Wiring structure and conductive connecting device

Abstract

The utility model provides a wiring structure and a conductive connecting device. The wiring structure comprises a connecting line, wherein at least one part of a conductor part of the connecting line is exposed; wherein the exposed part of the conductor part is molded into a wiring terminal structure with strength. The wiring structure is low in manufacturing cost, can provide more stable, more reliable and more durable connection, is low in connection impedance, can reduce energy loss in the conductive process, and has good conductive performance.

Description

Technical Field

[0001] The present application relates to the field of electrical connection technology, and in particular to a wiring structure and a conductive connection device. Background Art

[0002] In electrical connection devices, a terminal is an electrical component used to connect wires, and the serrations are usually a set of protruding metal teeth or grooves, whose shape and arrangement ensure proper alignment of the wire when inserted and provide a good electrical connection.

[0003] Currently, wires are typically secured to terminals or tines using riveting. After the conductor in the wire is securely riveted to the terminal or tines, current is then conducted through the terminal or tines to the conductive clip, achieving electrical connection. However, this connection method has drawbacks and urgently needs improvement.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Utility Model Content

[0005] The present application provides a wiring structure and a conductive connection device with low manufacturing cost, which can provide a more stable, reliable and durable connection, and has a low connection impedance, which can reduce energy loss during the conduction process and has better conductive performance.

[0006] According to some embodiments, the present application provides a wiring structure, including:

[0007] A connecting wire, wherein at least a portion of a conductor portion of the connecting wire is exposed; wherein the exposed portion of the conductor portion is formed into a strong terminal structure.

[0008] In some embodiments, the exposed portion of the conductor portion is configured as the molded terminal structure.

[0009] In some embodiments, the exposed portion of the conductor portion is configured as the terminal structure formed by mold compression molding.

[0010] In some embodiments, the outer profile of the terminal structure is the same as that of a standard terminal.

[0011] In some embodiments, the connecting wire further comprises an insulating protective layer;

[0012] The outer side of the unexposed portion of the conductor portion is covered with the insulating protective layer.

[0013] In some embodiments, a through hole is provided on the terminal structure.

[0014] In some embodiments, a bayonet is provided on the terminal structure.

[0015] In some embodiments, the conductor portion of the connecting wire includes a pure copper wire, a pure aluminum wire and / or a pure iron wire.

[0016] In some embodiments, the conductor portion includes a tinned copper wire, a copper-clad aluminum wire, and / or an aluminum-clad copper wire.

[0017] According to some embodiments, the present application further provides a conductive connection device for electrically connecting to a power supply device to achieve transmission of electrical energy, including the wiring structure provided in any of the aforementioned embodiments;

[0018] The conductive connection device is electrically connected to the power supply equipment via the wiring structure.

[0019] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application.

[0020] The wiring structure and conductive connection device provided by this application can or at least have the following advantages:

[0021] In the embodiments of the present application, at least a portion of the conductor portion of the connecting wire is exposed, and the exposed portion is formed into a strong, regularly shaped terminal structure. This eliminates the need for additional traditional metal teeth or traditional metal terminals to be riveted to the conductor portion, thereby reducing manufacturing costs. The terminal structure formed from the exposed conductor portion not only provides a more stable, reliable, and durable connection, but also reduces connection impedance and energy loss during the conduction process, resulting in a wiring structure with better conductivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objects and advantages of the present application will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings.

[0023] Figure 1 is a schematic diagram of the three-dimensional structure of a mold forming device provided in some embodiments of the present application;

[0024] Figure 2 is a schematic diagram of a three-dimensional structure in which the exposed conductor portion is placed into a lower mold in some embodiments of the present application;

[0025] Figure 3 is a schematic diagram of a three-dimensional structure of a wiring structure provided by some embodiments of the present application;

[0026] Figure 4 is a schematic diagram of a three-dimensional structure in which the conductive connecting device is a battery clamp in some embodiments of the present application;

[0027] Figure 5 is a schematic diagram of a three-dimensional structure in which the conductive connecting device is a welding clamp in some embodiments of the present application;

[0028] Figure 6 This is a schematic diagram of the three-dimensional structure when the conductive connecting device is a grounding clamp in some embodiments of the present application.

[0029] Reference numerals:

[0030] 10. Connecting wire; 101. Conductor part; 102. Insulating protective layer; 20. Terminal structure; 201. Through hole; 1. Upper mold; 2. Lower mold; 100. Wiring structure; 210a. Upper battery clamp; 210b. Lower battery clamp; 221a. Pressing handle; 221b. Handle; 222a. Upper clamping part; 222b. Lower clamping part; 230a. First clamping body; 230b. Second clamping body. DETAILED DESCRIPTION

[0031] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0033] Hereinafter, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "comprising" and / or "including" are used in this specification, they may specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0034] In the following embodiments, when elements are “connected,” it can be interpreted that the elements are not only directly connected but also connected via other constituent elements interposed therebetween. For example, when elements are described as being connected or electrically connected, the elements may not only be directly connected or directly electrically connected but may also be connected or electrically connected via another element interposed therebetween.

[0035] It should also be noted that the illustrations provided herein are merely schematic illustrations of the basic concept of the present application. Although the illustrations only show components related to the present application and are not drawn according to the number, shape, and size of components in actual implementation, the type, quantity, and proportion of each component in actual implementation may be changed at will, and the component layout may also be more complex.

[0036] This application provides a wiring structure and conductive connection device that have low manufacturing costs, can provide a more stable, reliable, and durable connection, and have low connection impedance, which can reduce energy loss during the conduction process and have good conductive performance. The details will be described in subsequent embodiments.

[0037] See also Figures 1 to 3 According to some embodiments, the present application provides a wiring structure comprising a connecting wire 10. At least a portion of a conductor portion 101 of the connecting wire 10 is exposed, and the exposed portion of the conductor portion 101 is formed into a strong terminal structure 20.

[0038] In the wiring structure provided in the above embodiment, at least a portion of the conductor portion 101 of the connecting wire 10 is exposed, and the exposed portion of the conductor portion 101 is formed into a strong, regularly shaped terminal structure 20. This eliminates the need for additional traditional metal teeth or traditional metal terminals to be riveted to the conductor portion 101. Riveting typically requires specialized equipment and tools, as well as specific rivets or rivet caps. The cost of these equipment and materials is relatively high, especially when a large number of connections are required. Therefore, the terminal structure 20 is formed from the exposed portion of the conductor portion 101, which can effectively reduce manufacturing costs.

[0039] Furthermore, the terminal structure 20 is configured as a structure integrally formed with the conductor portion 101, which can also avoid large stress concentration, thereby avoiding local deformation or fatigue at the connection, so that the wiring structure can provide a more stable, reliable and durable connection.

[0040] In addition, since the terminal structure 20 is a strong, regular structure formed by the exposed conductor part 101 and there is no limiting boundary surface, the electrical contact is closer and the connection impedance is smaller, which is beneficial to reduce energy loss during the conduction process and make the wiring structure have better conductive performance.

[0041] The embodiment of the present application does not specifically limit the molding method of the terminal structure 20. In some embodiments, the exposed portion of the conductor portion 101 is molded into the terminal structure 20.

[0042] For example, the exposed conductor portion 101 can be heated and softened by ultrasonic waves, resistance welding, or other methods, and then placed in a molding device for shaping to form the terminal structure 20. However, this is not limiting, and other methods can also be used to soften the conductor portion 101, as long as it can be shaped into a tangible, regularly shaped terminal structure 20.

[0043] In some embodiments, the exposed portion of the conductor portion 101 is molded into a terminal structure 20 by a mold.

[0044] See also Figure 1 and Figure 2 It is understood that a mold forming device is provided, which may specifically include an upper mold 1 and a lower mold 2, and the upper mold 1 and the lower mold 2 may be parallel to each other. The upper mold 1 may be arranged above the lower mold 2, and by connecting to an external lifting mechanism, the upper mold 1 and the lower mold 2 can be moved closer to or farther away from each other.

[0045] like Figure 2 As shown, the exposed conductor portion 101 is placed in the lower mold 2. The upper mold 1 is then lowered and brought closer to the lower mold 2 for mold closing. The exposed conductor portion 101 is heated by high-frequency current, and the upper mold 1 and the lower mold 2 cooperate with each other to form the exposed conductor portion 101 into a terminal structure 20 by mold pressing.

[0046] In some embodiments, the exposed conductor portion 101 can be molded into a terminal structure 20 by high-frequency current molding with a frequency greater than 100 kHz.

[0047] In some embodiments, the outer contour of the terminal structure 20 can be formed into the same shape as a standard terminal.

[0048] It is understood that for different power supply devices, the outer profiles of the conventional terminals or conventional large teeth that match them may be different. The standard terminals involved in the above embodiments refer to conventional terminals or conventional large teeth that match the power supply devices.

[0049] The wiring structure provided in the above embodiment is compatible with various power supply devices by shaping the outer contour of the wiring terminal structure 20 into the same shape as the standard terminal.

[0050] It should be noted that in this embodiment, it is permissible for the outer profile of the terminal block structure 20 to be identical to that of the standard terminal, or for the outer profile of the terminal block structure 20 to be substantially the same as that of the standard terminal within an allowable error range. For example, the outer profile of the terminal block structure 20 may be substantially the same as that of the standard terminal within a dimensional error range of less than or equal to ±2%.

[0051] The present embodiment does not specifically limit the material composition of the conductor portion 101 in the wiring structure. In some embodiments, the conductor portion 101 may include pure copper, pure aluminum, and / or pure iron. In other embodiments, the conductor portion 101 may also include tinned copper, copper-clad aluminum, and / or aluminum-coated copper.

[0052] Please continue reading Figure 2 and Figure 3 In some embodiments, the connecting wire 10 may further include an insulating protective layer 102 . The outer side of the unexposed portion of the conductor portion 101 may be covered by the insulating protective layer 102 .

[0053] In the wiring structure provided in the above embodiment, the insulating protection layer 102 is sleeved on the outside of the conductor portion 101 (part of the end portion of the conductor portion 101 needs to be exposed) to provide insulation protection for the conductor portion 101 .

[0054] The present embodiment does not impose any specific restrictions on the material of the insulating protective layer 102. The choice of different materials can depend on the specific application requirements, including the working environment temperature, chemical exposure, electrical performance requirements, mechanical stress, etc. By selecting a suitable insulating material, the durability of the conductor portion 101 and its reliability in the corresponding application scenario can be ensured.

[0055] As an example, the insulating protective layer 102 may be formed from weather-resistant cross-linked polyethylene, which maintains excellent insulation properties and exhibits excellent resistance to aging, wear, and environmental stress cracking. Alternatively, the insulating protective layer 102 may be formed from polyvinyl chloride, which exhibits excellent chemical resistance and is relatively low-cost, making it suitable for mass production.

[0056] Please continue reading Figure 3 In some embodiments, a through hole 201 may be provided on the terminal structure 20 so that the terminal structure can be fixed to the electrode contact of the power supply device.

[0057] In other embodiments, the terminal structure 20 may also be provided with a snap-in connection so that the terminal structure can be snap-connected with the electrode contact of the power supply device.

[0058] According to some embodiments, this application also provides a conductive connection device for electrically connecting to a power supply device to achieve electrical energy transmission. The conductive connection device includes the wiring structure described in any of the aforementioned embodiments, thereby electrically connecting to the power supply device via the aforementioned wiring structure. The conductive connection device can also achieve the technical effects achieved by the aforementioned wiring structure, and will not be described in detail here.

[0059] As an example, the conductive connection device may include but is not limited to a battery clamp, a welding clamp, a grounding clamp, and the like.

[0060] Battery clamps can be used, for example Figure 4 As shown, the battery clamp may specifically include a wiring structure 100, an upper battery clamp 210a, and a lower battery clamp 210b provided on one side of the upper battery clamp 210a.

[0061] The wiring structure 100 can be installed between the upper battery clamp 210a and the lower battery clamp 210b for connecting to the battery.

[0062] The welding clamp can be used to clamp objects during welding, such as Figure 5 As shown, the welding clamp may specifically include a wiring structure 100, a pressing handle 221a, a handle 221b, an upper clamping portion 222a and a lower clamping portion 222b.

[0063] Specifically, a clamping portion for clamping an article is provided at one end of the handle 221 b , and the clamping portion may include an upper clamping portion 222 a and a lower clamping portion 222 b provided on one side of the upper clamping portion 222 a .

[0064] The wiring structure 100 may be installed between the upper clamping portion 222a and the lower clamping portion 222b.

[0065] For example, the pressing handle 221 a may be provided at the upper clamping portion 222 a and disposed on one side of the handle 221 b .

[0066] The grounding clamp can be e.g. Figure 6 The grounding clamp may specifically include a wiring structure 100, a first clamping body 230a, and a second clamping body 230b hinged to the first clamping body 230a.

[0067] The wiring structure 100 may be installed between the first clamping body 230 a and the second clamping body 230 b .

[0068] It is understandable that the battery clamp, welding clamp and grounding clamp described above may also include other functional components, such as assembly components, pins, torsion springs, etc., which should be technologies well known to those skilled in the art and will not be described in detail here.

[0069] The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A wiring structure, characterized in that: include: A connecting wire, wherein at least a portion of a conductor portion of the connecting wire is exposed; wherein the exposed portion of the conductor portion is formed into a strong terminal structure; Wherein, the exposed portion of the conductor part is configured as the terminal structure formed by mold compression molding.

2. The wiring structure according to claim 1, wherein: The outer contour of the terminal structure is the same as that of a standard terminal.

3. The wiring structure according to claim 1, wherein: The connecting wire also includes an insulating protective layer; The outer side of the unexposed portion of the conductor portion is covered with the insulating protective layer.

4. The wiring structure according to claim 1, wherein: A through hole is provided on the wiring terminal structure.

5. The wiring structure according to claim 1, wherein: The wiring terminal structure is provided with a bayonet.

6. The wiring structure according to claim 1, wherein: The conductor portion of the connecting wire includes a pure copper wire, a pure aluminum wire and / or a pure iron wire.

7. The wiring structure according to claim 1, wherein: The conductor part includes a tinned copper wire, a copper-clad aluminum wire and / or an aluminum-clad copper wire.

8. A conductive connection device, characterized in that: Used to be electrically connected to a power supply device to achieve transmission of electric energy, comprising a wiring structure as claimed in any one of claims 1 to 7; The conductive connection device is electrically connected to the power supply equipment via the wiring structure.

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