Pressing device for wafer adsorption
Through the side guard plates and wafer pressing actuator of the wafer adsorption clamping device, combined with the two-level distributed pressing of springs and springs, the problems of wafer warping and shaking during the cutting process are solved, and the flatness of the wafer and the improvement of cutting accuracy are achieved.
Patent Information
- Application Number
- CN202422650223.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-10-31
AI Technical Summary
The wafer warps and deforms greatly during the cutting process, making it difficult to adsorb, resulting in shaking and difficulty in cutting. The uneven deformation also makes it easy to crack.
A wafer adsorption clamping device is used, including side guard plates, rear fixing plates, cylinder-driven motor fixing plates and wafer pressing actuators driven by screw motors. It combines springs and springs to perform two-level distributed clamping to prevent direct damage to the wafer.
The wafer is tightly fitted to the processing stage, ensuring the wafer is flat during the cutting process, preventing shaking and cracking, and improving cutting accuracy and production efficiency.
Smart Images
Figure CN223401592U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field related to wafer processing, and in particular to a pressing device for wafer adsorption. Background Art
[0002] During the wafer cutting process, the wafer's warping deformation is relatively large, making it difficult for the wafer adsorption stage to hold the wafer. Due to this, the wafer shakes after the stage rotates, making subsequent cutting impossible. Furthermore, the wafer's deformation is irregular, requiring uniform compression to prevent cracking.
[0003] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a wafer adsorption pressing device to make it more valuable for industrial use. Utility Model Content
[0004] In order to solve any of the above technical problems, the purpose of the present invention is to provide a wafer adsorption pressing device.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] A wafer adsorption pressing device includes side guard plates distributed along the left and right directions, a rear fixing plate installed on the side guard plates and distributed along the vertical direction, and a wafer pressing actuator;
[0007] The cylinder installed on the rear fixing plate drives the motor fixing plate below to move in the vertical direction. A screw motor is installed at the bottom of the motor fixing plate, and the screw motor drives the wafer pressing actuator below to move in the vertical direction.
[0008] The wafer pressing actuator includes an upper connecting plate, a middle connecting plate, a lower connecting plate and a clamping plate from top to bottom. The driving end of the screw motor is connected to the middle part of the upper connecting plate below, and the lower connecting plate is connected to the clamping plate below.
[0009] The upper connecting plate and the middle connecting plate are connected together by a plurality of pins and fastening rings. The pins pass through the fastening ring and the upper connecting plate from top to bottom and are then locked on the middle connecting plate by screws.
[0010] The middle connecting plate and the lower connecting plate are connected together by a plurality of pins and fastening rings. The pins pass through the fastening ring and the middle connecting plate from top to bottom and then are embedded in the lower connecting plate below.
[0011] A spring is installed on the second pin shaft between the middle connecting plate and the lower connecting plate, and a plurality of spring sheets are installed between the upper connecting plate and the lower connecting plate.
[0012] As a further improvement of the present invention, an air blowing fixing plate is installed at the front end of the side guard plate, and an air blowing mechanism distributed along the left and right directions is installed at the bottom of the air blowing fixing plate.
[0013] As a further improvement of the present invention, the air blowing mechanism is inclined toward one side of the wafer pressing actuator below.
[0014] As a further improvement of the present invention, a fine-tuning mechanism is provided between the rear fixed plate and the cylinder, the fine-tuning mechanism includes a left fixed plate, a right fixed plate and a connecting plate, the right side of the connecting plate is installed on the rear fixed plate, the left fixed plate and the right fixed plate are installed on the left side of the connecting plate from left to right, an adjusting fixed plate is installed on the connecting plate between the left fixed plate and the right fixed plate, an adjusting movable plate is installed on the connecting plate above the adjusting fixed plate, and the adjusting bolt installed on the adjusting fixed plate along the vertical direction is connected to the adjusting movable plate above.
[0015] As a further improvement of the present invention, nut 1 and nut 2 are installed on the pin shaft 1 between the fastening ring and the upper connecting plate in sequence from top to bottom.
[0016] As a further improvement of the present invention, a sleeve is installed on the upper connecting plate on the outer side of the pin shaft.
[0017] As a further improvement of the present invention, a sleeve is installed on the middle connecting plate outside the second pin shaft.
[0018] By means of the above solution, the present invention has at least the following advantages:
[0019] The utility model can press the wafer during the adsorption process of the wafer carrier, so that the wafer and the processing carrier are closely fitted, ensuring that the wafer is as flat as possible.
[0020] During the compacting process, the utility model is provided with an initial pre-compression of the cylinder, and then fine compaction is performed according to the lead screw motor, so as to realize compaction by secondary distribution, thereby preventing direct downward pressure from damaging the wafer.
[0021] In the process of the secondary distributed pressing of the utility model, the elastic sheet and the spring provided on the wafer pressing actuator can play a buffering role, prevent overpressure, and protect the wafer.
[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.
[0024] Figure 1 This is a schematic structural diagram of a wafer adsorption pressing device of the present invention;
[0025] Figure 2 yes Figure 1 Schematic diagram of the structure of the fine-tuning mechanism;
[0026] Figure 3 yes Figure 1 Schematic diagram of the structure of the wafer pressing actuator;
[0027] Figure 4 yes Figure 3 Schematic diagram of the internal structure.
[0028] The meanings of the reference numerals in the figures are as follows.
[0029] Blowing fixed plate 1, fine adjustment mechanism 2, side guard plate 3, rear side fixed plate 4, wafer pressing actuator 5, screw motor 6, motor fixing plate 7, cylinder 8, blowing mechanism 9;
[0030] Left fixed plate 201, adjustment fixed plate 202, adjustment bolt 203, adjustment movable plate 204, right fixed plate 205, connecting plate 206;
[0031] Pin 1 501 , fastening ring 502 , nut 1 503 , spring piece 504 , lower connecting plate 505 , pressing plate 506 , middle connecting plate 507 , upper connecting plate 508 , pin 2 509 , spring 510 , sleeve 511 , screw 512 , nut 2 513 . DETAILED DESCRIPTION
[0032] The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0033] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.
[0034] like Figures 1 to 4 As shown, a wafer suction clamping device includes side shields 3 extending horizontally, a rear fixing plate 4 mounted on the side shields 3 and extending vertically, and a wafer-pressing actuator 5. A cylinder 8 mounted on the rear fixing plate 4 drives a motor fixing plate 7 below to move vertically. A lead screw motor 6 is mounted at the bottom of the motor fixing plate 7, which drives the wafer-pressing actuator 5 below to move vertically.
[0035] 1. A fine-tuning mechanism 2 is provided between the rear fixing plate 4 and the cylinder 8. The fine-tuning mechanism 2 comprises a left fixing plate 201, a right fixing plate 205, and a connecting plate 206. The right side of the connecting plate 206 is mounted on the rear fixing plate 4. The left fixing plate 201 and the right fixing plate 205 are mounted on the left side of the connecting plate 206, from left to right. An adjustment plate 202 is mounted on the connecting plate 206 between the left and right fixing plates 201 and 205. An adjustment plate 204 is mounted on the connecting plate 206 above the adjustment plate 202. An adjustment bolt 203 mounted vertically on the adjustment plate 202 is connected to the adjustment plate 204 above. This allows the left fixing plate 201 and the right fixing plate 205 to be fine-tuned and moved on the connecting plate 206.
[0036] 2. Wafer pressing actuator 5:
[0037] The wafer pressing actuator 5 includes an upper connecting plate 508, a middle connecting plate 507, a lower connecting plate 505 and a clamping plate 506 from top to bottom. The driving end of the screw motor 6 is connected to the middle part of the upper connecting plate 508 below, and the lower connecting plate 505 is connected to the clamping plate 506 below.
[0038] The upper connecting plate 508 and the middle connecting plate 507 are connected together by a plurality of pins 501 and fastening rings 502. The pins 501 pass through the fastening ring 502 and the upper connecting plate 508 from top to bottom and are then locked to the middle connecting plate 507 by screws 512.
[0039] The middle connecting plate 507 and the lower connecting plate 505 are connected together through a plurality of second pins 509 and a fastening ring 502. The second pins 509 pass through the fastening ring 502 and the middle connecting plate 507 from top to bottom and are then embedded in the lower connecting plate 505 below.
[0040] A spring 510 is installed on the second pin 509 between the middle connecting plate 507 and the lower connecting plate 505 , and a plurality of spring pieces 504 are installed between the upper connecting plate 508 and the lower connecting plate 505 .
[0041] Nut 1 503 and nut 2 513 are installed in order from top to bottom on pin 1 501 between the fastening ring 502 and the upper connecting plate 508. A sleeve 511 is installed on the upper connecting plate 508 outside of pin 1 501. A sleeve 511 is installed on the middle connecting plate 507 outside of pin 2 509.
[0042] 3. A blowing fixed plate 1 is installed at the front end of the side guard plate 3, and a blowing mechanism 9 distributed along the left and right directions is installed at the bottom of the blowing fixed plate 1. The blowing mechanism 9 is tilted toward one side of the wafer pressing actuator 5 below.
[0043] Brief description of the working process of this utility model:
[0044] After the wafer is transported to the adsorption carrier, the cylinder 8 is activated and initially pressed down, and then the screw motor 6 moves to drive the wafer pressing actuator 5 to move downward, so that the clamping plate 506 in the wafer pressing actuator 5 presses the wafer. In the process of pressing the wafer, the spring 510 installed on the pin shaft 501 of the lower connecting plate 505 and the middle connecting plate 507 will also shrink to buffer part of the deformation and ensure that the wafer is pressed evenly.
[0045] The utility model presses the wafer during the adsorption process of the wafer carrier, so that the wafer fits tightly with the processing carrier, ensuring that the wafer is as flat as possible, and the wafer can be firmly adsorbed without displacement during the movement and cutting process of the vacuum adsorption platform, thereby ensuring the cutting production of the wafer.
[0046] During the pressing process, a cylinder is provided for initial pre-pressing, and then fine pressing is performed according to the screw motor to achieve two-level distribution pressing to prevent direct downward pressure from damaging the wafer.
[0047] During the secondary distributed pressing process, the springs and springs provided on the wafer pressing actuator can act as a buffer to prevent overpressure and protect the wafer.
[0048] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.
[0049] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.
[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.
Claims
1. A wafer adsorption pressing device, comprising side guard plates (3) distributed along the left-right direction, a rear fixing plate (4) mounted on the side guard plates (3) and distributed along the vertical direction, and a wafer pressing actuator (5); characterized in that: A cylinder (8) mounted on the rear fixing plate (4) drives the motor fixing plate (7) below to move in the vertical direction. A lead screw motor (6) is mounted at the bottom of the motor fixing plate (7). The lead screw motor (6) drives the wafer pressing actuator (5) below to move in the vertical direction. The wafer pressing actuator (5) comprises, from top to bottom, an upper connecting plate (508), a middle connecting plate (507), a lower connecting plate (505) and a pressing plate (506); the driving end of the screw motor (6) is connected to the middle of the upper connecting plate (508) below, and the lower connecting plate (505) is connected to the pressing plate (506) below; The upper connecting plate (508) and the middle connecting plate (507) are connected together through a plurality of pins (501) and a fastening ring (502). The pins (501) pass through the fastening ring (502) and the upper connecting plate (508) in sequence from top to bottom and are then fastened to the middle connecting plate (507) by screws (512). The middle connecting plate (507) and the lower connecting plate (505) are connected together through a plurality of second pins (509) and a fastening ring (502). The second pins (509) pass through the fastening ring (502) and the middle connecting plate (507) from top to bottom and are then embedded in the lower connecting plate (505). A spring (510) is installed on the second pin shaft (509) between the middle connecting plate (507) and the lower connecting plate (505), and a plurality of spring sheets (504) are installed between the upper connecting plate (508) and the lower connecting plate (505).
2. The wafer adsorption pressing device according to claim 1, wherein: An air blowing fixing plate (1) is installed at the front end of the side guard plate (3), and an air blowing mechanism (9) distributed along the left and right directions is installed at the bottom of the air blowing fixing plate (1).
3. The wafer adsorption pressing device according to claim 2, wherein: The air blowing mechanism (9) is tilted toward one side of the wafer pressing actuator (5) below.
4. The wafer adsorption pressing device according to claim 1, wherein: A fine adjustment mechanism (2) is provided between the rear fixing plate (4) and the cylinder (8), the fine adjustment mechanism (2) comprising a left fixing plate (201), a right fixing plate (205) and a connecting plate (206), the right side of the connecting plate (206) being mounted on the rear fixing plate (4), the left fixing plate (201) and the right fixing plate (205) being mounted on the left side of the connecting plate (206) from left to right, an adjusting fixed plate (202) being mounted on the connecting plate (206) between the left fixing plate (201) and the right fixing plate (205), an adjusting movable plate (204) being mounted on the connecting plate (206) above the adjusting fixed plate (202), and an adjusting bolt (203) mounted on the adjusting fixed plate (202) in a vertical direction being connected to the adjusting movable plate (204) above.
5. The wafer adsorption pressing device according to claim 1, wherein: Nut 1 (503) and nut 2 (513) are sequentially installed on the pin shaft 1 (501) between the fastening ring (502) and the upper connecting plate (508) from top to bottom.
6. The wafer adsorption pressing device according to claim 1, wherein: A sleeve (511) is installed on the upper connecting plate (508) outside the pin shaft (501).
7. The wafer adsorption pressing device according to claim 1, wherein: A sleeve (511) is installed on the middle connecting plate (507) outside the second pin shaft (509).