Wireless intelligent transmitter

Abstract

The utility model relates to the technical field of transmitters, in particular to a wireless intelligent transmitter which comprises a shell, an intelligent transmitter body is arranged on the inner side of the shell, heat dissipation holes are formed in the rear side of the shell, a fixing cover is fixedly connected to the rear end of the outer surface of the shell, an annular groove is formed in the outer surface, located in the fixing cover, of the shell, and the annular groove is communicated with the intelligent transmitter body. The inner side of the annular groove communicates with a plurality of air guide pipes distributed at equal angles, and a semiconductor chilling plate is embedded in the rear side of the fixing cover. According to the utility model, through the effects of the heat radiation fins, the micro fan, the heat conduction plate, the separation ring, the ring groove, the gas-guide tube, the semiconductor refrigeration sheet, the refrigeration plate, the cooling fins and the heat radiation holes, the problems that the internal heat accumulation of the transmitter is easily caused by the influence of the external environment and the insufficient heat radiation performance when the existing wireless intelligent transmitter works, and the temperature of the transmitter is reduced are solved. Therefore, internal electronic components are damaged, and the service life of the electronic components is shortened.

Description

Technical Field

[0001] The utility model relates to the technical field of transmitters, in particular to a wireless intelligent transmitter. Background Art

[0002] Transmitters evolved from sensors. Any sensor that can output a standard signal is called a transmitter. A standard signal refers to a signal whose form and range of physical quantity conform to international standards. Wireless smart transmitters are high-tech devices that integrate sensors, microprocessors, communication modules, and control circuits, offering a high degree of intelligence and automation. Through internal intelligent algorithms, automatic calibration, and fault detection, they provide high-precision measurement and control capabilities to meet the requirements of industrial processes. Temperature transmitters are one such example.

[0003] At present, when the existing wireless intelligent transmitter is working, it is easily affected by the external environment and its own insufficient heat dissipation performance, which leads to the accumulation of heat inside the transmitter, thereby causing damage to the internal electronic components and reducing their service life. For this reason, we propose a wireless intelligent transmitter. Utility Model Content

[0004] The purpose of the utility model is to provide a wireless intelligent transmitter with the advantages of good heat dissipation performance and long service life, which solves the problem that the existing wireless intelligent transmitter is easily affected by the external environment and its own insufficient heat dissipation performance during operation, which easily leads to heat accumulation inside the transmitter, thereby causing damage to the internal electronic components and shortening its service life.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wireless intelligent transmitter, comprising a shell, an intelligent transmitter body is provided on the inner side of the shell, a heat dissipation hole is provided on the rear side of the shell, a fixed cover is fixedly connected to the rear end of the outer surface of the shell, an annular groove is provided on the outer surface of the shell located inside the fixed cover, a plurality of air ducts distributed at equal angles are connected to the inner side of the annular groove, a semiconductor refrigeration plate is embedded in the rear side of the fixed cover, a heat conduction plate is fixedly connected to the rear side of the heat conduction plate, a plurality of equidistantly distributed heat dissipating fins are fixedly connected to the rear side of the heat conduction plate, a refrigeration plate is embedded in the rear side of the inner cavity of the fixed cover, a plurality of equidistantly distributed cooling fins are fixedly connected to the front side of the refrigeration plate, a partition ring is fixedly connected between the rear side of the inner wall of the fixed cover and the rear end of the outer surface of the shell, and micro fans are fixedly installed on both ends of the rear side of the fixed cover.

[0006] Preferably, a connecting sleeve is provided at the bottom of the intelligent transmitter body, and a detection tube is provided at the lower end of the connecting sleeve.

[0007] Preferably, the air guide tube is arranged to be inclined inward.

[0008] Preferably, the hot surface of the semiconductor refrigeration plate is in contact with the heat conducting plate, and the cold surface of the semiconductor refrigeration plate is in contact with the refrigeration plate.

[0009] Preferably, the air inlet end of the micro fan extends to the inner cavity of the fixed cover through a pipe, and the air outlet end of the micro fan extends to the inner cavity between the fixed cover and the separation ring through a pipe.

[0010] Preferably, a high-gain antenna is fixedly mounted on the right side of the shell, and a PT isolation amplifier is fixedly mounted on the front side of the high-gain antenna.

[0011] Preferably, the inner surfaces of the cooling fins and the heat dissipating fins are both provided with through holes, and the number of the through holes is multiple.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0013] 1. The utility model is provided with heat dissipation fins, micro-fans, heat conduction plates, separator rings, ring grooves, air ducts, semiconductor refrigeration sheets, refrigeration plates, cooling fins and heat dissipation holes. When the transmitter is working, the micro-fans and semiconductor refrigeration sheets work, the cold surface of the semiconductor refrigeration sheets can cool the cooling fins through the refrigeration plates, and the heat generated by the hot surface of the semiconductor refrigeration sheets can be transferred to the heat dissipation fins through the heat conduction plates, thereby ensuring the normal operation of the semiconductor refrigeration sheets. After the micro-fan absorbs the gas between the fixed cover and the shell and transports it to the inner cavity between the fixed cover and the separator ring, the gas can be assisted by the separator ring and the ring groove so that the gas can be blown to the intelligent transmitter body through the air duct to achieve heat dissipation. At the same time, the gas after heat dissipation can enter the inner cavity between the fixed cover and the shell through the heat dissipation holes to replenish the loss of gas, and the flow of gas can blow the cooling fins after cooling, thereby achieving effective cooling of the heat dissipation gas, thereby ensuring the normal use of the intelligent transmitter body.

[0014] 2. The utility model has a high gain value through the setting of a high-gain antenna, which can concentrate signal energy, reduce interference, and can transmit over long distances or enhance signal coverage. Through the setting of a PT isolation amplifier, it plays an important role in industrial automation and temperature measurement, and can provide high-precision temperature signal conversion and isolation amplification, ensuring stable transmission and processing of signals, thereby improving the anti-interference strength of this transmitter. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of the utility model from the first perspective;

[0016] Figure 2 This is a schematic diagram of the structure of the utility model from a second viewing angle;

[0017] Figure 3 This is a schematic cross-sectional view of the utility model from a third viewing angle;

[0018] Figure 4 This is a schematic cross-sectional view of the fixed cover of the utility model.

[0019] In the figure: 1. Shell; 2. Intelligent transmitter body; 3. Connecting sleeve; 4. Detection tube; 5. Fixed cover; 6. High-gain antenna; 7. PT100 isolation amplifier; 8. Heat dissipation fins; 9. Micro fan; 10. Heat conduction plate; 11. Separation ring; 12. Ring groove; 13. Air guide tube; 14. Through hole; 15. Semiconductor refrigeration plate; 16. Refrigeration plate; 17. Cooling fins; 18. Heat dissipation hole. DETAILED DESCRIPTION

[0020] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] In the description of this utility model, unless otherwise specified, "plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific direction, be constructed, or operate in a specific direction, and therefore should not be construed as limiting this utility model. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0023] The shell 1, smart transmitter body 2, connecting sleeve 3, detection tube 4, fixed cover 5, high-gain antenna 6, PT100 isolation amplifier 7, heat dissipation fins 8, micro fan 9, heat conduction plate 10, separation ring 11, ring groove 12, air guide tube 13, through hole 14, semiconductor refrigeration plate 15, refrigeration plate 16, cooling fins 17 and heat dissipation holes 18 components of this application are all universal standard parts or components known to technical personnel in this field, and their structures and principles can be known to technical personnel through technical manuals or through conventional experimental methods.

[0024] Example 1

[0025] See also Figure 1-Figure 4 As shown, the utility model provides a technical solution: a wireless intelligent transmitter, including a shell 1, an intelligent transmitter body 2 is provided on the inner side of the shell 1, a connecting sleeve 3 is provided at the bottom of the intelligent transmitter body 2, a detection tube 4 is provided at the lower end of the connecting sleeve 3, a heat dissipation hole 18 is provided on the rear side of the shell 1, a fixed cover 5 is fixedly connected to the rear end of the outer surface of the shell 1, an annular groove 12 is provided on the outer surface of the shell 1 located inside the fixed cover 5, a plurality of air guide pipes 13 distributed at equal angles are connected to the inner side of the annular groove 12, the air guide pipes 13 are inclined inwardly, a semiconductor refrigeration sheet 15 is embedded in the rear side of the fixed cover 5, a heat conduction plate 10 is fixedly connected to the rear side of the semiconductor refrigeration sheet 15, and a heat conduction plate 10 is fixedly connected to the rear side of the fixed cover 5. A plurality of equidistantly distributed heat dissipating fins 8 are fixedly connected to the rear side of the plate 10, the hot surface of the semiconductor refrigeration plate 15 is in contact with the heat conducting plate 10, and the cold surface of the semiconductor refrigeration plate 15 is in contact with the refrigeration plate 16. A refrigeration plate 16 is embedded in the rear side of the inner cavity of the fixed cover 5, and a plurality of equidistantly distributed cooling fins 17 are fixedly connected to the front side of the refrigeration plate 16. A separating ring 11 is fixedly connected between the rear side of the inner wall of the fixed cover 5 and the rear end of the outer surface of the shell 1. Micro fans 9 are fixedly installed on the left and right ends of the rear side of the fixed cover 5. The air inlet end of the micro fan 9 extends to the inner cavity of the fixed cover 5 through a pipe, and the air outlet end of the micro fan 9 extends to the inner cavity between the fixed cover 5 and the separating ring 11 through a pipe.

[0026] This technical solution: through the arrangement of the intelligent transmitter body 2, the connecting sleeve 3 and the detection tube 4, the detection use of the intelligent transmitter body 2 is guaranteed. Through the arrangement of the heat dissipation fins 8, the micro fan 9, the heat conduction plate 10, the separation ring 11, the ring groove 12, the air guide tube 13, the semiconductor refrigeration sheet 15, the refrigeration plate 16, the cooling fins 17 and the heat dissipation holes 18, when the transmitter is working, the micro fan 9 and the semiconductor refrigeration sheet 15 work, the cold surface of the semiconductor refrigeration sheet 15 can cool the cooling fins 17 through the refrigeration plate 16, and the heat generated by the hot surface of the semiconductor refrigeration sheet 15 can be transferred to the heat dissipation fins 8 through the heat conduction plate 10, thereby ensuring the normal operation of the semiconductor refrigeration sheet 15. After the fan 9 absorbs the gas between the fixed cover 5 and the shell 1 and transports it to the inner cavity between the fixed cover 5 and the separation ring 11, the gas can be assisted by the separation ring 11 and the ring groove 12, so that the gas can be blown to the smart transmitter body 2 through the air duct 13 to achieve heat dissipation. At the same time, the heat-dissipated gas can enter the inner cavity between the fixed cover 5 and the shell 1 through the heat dissipation hole 18 to replenish the loss of gas, and the flow of gas can blow the cooling fins 17 after cooling, so as to achieve effective cooling of the heat-dissipating gas and ensure the normal use of the smart transmitter body 2. The recycling of the gas minimizes the adverse effects of high temperature, dust, moisture, etc. in the external environment on the transmitter.

[0027] Example 2

[0028] On the basis of embodiment 1, the present invention is as follows Figure 1-Figure 4 As shown, a high-gain antenna 6 is fixedly installed on the right side of the housing 1 , and a PT100 isolation amplifier 7 is fixedly installed on the front side of the high-gain antenna 6 .

[0029] This technical solution: through the setting of the high-gain antenna 6, it has a higher gain value, can concentrate signal energy, reduce interference, can transmit over long distances or enhance signal coverage. Through the setting of the PT100 isolation amplifier 7, it plays an important role in industrial automation and temperature measurement, can provide high-precision temperature signal conversion and isolation amplification, ensure stable transmission and processing of the signal, thereby improving the anti-interference strength of the transmitter.

[0030] Example 3

[0031] On the basis of embodiment 1, the present invention is as follows Figure 1-Figure 4 As shown, it is disclosed that the inner surfaces of the cooling fins 17 and the heat dissipating fins 8 are both provided with through holes 14 , and the number of the through holes 14 is multiple.

[0032] This technical solution: by providing the through holes 14 , the cooling and heat dissipation efficiencies of the cooling fins 17 and the heat dissipation fins 8 can be improved respectively.

[0033] It is important to note that the construction and arrangement of the present application shown in a number of different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, colors, directional changes, etc.) without departing substantially from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of the discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "means plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also an equivalent structure. Without departing from the scope of the present invention, other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0034] Additionally, in order to provide a concise description of example embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the scope of protection of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. A wireless intelligent transmitter, comprising a housing (1), characterized in that: An intelligent transmitter body (2) is provided on the inner side of the shell (1), a heat dissipation hole (18) is provided on the rear side of the shell (1), a fixed cover (5) is fixedly connected to the rear end of the outer surface of the shell (1), an annular groove (12) is provided on the outer surface of the shell (1) located inside the fixed cover (5), a plurality of air guide pipes (13) distributed at equal angles are connected to the inner side of the annular groove (12), a semiconductor cooling plate (15) is embedded on the rear side of the fixed cover (5), and the rear side of the semiconductor cooling plate (15) is provided with a heat dissipation plate (15). A heat conducting plate (10) is fixedly connected, and a plurality of equidistantly distributed heat dissipating fins (8) are fixedly connected to the rear side of the heat conducting plate (10). A refrigeration plate (16) is embedded in the rear side of the inner cavity of the fixed cover (5), and a plurality of equidistantly distributed cooling fins (17) are fixedly connected to the front side of the refrigeration plate (16). A separation ring (11) is fixedly connected between the rear side of the inner wall of the fixed cover (5) and the rear end of the outer surface of the shell (1). Micro fans (9) are fixedly installed at both left and right ends of the rear side of the fixed cover (5).

2. The wireless intelligent transmitter according to claim 1, characterized in that: A connecting sleeve (3) is provided at the bottom of the intelligent transmitter body (2), and a detection tube (4) is provided at the lower end of the connecting sleeve (3).

3. The wireless intelligent transmitter according to claim 1, characterized in that: The air guide tube (13) is arranged to be inclined inwards.

4. The wireless intelligent transmitter according to claim 1, characterized in that: The hot surface of the semiconductor refrigeration sheet (15) is in contact with the heat conducting plate (10), and the cold surface of the semiconductor refrigeration sheet (15) is in contact with the refrigeration plate (16).

5. The wireless intelligent transmitter according to claim 1, characterized in that: The air inlet end of the micro fan (9) extends through a pipe to the inner cavity of the fixed cover (5), and the air outlet end of the micro fan (9) extends through a pipe to the inner cavity between the fixed cover (5) and the separation ring (11).

6. The wireless intelligent transmitter according to claim 1, characterized in that: A high-gain antenna (6) is fixedly mounted on the right side of the housing (1), and a PT100 isolation amplifier (7) is fixedly mounted on the front side of the high-gain antenna (6).

7. The wireless intelligent transmitter according to claim 1, characterized in that: The inner surfaces of the cooling fins (17) and the heat dissipating fins (8) are both provided with through holes (14), and the number of the through holes (14) is multiple.

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