Wafer sweeping switching mechanism
By designing a wafer scanning switching mechanism and utilizing the coordination of the cylinder, connecting rod mechanism and photoelectric sensor, the switching of the opposing scanning fiber optic sensor between different sizes is realized, which solves the problem of insufficient applicability in the existing technology and realizes the effective scanning of wafers of different sizes.
Patent Information
- Application Number
- CN202422971694.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-12-03
AI Technical Summary
The existing wafer scanning mechanism is difficult to adapt to wafer cassettes of different sizes and specifications, and its applicability is insufficient.
A wafer scanning switching mechanism was designed. Through the cooperation of the cylinder, connecting rod mechanism and photoelectric sensor, the switching of the optical fiber sensor of the wafer scanning type between different sizes was realized to adapt to the scanning of wafers of different sizes.
The applicability of wafer scanning has been greatly improved, and wafers of different sizes can be effectively scanned.
Smart Images
Figure CN223401055U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer detection, in particular to a wafer scanning switching mechanism. Background Art
[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. It is generally in the form of a round sheet. Before inspecting the wafer, it is necessary to check whether there is a wafer inside the wafer slot of the cassette. This process is called scanning. Common wafer scanning methods include through-beam and reflective. Although the reflective scanning method has a simple structure, it has poor resolution for wafer stacks. The through-beam scanning method is more stable and reliable. Existing wafer scanning mechanisms are generally only suitable for wafer cassettes of one size during the scanning process. It is difficult to scan cassettes of different sizes, and its applicability is insufficient.
[0003] To this end, the utility model provides a wafer scanning switching mechanism to solve the above problems. Utility Model Content
[0004] In view of the deficiencies in the prior art, the present invention provides a wafer scanning switching mechanism to solve the above problems.
[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a wafer scanning switching mechanism, including a base, the top of the base is provided with a scanning moving cylinder, a scanning reset sensor, a scanning moving position sensor, a corresponding scanning optical fiber sensor, a scanning switching cylinder, a switching connecting rod mechanism, an 8-inch scanning sensor, a 12-inch scanning sensor, an 8-inch scanning sensor, and a 12-inch scanning sensor, and the base is used to install and connect various components.
[0006] Preferably, the 8-inch scanning sensor is located above the 12-inch scanning sensor, and the 12-inch scanning sensor is located inside the 8-inch scanning sensor.
[0007] Preferably, opposing-type scanning optical fiber sensors are provided on both sides of the switching link mechanism, and the scanning switching cylinder is provided below the switching link mechanism.
[0008] Preferably, the scanning sheet reset sensor and the scanning sheet movement position sensor are fixedly mounted on the top left side of the base, and the scanning sheet movement position sensor is located in front of the scanning sheet reset sensor.
[0009] Preferably, the sweeping sheet moving cylinder is fixedly installed on the top right side of the base.
[0010] Preferably, an 8-inch scanning sensor, a 12-inch scanning sensor, an 8-inch scanning induction sheet, and a 12-inch scanning induction sheet are provided on both sides of the top of the base.
[0011] Beneficial effects
[0012] The utility model provides a wafer scanning switching mechanism. Compared with the prior art, it has the following beneficial effects:
[0013] 1. The wafer scanning switching mechanism of the utility model cooperates with the cylinder, the connecting rod mechanism and the photoelectric sensor to enable the opposing scanning fiber optic sensor to switch between different scanning sizes to scan wafers of different sizes, thereby greatly improving the applicability of wafer scanning. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the implementation scheme of the present invention or the technical scheme in the prior art, the drawings required for use in the implementation scheme or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation schemes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0015] Figure 1 This is a three-dimensional diagram of the external structure of the utility model;
[0016] Figure 2 It is a top view of the structure of the utility model;
[0017] In the figure: 1. Base; 2. Sweep moving cylinder; 3. Sweep resetting sensor; 4. Sweep moving in position sensor; 5. Through-beam sweeping optical fiber sensor; 6. Sweep switching cylinder; 7. Switching connecting rod mechanism; 8. 8-inch sweeping sensor; 9. 12-inch sweeping sensor; 10. 8-inch sweeping induction sheet; 11. 12-inch sweeping induction sheet. DETAILED DESCRIPTION
[0018] It should be noted that in the description of the embodiments of the present application, the terms "front, rear", "left, right", "up, down", etc. indicating directions or positional relationships are all based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present application. The terms "install", "connect", and "connected" should be understood in a broad sense. For example, they can be fixedly connected, detachably connected, or integrally connected; they can be directly connected, or indirectly connected through an intermediate medium, or they can be internal connections between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0019] The present application will be further described in detail below through the accompanying drawings and examples.
[0020] Reference Figures 1 to 2 The embodiment of the present application provides a wafer scanning switching mechanism, including a base 1. The top of the base 1 is provided with a scanning moving cylinder 2, a scanning reset sensor 3, a scanning moving position sensor 4, a corresponding scanning optical fiber sensor 5, a scanning switching cylinder 6, a switching connecting rod mechanism 7, an 8-inch scanning sensor 8, a 12-inch scanning sensor 9, an 8-inch scanning sensor 10, and a 12-inch scanning sensor 11. The base 1 is used to install and connect various components. The 8-inch scanning sensor 8 is located above the 12-inch scanning sensor 9, and the 12-inch scanning sensor 11 is located on the inner side of the 8-inch scanning sensor 10. The corresponding scanning optical fiber sensor 5 is provided on both sides of the switching connecting rod mechanism 7, and the scanning switching cylinder 6 is provided below the switching connecting rod mechanism 7. The scanning reset sensor 3 and the scanning moving position sensor 4 are fixedly mounted on the top left side of the base 1, and the scanning moving position sensor 4 is located in front of the scanning reset sensor 3. The scanning moving cylinder 2 is fixedly mounted on the top right side of the base 1. An 8-inch scanning sensor 8 , a 12-inch scanning sensor 9 , an 8-inch scanning induction sheet 10 , and a 12-inch scanning induction sheet 11 are provided on both sides of the top of the base 1 .
[0021] In this embodiment, when the scanning switching cylinder 6 is reset, the 8-inch scanning sensing piece 10 is located at the 8-inch scanning sensor 8, the 8-inch scanning state is ON, the scanning moving cylinder 2 moves forward, the scanning moving position sensor 4 is ON, the opposing scanning optical fiber sensor 5 performs 8-inch wafer scanning, the scanning moving cylinder 2 is reset, the scanning reset sensor 3 is ON, and the 8-inch wafer scanning is completed.
[0022] The scanning reset sensor 3 moves forward, and the scanning reset sensor 3 drives the opposing type scanning optical fiber sensor 5 to move. The 12-inch scanning sensor 11 is located at the 12-inch scanning sensor 9. The 12-inch scanning state is ON, the scanning moving cylinder 2 moves forward, the scanning moving position sensor 4 is ON, the opposing type scanning optical fiber sensor 5 performs 12-inch wafer scanning, the scanning moving cylinder 02 is reset, the scanning reset sensor 3 is ON, and the 12-inch wafer scanning is completed.
[0023] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.
[0024] Working principle: When the scanning switching cylinder 6 is reset, the 8-inch scanning sensing piece 10 is located at the 8-inch scanning sensor 8, the 8-inch scanning state is ON, the scanning moving cylinder 2 moves forward, the scanning moving position sensor 4 is ON, the opposing scanning optical fiber sensor 5 performs 8-inch wafer scanning, the scanning moving cylinder 2 is reset, the scanning reset sensor 3 is ON, and the 8-inch wafer scanning is completed.
[0025] The scanning reset sensor 3 moves forward, and the scanning reset sensor 3 drives the opposing type scanning optical fiber sensor 5 to move. The 12-inch scanning sensor 11 is located at the 12-inch scanning sensor 9. The 12-inch scanning state is ON, the scanning moving cylinder 2 moves forward, the scanning moving position sensor 4 is ON, the opposing type scanning optical fiber sensor 5 performs 12-inch wafer scanning, the scanning moving cylinder 02 is reset, the scanning reset sensor 3 is ON, and the 12-inch wafer scanning is completed.
[0026] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.
[0027] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A wafer scanning switching mechanism, comprising a base (1), characterized in that: The top of the base (1) is provided with a sweeping sheet moving cylinder (2), a sweeping sheet resetting sensor (3), a sweeping sheet moving in-position sensor (4), a corresponding sweeping sheet optical fiber sensor (5), a sweeping sheet switching cylinder (6), a switching connecting rod mechanism (7), an 8-inch sweeping sheet sensor (8), a 12-inch sweeping sheet sensor (9), an 8-inch sweeping sheet induction sheet (10), and a 12-inch sweeping sheet induction sheet (11). The base (1) is used for installing and connecting various components.
2. The wafer scanning switching mechanism according to claim 1, characterized in that: The 8-inch scanning sensor (8) is located above the 12-inch scanning sensor (9), and the 12-inch scanning sensing sheet (11) is located inside the 8-inch scanning sensing sheet (10).
3. The wafer scanning switching mechanism according to claim 1, wherein: Opposing-type scanning optical fiber sensors (5) are provided on both sides of the switching link mechanism (7), and the scanning switching cylinder (6) is provided below the switching link mechanism (7).
4. The wafer scanning switching mechanism according to claim 1, wherein: The film scanning reset sensor (3) and the film scanning movement position sensor (4) are fixedly mounted on the top left side of the base (1), and the film scanning movement position sensor (4) is located in front of the film scanning reset sensor (3).
5. The wafer scanning switching mechanism according to claim 1, characterized in that: The sweeping sheet moving cylinder (2) is fixedly mounted on the top right side of the base (1).
6. The wafer scanning switching mechanism according to claim 1, characterized in that: An 8-inch scanning sensor (8), a 12-inch scanning sensor (9), an 8-inch scanning induction sheet (10), and a 12-inch scanning induction sheet (11) are provided on both sides of the top of the base (1).