Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a connecting part, the connecting part is formed by alternately stacking first metal layers and dielectric layers, in the stacking direction, the connecting part comprises a first end and a second end, the second end of the connecting part comprises a step surface, and the step surface comprises a top surface and a bottom surface; the main board is connected with the first end of the connecting part; the component is connected with the second end of the connecting part, and at least part of the component is arranged on the top surface of the step surface; the circuit is arranged in the connecting part, and the main board and the component are electrically connected through the circuit.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] As 5G (5th Generation Mobile Communication Technology) terminals increase signal transmission frequencies and enable more functions, the area and number of components placed on the motherboard are also increasing. Constrained by the overall size requirements of 5G terminals and the need for battery space, the motherboard layout area is gradually being compressed.

[0003] In the related art, the photosensitive chip is installed on the hard board area of ​​the soft-hard board, and the camera is connected to the BTB (Board-to-Board) male socket through the soft board, and the BTB male socket is snap-fitted and welded to the BTB female socket in the hard board area.

[0004] The FPCB, along with the BTB male and female connectors, takes up a significant amount of space on the motherboard, making layout above the motherboard difficult and limiting motherboard miniaturization. Furthermore, the FPCB is prone to redundant or excessive length, making wiring difficult. Utility Model Content

[0005] The present application aims to provide an electronic device that at least solves the technical problems of difficult space layout on the motherboard, limited motherboard miniaturization design and difficult wiring.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] In a first aspect, an embodiment of the present application proposes an electronic device, which includes: a connecting component, which is formed by alternately stacking a first metal layer and a dielectric layer, and in the stacking direction, the connecting component includes a first end and a second end, and the second end of the connecting component includes a step surface, and the step surface includes a top surface and a bottom surface; a main board, which is connected to the first end of the connecting component; components, which are connected to the second end of the connecting component, and at least some of the components are arranged on the top surface of the step surface; and a circuit, which is arranged in the connecting component, and the main board and the components are electrically connected through the circuit.

[0008] By providing a connecting component stacked by a first metal layer and a dielectric layer, and pre-embedded wiring in the connecting component, the electrical connection between the connecting component and the mainboard can be simultaneously completed after the component is installed in the designated area of ​​the second end of the connecting component. This allows the connecting component to take into account both the positioning and support functions of the component and the electrical connection function of the component, thereby eliminating the matching connection scheme of the flexible board, BTB male socket and BTB female socket proposed in the relevant technology.

[0009] Compared to BTB male and female connectors, the connector eliminates the plug-in mating structure found in these connectors. This reduces structural and process complexity, thereby lowering production costs. It also reduces the required space, thereby easing the difficulty of spatial layout on the motherboard and facilitating miniaturized motherboard design. Furthermore, compared to mating connection solutions in related technologies, the connector eliminates the need for an independent external connection structure similar to a flexible board by pre-embedded wiring within the connector. This not only rationally utilizes the space within the connector, further reducing the difficulty of spatial layout on the motherboard, but also eliminates the length redundancy or excessive shortness associated with flexible board connections, thereby reducing the wiring complexity of the connector.

[0010] It can be seen that this application solves the technical problems of difficult spatial layout on the motherboard, limited miniaturization design of the motherboard and difficult wiring by setting the above-mentioned connecting components, thereby achieving the technical effect of improving the compactness of the electronic device structure, reducing the size of the motherboard, and reducing the difficulty of miniaturization design and lightweight design of electronic equipment.

[0011] On this basis, a stepped surface is formed on the second end of the connecting component. Specifically, the stepped surface can be machined on the second end of the connecting component through a cover removal process. The stepped surface includes a top surface and a bottom surface. Among the components arranged at the second end of the connecting component, at least some components are arranged on the top surface of the stepped surface. After the connecting component including the stepped surface is installed on top of the mainboard, the top surface of the stepped surface is raised relative to the bottom surface of the stepped surface.

[0012] Thus, by placing at least some components above the stepped surface, the height of the components can be raised by the stepped surface, thereby meeting the layout requirements of the components in the height direction of the motherboard and ensuring that the components can function normally. In addition, compared with the technical solution of separately placing a pad between the motherboard and the components for elevation, the present application constructs a stepped surface on the connecting component, so that the connecting component can not only have the functions of electrical connection and positioning support, but also take into account the function of raising the components, thereby further reducing the structural complexity of the electronic device and reducing the production cost of the electronic device.

[0013] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0015] Figure 1is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0016] Figure 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0017] Figure 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0018] Figure 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0019] Figure 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0020] Figure 6 Schematic diagram of the structure of an electronic device according to an embodiment of the present application.

[0021] Reference numerals:

[0022] 100 electronic device, 110 mainboard, 112 opening, 1122 first opening, 1124 second opening, 114 narrow edge, 116 trace, 120 connecting component, 1202 first metal layer, 1204 dielectric layer, 1206 first end, 1208 second end, 122 step surface, 1222 top surface, 1224 bottom surface, 124 recessed portion, 1242 groove, 1244 notch, 126 first through hole, 128 second through hole, 1300 component, 130 first component, 132 receiver, 1322 second contact, 134 camera, 1342 first contact, 1344 hard board area, 140 second component, 142 flash, 144 infrared sensor, 150 circuit, 160 second metal layer, 170 third component, 180 first pad, 182 second pad. DETAILED DESCRIPTION

[0023] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0026] The following combination Figures 1 to 6 An electronic device according to an embodiment of the present application is described.

[0027] like Figure 1 and Figure 2 As shown, according to some embodiments of the present application, the electronic device 100 includes: a connecting component 120, the connecting component 120 is formed by alternately stacking the first metal layer 1202 and the dielectric layer 1204, in the stacking direction ( Figure 1 (indicated by arrow a), the connecting component 120 includes a first end 1206 and a second end 1208, the second end 1208 of the connecting component 120 includes a step surface 122, the step surface 122 includes a top surface 1222 and a bottom surface 1224; the main board 110, the main board 110 is connected to the first end 1206 of the connecting component 120; the component 1300, the component 1300 is connected to the second end 1208 of the connecting component 120, and at least part of the component 1300 is arranged on the top surface 1222 of the step surface 122; the circuit 150, the circuit 150 is arranged in the connecting component 120, and the main board 110 and the component 1300 are electrically connected through the circuit 150.

[0028] In this embodiment, the electronic device 100 includes a mainboard 110 and components 1300. Components 1300 need to be electrically connected to the mainboard 110. The mainboard 110 is provided with a power supply circuit and a control circuit. The mainboard 110 controls the operation of the components 1300 through the power supply circuit and the control circuit, so that the components 1300 can realize corresponding functions, such as image information acquisition, communication signal transmission, voice information acquisition, or infrared signal acquisition.

[0029] On this basis, the electronic device 100 further includes a connecting component 120, which is formed by stacking multiple first metal layers 1202 and multiple dielectric layers 1204. Specifically, the first metal layers 1202 and dielectric layers 1204 are stacked alternately. After stacking, the connecting component 120 is divided into a first end 1206 and a second end 1208 along the stacking direction. The first end 1206 is used to connect to the motherboard 110, and the second end 1208 is used to connect to the component 1300. In other words, the component 1300 and the motherboard 110 are located on opposite sides of the connecting component 120.

[0030] Among them, a circuit 150 is pre-buried in the connecting component 120, and the circuit 150 extends in the stacking direction of the first metal layer 1202 and the dielectric layer 1204. The circuit 150 is used to electrically connect the component 1300 and the mainboard 110 inside the connecting component 120, so that the mainboard 110 can control the operation of the component 1300 through the power supply circuit and control circuit thereon, thereby realizing the corresponding function.

[0031] The circuit 150 may connect the component 1300 and the mainboard 110 via a pad, and the circuit 150 may also connect the component 1300 and the mainboard 110 via the first metal layer 1202 .

[0032] It can be seen that by providing a connecting component 120 stacked by a first metal layer 1202 and a dielectric layer 1204, and pre-embedded circuits 150 in the connecting component 120, the component 1300 can be installed in the designated area of ​​the second end 1208 of the connecting component 120 and simultaneously complete the electrical connection between the connecting component 120 and the mainboard 110, so that the connecting component 120 can take into account both the positioning and support functions of the component 1300 and the electrical connection function of the component 1300, thereby eliminating the matching connection scheme of the flexible board, BTB male socket and BTB female socket proposed in the relevant technology.

[0033] Compared to the BTB male and female connectors, the connector 120 eliminates the plug-in mating structure found in the BTB male and female connectors. This reduces structural and process complexity, thereby lowering production costs. It also reduces the required space, thereby reducing the difficulty of spatial layout on the motherboard 110 and facilitating the miniaturization of the motherboard 110. Furthermore, compared to mating connection solutions in related arts, the connector 120 eliminates the need for an independent external connection structure similar to a flexible circuit board by pre-embedded wiring 150 within the connector. This not only rationally utilizes the space within the connector 120, further reducing the difficulty of spatial layout on the motherboard 110, but also eliminates the issues of redundant or excessively short lengths associated with flexible circuit board connections, thereby reducing the wiring complexity of the connector 120.

[0034] It can be seen that the present application solves the technical problems of difficult spatial layout on the mainboard 110, limited miniaturization design of the mainboard 110, and difficult wiring by setting the above-mentioned connecting component 120, thereby achieving the technical effect of improving the structural compactness of the electronic device 100, reducing the size of the mainboard 110, and reducing the difficulty of miniaturization design and lightweight design of the electronic device 100.

[0035] On this basis, a stepped surface 122 is formed on the second end 1208 of the connecting component 120. Specifically, the stepped surface 122 can be processed on the second end 1208 of the connecting component 120 through a decapping process. The stepped surface 122 includes a top surface 1222 and a bottom surface 1224. Among the components 1300 arranged at the second end 1208 of the connecting component 120, at least some of the components 1300 are disposed on the top surface 1222 of the stepped surface 122. After the connecting component 120 including the stepped surface 122 is mounted on the mainboard 110, the top surface 1222 of the stepped surface 122 is raised relative to the bottom surface 1224 of the stepped surface 122.

[0036] It can be seen that by arranging at least part of the components 1300 above the step surface 122, the height of the components 1300 can be raised by the step surface 122, thereby meeting the layout requirements of the components 1300 in the height direction of the mainboard 110 and ensuring that the components 1300 can work normally. In addition, compared with the technical solution of separately arranging a pad between the mainboard 110 and the components 1300 for padding, the present application constructs a step surface 122 on the connecting component 120, so that the connecting component 120 can take into account the padding function of the components 1300 on the basis of having the electrical connection function and the positioning support function, thereby further reducing the structural complexity of the electronic device 100 and reducing the production cost of the electronic device 100. Figure 1 、 Figure 3 and Figure 5 As shown, in some embodiments, optionally, the component 1300 includes: a first component 130 , which is disposed on the bottom surface 1224 of the step surface 122 ; and a second component 140 , which is disposed on the top surface 1222 of the step surface 122 .

[0037] In this embodiment, component 1300 includes a first component 130 and a second component 140 .

[0038] The first component 130 has relatively few restrictions on its placement height above the mainboard 110, while the second component 140 needs to be placed a predetermined distance above the mainboard 110 to meet its functional requirements. For example, the flashlight 142 and infrared sensor 144 need to be a certain distance above the mainboard 110 to avoid interference with the mainboard 110.

[0039] In this regard, the first component 130 is arranged on the bottom surface 1224 of the step surface 122, and the second component 140 is arranged on the top surface 1222 of the step surface 122. By arranging the first component 130 on the bottom surface 1224 of the step surface 122, the height of the first component 130 can be lowered on the basis of meeting the layout requirements of the first component 130, thereby avoiding the first component 130 occupying too much space above the mainboard 110, thereby providing convenient conditions for the miniaturized design of the mainboard 110 and reducing the difficulty of the space layout above the mainboard 110.

[0040] By placing the second component 140 on the top surface 1222 of the stepped surface 122, the height of the second component 140 can be raised by the stepped surface 122, thereby meeting the layout requirements of the second component 140 in the height direction of the mainboard 110 and ensuring the normal operation of the second component 140. In addition, compared with the technical solution of separately providing a pad between the mainboard 110 and the second component 140 for elevation, the present application constructs the stepped surface 122 on the connecting component 120, so that the connecting component 120 can not only have the electrical connection function and the positioning and support function, but also take into account the elevation function of the component 1300, thereby further reducing the structural complexity of the electronic device 100 and reducing the production cost of the electronic device 100.

[0041] like Figure 1 、 Figure 3 and Figure 5 As shown, in some embodiments, optionally, the first end 1206 of the connecting component 120 includes a recessed portion 124 , and the mainboard 110 is at least partially embedded in the recessed portion 124 .

[0042] In this technical solution, a recessed portion 124 is provided on the first end 1206 of the connecting component 120 for connecting to the main board 110. Specifically, the recessed portion 124 can be processed at the first end 1206 of the connecting component 120 through a cover opening process. After the connecting component 120 including the recess is installed above the main board 110, the area without the recessed portion 124 sinks relative to the recessed portion 124.

[0043] It can be seen that by providing the recessed portion 124, a partial area of ​​the connecting component 120 can be sunk into the hollow area of ​​the mainboard 110 or the edge area of ​​the mainboard 110, thereby reducing the space occupied by the connecting component 120 above the mainboard 110, thereby achieving the technical effect of reducing the difficulty of the space layout above the mainboard 110 and providing convenient conditions for the miniaturized design of the mainboard 110.

[0044] like Figure 1 、 Figure 3 and Figure 5 As shown, in some embodiments, optionally, in the stacking direction, the bottom surface 1224 of the step surface 122 and the recessed portion 124 are offset.

[0045] In this embodiment, the top surface 1222 of the stepped surface 122 and the recessed portion 124 are opposite each other in the stacking direction of the first metal layer 1202 and the dielectric layer 1204, and the bottom surface 1224 of the stepped surface 122 is offset from the recessed portion 124. After assembly, a portion of the motherboard 110 is embedded in the recessed portion 124 below the top surface 1222 of the stepped surface 122. The first component 130 is arranged on the bottom surface 1224 of the stepped surface 122. As the recessed portion 124 is inserted downward, the first component 130 is lowered into or around the circuit board. The second component 140 is elevated by the top surface 1222 of the stepped surface 122 to operate at a specified height.

[0046] It can be seen that by staggering the bottom surface 1224 of the step surface 122 and the recessed portion 124 on the upper and lower sides of the connecting component 120, the sinking requirement of the first component 130 can be achieved on the basis of meeting the raising requirement of the second component 140, so that the first component 130 can be sunk to the hollow area inside the mainboard 110 or the edge area of ​​the mainboard 110, thereby reducing the space occupied by the first component 130 above the mainboard 110, and then achieving the technical effect of reducing the difficulty of the space layout above the mainboard 110 and providing convenient conditions for the miniaturization design of the mainboard 110.

[0047] like Figure 2 、 Figure 4 and Figure 6 As shown, in some embodiments, optionally, the mainboard 110 includes an opening 112 , and the connecting component 120 is disposed at an edge of the opening 112 through a recess 124 .

[0048] In this embodiment, an opening 112 is provided on the mainboard 110 , and the opening 112 passes through the mainboard 110 in the height direction of the mainboard 110 .

[0049] On this basis, the connecting component 120 rests on the edge of the opening 112 through the recess 124. Specifically, the second component 140 and the step surface 122 are arranged in the area around the opening 112 along with the groove 1242. The first component 130 and the connecting component 120 around the step surface 122 are sunk into the interior of the opening 112.

[0050] It can be seen that by setting the opening 112 on the mainboard 110, the mainboard 110 can avoid the sunken first component 130 and part of the connecting part 120, thereby reducing the space occupied by the first component 130 and the connecting part 120 above the mainboard 110, thereby providing convenient conditions for the miniaturized design of the mainboard 110 and the ultra-thin design of the electronic device 100.

[0051] Specifically, the first component 130 is spaced apart from the sidewall of the opening 112 to prevent the first component 130 from short-circuiting.

[0052] like Figure 2 and Figure 6 As shown, in some embodiments, optionally, the opening 112 includes a first opening 1122 and a second opening 1124, the first opening 1122 and the second opening 1124 are arranged side by side, and the area on the main board 110 between the first opening 1122 and the second opening 1124 is the narrow edge 114; the recessed portion 124 is a groove 1242, and the connecting component 120 is mounted on the narrow edge 114 through the groove 1242.

[0053] In this embodiment, a first opening 1122 and a second opening 1124 are provided side by side on the main board 110, wherein a portion of the main board 110 between the first opening 1122 and the second opening 1124 forms a narrow side 114 of the main board 110. After the electrical components and the main board 110 are assembled, the narrow side 114 has a stress concentration problem, so that the narrow side 114 is more easily damaged than other areas on the main board 110, specifically causing the narrow side 114 to deform or even break.

[0054] On this basis, the recessed portion 124 is a groove 1242, which includes a bottom wall and two side walls. During assembly, the connecting component 120 is fitted onto the outside of the narrow side 114 via the groove 1242. After assembly, the top of the narrow side 114 contacts the bottom wall of the groove 1242, and the side of the narrow side 114 faces the side walls of the groove 1242. When the narrow side 114 is affected by an external force, part of the force can be transferred to the connecting component 120 through contact, thereby reducing the stress on the narrow side 114. In addition, the side walls of the groove 1242 on both sides of the narrow side 114 can block the narrow side 114, preventing the narrow side 114 from being significantly deformed or even broken.

[0055] It can be seen that by providing a groove 1242 on the connecting component 120 and fitting the groove 1242 on the narrow side 114 of the mainboard 110, the narrow side 114 can be structurally reinforced by the connecting component 120, so that the connecting component 120 can take into account the reinforcement function on the basis of the electrical connection function and the positioning function, thereby achieving the technical effect of improving the structural stability of the mainboard 110 and reducing the failure rate of the mainboard 110.

[0056] Moreover, compared with the technical solution of separately providing a reinforcing steel sheet for the narrow side 114, the reinforcing steel sheet will not only increase the material cost, but will also occupy the component 1300 arrangement space and wiring space above the narrow side 114. The above problem can be solved by taking the structural reinforcement function into consideration through the connecting component 120.

[0057] like Figure 3 、 Figure 4 and Figure 6 As shown, in some embodiments, optionally, the recessed portion 124 is a notch 1244 , and the connecting component 120 is snapped onto the edge of the opening 112 through the notch 1244 ; the opening 112 is located at the edge of the mainboard 110 .

[0058] In this embodiment, recessed portion 124 is a notch 1244, which includes a bottom wall and a side wall. During assembly, connecting component 120 rests against the edge of opening 112 via notch 1244. After assembly, the bottom wall of notch 1244 rests on the portion of mainboard 110 surrounding the opening, while the side walls of notch 1244 face the edge of the opening.

[0059] The second component 140 and the stepped surface 122 are located at the top of the notch 1244 , and the first component 130 is located around the notch 1244 and is sunk into the opening.

[0060] It can be seen that by setting the recessed portion 124 as a notch 1244, the connecting component 120 can be used with a single opening, thereby meeting the sinking requirement of the first component 130 on the inside of the opening and meeting the raising requirement of the second component 140 around the opening, thereby achieving the technical effect of reducing the difficulty of the spatial layout of the mainboard 110 and providing convenient conditions for the miniaturized design of the mainboard 110.

[0061] On this basis, the opening 112 is opened at the edge of the main board 110 . In the circumferential direction of the opening 112 , the opening 112 is closed on three sides and open on one side.

[0062] Among them, compared with opening a hole 112 in the middle of the mainboard 110, opening a hole 112 at the edge of the mainboard 110 is less difficult and causes less damage to the structural strength of the mainboard 110, thereby achieving the technical effect of reducing the processing difficulty of the mainboard 110 and reducing the failure rate of the mainboard 110.

[0063] In addition, the edge of the mainboard 110 is often provided with openings 112 to avoid other components. For this purpose, the connecting component 120 can reasonably utilize its own openings 112 through the notch 1244 for layout, thereby meeting the sinking requirements of the first component 130 and the lifting requirements of the second component 140 without increasing the process complexity of the mainboard 110.

[0064] like Figure 4 and Figure 6 As shown, in some embodiments, optionally, the electronic device 100 further includes:

[0065] The second metal layer 160 is disposed on the sidewall of the recess 124 , and the second metal layer 160 is located between the first component 130 and a portion of the mainboard 110 in the recess 124 .

[0066] In this embodiment, the sidewalls of the recess 124 are covered with a second metal layer 160 .

[0067] Specifically, when the recessed portion 124 is a groove 1242, a second metal layer 160 is provided on the sidewalls of the two grooves 1242 on the left and right sides of the mainboard 110. The second metal layer 160 on the left separates the first component 130 on the left and the portion of the mainboard 110 within the groove 1242, while the second metal layer 160 on the right separates the first component 130 on the right and the portion of the mainboard 110 within the groove 1242. When the recessed portion 124 is a notch 1244, the notch 1244 includes only one sidewall, and a single second metal layer 160 is disposed between the first component 130 and the portion of the mainboard 110 within the notch 1244.

[0068] Among them, the second metal layer 160 can play a signal shielding role. The mainboard 110 is provided with a wiring 116. By setting the second metal layer 160, signal interference between the wiring 116 inside the recess 124 and the first component 130 can be avoided, thereby achieving the technical effect of improving the working stability of the first component 130 and reducing the failure rate of the electronic device 100.

[0069] like Figure 4 and Figure 6 As shown, in some embodiments, optionally, the electronic device 100 further includes: a third component 170 , the third component 170 is connected to the first end 1206 of the connecting component 120 , and the third component 170 avoids the recess 124 , and the circuit 150 is electrically connected to the third component 170 .

[0070] In this embodiment, the electronic device 100 further includes a third component 170, which is connected to the first end 1206 of the connecting member 120 and is located outside the recess 124. The area outside the recess 124 on the first end 1206 of the connecting member 120 corresponds to a subsidence area. After assembly, the third component 170, along with the first component 130, is subsident into the opening 112, or is subsident below the mainboard 110. This allows the connecting member 120 to position and support more components 1300, thereby improving the structural compactness of the electronic device 100. Furthermore, the space occupied by the components 1300 above the mainboard 110 is further reduced, facilitating a miniaturized design of the mainboard 110.

[0071] like Figure 2 、 Figure 4 and Figure 6As shown, in some embodiments, optionally, the first component 130 includes: at least one of a receiver 132 and a camera 134 ; the second component 140 includes: at least one of a flash 142 and an infrared sensor 144 .

[0072] like Figure 3 、 Figure 4 、 Figure 5 and Figure 6 As shown, in some embodiments, optionally, the first solder pad 180 connects the mainboard 110 and the first end 1206 of the connecting component 120 ; the second solder pad 182 connects the first component 130 and the stepped surface 122 .

[0073] In this embodiment, a first soldering pad 180 is provided at the first end 1206 of the connecting component, and the first soldering pad 180 is connected to a contact on the mainboard 110. The provision of the first soldering pad 180 can increase the contact area between the mainboard 110 and the connecting component 120, thereby improving the positioning stability of the connecting component 120 on the mainboard 110 and reducing the probability of the connecting component 120 tilting or even falling off. In addition, the first soldering pad 180 can meet the electrical connection requirements between the mainboard 110 and the connecting component 120, ensuring that electrical signals can be transmitted between the mainboard 110 and the circuit 150.

[0074] The second end 1208 of the connecting component is provided with a second solder pad 182. The second solder pad 182 can be provided on the bottom surface 1224 of the stepped surface 122. The camera 134 can be connected to the second solder pad 182 via the first contact 1342 on the hard board area 1344. Correspondingly, the receiver 132 can be connected to the second solder pad 182 via the second contact 1322 thereon. The second solder pad 182 can also be provided on the top surface 1222 of the stepped surface 122, with the flash 142 or the infrared sensor 144 fixed to the second solder pad 182. By providing the second solder pad 182, the contact area between the first component 130 and the connecting component 120 can be expanded, thereby improving the positioning stability of the first component 130 and reducing the probability of the first component 130 tilting or even falling off. The second solder pad 182 can also meet the electrical connection requirements of the first component 130 and the connecting component 120, ensuring that electrical signals can be transmitted between the first component 130 and the circuit 150.

[0075] like Figure 1 、 Figure 3 and Figure 5As shown, in some embodiments, optionally, the connecting component 120 includes a first through hole 126, the first through hole 126 passes through the dielectric layer 1204 between the two adjacent first metal layers 1202, and the circuit 150 connects the two adjacent first metal layers 1202 through the first through hole 126; and / or the connecting component 120 includes a second through hole 128, the second through hole 128 passes through the first metal layer 1202 and the dielectric layer 1204.

[0076] In this technical solution, a first through hole 126 and a second through hole 128 are opened in the connecting component 120, and a circuit 150 is arranged in the first through hole 126 and the second through hole 128 to achieve electrical connection between the first component 130, the second component 140 and the mainboard 110.

[0077] Specifically, the first through-hole 126 only passes through the dielectric layer 1204 between two adjacent first metal layers 1202. In this case, the first metal layer 1202 participates in the transmission of electrical signals. The two adjacent first metal layers 1202 are electrically connected through the line 150 in the first through-hole 126 between them. When it is necessary to transmit electrical signals across multiple first metal layers 1202, multiple first through-holes 126 are required for wiring.

[0078] The second through hole 128 penetrates the first metal layer 1202 and the dielectric layer 1204 at the same time. The depth of the second through hole 128 can be selected according to the actual electrical connection requirements. Specifically, the second through hole 128 can penetrate the connecting component 120 along the stacking direction, thereby directly connecting the components 1300 and the main board 110 on the upper and lower sides through the line 150. The second through hole 128 can also be arranged inside the connecting component 120 to cooperate with the wiring of the first metal layer 1202.

[0079] By providing the first through hole 126 and the second through hole 128, the space inside the connecting component 120 can be reasonably utilized for wiring, thereby eliminating the external soft board structure in the related art, and then the connecting component 120 can take into account both the positioning support function and the electrical connection function, thereby achieving the technical effect of improving the structural compactness of the electronic device 100, reducing the size of the mainboard 110, and reducing the difficulty of miniaturization and lightweight design of the electronic device 100.

[0080] like Figure 1 and Figure 2As shown, in one embodiment of the present invention, the shape of the connecting component 120 is designed to be a "J" shape. The connecting component 120 is mainly composed of a top surface layer, a bottom surface layer, an inner copper layer, and a dielectric layer 1204. In order to achieve welding on the narrow side of the motherboard, the connecting component 120 is designed with a bottom groove 1242. The bottom groove 1242 can be processed by a cover-opening technology, and a first soldering pad 180 is designed on the bottom wall of the groove 1242 for soldering to the motherboard 110. A second soldering pad 182 can be designed on the top surface for mounting components 1300. The mounted components 1300 achieve signal conduction with the motherboard 110 through the circuit 150 in the first through hole 126 and the second through hole 128 inside the connecting component 120. At the same time, the connecting component 120 is designed with a step surface 122, which can be produced by cover opening technology + milling molding. A second solder pad 182 is designed on the step surface for connecting with the first contact 1342 designed on the hard board area 1344 at the bottom of the camera 134.

[0081] The specific stacking method of the connecting component 120, the mainboard 110, the camera 134, and the components 1300 is as follows: Figure 2 As shown, the connecting component 120 is welded to the narrow edge 114 of the mobile phone motherboard to provide reinforcement, preventing cracks or even complete breakage of the narrow edge 114 due to excessive stress when the phone is impacted or dropped, thereby preventing functional failure of the motherboard 110. The first end 1206 and second end 1208 of the connecting component 120 can be designed with solder pads as needed, with the first solder pad 180 at the top being soldered to the component 1300.

[0082] For example, the second end 1208 can be soldered to the flash 142, eliminating the need to reserve space for the flash 142 and its spacer on the mobile phone motherboard 110, thus saving board space. Furthermore, when components with height requirements in the stacking direction are soldered to the top or bottom, the distance from the top or bottom to the mobile phone motherboard 110 can be adjusted through the stacking and material design of the connecting component 120, eliminating the need for additional design or custom spacer, thus saving costs.

[0083] Correspondingly, the connection structure of the camera 134 is simplified, the soft board and the BTB connector on the soft board are cancelled, and a first contact 1342 is designed on the hard board area 1344 at the bottom of the camera 134. The camera 134 is mainly connected to the first pad 180 on the connecting component 120 through the first contact 1342 (welding or direct contact), and then connected to the mainboard 110 through the circuit 150, the first through hole 126, and the second through hole 128 inside the connecting component 120, thereby realizing the function of signal conduction.

[0084] The design and production of a connecting component 120 can realize the signal connection between the two cameras 134 and the mainboard 110. Compared with the BTB connection method in the related art, the space required for arranging components is reduced.

[0085] In summary, in this embodiment, the designed connecting component 120 has the functions of reinforcement, elevation, and signal conduction, thereby saving layout space, solving local wiring bottlenecks, and reducing costs.

[0086] It can be seen that in this embodiment, the designed connecting component 120 has a signal conduction function, which can simplify the connection design of the camera 134, eliminate the soft board area of ​​the camera 134, and eliminate the need to use BTB devices, thereby reducing the material cost and production cost of the connection structure of the camera 134.

[0087] In this embodiment, the designed connecting component 120 can simultaneously achieve signal conduction for multiple cameras 134, thereby reducing the number of devices arranged on the mobile phone motherboard 110 to achieve signal conduction for the cameras 134, saving layout space, and being conducive to further reducing the area of ​​the motherboard 110, making space for the battery, and increasing the battery capacity.

[0088] In this embodiment, the designed connecting component 120 replaces the reinforcing steel sheet with a single function to achieve the reinforcement function. At the same time, devices can be welded on the top and bottom. Some devices of the main board 110 can be arranged on the connecting component 120, saving the layout space of the main board 110.

[0089] In this embodiment, the thickness of the designed connecting component 120 can be adjusted according to needs through stacking design, material design, etc., so as to realize the raising function of the devices welded on the top and bottom of the connecting component 120 and with height requirements, without the need to separately design and manufacture a raising plate, thus saving costs.

[0090] In this embodiment, when a wiring bottleneck is encountered at the narrow side 114 , a circuit 150 may be designed in the connecting component 120 to solve the layout and wiring bottleneck problem.

[0091] like Figure 1 and Figure 2As shown, in one embodiment of the present invention, the connecting component 120 is designed in a "Z" shape. To facilitate welding to the mobile phone motherboard 110, the bottom of the connecting component 120 is designed with a notch 1244. The notch 1244 can be produced using a combination of cover-opening technology and CNC (Computerized Numerical Control) molding technology. A first soldering pad 180 is designed at the bottom for soldering to the motherboard 110. A second soldering pad 182 can be designed at the top for mounting components 1300. The mounted components 1300 achieve signal conduction with the motherboard 110 through the internal circuit design of the connecting component 120.

[0092] At the same time, the top of the connecting component 120 is designed with a step surface 122, which can be produced by cover opening technology + CNC molding. The step surface is designed with a second solder pad 182 for connecting with the first contact 1342 designed on the hard board at the bottom of the camera 134.

[0093] In this embodiment, connecting component 120 is welded to opening 112. Solder pads can be designed on both the top and bottom of connecting component 120 as needed. Infrared sensor 144 can be welded to the top of connecting component 120. Connecting component 120 acts as a pad, eliminating the need to design and customize a separate pad for infrared sensor 144 on mainboard 110, thus saving costs. Depending on the required distance between infrared sensor 144 and mainboard 110, the thickness of connecting component 120 can be adjusted through stacking design and material design to meet the required height requirement for infrared sensor 144.

[0094] Accordingly, the camera 134 is simplified, the module's soft board and the BTB connector on the soft board are eliminated, and a first contact 1342 is designed on the hard board area 1344 at the bottom of the camera 134. The camera 134 is primarily connected to the second pad 182 on the connecting component 120 via the first contact 1342 (welding or direct contact), and then connected to the mainboard 110 through the internal circuit design of the connecting component 120, thereby achieving signal conduction.

[0095] In summary, in this embodiment, the designed connecting component 120 has the functions of raising the height and conducting signals, thereby saving the material cost and manufacturing cost of separately designing and manufacturing a raising plate.

[0096] In this embodiment, the designed connecting component 120 has a signal conduction function. By changing the connection method between the existing camera 134 and the mainboard 110, the design of the camera 134 can be simplified, the soft board area of ​​the camera 134 can be eliminated, and there is no need to use BTB devices, thereby reducing the material cost and production cost of the camera 134.

[0097] In this embodiment, the components 1300 can be welded to both the top and the bottom of the connecting component 120 , and some components of the mainboard 110 can be arranged on the connecting component 120 , saving layout space of the mainboard 110 .

[0098] In this embodiment, the thickness of the designed connecting component 120 can be adjusted according to needs through stacking design, material design, etc., thereby meeting the height-raising function of some components 1300 with height requirements, replacing the use of raising plates, and saving costs.

[0099] like Figure 5 and Figure 6 As shown, in one embodiment of the present invention, camera 134 often experiences signal interference from traces 116 on mainboard 110, resulting in lag or color bars during camera 134 operation. This embodiment incorporates a side-plating process into the design of connecting component 120, creating a copper layer of a certain thickness on the side to act as a shield. When traces are incorporated into mainboard 110 within narrow edge 114, signal interference from the traces to camera 134 may occur. Therefore, a side-plating process is performed on the sidewalls of groove 1242 to form a second metal layer 160. This second metal layer 160 acts as a signal shield, resolving the signal interference issue.

[0100] The electronic device 100 may be a terminal or other device other than a terminal. For example, the electronic device 100 may be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device 100, a mobile internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. It may also be a personal computer (PC), a television (TV), an ATM, or an kiosks, etc., and the embodiments of the present application are not specifically limited thereto.

[0101] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0102] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: a connecting component, wherein the connecting component is formed by alternately stacking a first metal layer and a dielectric layer, wherein in a stacking direction, the connecting component includes a first end and a second end, the second end of the connecting component includes a stepped surface, and the stepped surface includes a top surface and a bottom surface; a mainboard connected to the first end of the connecting component; components, the components being connected to the second end of the connecting member, and at least a portion of the components being disposed on the top surface of the stepped surface; A circuit is provided in the connecting component, and the mainboard and the components are electrically connected via the circuit.

2. The electronic device according to claim 1, wherein The components include: a first component, the first component being disposed on the bottom surface of the step surface; A second component is provided on the top surface of the step surface.

3. The electronic device according to claim 2, wherein: The first end of the connecting component includes a recessed portion, and the main board is at least partially embedded in the recessed portion.

4. The electronic device according to claim 3, wherein: In the stacking direction, the bottom surface of the step surface and the recessed portion are offset.

5. The electronic device according to claim 3, wherein: The main board includes an opening, and the connecting component is arranged at the edge of the opening through the recessed portion.

6. The electronic device according to claim 5, characterized in that The openings include a first opening and a second opening, the first opening and the second opening are arranged side by side, and the area between the first opening and the second opening on the mainboard is a narrow edge; The recessed portion is a groove, and the connecting component is sleeved on the narrow edge through the groove.

7. The electronic device according to claim 5, wherein: The recessed portion is a notch, and the connecting component is snapped onto the edge of the opening through the notch; The opening is located at the edge of the main board.

8. The electronic device according to claim 3, wherein: Also includes: A second metal layer is provided on a sidewall of the recessed portion, and the second metal layer is located between the first component and a portion of the mainboard in the recessed portion.

9. The electronic device according to claim 4, characterized in that Also includes: A third component is connected to the first end of the connecting component, and the third component is located outside the recessed portion, and the circuit is electrically connected to the third component.

10. The electronic device according to any one of claims 2 to 9, characterized in that: The first component includes: at least one of a receiver and a camera; The second component includes at least one of a flash lamp and an infrared sensor.

11. The electronic device according to any one of claims 2 to 9, characterized in that: Also includes: a first solder pad, connecting the mainboard and the first end of the connecting component; The second pad connects the first component and the stepped surface.

12. The electronic device according to any one of claims 1 to 9, characterized in that: The connecting component includes a first through hole, the first through hole penetrates the dielectric layer between two adjacent first metal layers, and the circuit connects the two adjacent first metal layers through the first through hole; and / or The connecting component includes a second through hole therein, and the second through hole passes through the first metal layer and the dielectric layer.

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