Semiconductor wafer electroplating clamp

Abstract

The utility model discloses a semiconductor wafer electroplating clamp, which relates to the technical field of wafer electroplating, and comprises a mounting plate and a wafer, two mounting blocks with the same structure are arranged on the mounting plate, electric push rods are arranged on the sides, far away from each other, of the two mounting blocks, connecting rods are arranged at the output ends of the two electric push rods, and the connecting rods are connected with the mounting plate. Clamping plates are arranged on the connecting rods, and the clamping plates on the two sides are used for clamping a wafer; through the peripheral round rods on the placing assembly, the wafer can be positioned, and then the wafer can be supported through upward movement of the supporting ring, so that the wafer can be horizontally placed, the wafer does not need to be manually taken to wait for being clamped by clamping plates on the two sides, and then the wafer can be conveniently and rapidly clamped through the clamping plates in the follow-up process.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer electroplating, in particular to a semiconductor wafer electroplating fixture. Background Art

[0002] The wafer electroplating process is a process of depositing metal or alloy materials on the wafer surface through electrolysis to improve wafer performance or prepare a specific structure. Its purpose is to form a uniform, dense and well-structured metal film on the wafer surface.

[0003] When placing the wafer in the electrolyte solution in the electroplating tank, it needs to be fixed with an electroplating fixture. However, the existing wafer electroplating fixture cannot clamp the wafer quickly and easily, making the fixture inconvenient to use. Therefore, we propose a semiconductor wafer electroplating fixture. Utility Model Content

[0004] The purpose of the present invention is to provide a semiconductor wafer electroplating fixture to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a semiconductor wafer electroplating fixture, comprising a mounting plate and a wafer, wherein two mounting blocks of identical structure are provided on the mounting plate, and electric push rods are provided on the sides of the two mounting blocks that are away from each other, and connecting rods are provided on the output ends of the two electric push rods, and clamping plates are provided on the connecting rods, and the clamping plates on both sides are used to clamp the wafer;

[0006] A placement component is provided on the mounting plate.

[0007] As a preferred solution of the semiconductor wafer electroplating fixture described in the utility model, the placement component includes a fixed frame, the fixed frame is connected to the mounting plate, and round rods are provided around the top of the fixed frame, and the wafer is in contact with the round rods around each other.

[0008] As a preferred solution of the semiconductor wafer electroplating fixture described in the present invention, the outer wall of the round rod is slidably sleeved with a support ring, and the top of the support ring is in contact with the wafer.

[0009] As a preferred solution of the semiconductor wafer electroplating fixture described in the present invention, a connecting plate is connected between the front and rear support rings, and the height of the top of the connecting plate is lower than the height of the top of the support ring.

[0010] As a preferred solution of the semiconductor wafer electroplating fixture described in the utility model, the support rings at both ends of the rear side are provided with vertical rods, and the tops of the vertical rods are connected to the top rods, and the mounting plate is provided with a micro electric telescopic rod connected to the top rod.

[0011] As a preferred solution of the semiconductor wafer electroplating fixture described in the present invention, the mounting plate is connected to the piston rod of the cylinder, the cylinder is arranged on a mounting frame, and a mounting hole is provided on the mounting frame.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. The wafer can be positioned by placing the four round rods on the assembly, and then the wafer can be supported by moving the support ring upwards, so that the wafer can be placed flat. There is no need to manually pick up the wafer and wait for the clamping plates on both sides, which facilitates the subsequent quick clamping by the clamping plates.

[0014] 2. Through the micro electric telescopic rod, the wafer can be clamped and the support ring can be driven to move downward without contacting the bottom of the wafer, thereby not affecting the electroplating on the bottom of the wafer. The vertical movement of the support ring will not cause wear to the bottom of the wafer compared to the lateral movement, and it is highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of a semiconductor wafer electroplating fixture of the present invention;

[0016] Figure 2 This is a three-dimensional schematic diagram of the placement component structure of a semiconductor wafer electroplating fixture of the present invention;

[0017] Figure 3 The utility model is a schematic side view of the placement component structure of a semiconductor wafer electroplating fixture.

[0018] In the figure: 1. Mounting frame; 2. Cylinder; 3. Mounting plate; 4. Mounting block; 5. Electric push rod; 6. Connecting rod; 7. Clamp; 8. Wafer; 9. Mounting hole; 10. Fixing frame; 11. Round rod; 12. Support ring; 13. Micro electric telescopic rod; 14. Push rod; 15. Vertical rod; 16. Connecting plate. DETAILED DESCRIPTION

[0019] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] As mentioned in the background art, the conventional wafer electroplating fixture cannot quickly and easily clamp the wafer, which makes the fixture inconvenient to use. The present invention provides a semiconductor wafer electroplating fixture.

[0021] Example 1

[0022] Reference Figures 1 to 3 A semiconductor wafer electroplating fixture includes a mounting plate 3 and a wafer 8. Two mounting blocks 4 of the same structure are provided on the mounting plate 3. Electric push rods 5 are provided on the sides of the two mounting blocks 4 that are away from each other. Connecting rods 6 are provided on the output ends of the two electric push rods 5. Clamping plates 7 are provided on the connecting rods 6. The clamping plates 7 on both sides are used to clamp the wafer 8.

[0023] The mounting plate 3 is provided with a placement component.

[0024] The placement component includes a fixed frame 10, which is connected to the mounting plate 3. Round rods 11 are provided around the top of the fixed frame 10. The wafer 8 is in contact with the round rods 11 around the four sides, so that the wafer 8 can be positioned.

[0025] The outer wall of the round rod 11 is slidably sleeved with a support ring 12 . The top of the support ring 12 contacts the wafer 8 and can support the wafer 8 . The support ring 12 can be guided by the round rod 11 .

[0026] The circular rods 11 around the wafer 8 can position the wafer 8, and then the support ring 12 can be moved upward to support the wafer 8 so that the wafer 8 can be placed flat. This way, there is no need to manually pick up the wafer 8 and wait for the clamping plates 7 on both sides to clamp it, which is more convenient and facilitates subsequent quick clamping by the clamping plates 7.

[0027] A connecting plate 16 is connected between the front and rear support rings 12, and the height of the top of the connecting plate 16 is lower than the height of the top of the support ring 12, so that the connecting plate 16 does not need to contact the wafer 8, and when the support rings 12 at both ends of the rear side are moved, the support rings 12 at both ends of the front side can also be driven to move by the connecting plate 16.

[0028] The support rings 12 at both ends of the rear side are each provided with a vertical rod 15, and the top of the vertical rod 15 is connected to the top rod 14. A micro-electric telescopic rod 13 connected to the top rod 14 is provided on the mounting plate 3. The micro-electric telescopic rod 13 drives the top rod 14 to move, so that the vertical rod 15 drives the support rings 12 at both ends of the rear side to move, and can drive the support rings 12 at both ends of the front side to move through the connecting plate 16, so that after the wafer 8 is clamped, the support ring 12 can be driven to move downward without contacting the bottom of the wafer 8, thereby not affecting the electroplating of the bottom of the wafer 8, and the vertical movement of the support ring 12 will not cause wear to the bottom of the wafer 8 relative to the lateral movement, and it is highly practical.

[0029] The connecting plates 16 on both sides are provided so that the vertical rods 15 do not need to be installed on the support rings 12 at both ends of the front side, so that the wafer 8 is not hindered by the vertical rods 15 on the front side when it is placed from the front side.

[0030] Example 2

[0031] Reference Figure 1 The mounting plate 3 is connected to the piston rod of the cylinder 2. The cylinder 2 is arranged on the mounting frame 1, and the mounting frame 1 is provided with a mounting hole 9. The mounting hole 9 is fixed with a bolt on the electroplating tank. The cylinder 2 drives the mounting plate 3 to rise and fall, so that the wafer 8 can be placed in the electroplating tank, and then the wire wiring work is completed before electroplating can be carried out.

[0032] The rest of the structure is the same as that of Example 1.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer electroplating fixture, characterized by: include, A mounting plate (3) and a wafer (8), wherein two mounting blocks (4) of the same structure are provided on the mounting plate (3), electric push rods (5) are provided on the sides of the two mounting blocks (4) that are away from each other, connecting rods (6) are provided on the output ends of the two electric push rods (5), and clamping plates (7) are provided on the connecting rods (6), and the clamping plates (7) on both sides are used to clamp the wafer (8); A placement component is provided on the mounting plate (3).

2. The semiconductor wafer electroplating fixture according to claim 1, characterized in that: The placement component comprises a fixing frame (10), the fixing frame (10) is connected to the mounting plate (3), round rods (11) are provided around the top of the fixing frame (10), and the wafer (8) is in contact with the round rods (11) on the four sides respectively.

3. The semiconductor wafer electroplating fixture according to claim 2, characterized in that: The outer wall of the round rod (11) is slidably sleeved with a support ring (12), and the top of the support ring (12) is in contact with the wafer (8).

4. The semiconductor wafer electroplating fixture according to claim 3, characterized in that: A connecting plate (16) is connected between the front and rear support rings (12), and the height of the top of the connecting plate (16) is lower than the height of the top of the support ring (12).

5. The semiconductor wafer electroplating fixture according to claim 3, characterized in that: The support rings (12) at both ends of the rear side are both provided with vertical rods (15), and the tops of the vertical rods (15) are connected to the top rods (14). The mounting plate (3) is provided with a micro electric telescopic rod (13) connected to the top rod (14).

6. The semiconductor wafer electroplating fixture according to claim 1, characterized in that: The mounting plate (3) is connected to the piston rod of the cylinder (2); the cylinder (2) is arranged on a mounting frame (1); and a mounting hole (9) is provided on the mounting frame (1).

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