Electronic package

Abstract

An electronic package is mainly characterized in that a groove is formed in a bearing structure, a circuit structure is placed in the groove, chips of different specifications are used as a first electronic element and a second electronic element to be electrically connected with the bearing structure and the circuit structure respectively, and the requirement for multiple functions is met.

Description

Technical Field

[0001] The present application relates to a semiconductor device, and more particularly to an electronic package. Background Art

[0002] With the booming electronics industry, wireless communication technology has been widely adopted in a wide variety of consumer electronics products to facilitate the reception and transmission of various wireless signals. To meet the design requirements of these consumer electronics, the manufacturing and design of wireless communication modules are being developed towards lightweight, thin, short, and compact designs. Patch antennas, in particular, are widely used in wireless communication modules for electronic products such as cell phones due to their compact size, light weight, and ease of manufacture.

[0003] Figure 1 FIG is a three-dimensional schematic diagram of an existing wireless communication module 1. Figure 1 As shown, the wireless communication module 1 includes: a substrate 10, a plurality of electronic components 11 disposed on the substrate 10, an antenna structure 12, and packaging material 13. The substrate 10 is a rectangular circuit board. The electronic components 11, such as radio frequency chips and / or millimeter wave chips, are disposed on the substrate 10 and electrically connected to the substrate 10. The antenna structure 12 is planar and includes an antenna body 120 and a conductive wire 121. The antenna body 120 is electrically connected to the electronic components 11 via the conductive wire 121. The packaging material 13 covers the electronic components 11 and a portion of the conductive wire 121.

[0004] If a millimeter wave chip for 5G mmWave signals is used as the electronic component 11, it usually needs to be placed on a substrate 10 made of a dielectric layer with low dielectric constant / dielectric loss factor (low DK / Df) to reduce signal / energy loss. However, other RF chips have no restrictions on the dielectric material required for the substrate 10.

[0005] On the other hand, if a radio frequency chip is used as the electronic component 11, it needs to be placed on a substrate 10 with fine line specifications so that the electrical contacts of the radio frequency chip can be completely wired to the other side of the substrate 10, but a millimeter wave chip does not need to use a substrate 10 with fine line specifications.

[0006] However, in the existing wireless communication module 1, when using chips of different specifications (RF chip, millimeter wave chip) as the electronic component 11, it is necessary to consider substrates 10 of different specifications. Therefore, it is impossible to configure electronic components 11 of different specifications on the existing single-specification substrate 10, that is, it is impossible to configure RF chips and millimeter wave chips at the same time, and thus it is impossible to meet multi-functional requirements.

[0007] Furthermore, if one wishes to simultaneously configure millimeter wave chips and RF chips for 5G mmWave signals, a special substrate 10 must be specially manufactured that meets the specifications of fine lines and low DK / Df dielectric layers, which will significantly increase its production cost, making it difficult to reduce the overall cost of the terminal product.

[0008] Therefore, how to overcome the various problems of the above-mentioned prior art has become a topic that needs to be solved urgently. Utility Model Content

[0009] In view of the various deficiencies of the above-mentioned prior art, the present application provides an electronic package, comprising: a supporting structure having a wiring layer, defining a first side and a second side opposite to each other, and forming at least one groove connecting the first side and the second side; a circuit structure, arranged in the groove and having a circuit layer; a first electronic component, arranged on the circuit structure corresponding to the first side and electrically connected to the circuit layer; a second electronic component, arranged on the first side of the supporting structure and electrically connected to the wiring layer; a conductive structure, bridging the supporting structure and the circuit structure and electrically connecting the wiring layer and the circuit layer; and a packaging layer, covering the first electronic component.

[0010] The present application also provides a method for manufacturing an electronic package, comprising: providing a supporting structure having a wiring layer, which defines a first side and a second side opposite to each other, and forms at least one groove connecting the first side and the second side; placing at least one circuit structure having a circuit layer in the groove; arranging a first electronic component on the circuit structure corresponding to the first side, and electrically connecting the first electronic component to the circuit layer; arranging a second electronic component on the first side of the supporting structure, and electrically connecting the second electronic component to the wiring layer; bridging the supporting structure and the circuit structure through a conductive structure, so that the conductive structure electrically connects the wiring layer and the circuit layer; and covering the first electronic component with a packaging layer.

[0011] In the aforementioned electronic package and its manufacturing method, the packaging layer extends into the groove to cover the circuit structure.

[0012] In the aforementioned electronic package and its manufacturing method, the packaging layer also covers the conductive structure.

[0013] In the aforementioned electronic package and method of manufacturing the same, the carrier structure is formed with a plurality of recesses, each of which houses the circuit structure. This allows the first side of the carrier structure to be configured with a plurality of first electronic components and a plurality of conductive structures. For example, a plurality of encapsulation layers are formed on the first side of the carrier structure to respectively encapsulate each first electronic component. Alternatively, the encapsulation layer encapsulates a plurality of first electronic components.

[0014] In the aforementioned electronic package and its manufacturing method, the packaging layer also covers the second electronic component.

[0015] In the aforementioned electronic package and its manufacturing method, the packaging layer also extends to the side surface of the supporting structure.

[0016] In the aforementioned electronic package and its manufacturing method, the conductive structure is disposed on the first side or the second side of the supporting structure.

[0017] In the aforementioned electronic package and its manufacturing method, the conductive structure is an interposer, a bonding wire, an active component, a passive component or a combination thereof.

[0018] From the above, it can be seen that in the electronic package and its manufacturing method of the present application, the circuit structure is mainly placed in the groove of the supporting structure to form substrate areas of different specifications. Therefore, compared with the existing technology, the electronic package of the present application can configure the first electronic component and the second electronic component according to their specifications on the required substrate area. When the electronic package needs to use chips of different specifications, the chips of different specifications can be simultaneously configured as the first electronic component and the second electronic component on the circuit structure and the supporting structure, thereby meeting multi-functional requirements.

[0019] Furthermore, the circuit structure and the supporting structure can be manufactured using existing technologies and equipment, so there is no need to add new processes and new materials or purchase new special-purpose machines. Therefore, compared with the existing technology, the electronic package of this application will not incur additional cost expenditure during production, which is conducive to reducing the production cost of the electronic package, thereby effectively reducing the overall cost of the terminal product. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional schematic diagram of an existing wireless communication module.

[0021] Figures 2A to 2D It is a cross-sectional schematic diagram of the manufacturing method of the electronic package of the present application.

[0022] Figure 2E for Figure 2D Schematic diagram from above.

[0023] Figure 3A 、 Figure 4A 、 Figure 5A 、 Figure 6A 、 Figure 7A 、 Figure 8A and Figure 9A Schematic cross-sectional views of various embodiments of the electronic package of the present application.

[0024] Figure 3B 、 Figure 4B 、 Figure 5B 、 Figure 6B 、 Figure 7B 、 Figure 8B and Figure 9B They are Figure 3A 、 Figure 4A 、 Figure 5A 、 Figure 6A 、 Figure 7A 、 Figure 8A and Figure 9A Schematic diagram from above.

[0025] Description of Reference Numerals

[0026] 1. Wireless communication module

[0027] 10 substrate

[0028] 11 Electronic components

[0029] 12 Antenna Structure

[0030] 120 antenna body

[0031] 121 wire

[0032] 13 Packaging Materials

[0033] 2,3,4,5,6,7,8,9 Electronic packaging

[0034] 2a Baseboard module

[0035] 20 load-bearing structure

[0036] 20a First side

[0037] 20b Second side

[0038] 20c Side

[0039] 200 grooves

[0040] 201 wiring layer

[0041] 202 Insulation Materials

[0042] 21 First Electronic Components

[0043] 210 electrode pads

[0044] 211,221,231,241 conductive bumps

[0045] 22 Second electronic component

[0046] 23 Third electronic components

[0047] 24,74,84,94 Conductive structures

[0048] 25,35,45,55,65 encapsulation layer

[0049] 28 Primer

[0050] 29 Line Structure

[0051] 290 Insulation layer

[0052] 291 circuit layer

[0053] 9 bearing parts

[0054] S Cutting path. DETAILED DESCRIPTION

[0055] The following describes the implementation of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0056] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "on", "first", "second", "one", etc. quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.

[0057] Figures 2A to 2D It is a cross-sectional schematic diagram of a method for manufacturing the electronic package 2 of the present application.

[0058] like Figure 2A As shown, a supporting structure 20 is arranged on a supporting member 9, and the supporting structure 20 is defined with a first side 20a and a second side 20b opposite to each other, and the supporting structure 20 has at least one groove 200 connecting the first side 20a and the second side 20b, so that at least one circuit structure 29 is placed in the groove 200, so that the supporting structure 20 and the circuit structure 29 serve as a substrate module 2a.

[0059] In this embodiment, the carrier structure 20 comprises, for example, a core-layer package substrate, a coreless package substrate, or other wiring structure, with at least one wiring layer 201, such as a redistribution layer (RDL), bonded to an insulating material 202. For example, the insulating material 202 may be polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or other dielectric materials.

[0060] Furthermore, the circuit structure 29 includes at least one insulating layer 290 and a circuit layer 291 bonded to the insulating layer 290, such as a redistribution layer (RDL). For example, the insulating layer 290 is made of a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or other materials.

[0061] It should be understood that the supporting structure 20 may also be other substrates for supporting chips, such as a board with metal routing, and is not limited to the above.

[0062] like Figure 2B As shown, at least one (e.g., two) first electronic components 21 are arranged on the circuit structure 29 corresponding to the first side 20a, and at least one second electronic component 22 and at least one third electronic component 23 are arranged on the first side 20a of the supporting structure 20, and at least one (e.g., four) conductive structures 24 are arranged to bridge the circuit structure 29 and the first side 20a of the supporting structure 20.

[0063] In this embodiment, the first electronic component 21 is an active component, a passive component, or a combination thereof. The active component is, for example, a semiconductor chip, while the passive component is, for example, a resistor, capacitor, or inductor. For example, the first electronic component 21 is a semiconductor chip such as an RF chip or a millimeter-wave chip, having a plurality of electrode pads 210 electrically connected to the circuit layer 291 via a plurality of conductive bumps 211 using a flip-chip method.

[0064] Furthermore, the second electronic component 22 and the third electronic component 23 are active components, passive components, or a combination thereof. The active component is, for example, a semiconductor chip, while the passive component is, for example, a resistor, capacitor, and inductor. For example, the second electronic component 22 and the third electronic component 23 can be semiconductor chips such as radio frequency chips or millimeter wave chips. They are electrically connected to the wiring layer 201 via a plurality of conductive bumps 221 , 231 using a flip chip method, and the conductive bumps 221 , 231 are covered with an underfill 28 .

[0065] In addition, the conductive structure 24 is a Through Silicon Interposer (TSI) that electrically connects the wiring layer 201 and the circuit layer 291 via a plurality of conductive bumps 241. The interposer can be made of a Through Silicon Interposer (TSI) or an organic circuit board.

[0066] It should be understood that there are many ways to electrically connect the first electronic component 21 , the second electronic component 22 , the third electronic component 23 , and even the conductive structure 24 to the substrate module 2 a , such as wire bonding, and the methods are not limited to the above.

[0067] like Figure 2C As shown, a plurality of packaging layers 25 are formed on the supporting structure 20 and the circuit structure 29 , so that each packaging layer 25 covers each first electronic component 21 and the adjacent conductive structure 24 , and fills the groove 200 to cover the circuit structure 29 .

[0068] In this embodiment, the encapsulation layer 25 is an insulating material, such as polyimide (PI), dry film, an encapsulation compound such as epoxy, or a molding compound. For example, the encapsulation layer 25 can be formed using a liquid compound, injection, lamination, or compression molding.

[0069] like Figure 2D and Figure 2E As shown, remove the carrier 9 and follow the Figure 2C The cutting path S shown is used to perform a singulation process to obtain the desired electronic package 2 .

[0070] In another embodiment, if Figure 3A and Figure 3B In the electronic package 3 shown, the packaging layer 35 may only cover the first electronic component 21 but not the conductive structure 24 and the circuit structure 29 .

[0071] In other embodiments, Figure 4A and Figure 4B The electronic package 4 shown may also be formed by only using a single packaging layer 45 to cover all first electronic components 21 , all conductive structures 24 and the circuit structure 29 .

[0072] Furthermore, if Figure 5A and Figure 5B In the electronic package 5 shown, the packaging layer 55 can cover the first electronic component 21 , the second electronic component 22 , the third electronic component 23 and the conductive structure 24 disposed on the supporting structure 20 and the circuit structure 29 .

[0073] Further, if Figure 6A and Figure 6BIn the electronic package 6 shown, the packaging layer 65 is not only formed on the supporting structure 20 and the circuit structure 29 , but also extends to the side surface 20 c of the supporting structure 20 to cover the supporting structure 20 .

[0074] In addition, if Figure 7A and Figure 7B In the electronic package 7 shown, the conductive structure 74 can be disposed on the second side 20 b of the supporting structure 20 as required, so that the conductive structure 74 and the first electronic component 21 , the second electronic component 22 , and the third electronic component 23 are located on different sides.

[0075] Or, as Figure 8A and Figure 8B In the electronic package 8 shown, the conductive structure 84 can be similar to the structures of the first electronic component 21 , the second electronic component 22 , and the third electronic component 23 , and can be a bridge die formed by active components, passive components, or a combination thereof.

[0076] Even, if Figure 9A and Figure 9B In the electronic package 9 shown, the conductive structure 94 may be a bonding wire.

[0077] It should be understood that there are many types and configurations of the conductive structures 24 , 74 , 84 , and 94 , which are mainly used to provide electrical connection between the wiring layer 201 and the circuit layer 291 .

[0078] Therefore, in the manufacturing method of the electronic package of the present application, the circuit structure 29 is mainly placed in the groove 200 of the carrier structure 20, so that the substrate module 2a can be designed with substrate areas of different specifications according to needs. For example, the circuit layer 291 of the circuit structure 29 meets the requirements of fine circuits, and the insulating material 202 of the carrier structure 20 meets the requirements of low DK / Df dielectric layer specifications (or, the wiring layer 201 of the carrier structure 20 meets the requirements of fine circuits, and the insulating layer 290 of the circuit structure 29 meets the requirements of low DK / Df dielectric layer specifications). DK / Df dielectric layer specification requirements), therefore, compared to the prior art, the electronic packages 2~9 of the present application can configure the first electronic component 21 (RF chip or millimeter wave chip) and the second electronic component 22 (RF chip or millimeter wave chip) on the required substrate area according to their specifications, so that when the electronic packages 2~9 need to use chips of different specifications (such as RF chip and millimeter wave chip), the RF chip and the millimeter wave chip can be respectively configured on the circuit structure 29 and the supporting structure 20 at the same time, thereby meeting the multi-functional requirements.

[0079] Furthermore, the substrate module 2a can be manufactured using existing technology and equipment without adding new processes and new materials or purchasing new special machines. Therefore, the manufacturing method of the present application will not generate a large amount of additional cost expenditure, which is conducive to reducing the manufacturing cost of the electronic packages 2~9, thereby effectively reducing the overall cost of the terminal product.

[0080] The present application also provides an electronic package 2-9, comprising: a supporting structure 20 having a wiring layer 201, at least one circuit structure 29, at least one first electronic component 21, at least one second electronic component 22, at least one conductive structure 24, 74, 84, 94 and at least one packaging layer 25, 35, 45, 55, 65.

[0081] The supporting structure 20 is defined with a first side 20 a and a second side 20 b opposite to each other, and is formed with at least one groove 200 communicating with the first side 20 a and the second side 20 b.

[0082] The circuit structure 29 is disposed in the groove 200 and has a circuit layer 291 .

[0083] The first electronic component 21 is disposed on the circuit structure 29 corresponding to the first side 20 a and is electrically connected to the circuit layer 291 .

[0084] The second electronic component 22 is disposed on the first side 20 a of the supporting structure 20 and is electrically connected to the wiring layer 201 .

[0085] The conductive structures 24 , 74 , 84 , and 94 bridge the supporting structure 20 and the circuit structure 29 and electrically connect the wiring layer 201 and the circuit layer 291 .

[0086] The packaging layers 25 , 35 , 45 , 55 , and 65 cover the first electronic component 21 .

[0087] In one embodiment, the packaging layer 25 , 45 , 55 , 65 extends into the groove 200 to cover the circuit structure 29 .

[0088] In one embodiment, the encapsulation layer 25 , 45 , 55 , 65 further covers the conductive structure 24 , 84 , 94 .

[0089] In one embodiment, the carrier structure 20 is formed with a plurality of recesses 200, with the circuit structure 29 disposed in each recess 200. This allows the first side 20a of the carrier structure 20 to be configured with a plurality of first electronic components 21 and a plurality of conductive structures 24, 84, and 94. For example, a plurality of encapsulation layers 25 and 35 are formed on the first side 20a of the carrier structure 20 to respectively encapsulate each first electronic component 21. Alternatively, the encapsulation layers 45, 55, and 65 encapsulate a plurality of first electronic components 21.

[0090] In one embodiment, the packaging layer 55 , 65 further covers the second electronic component 22 .

[0091] In one embodiment, the encapsulation layer 65 further extends to the side surface 20 c of the supporting structure 20 .

[0092] In one embodiment, the conductive structures 24 , 74 are disposed on the first side 20 a or the second side 20 b of the supporting structure 20 .

[0093] In one embodiment, the conductive structures 24 , 74 , 84 , 94 are interposers, bonding wires, active components, passive components, or a combination thereof.

[0094] To summarize, the electronic package and its manufacturing method of the present application form substrate areas of different specifications by placing the circuit structure in the groove of the supporting structure. Therefore, the electronic package of the present application can configure the first electronic component and the second electronic component on the required substrate areas according to their specifications. When the electronic package needs to use electronic components (chips) of different specifications, the electronic components of different specifications can be configured on the circuit structure and the supporting structure respectively at the same time, thereby meeting multi-functional requirements.

[0095] Furthermore, the circuit structure and the supporting structure can be manufactured using existing technologies and equipment, without adding new processes and new materials or purchasing new special machines. Therefore, the electronic package of this application will not incur additional costs during production, which is conducive to reducing the production cost of the electronic package, thereby effectively reducing the overall cost of the terminal product.

[0096] The above embodiments are intended only to illustrate the principles and effects of this application and are not intended to limit this application. Those skilled in the art may modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be as set forth in the claims.

Claims

1. An electronic package, characterized in that: include: A supporting structure having a wiring layer and defining a first side and a second side opposite to each other, and forming at least one groove connecting the first side and the second side; a circuit structure disposed in the groove and having a circuit layer; A first electronic component is disposed on the circuit structure corresponding to the first side and electrically connected to the circuit layer; a second electronic component disposed on the first side of the supporting structure and electrically connected to the wiring layer; A conductive structure, bridging the supporting structure and the circuit structure and electrically connecting the wiring layer and the circuit layer; as well as The packaging layer covers the first electronic component.

2. The electronic package according to claim 1, wherein: The packaging layer extends into the groove to cover the circuit structure.

3. The electronic package according to claim 1, wherein: The packaging layer also covers the conductive structure.

4. The electronic package according to claim 1, wherein: A plurality of grooves are formed on the supporting structure, and the circuit structure is respectively arranged in each groove, so that a plurality of the first electronic components and a plurality of the conductive structures are disposed on the first side of the supporting structure.

5. The electronic package according to claim 4, wherein: A plurality of packaging layers are formed on the first side of the supporting structure to respectively cover the first electronic components.

6. The electronic package according to claim 4, wherein: The packaging layer covers a plurality of the first electronic components.

7. The electronic package according to claim 1, wherein: The packaging layer also covers the second electronic component.

8. The electronic package according to claim 1, wherein: The encapsulation layer also extends to the side surfaces of the supporting structure.

9. The electronic package according to claim 1, wherein: The conductive structure is arranged on the first side or the second side of the supporting structure.

10. The electronic package according to claim 1, wherein The conductive structure is an interposer, a bonding wire, an active component, a passive component or a combination thereof.

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