Multi-combination laminated patch common-mode inductor

Abstract

The utility model discloses a multi-combination laminated patch common mode inductor, which comprises a connecting electrode, a circuit component, a heat conducting plate and a mounting rack, an isolating material is arranged on one side of the connecting electrode, the circuit component is used for circulation of a circuit, the heat conducting plate is used for conducting heat of the circuit component, and the mounting rack is used for mounting the connecting electrode. And the mounting rack is used for separating the circuit assembly from the heat conducting plate. By utilizing the design of the circuit assembly, the heat conducting plate and the mounting frame, and through the design and installation of the partition plate and the fixing column, the plurality of connecting circuit boards are respectively arranged at the top end and the bottom end of the partition plate, then the heat conducting plate is inserted into the placing groove, and the connecting circuit boards are separated from the heat conducting plate, so that the connecting circuit boards are connected with the mounting frame along with the operation of the connecting circuit boards. The generated heat can be conducted to the heat conducting plate through the circulating groove and conducted to the outside of the isolation material through the heat conducting plate, heat dissipation in the isolation material is conducted, and the temperature in the inductor is reduced.

Description

Technical Field

[0001] The utility model relates to the field of inductors, in particular to a multi-combination laminated chip common mode inductor. Background Art

[0002] Common-mode inductors, also called common-mode chokes, are commonly used in computer switching power supplies to filter common-mode electromagnetic interference signals. In board design, common-mode inductors also act as EMI filters, used to suppress the outward radiation of electromagnetic waves generated by high-speed signal lines. Multi-combination stacked chip common-mode inductors are common-mode inductors that stack multiple layers of magnetic materials and isolate them from each other with insulating materials.

[0003] During the use of stacked common-mode inductors, a large amount of heat is generated due to their compact stacked structure. However, the stacked magnetic materials are wrapped by insulating materials, which prevents the heat from dissipating quickly. As a result, the temperature inside the common-mode inductor continues to accumulate, affecting the performance of the common-mode inductor. Utility Model Content

[0004] The purpose of the present invention is to provide a multi-combination stacked chip common mode inductor to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a multi-combination laminated common-mode chip inductor, comprising a connecting electrode, one side of which is provided with an insulating material, and further comprising:

[0006] A circuit component, the circuit component is arranged inside the insulating material and is used for the circulation of the circuit;

[0007] A heat conducting plate, the heat conducting plate being arranged inside the circuit assembly and being used for conducting heat of the circuit assembly;

[0008] The mounting frame is arranged outside the heat conducting plate and is used to separate the circuit component and the heat conducting plate.

[0009] Preferably, the circuit assembly includes an electrode plate and a connecting circuit board, one end of the electrode plate is fixedly connected to one end of the connecting circuit board, the connecting electrode is sleeved on the outside of the electrode plate, and the insulating material is sleeved on the outside of the connecting circuit board.

[0010] Preferably, the other end of the connecting circuit board is fixedly connected with a connecting column for connecting an adjacent connecting circuit board.

[0011] Preferably, the mounting frame includes a partition plate and a fixing column, and one end of the fixing column is fixedly connected to the outer wall of the partition plate.

[0012] Preferably, a placement groove for inserting the heat conducting plate is opened on one side of the partition plate.

[0013] Preferably, the top and bottom ends of the inner wall of the placement groove are respectively provided with flow grooves, and the flow grooves are used to conduct heat from the circuit components to the heat conducting plate.

[0014] The technical effects and advantages of this utility model are:

[0015] The utility model utilizes the design of circuit components, heat conducting plates and mounting frames, and is installed through the design of partition plates and fixing columns, so that a plurality of connection circuit boards are respectively arranged at the top and bottom ends of the partition plates, and then the heat conducting plates are inserted into the interior of the placement slots, and are separated by the connection circuit boards and the heat conducting plates. As the connection circuit boards operate, the heat generated is conducted to the heat conducting plates through the circulation slots, and is then conducted to the outside of the insulation material through the heat conducting plates, thereby dissipating heat inside the insulation material and reducing the temperature inside the inductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the common-mode inductor of the utility model.

[0017] Figure 2 This is a schematic diagram of the three-dimensional structure of the heat dissipation plate and circuit components of the utility model.

[0018] Figure 3 This is a schematic diagram of the three-dimensional structure of the circuit component of the utility model.

[0019] Figure 4 This is a schematic diagram of the three-dimensional structure of the mounting frame of the utility model.

[0020] In the figure: 1. connecting electrode; 2. insulating material; 3. circuit component; 31. electrode plate; 32. connecting circuit board; 33. connecting column; 4. heat conducting plate; 5. mounting frame; 51. partition plate; 52. fixing column; 53. placement slot; 54. circulation slot. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] The utility model provides Figure 1-4 The multi-combination laminated common-mode inductor shown includes a connecting electrode 1, an insulating material 2 is provided on one side of the connecting electrode 1, and further includes:

[0023] The circuit component 3 is arranged inside the insulating material 2 and is used for the circulation of the circuit;

[0024] The heat conducting plate 4 is arranged inside the circuit assembly 3 and is used to conduct heat of the circuit assembly 3;

[0025] The mounting frame 5 is arranged outside the heat conducting plate 4 and is used to separate the circuit assembly 3 and the heat conducting plate 4 .

[0026] Specifically, the circuit assembly 3 includes an electrode plate 31 and a connecting circuit board 32, one end of the electrode plate 31 is fixedly connected to one end of the connecting circuit board 32, the connecting electrode 1 is sleeved on the outside of the electrode plate 31, the insulating material 2 is sleeved on the outside of the connecting circuit board 32, and the other end of the connecting circuit board 32 is fixedly connected to a connecting column 33 for connecting adjacent connecting circuit boards 32.

[0027] Furthermore, the electrode 1, the insulating material 2 and the circuit component 3 are connected to form the existing model WHLC-2012A-801T0 multilayer chip common mode inductor. The insulating material 2 is added between each magnetic layer to prevent short circuits between layers and improve the voltage resistance of the inductor. The multi-combination multi-layer chip common mode inductor is an electronic component widely used in modern electronic devices. It is mainly used to suppress common mode noise and electromagnetic interference (EMI). The design of this inductor combines multiple materials and technologies to improve its performance and reliability. The core of the multi-combination multi-layer chip common mode inductor consists of multiple stacked The inductor is composed of layers of magnetic materials, the selection of which depends on the required performance parameters, such as magnetic permeability, saturation magnetic flux density and resistivity. Each laminate is precision-machined to ensure the optimization of inductance and magnetic performance. Two connecting electrodes 1 are provided, which are symmetrically arranged at both ends of the insulating material 2 for soldering to the circuit board. Two electrode plates 31 are provided, which are respectively sleeved on the inside of the connecting electrode 1. Multiple connecting circuit boards 32 and connecting columns 33 are used to connect the two electrode plates 31. The multiple connecting circuit boards 32 are multiple stacked chip inductors, and the connecting columns 33 are used to connect adjacent connecting circuit boards 32.

[0028] Specifically, the mounting frame 5 includes a partition plate 51 and a fixed column 52, one end of the fixed column 52 is fixedly connected to the outer wall of the partition plate 51, and a placement groove 53 for inserting the heat conducting plate 4 is provided on one side of the partition plate 51, and the top and bottom ends of the inner wall of the placement groove 53 are respectively provided with flow grooves 54, and the flow grooves 54 are used to conduct the heat of the circuit component 3 to the heat conducting plate 4.

[0029] Furthermore, the mounting frame 5 is made entirely of ceramic material, which has the following significant advantages: 1. Excellent high-frequency performance: Ceramic materials exhibit excellent performance in high-frequency environments, have low loss and high dielectric constant, and can effectively reduce electromagnetic interference (EMI) in high-frequency circuits. 2. High-temperature resistance: Ceramic materials generally have good high-temperature resistance, can maintain stable electrical and magnetic properties in high-temperature environments, and are not easily affected by temperature changes. 3. High mechanical strength: Ceramic materials have high mechanical strength and hardness, can resist vibration and impact, ensure the structural stability of the inductor, and are suitable for use in harsh environments. 4. Low loss: The low loss characteristics of ceramic materials make them suitable for high-frequency circuits. It has low power loss, can effectively improve the efficiency of power conversion and reduce heat generation. 5. Good dimensional stability: Ceramic materials have good dimensional stability under temperature changes and are not prone to expansion or contraction, ensuring the stable operation of the inductor under various temperature conditions. 6. Excellent insulation performance: Ceramic materials themselves have excellent insulation properties, which can effectively isolate current, prevent the conduction of common-mode noise, and improve the anti-interference ability of the circuit. 7. Easy to process and shape: Ceramic materials can be processed into various complex shapes and sizes through sintering technology, which is convenient for manufacturing common-mode inductors of various specifications and types. 8. Environmentally friendly and non-toxic: Ceramic materials are generally non-toxic and harmless, and will not cause harm to the environment and human health, and are in line with environmental standards. To meet the requirements of the protection, a plurality of partition plates 51 are provided, which are respectively inserted between adjacent connecting circuit boards 32. The material used for the connecting circuit boards 32 is the same as the material of the insulating material 2, thereby playing an insulating role. Four fixing columns 52 are provided, which are respectively set at the four corners of the partition plate 51. The partition plate 51 and the fixing columns 52 are fixed by bonding. By producing fixing columns 52 of different sizes, it is possible to adapt to common-mode inductors of different sizes, thereby correspondingly installing different numbers of partition plates 51 to meet the use requirements of common-mode inductors of different sizes. The size of the placement slot 53 is adapted to the size of the heat conducting plate 4. The heat conducting plate 4 is made of copper plate. Copper is one of the best thermal conductors of all metals, with a thermal conductivity coefficient of about 401W / m·K, which has The following advantages: high thermal conductivity: very suitable for applications that require efficient heat dissipation, ductility and machinability: copper can be easily processed into various shapes and sizes, the heat conducting plate 4 is inserted into the interior of the placement groove 53, and its two ends extend out of the placement groove 53 and are flush with the outer wall of the insulating material 2. There are multiple circulation grooves 54, and the direction of the circulation grooves 54 is perpendicular to the direction of the connecting circuit board 32, thereby preventing the connecting circuit board 32 from entering the placement groove 53 through the circulation grooves 54. When the heat generated by the connecting circuit board 32 is conducted to the heat conducting plate 4 through the circulation grooves 54, and after being absorbed by the heat conducting plate 4, it is conducted to the outside of the heat conducting plate 4 and the insulating material 2, thereby realizing heat exchange and cooling the circuit components 3 inside the insulating material 2.

[0030] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A multi-combination laminated common-mode inductor, comprising a connecting electrode (1), wherein one side of the connecting electrode (1) is provided with an insulating material (2), characterized in that: Also includes: A circuit component (3), the circuit component (3) being arranged inside the insulating material (2), the circuit component (3) being used for the circulation of the circuit; a heat conducting plate (4), the heat conducting plate (4) being arranged inside the circuit assembly (3), and the heat conducting plate (4) being used to conduct heat of the circuit assembly (3); A mounting frame (5) is provided outside the heat conducting plate (4), and the mounting frame (5) is used to separate the circuit component (3) and the heat conducting plate (4).

2. The multi-combination stacked common mode inductor according to claim 1, characterized in that: The circuit assembly (3) comprises an electrode plate (31) and a connecting circuit board (32), one end of the electrode plate (31) and one end of the connecting circuit board (32) are fixedly connected, the connecting electrode (1) is sleeved on the outside of the electrode plate (31), and the insulating material (2) is sleeved on the outside of the connecting circuit board (32).

3. The multi-combination stacked common mode inductor according to claim 2, characterized in that: The other end of the connecting circuit board (32) is fixedly connected with a connecting column (33) for connecting an adjacent connecting circuit board (32).

4. The multi-combination stacked common mode inductor according to claim 2, characterized in that: The mounting frame (5) comprises a partition plate (51) and a fixing column (52), one end of the fixing column (52) being fixedly connected to the outer wall of the partition plate (51).

5. The multi-combination stacked common mode inductor according to claim 4, characterized in that: A placement groove (53) for inserting the heat conducting plate (4) is provided on one side of the partition plate (51).

6. The multi-combination stacked common mode inductor according to claim 5, characterized in that: The top and bottom ends of the inner wall of the placement groove (53) are respectively provided with circulation grooves (54), and the circulation grooves (54) are used to conduct heat from the circuit component (3) to the heat conducting plate (4).

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