 112 by other detachable means such as snap connections. The detachable second plate 112 can be replaced, thereby adjusting the screwing distance of the screwing member 13 and indirectly adjusting the movement range of the movable plate 15. Of course, it is understandable that in other embodiments, the first plate 111 and the second plate 112 can also be integrally formed.

[0036] like Figure 3 As shown, in some embodiments, a long hole 151 is provided on the movable plate 15 along the direction of clamping or releasing the wafer, and a locking hole is provided on the first plate 111, and the locking member 14 locks the movable plate 15 through the long hole 151 and the locking hole; illustratively, the locking hole can be a through hole or a screw hole; and correspondingly, the locking member 14 can be a bolt or a combination of a bolt and a nut.

[0037] like Figure 2 and Figure 3 As shown, in some embodiments, to quantify the movement of the clamping shaft 12, one of the first plate 111 or the movable plate 15 is provided with scale lines 16 distributed along the direction of clamping or releasing the wafer. The scale lines 16 accurately indicate the movement position of the movable plate 15 relative to the first plate 111. Furthermore, for better visualization, the other of the first plate 111 or the movable plate 15 is provided with indicator marks 17 that align with the scale lines 16. Indicator marks 17 are not specifically limited and can be marked lines, arrows, or the like.

[0038] like Figure 3As shown, during the wafer cleaning process, the clamping shaft 12 not only needs to clamp the wafer but also needs to drive the wafer to rotate. Based on this, the clamping assembly 1 also includes a rotary drive member 18. The rotary drive member 18 is disposed on the movable plate 15. The output end of the rotary drive member 18 is connected to the clamping shaft 12 to drive the clamping shaft 12 to rotate along its own axis. Therefore, after the clamping shaft 12 clamps the wafer, the rotation of the clamping shaft 12 drives the wafer to rotate. For example, the rotary drive member 18 uses a rotary motor. To avoid interference, the rotary motor and the clamping shaft 12 are located on both sides of the movable plate 15, and the rotary shaft of the rotary motor is inserted through the movable plate 15 and connected to the clamping shaft 12. In addition, a receiving hole 113 for the rotary drive member 18 to pass through is defined on the first plate 111. The rotary drive member 18 is inserted through the receiving hole 113. In the current embodiment, the receiving hole 113 is larger than the size of the rotary drive member 18, so that the rotary drive member 18 can also move within the receiving hole 113 during the movement of the movable plate 15.

[0039] like Figure 1 and Figure 2 As shown, in some embodiments, the driving assembly 2 includes a base 21, on which a movable driving member 22 and a guide rail 23 extending along the direction of clamping or releasing the wafer are provided. The output end of the movable driving member 22 is connected to the mounting plate 11, and the mounting plate 11 slides on the guide rail 23 through a slider provided thereon, so that after the clamping force is adjusted, the wafer is automatically clamped by the movable driving member 22.

[0040] The present invention further provides a wafer cleaning device, comprising a cleaning roller 3 and the aforementioned wafer clamping mechanism. The cleaning roller 3 is rotatably disposed within the clamping space, thereby cleaning the wafer in the clamping assembly 1. The rotation of the cleaning roller 3 can be achieved by a rotating drive member connected to the cleaning roller 3, and the details will not be repeated here.

[0041] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. Wafer clamping mechanism, characterized in that, include: A clamping assembly (1), wherein at least two of the clamping assemblies (1) enclose a clamping space to clamp a wafer; each of the clamping assemblies (1) comprises a mounting plate (11), wherein the mounting plate (11) is provided with a clamping shaft (12) movable in a direction of clamping or releasing the wafer; a screwing member (13) and a locking member (14) are provided on the mounting plate (11); the screwing member (13) is screwed onto the mounting plate (11); the screwing member (13) can approach or move away from the clamping shaft (12); when the screwing member (13) approaches the clamping shaft (12), the screwing member (13) can push the clamping shaft (12) to move in a direction of clamping the wafer; The locking member (14) is capable of locking or releasing the clamping shaft (12) relative to the mounting plate (11); A driving component (2), wherein the output end of the driving component (2) is connected to the mounting plate (11), and the driving component (2) drives the clamping shafts (12) to move closer to or farther from each other, so as to change the size of the clamping space.

2. The wafer clamping mechanism according to claim 1, wherein: The clamping assembly (1) further comprises a movable plate (15), the clamping shaft (12) is arranged on the movable plate (15), the screwing member (13) can abut against the movable plate (15), and the movable plate (15) and the mounting plate (11) can be locked by the locking member (14).

3. The wafer clamping mechanism according to claim 2, wherein: The mounting plate (11) comprises a first plate (111) and a second plate (112); the output end of the driving assembly (2) is connected to the first plate (111); the movable plate (15) is arranged on the first plate (111); the second plate (112) is detachably arranged on the first plate (111); the second plate (112) is provided with a screw hole; the screwing member (13) is screwed into the screw hole.

4. The wafer clamping mechanism according to claim 3, wherein: The second plate (112) is L-shaped.

5. The wafer clamping mechanism according to claim 3, wherein: The movable plate (15) is provided with a long hole (151), the first plate (111) is provided with a locking hole, and the locking member (14) locks the movable plate (15) through the long hole (151) and the locking hole.

6. The wafer clamping mechanism according to claim 3, wherein: One of the first plate (111) or the movable plate (15) is provided with scale lines (16) distributed along the direction of clamping or releasing the wafer.

7. The wafer clamping mechanism according to claim 6, wherein: The other of the first plate (111) or the movable plate (15) is provided with an indication mark (17) that matches the scale line (16).

8. The wafer clamping mechanism according to claim 3, wherein: The clamping assembly (1) further includes a rotary drive member (18), which is arranged on the movable plate (15). The output end of the rotary drive member (18) is connected to the clamping shaft (12) to drive the clamping shaft (12) to rotate along its own axis. The first plate (111) is provided with a placement hole (113) for the rotary drive member (18) to pass through, and the size of the placement hole (113) is larger than the size of the rotary drive member (18).

9. The wafer clamping mechanism according to any one of claims 1 to 8, characterized in that: The driving assembly (2) comprises a base (21), on which a movable driving member (22) and a guide rail (23) extending in a direction of clamping or releasing the wafer are provided, wherein an output end of the movable driving member (22) is connected to the mounting plate (11), and the mounting plate (11) is slidably connected to the guide rail (23).

10. A wafer cleaning device, characterized in that: It comprises a cleaning roller (3) and a wafer clamping mechanism according to any one of claims 1 to 9, wherein the cleaning roller (3) is rotatably arranged in the clamping space.

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