Surface-mounted LED light source
By using blue and red chips combined with specific phosphors in LED light sources and optimizing the heat dissipation and current distribution design, the problems of spectral discontinuity and poor heat dissipation are solved, efficient spectral continuity and heat dissipation performance are achieved, and the lighting quality and life are improved.
Patent Information
- Application Number
- CN202422598252.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-10-25
AI Technical Summary
Traditional LED light sources have discontinuous spectra, high risk of blue light hazards, and poor heat dissipation, which affects luminous efficiency and lifespan.
It uses a blue light chip and a red light chip combined with a specific ratio of phosphor. The heat dissipation pad is located in the middle of the printed circuit board, and multiple positive and negative pads are respectively set on both sides of the heat dissipation pad to optimize the current distribution and heat dissipation design.
It achieves the continuity and integrity of the spectrum, improves the lighting quality and color rendering, reduces the harm of blue light, and enhances the heat dissipation performance and service life.
Smart Images
Figure CN223402776U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of LED light sources, and in particular to a surface-mount LED light source. Background Art
[0002] As the public's awareness of healthy lighting increases, traditional LED lighting products are gradually exposing some limitations in design.
[0003] Traditional LED light sources typically use a blue light chip to excite a yellow phosphor to produce white light. This design results in a higher intensity blue light band in the light source spectrum, while light in other bands is relatively less, resulting in a discontinuous spectrum. This unbalanced spectrum may affect human circadian rhythms and visual comfort, while also increasing the risk of blue light hazards.
[0004] At the same time, when LEDs are working, about 60%-70% of the electrical energy is converted into heat energy, while only 30%-40% of the electrical energy is converted into light energy. This means that LED light sources generate a lot of heat. If the heat dissipation is not good, the temperature of the LED chip will rise, thereby affecting the luminous efficiency and lifespan. Existing heat dissipation methods include natural convection heat dissipation, passive heat dissipation (such as heat pipe technology), and active heat dissipation (such as adding fans for forced heat dissipation, liquid cooling, etc.). However, these heat dissipation methods have limitations, such as difficulty in implementation, high cost, poor thermal conductivity, high environmental requirements, and immature technology. Utility Model Content
[0005] The present application provides a patch-type LED light source to solve the problems of spectrum discontinuity and poor heat dissipation in the existing light source.
[0006] In a first aspect, the present application provides a SMD LED light source, comprising: multiple positive electrode pads, multiple negative electrode pads, a heat dissipation pad, a soldering frame, a blue light chip, a red light chip, and phosphor;
[0007] The heat dissipation pad is welded on the middle part of the printed circuit board, and the multiple negative electrode pads and the multiple positive electrode pads are respectively arranged on both sides of the heat dissipation pad;
[0008] The soldering frame is provided with a blue chip bowl cup area and a red chip bowl cup area, wherein the blue chip bowl cup area is located directly above the first area of the heat dissipation pad, and the red chip bowl cup area is located directly above the second area of the heat dissipation pad;
[0009] The blue chip is soldered on the first area of the heat dissipation pad, and the red chip is soldered on the second area of the heat dissipation pad. The blue chip and the red chip are connected to the multi-channel positive electrode pad and the multi-channel negative electrode pad respectively.
[0010] The phosphor is used to fill the blue light chip bowl cup area and the red light chip bowl cup area.
[0011] Furthermore, the number of the blue light chips is 3, and the number of the red light chips is 1; wherein, when the number of the blue light chips is 3, the three blue light chips are respectively a first blue light chip, a second blue light chip and a third blue light chip.
[0012] Furthermore, the wavelength range of the first blue light chip is 440-450 nm, the wavelength range of the second blue light chip is 450-460 nm, the wavelength range of the third blue light chip is 470-480 nm; and the wavelength range of the red light chip is 660-680 nm.
[0013] Furthermore, the multiple positive electrode pads include a first positive electrode pad, a second positive electrode pad, a third positive electrode pad and a fourth positive electrode pad; the multiple negative electrode pads include a first negative electrode pad, a second negative electrode pad, a third negative electrode pad and a fourth negative electrode pad.
[0014] Furthermore, the blue light chip and the red light chip are connected to the multiple positive electrode pads and the multiple negative electrode pads respectively, specifically including: the positive electrode of the first blue light chip is connected to the first positive electrode pad, and the negative electrode of the first blue light chip is connected to the first negative electrode pad; the positive electrode of the second blue light chip is connected to the second positive electrode pad, and the negative electrode of the second blue light chip is connected to the second negative electrode pad; the positive electrode of the third blue light chip is connected to the third positive electrode pad, and the negative electrode of the third blue light chip is connected to the third negative electrode pad; the positive electrode of the red light chip is connected to the fourth positive electrode pad, and the negative electrode of the red light chip is connected to the fourth negative electrode pad.
[0015] Furthermore, the multiple positive electrode pads are respectively provided with corresponding positive electrode pins, and the multiple negative electrode pads are respectively provided with corresponding negative electrode pins.
[0016] Furthermore, the multiple positive electrode pads are respectively provided with corresponding positive electrode pins, and the multiple negative electrode pads are respectively provided with corresponding negative electrode pins, specifically including: the first positive electrode pad is provided with a corresponding first positive electrode pin, the second positive electrode pad is provided with a corresponding second positive electrode pin, the third positive electrode pad is provided with a corresponding third positive electrode pin, and the fourth positive electrode pad is provided with a corresponding fourth positive electrode pin; the first negative electrode pad is provided with a corresponding first negative electrode pin, the second negative electrode pad is provided with a corresponding second negative electrode pin, the third negative electrode pad is provided with a corresponding third negative electrode pin, and the fourth negative electrode pad is provided with a corresponding fourth negative electrode pin.
[0017] Furthermore, the phosphor is composed of red phosphor, yellow phosphor and cyan phosphor; wherein the red phosphor accounts for 10-12%, the yellow phosphor accounts for 81-83%, and the cyan phosphor accounts for 6-7%.
[0018] Furthermore, the peak wavelength of the red phosphor is 652-657 nm, the peak wavelength of the yellow phosphor is 540-545 nm, and the peak wavelength of the cyan phosphor is 492-497 nm.
[0019] Furthermore, the chip-type LED light source provided by the present application further includes: transparent glue, wherein the transparent glue is filled above the phosphor.
[0020] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:
[0021] The SMD LED light source provided in the embodiment of the present application can generate a more continuous and complete spectrum and improve the lighting quality by using a blue chip and a red chip in combination with phosphor on the SMD LED light source. At the same time, the heat dissipation pad is located in the middle of the printed circuit board. This design helps to quickly disperse the heat generated by the chip and avoid heat concentration, thereby improving the thermal stability and service life of the LED light source; and multiple positive pads and multiple negative pads are respectively arranged on both sides of the heat dissipation pad. This layout helps to achieve uniform current distribution and reduce the problem of local overheating caused by current concentration. It also facilitates welding and connection. The blue chip and the red chip are respectively welded on different areas of the heat dissipation pad. This separation layout can reduce mutual interference between chips of different colors and improve light efficiency and color rendering. At the same time, using phosphor to fill the chip bowl area can improve light extraction efficiency and light color quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The accompanying drawings are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention.
[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0024] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.
[0025] Figure 1 A schematic structural diagram of a SMD LED light source provided in an embodiment of the present application;
[0026] Figure 2 A schematic diagram of the solder pad surface structure of a SMD LED light source provided in an embodiment of the present application;
[0027] Figure 3 A schematic diagram of a soldering frame for a SMD LED light source according to an embodiment of the present application;
[0028] Figure 4 A schematic diagram of the combined structure of the soldering frame and the soldering pad surface of the SMD LED light source provided in an embodiment of the present application;
[0029] Figure 5 This is another structural diagram of the SMD LED light source provided in the embodiment of the present application;
[0030] Figure 6 A schematic diagram of the driving state of the SMD LED light source provided in an embodiment of the present application. DETAILED DESCRIPTION
[0031] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0032] The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and configurations of specific examples are described below. Of course, these are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or configurations discussed.
[0033] For ease of description, spatially relative terms may be used herein to describe the relative position or movement of one element or feature relative to another element or feature as shown in the figures, such as "inside," "outside," "inside," "outside," "below," "beneath," "above," "above," "front," "back," and the like. Such spatially relative terms are intended to include different orientations of the device in use or operation other than the orientation depicted in the figures. For example, if the device in the figures undergoes a positional flip or a change in posture or motion state, then these directional indications will also change accordingly. For example, an element described as "below" or "below" another element or feature will subsequently be oriented as "above" or "above" another element or feature. Thus, the example term "below" can include both above and below orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein will be interpreted accordingly.
[0034] Example 1
[0035] See also Figure 1 , Figure 1 This is a schematic diagram of the structure of a patch type LED light source provided by the utility model. Figure 1 As shown, the structure includes multiple positive electrode pads 1, multiple negative electrode pads 2, heat dissipation pads 3, a fixed welding frame 4, a blue light chip 5, a red light chip 6 and phosphor 7, as follows:
[0036] The heat dissipation pad 3 is welded on the middle part of the printed circuit board, and the multiple negative electrode pads 2 and the multiple positive electrode pads 1 are respectively arranged on both sides of the heat dissipation pad 3 .
[0037] The soldering frame 4 is provided with a blue light chip bowl cup area 41 and a red light chip bowl cup area 42, wherein the blue light chip bowl cup area 41 is located directly above the first area of the heat dissipation pad 3, and the red light chip bowl cup area 42 is located directly above the second area of the heat dissipation pad 3.
[0038] The blue light chip 5 is welded on the first area of the heat dissipation pad 3, and the red light chip 6 is welded on the second area of the heat dissipation pad 3. The blue light chip 5 and the red light chip 6 are respectively connected to the multi-channel positive electrode pad 1 and the multi-channel negative electrode pad 2.
[0039] The phosphor 7 is used to fill the blue chip bowl cup area 41 and the red chip bowl cup area 42 .
[0040] like Figure 2 As shown, Figure 2 It is a schematic diagram of the pad surface structure of a SMD LED light source.
[0041] In one embodiment, the heat dissipation pad 3 is a square structure, and the heat dissipation pad 3 is arranged in the middle of the printed circuit board. The length and width of the heat dissipation pad 3 are both smaller than the length and width of the printed circuit board PCB.
[0042] In one embodiment, the plurality of positive electrode pads 1 include a first positive electrode pad 11 , a second positive electrode pad 12 , a third positive electrode pad 13 and a fourth positive electrode pad 14 ; wherein each positive electrode pad is a square structure.
[0043] Specifically, the multiple positive electrode pads 1 are welded to the first side end of the printed circuit board, and in the first side end, the first positive electrode pad 11, the second positive electrode pad 12, the third positive electrode pad 13 and the fourth positive electrode pad 14 are arranged in sequence from left to right at a preset distance, and the multiple positive electrode pads 1 are located on the first length side of the heat dissipation pad 3; the multiple positive electrode pads 1 and the heat dissipation pad 3 are separated by a first distance.
[0044] In one embodiment, the multiple negative electrode pads 2 include a first negative electrode pad 21 , a second negative electrode pad 22 , a third negative electrode pad 23 and a fourth negative electrode pad 24 ; wherein each negative electrode pad is a square structure.
[0045] Specifically, the multiple negative electrode pads 2 are welded to the second side end of the printed circuit board, and in the second side end, the first negative electrode pad 21, the second negative electrode pad 22, the third negative electrode pad 23 and the fourth negative electrode pad 24 are arranged in sequence from left to right at a preset distance, and the multiple negative electrode pads 2 are located on the second length side of the heat dissipation pad 3; the multiple negative electrode pads 2 and the heat dissipation pad 3 are separated by a first distance.
[0046] Preferably, the first side end and the second side end of the printed circuit board are corresponding side ends.
[0047] By optimizing the position of the heat dissipation pad and placing it in the center of the PCB, heat is evenly dispersed from the geometric center, improving the heat dissipation efficiency of the entire PCB. Multiple positive pads 1 and multiple negative pads 2 are soldered to the first and second side ends of the PCB, respectively, and maintain a certain distance from the heat dissipation pad 3. This layout helps reduce thermal interference between the pads and lower thermal resistance. Furthermore, each positive and negative pad is a square structure and is arranged in sequence at a preset distance. This regular layout simplifies the soldering process and also facilitates subsequent maintenance and inspection.
[0048] In one embodiment, the plurality of positive electrode pads 1 are respectively provided with corresponding positive electrode pins, and the plurality of negative electrode pads 2 are respectively provided with corresponding negative electrode pins.
[0049] Specifically, the first positive electrode pad 11 is provided with a corresponding first positive electrode pin 111, the second positive electrode pad 12 is provided with a corresponding second positive electrode pin 121, the third positive electrode pad 13 is provided with a corresponding third positive electrode pin 131, and the fourth positive electrode pad 14 is provided with a corresponding fourth positive electrode pin 141.
[0050] Specifically, the first negative electrode pad 21 is provided with a corresponding first negative electrode pin 211, the second negative electrode pad 22 is provided with a corresponding second negative electrode pin 221, the third negative electrode pad 23 is provided with a corresponding third negative electrode pin 231, and the fourth negative electrode pad 24 is provided with a corresponding fourth negative electrode pin 241.
[0051] In one embodiment, the fixing welding frame 4 is a square structure, and the size of the fixing welding frame 4 is the same as that of the printed circuit board.
[0052] like Figure 3 As shown, Figure 3 It is a schematic diagram of the soldering frame of the SMD LED light source.
[0053] In one embodiment, the size of the blue light chip bowl cup area 41 in the fixed welding frame 4 is larger than the size of the red light chip bowl cup area 42; and the blue light chip bowl cup area 41 in the fixed welding frame 4 is located on the left side of the red light chip bowl cup area 42; preferably, the blue light chip bowl cup area 41 in the fixed welding frame 4 can also be set on the right side of the red light chip bowl cup area 42 based on user needs.
[0054] Specifically, the blue chip bowl cup area 41 and the red chip bowl cup area 42 are separated by a spacing beam in the solid welding frame 4 .
[0055] In one embodiment, the blue light chip bowl cup area 41 and the red light chip bowl cup area 42 are transparent areas, and the blue light chip bowl cup area 41 is located directly above the first area of the heat dissipation pad 3, and the red light chip bowl cup area 42 is located directly above the second area of the heat dissipation pad 3. Based on this transparent feature, part of the structure of the pad surface of the SMD LED light source can be directly observed based on the blue light chip bowl cup area 41 and the red light chip bowl cup area 42.
[0056] like Figure 4 As shown, Figure 4It is a schematic diagram of the combined structure of the fixed welding frame and the pad surface of the SMD LED light source; based on the blue light chip bowl cup area 41, the first area of the heat dissipation pad 3, as well as the first positive electrode pad 11, the second positive electrode pad 12, and the third positive electrode pad 13 located on the first length side of the heat dissipation pad 3, and the first negative electrode pad 21, the second negative electrode pad 22, and the third negative electrode pad 23 located on the second length side of the heat dissipation pad 3 can be observed; based on the red light chip bowl cup area 42, the second area of the heat dissipation pad 3, as well as the fourth positive electrode pad 14 located on the first length side of the heat dissipation pad 3, and the fourth negative electrode pad 24 located on the second length side of the heat dissipation pad 3 can be observed.
[0057] In one embodiment, the number of the blue light chips 5 is 3, and the number of the red light chip 6 is 1.
[0058] In one embodiment, when the number of the blue light chips 5 is three, the three blue light chips are a first blue light chip 51 , a second blue light chip 52 and a third blue light chip 53 .
[0059] Specifically, the wavelength range of the first blue light chip 51 is 440-450 nm, the wavelength range of the second blue light chip 52 is 450-460 nm, and the wavelength range of the third blue light chip 53 is 470-480 nm;
[0060] Specifically, the wavelength range of the red light chip 6 is 660-680 nm.
[0061] In one embodiment, in order to realize the driving of the blue light chip and the red light chip, when the blue light chip and the red light chip are connected to the multiple positive electrode pads and the multiple negative electrode pads respectively, the positive electrode of the first blue light chip 51 is connected to the first positive electrode pad 11, and the negative electrode of the first blue light chip 51 is connected to the first negative electrode pad 21; the positive electrode of the second blue light chip 52 is connected to the second positive electrode pad 12, and the negative electrode of the second blue light chip 52 is connected to the second negative electrode pad 22; the positive electrode of the third blue light chip 53 is connected to the third positive electrode pad 13, and the negative electrode of the third blue light chip 53 is connected to the third negative electrode pad 23; the positive electrode of the red light chip 6 is connected to the fourth positive electrode pad 14, and the negative electrode of the red light chip 6 is connected to the fourth negative electrode pad 24.
[0062] like Figure 5 As shown, Figure 5 This is another structural diagram of a SMD LED light source.
[0063] In one embodiment, the first blue light chip 51 , the second blue light chip 52 and the third blue light chip 53 are located directly below the blue light chip bowl-cup area 41 , and the red light chip 6 is located directly below the red light chip bowl-cup area 42 .
[0064] In one embodiment, since each positive electrode pad and each negative electrode pad are provided with corresponding pins, and each blue light chip and red light chip are respectively connected to the corresponding positive electrode pad and negative electrode pad; based on this, when the first positive electrode pin 111 and the first negative electrode pin 211 are turned on, the first blue light chip is controlled to be driven based on the first positive electrode pad 11 and the first negative electrode pad 21; when the second positive electrode pin 121 and the second negative electrode pin 221 are turned on, the second blue light chip 52 is controlled to be driven based on the second positive electrode pad 12 and the second negative electrode pad 22; when the third positive electrode pin 131 and the third negative electrode pin 231 are turned on, the third blue light chip 53 is controlled to be driven based on the third positive electrode pad 13 and the third negative electrode pad 23; when the third positive electrode pin 141 and the third negative electrode pin 241 are turned on, the red light chip 6 is controlled to be driven based on the fourth positive electrode pad 14 and the fourth negative electrode pad 24.
[0065] In one embodiment, the phosphor 7 is composed of a red phosphor 71 , a yellow phosphor 72 and a cyan phosphor 73 .
[0066] Specifically, the proportion of the red phosphor is 10-12%, the proportion of the yellow phosphor is 81-83%, and the proportion of the cyan phosphor is 6-7%.
[0067] Specifically, the peak wavelength of the red phosphor is 652-657 nm, the peak wavelength of the yellow phosphor is 540-545 nm, and the peak wavelength of the cyan phosphor is 492-497 nm.
[0068] Specifically, the phosphor powder 7 is used to fill the blue chip bowl cup area 41 ; the phosphor powder 7 is used to fill the red chip bowl cup area 42 .
[0069] like Figure 6 As shown, Figure 6 It is a schematic diagram of the driving state of the SMD LED light source; by covering the blue light chip bowl cup area 41 and the red light chip bowl cup area 42 with phosphor 7, the blue light chip 5 corresponding to the blue light chip bowl cup area 41 will show yellow light after being lit, and the red light chip 6 corresponding to the red light chip bowl cup area 42 will show red light after being lit.
[0070] In one embodiment, the SMD LED light source provided in this embodiment further includes: transparent glue, wherein the transparent glue is filled above the phosphor.
[0071] In one embodiment, a blue light chip 5 and a red light chip 6 of specific wavelengths are provided in the SMD LED light source; and phosphors 7 of specific matching ratios are provided on the blue light chip 5 and the red light chip 6; therefore, when the first positive pin 111 and the first negative pin 211 are turned on at the same time, and the third positive pin 131 and the third negative pin 231 are turned on at the same time, the first blue light chip 51 and the third blue light chip 53 are triggered to illuminate at the same time. At this time, combined with the phosphor 7, an inhibitory spectrum can be emitted, making people more excited and increasing the human body's alertness.
[0072] Specifically, if only the second positive pin 121 and the second negative pin 221 are turned on, the second blue light chip 52 is triggered to light up. At this time, the second blue light chip 52 is triggered to light up, and combined with the phosphor 7, it will emit a release spectrum, which helps sleep and increases the relaxation of the human body.
[0073] Specifically, if the first positive pin 111 and the first negative pin 211, the second positive pin 121 and the second negative pin 221, and the third positive pin 131 and the third negative pin 231 are turned on at the same time, at this time, since the first blue light chip 51, the second blue light chip 52 and the third blue light chip 53 are triggered to light up at the same time, combined with the phosphor 7, it can provide a low-brightness full spectrum while having a rhythmic spectrum effect, different spectral rhythmic effects can be achieved through current, and high spectral continuity can be achieved.
[0074] Specifically, if the first positive pin 111 and the first negative pin 211, the second positive pin 121 and the second negative pin 221, the third positive pin 131 and the third negative pin 231 are turned on at the same time, and the fourth positive pin 141 and the fourth negative pin 241 are turned on at the same time, at this time, since the first blue light chip 51, the second blue light chip 52, the third blue light chip 53 and the red light chip 6 are triggered to illuminate at the same time, combined with the phosphor 7, it can provide a low-brightness full spectrum while having a rhythmic spectrum effect. Different spectral rhythmic effects can be achieved through current, and high spectral continuity can be achieved to further gain the red light spectrum, increase the display index, and improve the spectral continuity.
[0075] In summary, this embodiment provides a chip-type LED light source based on the use of blue light chips with wavelengths in the range of 440-450nm, 450-460nm and 470-480nm, and red light chips with a wavelength range of 660-680nm, combined with a specific matching ratio of phosphors, and the structure of the chip-type LED light source. It can reduce the hazards of blue light, protect human eye health, provide full-spectrum lighting, improve color rendering and color reproduction, and combine rhythmic lighting technology to adapt to the human physiological rhythm and improve the comfort and health of lighting; at the same time, the optimized structural design improves heat dissipation performance and service life.
[0076] It should be understood that the terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "comprise", "include", "contain" and "have" are inclusive and therefore specify the presence of stated features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the specific order described or illustrated, unless the order of execution is clearly indicated. It should also be understood that additional or alternative steps may be used.
[0077] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.
[0078] The foregoing description is intended only to provide specific embodiments of the present invention, intended to enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not intended to be limited to the embodiments shown herein, but rather to be construed in the broadest manner consistent with the principles and novel features claimed herein.
Claims
1. A SMD LED light source, characterized in that: include: Multiple positive electrode pads, multiple negative electrode pads, heat dissipation pads, soldering frame, blue light chip, red light chip and phosphor; The heat dissipation pad is welded on the middle part of the printed circuit board, and the multiple negative electrode pads and the multiple positive electrode pads are respectively arranged on both sides of the heat dissipation pad; The soldering frame is provided with a blue chip bowl cup area and a red chip bowl cup area, wherein the blue chip bowl cup area is located directly above the first area of the heat dissipation pad, and the red chip bowl cup area is located directly above the second area of the heat dissipation pad; The blue chip is soldered on the first area of the heat dissipation pad, and the red chip is soldered on the second area of the heat dissipation pad. The blue chip and the red chip are connected to the multi-channel positive electrode pad and the multi-channel negative electrode pad respectively. The phosphor is used to fill the blue light chip bowl cup area and the red light chip bowl cup area.
2. The SMD LED light source according to claim 1, characterized in that: The number of the blue light chips is 3, and the number of the red light chip is 1; When the number of the blue light chips is 3, the three blue light chips are respectively a first blue light chip, a second blue light chip and a third blue light chip.
3. The SMD LED light source according to claim 2, characterized in that: The wavelength range of the first blue light chip is 440-450nm, the wavelength range of the second blue light chip is 450-460nm, and the wavelength range of the third blue light chip is 470-480nm; The wavelength range of the red light chip is 660-680nm.
4. The SMD LED light source according to claim 2, characterized in that: The multiple positive electrode pads include a first positive electrode pad, a second positive electrode pad, a third positive electrode pad and a fourth positive electrode pad; The multiple negative electrode pads include a first negative electrode pad, a second negative electrode pad, a third negative electrode pad and a fourth negative electrode pad.
5. The SMD LED light source according to claim 4, characterized in that: The blue light chip and the red light chip are connected to the multiple positive electrode pads and the multiple negative electrode pads respectively, specifically comprising: The positive electrode of the first blue light chip is connected to the first positive electrode pad, and the negative electrode of the first blue light chip is connected to the first negative electrode pad; The positive electrode of the second blue light chip is connected to the second positive electrode pad, and the negative electrode of the second blue light chip is connected to the second negative electrode pad; The positive electrode of the third blue light chip is connected to the third positive electrode pad, and the negative electrode of the third blue light chip is connected to the third negative electrode pad; The positive electrode of the red light chip is connected to the fourth positive electrode pad, and the negative electrode of the red light chip is connected to the fourth negative electrode pad.
6. The SMD LED light source according to claim 5, characterized in that: The multiple positive electrode pads are respectively provided with corresponding positive electrode pins, and the multiple negative electrode pads are respectively provided with corresponding negative electrode pins.
7. The SMD LED light source according to claim 6, characterized in that: The multiple positive electrode pads are respectively provided with corresponding positive electrode pins, and the multiple negative electrode pads are respectively provided with corresponding negative electrode pins, specifically including: The first positive electrode pad is provided with a corresponding first positive electrode pin, the second positive electrode pad is provided with a corresponding second positive electrode pin, the third positive electrode pad is provided with a corresponding third positive electrode pin, and the fourth positive electrode pad is provided with a corresponding fourth positive electrode pin; The first negative electrode pad is provided with a corresponding first negative electrode pin, the second negative electrode pad is provided with a corresponding second negative electrode pin, the third negative electrode pad is provided with a corresponding third negative electrode pin, and the fourth negative electrode pad is provided with a corresponding fourth negative electrode pin.
8. The SMD LED light source according to claim 1, characterized in that: The phosphor powder is composed of red phosphor, yellow phosphor and blue-green phosphor; The red phosphor has a proportion of 10-12%, the yellow phosphor has a proportion of 81-83%, and the cyan phosphor has a proportion of 6-7%.
9. The SMD LED light source according to claim 8, characterized in that: The peak wavelength of the red phosphor is 652-657 nm, the peak wavelength of the yellow phosphor is 540-545 nm, and the peak wavelength of the cyan phosphor is 492-497 nm.
10. The SMD LED light source according to claim 1, characterized in that: Also includes: Transparent glue, wherein the transparent glue is filled above the phosphor.