Aluminum-based circuit board for heat dissipation of integrated circuit

Abstract

The utility model provides an aluminum-based circuit board for heat dissipation of an integrated circuit, which comprises an aluminum substrate, an insulating layer and a circuit layer which are sequentially arranged from bottom to top, the bottom surface of the insulating layer is provided with a plurality of upper jacks, and the top surface of the aluminum substrate is provided with a plurality of lower jacks in one-to-one correspondence with the upper jacks. A heat conduction column with the top matched with the upper insertion hole in an inserted mode is inserted into the lower insertion hole, an overhead hole is formed in the bottom face of the aluminum substrate, and a plurality of ventilation holes are formed in the two outer side walls of the aluminum substrate. When the aluminum-based circuit board for heat dissipation of the integrated circuit works, air can circulate in the overhead holes, meanwhile, lateral air can enter the overhead holes through the ventilation holes, and the circulating air can take away heat transferred to the aluminum substrate by the aluminum-based circuit board for heat dissipation of the integrated circuit.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an aluminum-based circuit board for heat dissipation of integrated circuits. Background Art

[0002] Circuit boards, also known as printed circuit boards, include ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout.

[0003] Circuit boards will generate heat during long-term use, causing the circuit boards to be at a higher temperature. Long-term high temperature will cause the circuit boards to age and affect the service life of the circuit boards. At the same time, many electronic components are generally installed on the surface of the circuit boards. Once the circuit boards catch fire, the electronic components will be damaged.

[0004] The existing Chinese patent with authorization announcement number CN201957334U discloses an aluminum-based circuit board, including an aluminum substrate, an insulating layer and a circuit layer. The circuit layer and the aluminum substrate are separated by an insulating layer. Component pads and circuits are formed on the circuit layer. A connecting hole is drilled on the ground pad among the component pads from the pad surface toward the aluminum substrate. The connecting hole passes through the insulating layer and extends into the aluminum substrate. The connecting hole is filled with a heat dissipation material, which connects the ground pad to the aluminum substrate.

[0005] The above-mentioned prior art solution has the following defects: the aluminum-based circuit board improves the heat dissipation performance only by punching holes and filling them with heat dissipation materials, which has the defect of poor heat dissipation performance. Utility Model Content

[0006] The problem to be solved by the present invention is to provide an aluminum-based circuit board for heat dissipation of integrated circuits in view of the above-mentioned deficiencies in the prior art, which solves the problem of poor heat dissipation performance in the prior art.

[0007] The above-mentioned utility model object of the present utility model is achieved through the following technical solutions: an aluminum-based circuit board for integrated circuit heat dissipation, comprising an aluminum substrate, an insulating layer, and a circuit layer arranged in sequence from bottom to top, a plurality of upper plug holes are opened on the bottom surface of the insulating layer, a plurality of lower plug holes arranged one-to-one corresponding to the upper plug holes are opened on the top surface of the aluminum substrate, a heat-conducting column whose top is plugged into the upper plug hole is inserted into the lower plug hole, an overhead hole is opened on the bottom surface of the aluminum substrate, and a plurality of ventilation holes are opened on both outer side walls of the aluminum substrate.

[0008] The utility model is further configured as follows: the material of the heat-conducting column is copper.

[0009] The present invention is further configured as follows: a lower through hole is opened on the bottom wall of each lower plugging hole, each lower through hole is connected to the overhead hole, and the aperture of the lower through hole is smaller than the aperture of the lower plugging hole.

[0010] The utility model is further configured as follows: a plurality of support members are arranged at equal intervals in the overhead hole, the support members include a vertical connecting plate with an upper through hole opened on the side wall, two diagonal support plates are obliquely arranged at the bottom of the vertical connecting plate, a first lower through hole is opened through the two diagonal support plates, and a flat support plate is provided at the bottom of each of the diagonal support plates.

[0011] The utility model is further configured as follows: a hollow tripod is integrally connected to the bottom of the vertical connecting plate, the cross section of the hollow tripod is a triangular ring, and a second lower through hole is penetrated through both inclined side walls of the hollow tripod.

[0012] The present invention is further configured as follows: a hollow square frame is integrally connected to the bottom of the vertical connecting plate, the cross section of the hollow square frame is a square ring, and third lower through holes are penetrated through both side walls of the hollow square frame.

[0013] The present invention is further configured as follows: a hollow circular frame is integrally connected to the bottom of the vertical connecting plate, the cross section of the hollow circular frame is annular, and a fourth lower through hole is opened through the circular surface of the hollow circular frame.

[0014] The present invention is further configured as follows: a hollow elliptical frame is integrally connected to the bottom of the vertical connecting plate, the cross section of the hollow elliptical frame is an elliptical ring, and a fifth lower through hole is opened through the elliptical surface of the hollow elliptical frame.

[0015] In summary, the beneficial technical effects of the present invention are as follows: when the aluminum-based circuit board for integrated circuit heat dissipation is working, air can circulate in the overhead holes, and at the same time, lateral air can also enter the overhead holes through the ventilation holes. The circulating air can take away the heat transferred from the aluminum-based circuit board for integrated circuit heat dissipation to the aluminum substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of an aluminum-based circuit board for heat dissipation of integrated circuits in Example 1;

[0017] Figure 2 is a schematic structural diagram of the support member in Example 1;

[0018] Figure 3 is a schematic structural diagram of the support member in Example 2;

[0019] Figure 4 is a schematic structural diagram of the support member in Example 3;

[0020] Figure 5is a schematic structural diagram of the support member in the fourth embodiment;

[0021] Figure 6 It is a structural diagram of the support member in Example 5.

[0022] In the above drawings: 1. Aluminum base plate; 2. Insulation layer; 3. Upper plug hole; 4. Overhead hole; 5. Ventilation hole; 6. Lower plug hole; 7. Thermal conductive column; 8. Lower through hole; 9. Support member; 10. Vertical connecting plate; 11. Upper through hole; 12. Diagonal support plate; 13. First lower through hole; 14. Flat support plate; 15. Hollow tripod; 16. Second lower through hole; 17. Hollow square frame; 18. Third lower through hole; 19. Hollow circular frame; 20. Fourth lower through hole; 21. Hollow elliptical frame; 22. Fifth lower through hole. DETAILED DESCRIPTION

[0023] In order to make the technical means, creative features, objectives and functions achieved by the present invention clearer and easier to understand, the present invention is further explained below with reference to the accompanying drawings and specific implementation methods. Example

[0024] like Figure 1 and 2 As shown, the utility model proposes an aluminum-based circuit board for heat dissipation of integrated circuits, which includes an aluminum substrate 1, an insulating layer 2, and a circuit layer arranged in sequence from bottom to top.

[0025] A plurality of upper insertion holes 3 are formed on the bottom surface of the insulating layer 2 . The upper insertion holes 3 are evenly arranged and are circular holes.

[0026] Aluminum substrate 1 has an overhead hole 4 formed on its bottom surface, and multiple ventilation holes 5 formed on both outer sidewalls of the aluminum substrate 1. Each of these ventilation holes 5 is connected to the overhead hole 4. When the aluminum-based circuit board for integrated circuit heat dissipation is in operation, air can flow through the overhead hole 4, while lateral air can also enter the overhead hole 4 through the ventilation holes 5. This circulating air can remove heat transferred from the aluminum-based circuit board to the aluminum substrate 1.

[0027] The top surface of the aluminum substrate 1 is provided with a plurality of circular lower holes 6. The lower through-holes 8 have a smaller diameter than the lower holes 6. The lower holes 6 are evenly spaced, corresponding one-to-one with the upper holes 3 and located directly below them. Thermally conductive pillars 7 are inserted into the lower holes 6, and the tops of the pillars 7 engage with the upper holes 3. The pillars 7 are made of copper. During operation, heat transferred to the insulating layer 2 is more quickly transferred to the aluminum substrate 1 via the thermally conductive pillars 7.

[0028] A lower through hole 8 is formed on the bottom wall of each lower insertion hole 6. The lower through hole 8 is a circular hole and is connected to the overhead hole 4. When the aluminum-based circuit board for integrated circuit heat dissipation is in operation, the heat transferred to the heat-conducting pillar 7 can enter the overhead hole 4 more quickly through the lower through hole 8.

[0029] like Figure 2 As shown, a plurality of support members 9 are arranged at equal intervals in the overhead hole 4. The support members 9 are used to improve the structural strength of the aluminum substrate 1. The top of the support member 9 is fixedly connected to the top wall of the overhead hole 4. The material of the support member 9 is aluminum.

[0030] The support member 9 includes a vertical connecting plate 10 with an upper through hole 11 on the side wall. The bottom of the vertical connecting plate 10 is integrally connected to two diagonal support plates 12. The two diagonal support plates 12 are arranged at an angle. A first lower through hole 13 is opened through the two diagonal support plates 12. The bottom of each diagonal support plate 12 is integrally connected to a flat support plate 14. By setting the flat support plate 14, the supporting stability of the support member 9 is improved.

[0031] When the aluminum-based circuit board for integrated circuit heat dissipation is working, the air entering the overhead hole 4 can pass through the upper through hole 11 and the first lower through hole 13. By providing the support member 9, it can be ensured that the aluminum substrate 1 has good structural strength and good heat dissipation. Example

[0032] like Figure 3 As shown, the present invention proposes an aluminum-based circuit board for integrated circuit heat dissipation. The difference between Example 2 and Example 1 is that a hollow tripod 15 is integrally connected to the bottom of the vertical connecting plate 10. The cross-section of the hollow tripod 15 is a triangular ring. A second lower through hole 16 is opened through both inclined side walls of the hollow tripod 15.

[0033] When the aluminum-based circuit board for integrated circuit heat dissipation is working, the air entering the overhead hole 4 can pass through the upper through hole 11 and the second lower through hole 16. By providing the support member 9, it can be ensured that the aluminum substrate 1 has good structural strength and good heat dissipation. Example

[0034] like Figure 4 As shown, the present invention proposes an aluminum-based circuit board for integrated circuit heat dissipation. The difference between Example 3 and Example 1 is that a hollow square frame 17 is integrally connected to the bottom of the vertical connecting plate 10. The cross-section of the hollow square frame 17 is a square ring. Third lower through holes 18 are opened on both side walls of the hollow square frame 17.

[0035] When the aluminum-based circuit board for integrated circuit heat dissipation is working, the air entering the overhead hole 4 can pass through the upper through hole 11 and the third lower through hole 18. By providing the support member 9, it can be ensured that the aluminum substrate 1 has good structural strength and good heat dissipation. Example

[0036] like Figure 5 As shown, the utility model proposes an aluminum-based circuit board for integrated circuit heat dissipation. The difference between Example 4 and Example 1 is that the bottom of the vertical connecting plate 10 is integrally connected with a hollow circular frame 19, the cross-section of the hollow circular frame 19 is a circular ring, and a fourth lower through hole 20 is opened through the circular surface of the hollow circular frame 19.

[0037] When the aluminum-based circuit board for integrated circuit heat dissipation is working, the air entering the overhead hole 4 can pass through the upper through hole 11 and the fourth lower through hole 20. By providing the support member 9, it can be ensured that the aluminum substrate 1 has good structural strength and good heat dissipation. Example

[0038] like Figure 6 As shown, the utility model proposes an aluminum-based circuit board for integrated circuit heat dissipation. The difference between Example 5 and Example 1 is that: the bottom of the vertical connecting plate 10 is integrally connected with a hollow elliptical frame 21, the cross-section of the hollow elliptical frame 21 is an elliptical ring, and a fifth lower through hole 22 is opened through the elliptical surface of the hollow elliptical frame 21.

[0039] When the aluminum-based circuit board for integrated circuit heat dissipation is working, the air entering the overhead hole 4 can pass through the upper through hole 11 and the fifth lower through hole 22. By providing the support member 9, it can be ensured that the aluminum substrate 1 has good structural strength and good heat dissipation.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model and are not limiting. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. An aluminum-based circuit board for heat dissipation of integrated circuits, comprising an aluminum substrate (1), an insulating layer (2), and a circuit layer arranged in sequence from bottom to top, characterized in that: The bottom surface of the insulating layer (2) is provided with a plurality of upper plug holes (3); the top surface of the aluminum substrate (1) is provided with a plurality of lower plug holes (6) arranged in a one-to-one correspondence with the upper plug holes (3); the lower plug holes (6) are provided with heat-conducting columns (7) whose tops are plugged into and matched with the upper plug holes (3); the bottom surface of the aluminum substrate (1) is provided with an overhead hole (4); and the two outer side walls of the aluminum substrate (1) are provided with a plurality of ventilation holes (5).

2. The aluminum-based circuit board for integrated circuit heat dissipation according to claim 1, characterized in that: The material of the heat-conducting column (7) is copper.

3. The aluminum-based circuit board for integrated circuit heat dissipation according to claim 1, characterized in that: A lower through hole (8) is provided on the bottom wall of each lower insertion hole (6), and each lower through hole (8) is connected to the overhead hole (4). The aperture of the lower through hole (8) is smaller than the aperture of the lower insertion hole (6).

4. The aluminum-based circuit board for integrated circuit heat dissipation according to claim 1, characterized in that: A plurality of support members (9) are arranged at equal intervals in the overhead hole (4), and the support member (9) includes a vertical connecting plate (10) with an upper through hole (11) opened on the side wall, and two diagonal support plates (12) are arranged obliquely at the bottom of the vertical connecting plate (10), and a first lower through hole (13) is opened through the two diagonal support plates (12), and a flat support plate (14) is arranged at the bottom of each diagonal support plate (12).

5. The aluminum-based circuit board for integrated circuit heat dissipation according to claim 4, characterized in that: The bottom of the vertical connecting plate (10) is integrally connected with a hollow triangle (15), the cross section of the hollow triangle (15) is a triangular ring, and a second lower through hole (16) is provided through both inclined side walls of the hollow triangle (15).

6. The aluminum-based circuit board for integrated circuit heat dissipation according to claim 4, characterized in that: The bottom of the vertical connecting plate (10) is integrally connected with a hollow square frame (17), the cross section of the hollow square frame (17) is a square ring, and third lower through holes (18) are provided through both side walls of the hollow square frame (17).

7. The aluminum-based circuit board for integrated circuit heat dissipation according to claim 4, characterized in that: The bottom of the vertical connecting plate (10) is integrally connected with a hollow circular frame (19), the cross section of the hollow circular frame (19) is annular, and a fourth lower through hole (20) is provided through the circular surface of the hollow circular frame (19).

8. The aluminum-based circuit board for integrated circuit heat dissipation according to claim 4, characterized in that: The bottom of the vertical connecting plate (10) is integrally connected with a hollow elliptical frame (21), the cross section of the hollow elliptical frame (21) is an elliptical ring, and a fifth lower through hole (22) is provided through the elliptical surface of the hollow elliptical frame (21).

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