Power tube assembly and PCB assembly
By introducing heat sink fins, thermal conductive film and fixing mechanism into the power tube assembly, the problems of cumbersome installation and poor heat dissipation are solved, convenient installation and efficient heat dissipation are achieved, and the life of the assembly is extended.
Patent Information
- Application Number
- CN202422558429.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-10-23
AI Technical Summary
The installation methods of existing power tube components and PCB components are cumbersome and have poor heat dissipation effects, which affects the difficulty of operation and the life of the components.
The heat dissipation structure adopts a combination of heat dissipation fins and thermal conductive film, and the design of the fixing mechanism and docking block achieves convenient installation and efficient heat dissipation, and uses thermal conductive silicone and copper film to enhance heat conduction efficiency.
It achieves convenient installation and efficient heat dissipation, reduces component temperature, extends service life, and simplifies disassembly and maintenance processes.
Smart Images

Figure CN223391492U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic power, in particular to a power tube assembly and a PCB assembly. Background Art
[0002] In today's era of electrification and automation, the power electronics market is developing at an unprecedented pace, especially in terms of reducing pollution and improving efficiency. With the global commitment to carbon neutrality goals and the increasing demand for more efficient and environmentally friendly solutions in the automotive and industrial fields, power tube components and PCB assemblies, as core components of power electronics systems, have become the focus of industry attention due to their performance, reliability and cost-effectiveness.
[0003] The power tube needs to be installed on a PCB board when in use. The PCB board provides a stable and reliable installation base for the power tube. When the power tube is used with the PCB board, the PCB board needs to be installed on different electronic components or used on existing products. Currently, when installing the PCB board, bolts are mainly used for fastening and installation, which is cumbersome. In addition, each disassembly and assembly requires the use of appropriate tools, which reduces the difficulty of PCB board installation and subsequent maintenance. Therefore, further improvements are needed. Utility Model Content
[0004] The purpose of the present invention is to provide a power tube assembly and a PCB assembly to solve the problem of the complicated installation method of the existing power tube assembly and PCB assembly proposed in the above background technology.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a power tube assembly, comprising a heat dissipation assembly and a plurality of power tubes, wherein the heat dissipation assembly is fixed to a PCB board, and the plurality of power tubes are arranged at the top of the PCB board. The heat dissipation assembly includes a heat dissipation fin fixed to the top of the PCB board, and one side of the heat dissipation fin is in contact with the plurality of power tubes. Heat dissipation holes are evenly opened on the PCB board around the power tubes, and the inner walls of the heat dissipation holes are coated with a thermally conductive film, wherein the thermally conductive film is a copper film.
[0006] Preferably, the heat dissipation component further includes thermally conductive silicone rubber provided on both sides of the power tube, and an adhesive layer is provided on the thermally conductive silicone rubber, and the thermally conductive silicone rubber is adhered to the PCB board through the adhesive layer.
[0007] Preferably, it includes a PCB board and a power tube assembly assembled on the PCB board.
[0008] Preferably, four mounting components are evenly arranged on one side of the PCB board, and the mounting components include a fixing mechanism and a docking component.
[0009] Preferably, the fixing mechanism includes four fixing blocks, and the fixing blocks are fixed on both sides of the bottom end, movable grooves are opened on both sides inside the fixing blocks, and compression springs are connected between the movable grooves, and inverted racks are connected on both sides of one end of the fixing block.
[0010] Preferably, the docking assembly includes a docking block sleeved on the outside of the fixed block, and a plug-in hole is provided on the docking block. The plug-in hole is stepped, and locking racks are evenly fixed on both inner walls of the plug-in hole.
[0011] Compared with the prior art, the beneficial effects of the present invention are: the power tube assembly and the PCB assembly are not only easy to fix and install, but also have good heat dissipation effect;
[0012] Align the multiple sets of fixing blocks on the PCB board with the multiple sets of docking blocks on the product, and then insert the fixing blocks into the corresponding insertion holes on the docking blocks. During this process, the inverted rack moves downward along the teeth of the locking rack, compressing the compression spring in the movable groove. After the fixing blocks are fully inserted, the inverted rack and the locking rack engage with each other, and the fixing blocks are locked. The operation is convenient, which enables convenient installation of the PCB board, replacing the traditional bolt fixation, making the installation and fixation of the PCB board more efficient.
[0013] Multiple power tubes are installed on the PCB, and heat sink fins are installed on one side of the power tubes, effectively increasing the heat dissipation area. The heat generated during the operation of the PCB and power tubes can be quickly dissipated into the air by the heat sink fins, effectively reducing the temperature of the components. In addition, multiple sets of thermally conductive silicone are bonded to the PCB using an adhesive layer to further improve heat conduction efficiency and prevent overheating of the components.
[0014] Multiple sets of heat dissipation holes are opened on the PCB board, and the inside of the heat dissipation holes is coated with a thermal conductive film. The thermal conductive film is a copper film, which increases the contact area with the air. The heat generated by the PCB board and power tube components can be discharged through multiple sets of PCB boards and thermal conductive film, achieving the effect of comprehensive and efficient heat dissipation, which helps to extend the service life of the PCB board and power tube components. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;
[0017] Figure 2 This is a schematic diagram of the three-dimensional structure of the PCB board of the utility model in the flipped state;
[0018] Figure 3 This is a schematic diagram of the cross-sectional structure of the fixing mechanism of the present utility model;
[0019] Figure 4 This is a schematic diagram of the cross-sectional three-dimensional structure of the fixing block of the present utility model;
[0020] Figure 5 It is a schematic diagram of the three-dimensional structure of the heat-conducting film and heat dissipation holes of the present invention.
[0021] Explanation of the reference numerals in the figure: 1. PCB board; 101. Heat dissipation hole; 102. Thermal conductive film; 2. Power tube; 3. Heat dissipation fin; 4. Thermal conductive silicone; 401. Adhesive layer; 5. Fixing mechanism; 501. Fixing block; 502. Movable groove; 503. Inverted rack; 504. Compression spring; 6. Docking block; 7. Plug hole; 8. Locking rack. DETAILED DESCRIPTION
[0022] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0023] See also Figure 1-Figure 5 , the utility model provides the following technical solutions:
[0024] Example 1
[0025] In order to solve the problem of single heat dissipation mode and poor heat dissipation effect of existing power tube components, the following technical solutions are announced. For details, please refer to Figure 1 、 Figure 2 、 Figure 5 A power tube assembly includes a heat dissipation assembly and a plurality of power tubes 2. The heat dissipation assembly is fixed to a PCB board 1. The plurality of power tubes 2 are arranged at the top of the PCB board 1. The heat dissipation assembly includes a heat dissipation fin 3 fixed to the top of the PCB board 1, and one side of the heat dissipation fin 3 is in contact with the plurality of power tubes 2. Heat dissipation holes 101 are evenly opened on the PCB board 1 outside the power tubes 2, and the inner walls of the heat dissipation holes 101 are coated with a thermal conductive film 102, which is a copper film. The heat dissipation assembly also includes thermal conductive silicone rubber 4 arranged on both sides of the power tubes 2, and the thermal conductive silicone rubber 4 is provided with an adhesive layer 401. The thermal conductive silicone rubber 4 is bonded to the PCB board 1 through the adhesive layer 401.
[0026] When in use, this embodiment has multiple groups of power tubes 2 installed on the PCB board 1, and heat dissipation fins 3 installed on one side of the power tubes 2, effectively increasing the heat dissipation area. The heat dissipation fins 3 can quickly dissipate the heat generated during the operation of the PCB board 1 and the power tubes 2 into the air, effectively reducing the temperature of the component. Multiple groups of thermally conductive silicone rubber 4 are bonded to the PCB board 1 using an adhesive layer 401, which can further improve the heat conduction efficiency and prevent the component from overheating. Multiple groups of heat dissipation holes 101 are opened on the PCB board 1, and the inside of the heat dissipation holes 101 is coated with a thermally conductive film 102, wherein the thermally conductive film 102 is a copper film, which increases the contact area with the air. The heat generated by the PCB board 1 and the power tubes 2 can be dissipated through the multiple groups of PCB boards 1 and the thermally conductive film 102, achieving the effect of comprehensive and efficient heat dissipation, which helps to extend the service life of the PCB board 1 and the power tubes 2.
[0027] Example 2
[0028] This embodiment is different from the first embodiment. By using the setting of the fixing mechanism 5 and the docking block 6, the PCB assembly can be installed conveniently and quickly. Therefore, the following technical solutions are published. Please refer to the detailed Figure 1 、 Figure 2 Figure 3 、 Figure 4 A PCB assembly includes a PCB board 1 and a power tube assembly assembled on the PCB board 1. Four mounting assemblies are evenly arranged on one side of the PCB board 1, and the mounting assembly includes a fixing mechanism 5 and a docking assembly. The fixing mechanism 5 includes four fixing blocks 501, and the fixing blocks 501 are fixed to both sides of the bottom end. Both sides of the interior of the fixing blocks 501 are provided with movable grooves 502, and a compression spring 504 is connected between the movable grooves 502. Both sides of one end of the fixing blocks 501 are connected to an inverted rack 503. The docking assembly includes a docking block 6 sleeved on the outside of the fixing blocks 501, and a plug hole 7 is provided on the docking block 6. The plug hole 7 is stepped, and locking racks 8 are evenly fixed on both inner walls of the plug hole 7.
[0029] When the present embodiment is in use, the multiple groups of fixing blocks 501 on the PCB board 1 are aligned with the multiple groups of docking blocks 6 on the product to be used, and then the fixing blocks 501 are correspondingly inserted into the insertion holes 7 on the docking blocks 6. During this process, the inverted rack 503 moves downward along the teeth of the locking rack 8, and the compression spring 504 in the movable groove 502 is compressed. After the fixing block 501 is fully inserted, the inverted rack 503 and the locking rack 8 are engaged with each other, and the fixing block 501 can be locked. The operation is convenient, so as to realize the convenient installation of the PCB board 1, replacing the traditional bolt fixing, making the installation and fixation of the PCB board 1 more efficient. Later, pressing the fixing block 501, cooperating with the compression spring 504 inside it to compress, the inverted rack 503 and the locking rack 8 can be separated, and the fixing block 501 can be separated from the fixing mechanism 5, so that the PCB board 1 can be conveniently disassembled, which is helpful for later maintenance.
[0030] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0031] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one location or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of the present embodiment. Persons of ordinary skill in the art will be able to understand and implement the present invention without inventive effort.
[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.
Claims
1. A power tube assembly, characterized in that: The invention comprises a heat dissipation component and a plurality of power tubes (2), wherein the heat dissipation component is fixed on a PCB board (1), and the plurality of power tubes (2) are arranged on the top of the PCB board (1). The heat dissipation component comprises a heat dissipation fin (3) fixed on the top of the PCB board (1), and one side of the heat dissipation fin (3) is in contact with the plurality of power tubes (2). Heat dissipation holes (101) are evenly opened on the PCB board (1) outside the power tubes (2), and the inner walls of the heat dissipation holes (101) are coated with a heat conductive film (102), and the heat conductive film (102) is a copper film.
2. The power tube assembly according to claim 1, characterized in that: The heat dissipation component further comprises heat-conducting silica gel (4) arranged on both sides of the power tube (2), and an adhesive layer (401) is provided on each of the heat-conducting silica gel (4), and the heat-conducting silica gel (4) is adhered to the PCB board (1) via the adhesive layer (401).
3. A PCB assembly, characterized in that: The invention comprises a PCB board (1) and a power tube assembly assembled on the PCB board (1), wherein the power tube assembly is the power tube assembly according to any one of claims 1 to 2.
4. The PCB assembly according to claim 3, wherein: Four mounting components are evenly arranged on one side of the PCB board (1), and the mounting components include a fixing mechanism (5) and a docking component.
5. The PCB assembly according to claim 4, wherein: The fixing mechanism (5) comprises four fixing blocks (501), and the fixing blocks (501) are fixed to both sides of the bottom end. Both sides of the inside of the fixing block (501) are provided with movable grooves (502), and compression springs (504) are connected between the movable grooves (502). Both sides of one end of the fixing block (501) are connected to an inverted rack (503).
6. The PCB assembly according to claim 4, wherein: The docking assembly comprises a docking block (6) sleeved on the outside of the fixed block (501), and a plug hole (7) is provided on the docking block (6). The plug hole (7) is stepped, and locking racks (8) are evenly fixed on both inner walls of the plug hole (7).