Vacuum furnace door for semiconductor process equipment

Abstract

The utility model belongs to the technical field of semiconductor process, and particularly relates to a vacuum furnace door for semiconductor process equipment, which comprises a furnace door body, the furnace door body is connected with a quartz tube through a vacuum flange, one side of the furnace door body far away from the quartz tube is connected with one end of a corrugated pipe, and the other end of the corrugated pipe is connected with a fixing plate. A fixing plate is arranged on the furnace door body, a pressing screw rod is installed on the fixing plate, and the fixing plate moves towards the direction close to the furnace door to enable the pressing screw rod to abut against the furnace door body. The corrugated pipe is arranged, and the fixing plate moves towards the direction close to the quartz tube, so that the furnace door body is driven to make contact with a vacuum flange on the quartz tube; and the furnace door body continuously and slowly moves towards the quartz tube, the corrugated pipe is compressed until the pressing screw presses the furnace door body, and the corrugated pipe also applies pressure towards the quartz tube to the furnace door body at the moment, so that the sealing performance between the quartz tube and the furnace door body is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor process technology, in particular to a vacuum furnace door used for semiconductor process equipment. Background Art

[0002] Low-pressure chemical vapor deposition systems are used for chemical vapor deposition processes of wafers of different sizes, such as integrated circuits, discrete devices, and MEMS.

[0003] During the chemical vapor deposition (CVD) process on wafers, process gases must be introduced under vacuum to initiate a reaction. The vacuum level is a critical characteristic of low-pressure CVD equipment. Previous vacuum furnace doors were typically driven by a push-pull drive system for the feed material, then moved to the vacuum flange and closed. If the vacuum furnace door and flange do not fit properly, leakage can occur during evacuation or when process gases are introduced, severely impacting equipment operation and product production. Furthermore, the process gases used in CVD processes are often flammable, explosive, or toxic, posing a safety hazard. Utility Model Content

[0004] In order to overcome the above-mentioned defects in the prior art, the utility model provides a vacuum furnace door for semiconductor process equipment.

[0005] A vacuum furnace door for semiconductor process equipment includes a furnace door body, which is connected to a quartz tube via a vacuum flange. The side of the furnace door body away from the quartz tube is connected to one end of a bellows, and the other end of the bellows is connected to a fixed plate. A clamping screw is installed on the fixed plate. The fixing plate moves toward the furnace door so that the clamping screw comes into contact with the furnace door body.

[0006] Furthermore, a guide sleeve is provided on the fixing plate, and the guide sleeve is slidably connected to the guide rod. One end of the guide rod is fixedly connected to the furnace door body, and the other end is provided with a limiting ring.

[0007] Furthermore, a sealing gasket is provided at the connection between the furnace door body and the vacuum flange.

[0008] Furthermore, the side of the fixing plate away from the quartz tube is connected to one end of the support column, the other end of the support column is connected to the slide seat, and the slide seat is connected to the transmission mechanism.

[0009] Due to the adoption of the above technical solution, the beneficial technical effect of the utility model is as follows: a bellows is provided in the utility model, and the fixed plate moves in the direction close to the quartz tube, thereby driving the furnace door body to contact the vacuum flange on the quartz tube, and the furnace door body continues to move slowly toward the quartz tube, and the bellows is compressed until the tightening screw presses the furnace door body. At this time, the bellows also applies pressure to the furnace door body in the direction of the quartz tube, further improving the sealing between the quartz tube and the furnace door body. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a front view of a vacuum furnace door for semiconductor process equipment according to the present invention;

[0011] Figure 2 The utility model is a top view of a vacuum furnace door for semiconductor process equipment.

[0012] In the figure, 1, furnace door body, 2, vacuum flange, 3, quartz tube, 4, bellows, 5, fixing plate, 6, pressing screw, 7, guide sleeve, 8, guide rod, 9, sealing gasket, 10, support column, 11, slide seat, 12, transmission mechanism, 13, limit ring. DETAILED DESCRIPTION

[0013] In order to more clearly illustrate the technical solution of the present invention, the present invention is further described below in conjunction with the accompanying drawings. Obviously, the drawings described below are only one embodiment of the present invention. For ordinary technicians in this field, without paying any creative work, other embodiments can be obtained based on these drawings and embodiments, which all fall within the scope of protection of the present invention.

[0014] according to Figure 1-2 As shown, a vacuum furnace door for semiconductor process equipment includes a furnace door body 1, which is connected to a quartz tube 3 through a vacuum flange 2. The side of the furnace door body 1 away from the quartz tube 3 is connected to one end of a bellows 4, and the other end of the bellows 4 is connected to a fixed plate 5. A clamping screw 6 is installed on the fixed plate 5. The fixing plate 5 moves toward the furnace door so that the clamping screw 6 contacts the furnace door body 1.

[0015] In the above-mentioned specific technical solution, in order to solve the problem in the prior art that the sealing between the quartz tube 3 and the furnace door is poor, and when gas is introduced into the quartz tube 3, air leakage occurs between the quartz tube 3 and the furnace door, a bellows 4 is provided, and the fixed plate 5 moves toward the direction close to the quartz tube 3, thereby driving the furnace door body 1 to contact the vacuum flange 2 on the quartz tube 3, and the furnace door body 1 continues to move slowly toward the quartz tube 3, and the bellows 4 is compressed until the tightening screw 6 presses the furnace door body 1. At this time, the bellows 4 also applies pressure to the furnace door body 1 in the direction of the quartz tube 3, further improving the sealing between the quartz tube 3 and the furnace door body 1. Preferably, two bellows 4 are symmetrically arranged on the left and right.

[0016] The fixing plate 5 is provided with a guide sleeve 7 , which is slidably connected to a guide rod 8 . One end of the guide rod 8 is fixedly connected to the furnace door body 1 , and the other end is provided with a limiting ring 13 .

[0017] A sealing gasket 9 is provided at the connection between the furnace door body 1 and the vacuum flange 2 , thereby increasing the sealing performance of the connection between the quartz tube 3 and the furnace door body 1 .

[0018] The side of the fixed plate 5 away from the quartz tube 3 is connected to one end of the support column 10, and the other end of the support column 10 is connected to the slide 11. The slide 11 is connected to the transmission mechanism 12. The transmission mechanism 12 drives the slide 11 to move closer to or away from the quartz tube 3, thereby achieving the sealing or opening of the quartz tube 3.

[0019] The above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the present invention. The scope of protection of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the essence and scope of protection of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the scope of protection of the present invention.

Claims

1. A vacuum furnace door for semiconductor process equipment, comprising a furnace door body (1), characterized in that: The furnace door body (1) is connected to the quartz tube (3) via a vacuum flange (2); the side of the furnace door body (1) away from the quartz tube (3) is connected to one end of the bellows (4); the other end of the bellows (4) is connected to a fixed plate (5); a pressing screw (6) is installed on the fixed plate (5); the fixing plate (5) moves toward the furnace door so that the pressing screw (6) contacts the furnace door body (1).

2. A vacuum furnace door for semiconductor process equipment according to claim 1, characterized in that: A guide sleeve (7) is provided on the fixed plate (5), and the guide sleeve (7) is slidably connected to a guide rod (8). One end of the guide rod (8) is fixedly connected to the furnace door body (1), and the other end is provided with a limiting ring (13).

3. A vacuum furnace door for semiconductor process equipment according to claim 2, characterized in that: A sealing gasket (9) is provided at the connection between the furnace door body (1) and the vacuum flange (2).

4. The vacuum furnace door for semiconductor process equipment according to claim 3, characterized in that: The side of the fixing plate (5) away from the quartz tube (3) is connected to one end of the support column (10), the other end of the support column (10) is connected to the slide seat (11), and the slide seat (11) is connected to the transmission mechanism (12).

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