Semiconductor storage device

Abstract

The utility model relates to the technical field of semiconductors, in particular to a semiconductor storage device which comprises a box cover connected to a storage box, a sealing heat dissipation mechanism enabling the storage box to be tightly attached to the box cover is arranged on the box cover, and a storage mechanism for storing semiconductor devices is arranged in the storage box. By arranging the storage mechanism, the semiconductor devices can be conveniently and quickly taken in the process of storing the semiconductor devices, so that the storage efficiency of the semiconductor devices is improved, the device can protect the semiconductor devices, the semiconductor devices are prevented from being damaged in the storage process, and the storage efficiency of the semiconductor devices is improved. By arranging the sealing heat dissipation mechanism, in the process of storing the semiconductor device, the box cover and the storage box can be tightly attached together, the situation that dust permeates into the storage box due to gaps is avoided, heat in the storage box can be discharged, the heat dissipation function is achieved, and the semiconductor device is further protected.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a semiconductor storage device. Background Art

[0002] Semiconductors are materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors have a wide range of applications. After semiconductor production, they need to be stored, which necessitates the use of storage devices.

[0003] Conventional semiconductor storage devices store semiconductor chips in a storage structure. However, when removing a semiconductor device, the bottom of the semiconductor device and the bottom of the storage groove are at the same level, and the two are attached to each other, making it difficult to remove the semiconductor device, thereby reducing its storage efficiency. In view of this, we provide a semiconductor storage device. Utility Model Content

[0004] In response to the shortcomings of the existing technology, the present invention provides a semiconductor storage device that solves the technical problem in the existing technology that it is difficult to quickly take out semiconductor devices, and achieves the goal of enabling semiconductor devices to be taken out and facilitating the storage of semiconductor devices, thereby improving the storage efficiency of semiconductor devices.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a semiconductor storage device, comprising a box cover connected to a storage box, the box cover is provided with a sealing heat dissipation mechanism that makes the storage box and the box cover tightly attached, and a storage mechanism for storing semiconductor devices is provided inside the storage box.

[0006] The storage mechanism includes a storage seat movably installed inside the storage box, and a plurality of placement slots and connecting slots are provided on the storage seat. A pressure plate is rotatably connected inside the connecting slot, and a connecting spring connected to the bottom end of the pressure plate is connected inside the connecting slot. A lifting plate is installed at the other end of the pressure plate, and a support pad is installed on the lifting plate.

[0007] Preferably, the sealed heat dissipation mechanism includes two groups of card slots opened on the top of the storage box, a card rod adapted to the card slots is installed on the box cover, a plurality of groups of extrusion springs are connected to the inside of the card rod, a sealing strip adapted to the card slots is connected to the extrusion spring, a sealing ring is installed on the inside of the box cover, a steel wire mesh is installed on the box cover, and a heat dissipation component for eliminating the heat inside the storage box is provided on the box cover.

[0008] Preferably, the heat dissipation assembly includes a mounting frame mounted on the box cover, a fan is mounted inside the mounting frame, the output end of the fan is connected to a mounting rod, a plurality of groups of fan blades and scrapers are mounted on the mounting rod, a dust baffle abutting the scraper is movably mounted on the mounting frame, and a plurality of groups of bolts are connected to the dust baffle.

[0009] Preferably, the top of the support pad and the bottom of the placement groove are in the same horizontal plane, and the material of the support pad is rubber.

[0010] Preferably, the side of the sealing strip is arc-shaped, and the outer edge of the sealing ring abuts against the inner edge of the storage box.

[0011] Preferably, the mounting rod passes through the dust shield plate and is connected to the scraper plate, and the dust shield plate is fixed to the mounting frame by bolts.

[0012] By means of the above technical solution, the present invention provides a semiconductor storage device having at least the following beneficial effects:

[0013] 1. The utility model provides a storage mechanism, which enables quick and easy access to semiconductor devices during storage, thereby improving the storage efficiency of semiconductor devices. The device can also protect semiconductor devices to prevent them from being damaged during storage.

[0014] 2. The utility model provides a sealed heat dissipation mechanism, which can tightly fit the box cover and the storage box together during the storage of semiconductor devices, avoiding gaps that allow dust to penetrate into the storage box, and can also discharge the heat inside the storage box, thereby achieving a heat dissipation function, further protecting the semiconductor devices, and improving the storage effect of semiconductor devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings described herein are used to provide further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0016] In the attached figure:

[0017] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a rear view structural diagram of the utility model;

[0019] Figure 3 This is a schematic diagram of the storage mechanism structure of the utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the sealing heat dissipation mechanism of the utility model;

[0021] Figure 5 This is a schematic diagram of the disassembled structure of the heat dissipation component of the utility model;

[0022] Figure 6 For this utility model Figure 4 Enlarged structural diagram at point A in the middle.

[0023] In the figure: 1. Storage box; 2. Box cover; 3. Sealed heat dissipation mechanism; 301. Heat dissipation component; 31. Card slot; 32. Card rod; 33. Extrusion spring; 34. Sealing strip; 35. Sealing ring; 36. Wire mesh; 37. Mounting frame; 38. Fan; 39. Mounting rod; 310. Fan blade; 311. Scraper; 312. Dust shield; 313. Bolt; 4. Storage mechanism; 41. Storage seat; 42. Placement slot; 43. Connecting slot; 44. Press plate; 45. Connecting spring; 46. Lifting plate; 47. Support pad. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] Example 1

[0026] In the prior art, it is difficult to quickly take out the semiconductor device. This embodiment provides a semiconductor storage device. Figures 1-6 , enabling semiconductor devices to be taken out and stored conveniently, thereby improving storage efficiency. The semiconductor storage device comprises a lid 2 connected to a storage box 1. The lid 2 is provided with a sealing and heat dissipation mechanism 3 that tightly fits the storage box 1 and the lid 2. The storage box 1 is internally provided with a storage mechanism 4 for storing semiconductor devices. The sealing and heat dissipation mechanism 3 not only tightly fits the storage box 1 and the lid 2, protecting the semiconductor devices from dust, but also dissipates heat around the semiconductor devices, thereby dissipating heat. The storage mechanism 4 can store different types of semiconductor devices and allows for quick access to semiconductor devices, improving storage efficiency.

[0027] In the process of storing semiconductor devices, in order to be able to quickly and conveniently take out semiconductor devices and improve the storage effect of semiconductor devices, the storage mechanism 4 includes a storage seat 41 movably installed inside the storage box 1, and a plurality of groups of placement grooves 42 and connecting grooves 43 are provided on the storage seat 41. A pressure plate 44 is rotatably connected inside the connecting groove 43, and a connecting spring 45 connected to the bottom end of the pressure plate 44 is connected inside the connecting groove 43. A lifting plate 46 is installed at the other end of the pressure plate 44, and a support pad 47 is installed on the lifting plate 46. The top of the support pad 47 is in the same horizontal plane as the bottom end of the placement groove 42, so that the semiconductor device can stably contact the support pad 47, thereby improving the storage stability of the semiconductor device. The material of the support pad 47 is rubber, which plays a protective role for the semiconductor device and also increases the friction with the semiconductor device, thereby improving the storage stability of the semiconductor device. When it is necessary to take the semiconductor device placed inside the placement groove 42, by pressing the pressure plate 44 downward, the connection end of the pressure plate 44 is rotated, and the connection spring 45 and the lifting plate 46 abutting against the bottom of the semiconductor device cooperate with each other, so that a gap appears between the semiconductor device and the bottom of the placement groove 42, thereby facilitating the quick removal of the semiconductor device and improving the storage efficiency of the semiconductor device.

[0028] Example 2

[0029] Based on the first embodiment, Figures 1-6 As shown, based on the problem that it is not easy to quickly take out semiconductor devices in the existing technology, during the storage of semiconductor devices, due to the different changes in the temperature environment, when the storage environment temperature is high, if the heat around the semiconductor devices cannot be eliminated in time, it is easy to affect the production quality of the semiconductor devices. Therefore, the device is also provided with a structure to eliminate the heat around the semiconductor devices.

[0030] During the storage of semiconductor devices, it is necessary to seal the box cover 2 and the storage box 1 to prevent dust from penetrating into the interior of the storage box 1 when the semiconductor devices are stored, thereby protecting the semiconductor devices. The sealing and heat dissipation mechanism 3 includes two groups of card slots 31 opened at the top of the storage box 1, and a card rod 32 adapted to the card slot 31 is installed on the box cover 2. Several groups of extrusion springs 33 are connected to the inside of the card rod 32, and a sealing strip 34 adapted to the card slot 31 is connected to the extrusion spring 33. The side shape of the sealing strip 34 is arc-shaped, which is convenient for inserting the sealing strip 34 into the inner side of the card slot 31 to improve the sealing effect of the box cover 2. A sealing ring 35 is installed on the inside of the box cover 2, and the outer edge of the sealing ring 35 abuts against the inner edge of the storage box 1, which can improve the sealing between the box cover 2 and the storage box 1 and improve the protection performance of the device. A steel wire mesh 36 is installed on the box cover 2, and a heat dissipation component 301 for eliminating the internal heat of the storage box 1 is provided on the box cover 2. With the connection of the hinge, the box cover 2 can be rotated, and the sealing ring 35 plays a preliminary sealing role. In the process of the card rod 32 being inserted into the card slot 31, with the connection of the extrusion spring 33, the sealing strip 34 is inserted into the inner side of the card slot 31, so that the box cover 2 fits tightly with the storage box 1, thereby playing a protective role for the semiconductor devices inside the storage box 1.

[0031] During the storage of semiconductor devices, it is necessary to eliminate the heat around the semiconductor devices to prevent the semiconductor devices from being damaged by excessively high temperatures. The heat dissipation component 301 includes a mounting frame 37 mounted on the box cover 2, and a fan 38 is installed inside the mounting frame 37. The output end of the fan 38 is connected to a mounting rod 39, and the mounting rod 39 passes through the dust baffle 312 and is connected to the scraper 311, so that the rotation of the scraper 311 can remove dust on the dust baffle 312, thereby improving the heat dissipation effect of the device. The mounting rod 39 is installed with several groups of fan blades 310 and scrapers 311, and a dust baffle 312 that is in contact with the scraper 311 is movably installed on the mounting frame 37. The dust baffle 312 is fixed to the mounting frame 37 by bolts 313, which reinforces the dust baffle 312 and improves the stability of dust blocking. Several groups of bolts 313 are connected to the dust baffle 312. The operation of the fan 38 can drive the mounting rod 39 to rotate, and then drive the fan blades 310 and the scraper 311 to rotate. The rotation of the fan blades 310 can discharge the heat inside the storage box 1, thereby playing a role in heat dissipation, and the dust baffle 312 is fixed to the mounting frame 37 by the bolts 313, which plays a role in fixing it. The rotation of the scraper 311 can scrape off the dust on the dust baffle 312, thereby improving the heat dissipation effect on the semiconductor device.

[0032] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements that are inherent to such process, method, article or apparatus.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor storage device comprising a box cover (2) connected to a storage box (1), characterized in that: The box cover (2) is provided with a sealing heat dissipation mechanism (3) for making the storage box (1) and the box cover (2) tightly adhere to each other, and a storage mechanism (4) for storing semiconductor devices is provided inside the storage box (1); The storage mechanism (4) comprises a storage seat (41) movably mounted inside the storage box (1); the storage seat (41) is provided with a plurality of placement slots (42) and connection slots (43); a pressure plate (44) is rotatably connected inside the connection slot (43); a connection spring (45) connected to the bottom end of the pressure plate (44) is connected inside the connection slot (43); a lifting plate (46) is mounted on the other end of the pressure plate (44); and a support pad (47) is mounted on the lifting plate (46).

2. The semiconductor storage device according to claim 1, wherein: The sealing heat dissipation mechanism (3) comprises two groups of card slots (31) opened on the top of the storage box (1); a card rod (32) adapted to the card slots (31) is installed on the box cover (2); a plurality of groups of extrusion springs (33) are connected inside the card rod (32); a sealing strip (34) adapted to the card slots (31) is connected to the extrusion spring (33); a sealing ring (35) is installed inside the box cover (2); a steel wire mesh (36) is installed on the box cover (2); and a heat dissipation component (301) for eliminating heat inside the storage box (1) is provided on the box cover (2).

3. The semiconductor storage device according to claim 2, wherein: The heat dissipation assembly (301) comprises a mounting frame (37) mounted on the box cover (2), a fan (38) being mounted inside the mounting frame (37), an output end of the fan (38) being connected to a mounting rod (39), a plurality of groups of fan blades (310) and scrapers (311) being mounted on the mounting rod (39), a dust shield (312) being movably mounted on the mounting frame (37) and abutting against the scrapers (311), and a plurality of groups of bolts (313) being connected to the dust shield (312).

4. The semiconductor storage device according to claim 1, wherein: The top of the support pad (47) and the bottom of the placement groove (42) are in the same horizontal plane, and the material of the support pad (47) is rubber.

5. The semiconductor storage device according to claim 2, wherein: The side of the sealing strip (34) is in an arc shape, and the outer edge of the sealing ring (35) abuts against the inner edge of the storage box (1).

6. The semiconductor storage device according to claim 3, wherein: The mounting rod (39) passes through the dust shield (312) and is connected to the scraper (311); the dust shield (312) is fixed to the mounting frame (37) via bolts (313).

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