Semiconductor wafer scribing machine

Abstract

The utility model relates to a semiconductor wafer scribing machine, which is characterized in that a dust collection ring (13) is arranged on the outer side of a top opening of a positioning box (14), a plurality of positioning ring grooves (15) are coaxially formed in the positioning box (14), the positioning ring grooves (15) are sequentially arranged from top to bottom, the diameters of the positioning ring grooves (15) are gradually reduced, and a vacuum chuck (16) is arranged at the bottom of the positioning box (14) in a sliding manner; according to the size of a wafer, the wafer is placed in a proper positioning ring groove (15) in a positioning box (14), rapid positioning of the wafer is achieved, the device is suitable for the wafers of different sizes, then vacuum adsorption and fixing are conducted on the bottom of the wafer through a vacuum suction cup (16) capable of being adjusted in an up-down sliding mode, a laser cutter (12) conducts scribing operation on the positioned and fixed wafer, and the wafer cutting efficiency is improved. And meanwhile, scraps generated by wafer scribing are adsorbed through the dust collection ring (13), so that the vacuum adsorption force of the vacuum chuck (16) and the adsorption stability of the wafer are prevented from being influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of dicing machines, in particular to a semiconductor wafer dicing machine. Background Art

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystals. The silicon ingot is ground, polished, and sliced ​​into silicon wafers, also known as wafers. The main working principle of a wafer dicing machine is to use a cutting tool or cutting wire to separate the entire wafer into individual crystals according to chip size. Therefore, the wafer dicing machine plays a vital role in the semiconductor manufacturing process. It determines the shape, size, and quality of the chips, directly affecting the performance and reliability of the integrated circuits.

[0003] Chinese utility model patent publication number CN219873466U discloses a semiconductor wafer processing dicing machine with a rapid positioning function. Two curved clamping plates push the wafer to the center of a rubber pad to achieve wafer positioning, and then a vacuum suction cup secures the wafer. However, this solution has a drawback: when the wafer diameter is smaller than the diameter of the vacuum cup, waste chips generated during wafer dicing will be sucked into the suction holes, affecting the vacuum suction force and wafer suction stability. Utility Model Content

[0004] The technical problem to be solved by the present invention is that when the diameter of the wafer of the existing semiconductor wafer processing dicing machine is smaller than the diameter of the vacuum suction cup, the waste chips generated by wafer dicing will be adsorbed into the suction hole, thereby affecting the vacuum adsorption force and the adsorption stability of the wafer.

[0005] In order to solve the above problems, the utility model provides a semiconductor wafer dicing machine, on which a laser cutter, a dust suction ring and a positioning box are sequentially provided on the machine body from top to bottom through support legs. The dust suction ring is arranged on the outside of the top opening of the positioning box. The interior of the positioning box is coaxially provided with multiple positioning ring grooves. The positioning ring grooves are arranged in sequence from top to bottom and the diameters gradually decrease. A vacuum suction cup is slidingly provided on the bottom of the positioning box.

[0006] The semiconductor wafer dicing machine provided by the utility model also has the following technical features:

[0007] The machine body is provided with an electric push rod and a vacuum pump, a guide hole is provided at the bottom of the positioning box, an air guide cylinder is provided at the output end of the electric push rod, the air guide cylinder passes through the guide hole and is connected to the vacuum suction cup; the output end of the vacuum pump is connected to a first tube body, the first tube body is connected to the interior of the vacuum suction cup through the air guide cylinder, an adsorption buffer pad is provided on the top of the vacuum suction cup, and a plurality of suction holes are provided on the vacuum suction cup and the adsorption buffer pad.

[0008] A positioning buffer pad is provided in the positioning ring groove.

[0009] The dust collection ring forms an annular suction groove from the inside to the outside; a dust collecting cabinet is provided on the machine body, a fan is provided on the dust collecting cabinet, the output end of the fan is connected to the inside of the dust collecting cabinet, the input end of the fan is connected to a second pipe body, and the end of the second pipe body is connected to the annular suction groove.

[0010] One side of the dust collecting cabinet is open and provided with a cabinet door.

[0011] The dust suction ring is arranged to be gradually inclined downward from the edge to the center.

[0012] The utility model has the following beneficial effects: the wafer is placed in a suitable positioning ring groove in the positioning box according to its size, so as to realize rapid positioning of the wafer, and is suitable for wafers of different sizes; the bottom of the wafer is then vacuum-adsorbed and fixed by a vacuum suction cup that can be adjusted to slide up and down; the laser cutter performs dicing operations on the positioned and fixed wafer; and at the same time, the waste chips generated by wafer dicing are adsorbed by the dust suction ring to avoid affecting the vacuum adsorption force of the vacuum suction cup and the adsorption stability of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a partial cross-sectional view of the utility model;

[0014] Figure 2 for Figure 1 A partial enlarged view of

[0015] Figure 3 Schematic diagram of the internal structure of the positioning box. DETAILED DESCRIPTION

[0016] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments. It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other.

[0017] like Figures 1 to 3 As shown, the semiconductor wafer dicing machine of the present invention is provided with a laser cutter 12, a dust suction ring 13 and a positioning box 14 in sequence from top to bottom on the body 10 through the support legs 11. The dust suction ring 13 is arranged on the outside of the top opening of the positioning box 14. The interior of the positioning box 14 is coaxially provided with a plurality of positioning ring grooves 15. The positioning ring grooves 15 are arranged in sequence from top to bottom and the diameters gradually decrease. A vacuum suction cup 16 is slidingly provided on the bottom of the positioning box 14.

[0018] According to the size of the wafer, it is placed in the appropriate positioning ring groove 15 in the positioning box 14 to achieve rapid positioning of the wafer, which is suitable for wafers of different sizes. The bottom of the wafer is then vacuum-adsorbed and fixed by the vacuum suction cup 16 that can slide up and down. The laser cutter 12 performs a slicing operation on the positioned and fixed wafer. At the same time, the dust collection ring 13 is used to adsorb the waste chips generated by wafer slicing to avoid affecting the vacuum adsorption force of the vacuum suction cup 16 and the adsorption stability of the wafer.

[0019] The positioning ring groove 15 can be set according to the selection corresponding to the commonly used wafer size, and the size of the vacuum suction cup 16 should be smaller than the minimum size of the commonly used wafer.

[0020] Preferably, the body 10 is provided with an electric push rod 17 and a vacuum pump 18, a guide hole 19 is opened at the bottom of the positioning box 14, and an air guide cylinder 20 is provided at the output end of the electric push rod 17, which passes through the guide hole 19 and is connected to the vacuum suction cup 16; the output end of the vacuum pump 18 is connected to a first tube body 21, and the first tube body 21 is connected to the interior of the vacuum suction cup 16 through the air guide cylinder 20, and an adsorption buffer pad 22 is provided on the top of the vacuum suction cup 16, and a plurality of suction holes 23 are jointly opened on the vacuum suction cup 16 and the adsorption buffer pad 22.

[0021] The output end of the electric push rod 17 drives the air guide cylinder 20 and the vacuum suction cup 16 to slide up and down along the bottom of the positioning box 14 to adjust the height so as to absorb the wafers placed in different positioning ring grooves 15.

[0022] The adsorption buffer pad 22 is made of soft materials such as rubber or silicone to reduce damage to the wafer.

[0023] Preferably, see Figure 2 A positioning buffer pad 24 is provided in the positioning ring groove 15 .

[0024] The positioning buffer pad 24 is made of a soft material such as rubber or silicone to reduce damage to the wafer. Its outline is annular and its cross section is L-shaped to cushion the bottom and sides of the wafer.

[0025] Preferably, the dust suction ring 13 is formed with an annular suction groove 25 from the inside to the outside; a dust collecting cabinet 26 is provided on the machine body 10, and a fan 27 is provided on the dust collecting cabinet 26. The output end of the fan 27 is connected to the interior of the dust collecting cabinet 26, and the input end of the fan 27 is connected to a second tube body 28, and the end of the second tube body 28 is connected to the annular suction groove 25.

[0026] Of course, a plurality of fans 27 and second tubes 28 may be arranged at intervals along the circumference of the dust collection ring 13 so that the dust collection ring 13 can uniformly absorb waste chips generated by wafer dicing and collect them in the dust collection cabinet 26 .

[0027] The machine body 10 also includes a control module and a control panel, which are electrically connected to the electric push rod 17, the vacuum pump 18, and the fan 27 to realize start and stop control.

[0028] Preferably, one side of the dust collecting cabinet 26 is open and provided with a cabinet door 29 , one side of the cabinet door 29 is hinged to the dust collecting cabinet 26 , and the other side is connected to the dust collecting cabinet 26 through a lock, and a sealing ring is also provided between the cabinet door 29 and the dust collecting cabinet 26 .

[0029] Preferably, the dust suction ring 13 is arranged to be gradually tilted downward from the edge to the center thereof, so that the suction force generated by the dust suction ring 13 is directed toward the waste chips generated by wafer dicing in the positioning box 14 .

[0030] The machine body 10 is mounted with an X-axis linear module 31 via legs 11. A Y-axis linear module 32 is located below the X-axis linear module 31. A Z-axis linear module 33 is connected to the below of the Y-axis linear module 32. The laser cutter 12 is located below the Z-axis linear module 33. The X-axis linear module 31, Y-axis linear module 32, and Z-axis linear module 33 can be ball screw linear modules, synchronous belt linear modules, or other linear modules. The ball screw linear module primarily consists of a ball screw, a nut, a guide rail, and a slider. Driven by a motor, the ball screw rotates, converting the rotational motion into linear motion of the slider through rolling friction between the balls and the nut's raceway. The synchronous belt linear module primarily consists of a synchronous belt, a synchronous pulley, a guide rail, and a slider. Driven by the motor, the synchronous belt transmits power through the synchronous pulley, driving the slider to slide on the guide rail.

[0031] The working principle of the utility model is as follows: according to the size of the wafer, the positioning ring groove 15 suitable for it is determined, and the electric push rod 17 is turned on. The output end of the electric push rod 17 drives the air guide cylinder 20 and the vacuum suction cup 16 to slide up and down along the bottom of the positioning box 14 to adjust the height, so that the vacuum suction cup 16 adapts to the positioning ring groove 15 where the current wafer is located, and the wafer is placed in the corresponding positioning ring groove 15. At the same time, the wafer is located on the vacuum suction cup 16; the vacuum pump 18 is turned on to stably adsorb and fix the wafer in the positioning ring groove 15, thereby realizing rapid positioning of wafers of different sizes;

[0032] The relative position of the laser cutter 12 and the wafer is adjusted by the X-axis linear module 31, the Y-axis linear module 32, and the Z-axis linear module 33, and the slicing operation is performed on the positioned and fixed wafer. At the same time, the fan 27 is turned on, and the waste chips generated by wafer slicing are evenly adsorbed through the dust collection ring 13 and collected in the dust collection cabinet 26 to avoid affecting the vacuum adsorption force of the vacuum suction cup 16 and the adsorption stability of the wafer.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A semiconductor wafer dicing machine, characterized in that: A laser cutter (12), a dust suction ring (13) and a positioning box (14) are sequentially provided on the machine body (10) through the support legs (11) from top to bottom. The dust suction ring (13) is arranged on the outer side of the top opening of the positioning box (14). The interior of the positioning box (14) is coaxially provided with a plurality of positioning ring grooves (15). The positioning ring grooves (15) are sequentially provided from top to bottom and their diameters gradually decrease. A vacuum suction cup (16) is slidably provided at the bottom of the positioning box (14).

2. The semiconductor wafer dicing machine according to claim 1, wherein: The machine body (10) is provided with an electric push rod (17) and a vacuum pump (18); a guide hole (19) is provided at the bottom of the positioning box (14); an air guide cylinder (20) is provided at the output end of the electric push rod (17); the air guide cylinder (20) passes through the guide hole (19) and is connected to the vacuum suction cup (16); the output end of the vacuum pump (18) is connected to a first tube (21); the first tube (21) is communicated with the interior of the vacuum suction cup (16) through the air guide cylinder (20); an adsorption buffer pad (22) is provided at the top of the vacuum suction cup (16); and a plurality of suction holes (23) are provided on the vacuum suction cup (16) and the adsorption buffer pad (22).

3. The semiconductor wafer dicing machine according to claim 1, wherein: A positioning buffer pad (24) is provided in the positioning ring groove (15).

4. The semiconductor wafer dicing machine according to claim 1, wherein: The dust collecting ring (13) is formed with an annular suction groove (25) from the inside to the outside; a dust collecting cabinet (26) is provided on the machine body (10), and a fan (27) is provided on the dust collecting cabinet (26); the output end of the fan (27) is connected to the inside of the dust collecting cabinet (26); the input end of the fan (27) is connected to a second pipe (28), and the end of the second pipe (28) is connected to the annular suction groove (25).

5. The semiconductor wafer dicing machine according to claim 4, wherein: One side of the dust collecting cabinet (26) is open and provided with a cabinet door (29).

6. The semiconductor wafer dicing machine according to claim 1, wherein: The dust suction ring (13) is arranged to be gradually inclined downward from the edge to the center.

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