Machining jig

Abstract

The utility model relates to a machining jig. The processing jig is used for processing the power device, and comprises a bearing assembly which is provided with a positioning hole extending along a first direction, the shape of the positioning hole is at least partially matched with that of a substrate of the power device, and the positioning hole is configured to accommodate and limit the substrate; the cover plate assembly is arranged on one side, in the first direction, of the bearing assembly and detachably connected with the bearing assembly, a channel penetrating through the bearing assembly in the first direction is formed in the cover plate assembly, and the channel communicates with the positioning hole; and at least part of the limiting assembly extends into the positioning hole, the limiting assembly is connected with the side, facing the bearing assembly, of the cover plate assembly, and the limiting assembly is configured to limit movement of the base plate in the first direction. The processing jig provided by the utility model does not need vacuum suction and other operations, is simple and convenient to operate, can save the time for replacing, disassembling and assembling the jig among different procedures, and reduces the probability of scratching an electronic element and a substrate by dislocation in the jig replacement process, so as to improve the production efficiency and the production quality of the power module.

Description

Technical Field

[0001] The present application relates to the field of packaging technology, and in particular to a processing jig. Background Art

[0002] Power modules, as important semiconductor devices, enable power conversion and regulation and are widely used in rail transit, smart grids, industrial energy conservation, electric vehicles, and new energy equipment. In recent years, the vigorous development of emerging high-power-density industries has placed higher demands on the manufacturing cost and production efficiency of power modules.

[0003] However, in the related art, the processing jig of the power module includes a vacuum adsorption device, which is cumbersome to operate and inconvenient to use during the processing of the power module. Utility Model Content

[0004] The embodiment of the present application provides a processing jig that does not require operations such as vacuum suction and is easy to operate during the processing of the power module.

[0005] An embodiment of the present application provides a processing jig, including a supporting assembly, a cover assembly, and a limiting assembly. The supporting assembly is provided with a positioning hole extending along a first direction, the positioning hole at least partially adapted to the shape of the substrate of the power device, and the positioning hole is configured to accommodate and limit the substrate. The cover assembly is arranged on one side of the supporting assembly in the first direction and is detachably connected to the supporting assembly. The cover assembly is provided with a channel extending through the first direction, and the channel is connected to the positioning hole. The limiting assembly at least partially extends into the positioning hole, and the limiting assembly is connected to the side of the cover assembly facing the supporting assembly, and the limiting assembly is configured to limit the movement of the substrate in the first direction.

[0006] In some embodiments, along the first direction, at least a portion of the positioning holes penetrates the supporting assembly.

[0007] In some embodiments, the positioning hole includes a first portion and a second portion. The first portion is arranged to penetrate the supporting assembly along a first direction, and the second portion is arranged to surround a portion of the first portion. The second portion includes a groove-like structure that is recessed inward from a side surface of the supporting assembly close to the cover assembly, and a connecting hole provided in the groove-like structure. The groove-like structure is connected to the first portion, and at least a portion of the limiting assembly extends into the second portion.

[0008] In some embodiments, there are multiple second parts, which are spaced apart from each other around the first part, and a limiting component is disposed in each second part.

[0009] In some embodiments, the orthographic projection of the first part in the first direction is polygonal, the orthographic projection of the second part in the first direction is arcuate, elliptical or polygonal, and each vertex of the first part is connected to the second part.

[0010] In some embodiments, the second portion is provided with a first chamfered portion, the inclination direction of the first chamfered portion intersects with the first direction, the four corners of the substrate include the second chamfered portion, and the inclination direction of the second chamfered portion is consistent with the inclination direction of the first chamfered portion.

[0011] In some embodiments, the limiting assembly includes a telescopic part, and the processing jig also includes a fastener. Along the first direction, the fastener is inserted into the cover assembly and detachably connects the cover assembly to the supporting assembly. The insertion depth of the fastener along the first direction is adjustable, and the telescopic part is connected to the fastener.

[0012] In some embodiments, the supporting component is provided with a groove, which is formed by being recessed from the surface of the supporting component toward the interior of the covering component. Grooves are respectively provided on both sides of the positioning hole, and the grooves extend to the wall of the supporting component to form the positioning hole and are connected to the positioning hole.

[0013] In some embodiments, at least part of the positioning holes are set through the supporting component, the limiting component is retractable along the first direction, and the processing jig also includes a heat transfer component, which is located on the side of the supporting component away from the cover component. The heat transfer component is configured to be inserted into the positioning holes set through the supporting component, and enables the substrate to move along the first direction and drive the limiting component to retract along the first direction.

[0014] In some embodiments, the heat transfer assembly includes a support portion and a protrusion. The protrusion is located on a side of the support portion close to the carrier assembly, the protrusion is protruding from the support portion, and the protrusion is adapted to the shape of a positioning hole penetrating the carrier assembly. The protrusion is configured to be inserted into the positioning hole penetrating the carrier assembly.

[0015] The processing jig provided in the embodiment of the present application can achieve the fixation of the substrate by setting the processing jig including the bearing component, the cover component and the limit component. Compared with the related art of fixing the substrate with a vacuum device, the processing jig provided in the embodiment of the present application can simplify the substrate fixing process, does not require tedious operations such as vacuum suction, and has a simple structural setting. In addition, the processing jig can support the processing of different processes, and there is no need to replace the jig when switching processes. For example, during the mounting process, the processing jig of the present application can be used to position the substrate. After the mounting is completed, the processing jig, the substrate, and the electronic components can be transferred to the reflow furnace together for the welding process. This can save the time of replacing and disassembling jigs between different processes, save the research and development costs of the jig, and reduce the probability of electronic components and substrates being scratched by misalignment during the replacement of the jig, so as to improve the production efficiency and production quality of the power module.

[0016] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0018] Figure 1 This is an exploded schematic diagram of an embodiment of a processing jig according to an embodiment of the present application;

[0019] Figure 2 This is an exploded schematic diagram of a partial structure of an embodiment of a processing jig according to an embodiment of the present application;

[0020] Figure 3 This is a structural diagram of a bearing assembly in an embodiment of a processing jig according to an embodiment of the present application;

[0021] Figure 4 It is a structural schematic diagram of the cover plate assembly in an embodiment of the processing fixture of the present application.

[0022] Description of Figure Numbers:

[0023] X first direction;

[0024] 100 bearing assembly; 110 positioning hole; 111 first portion; 1111 first chamfered portion; 112 second portion;

[0025] 200 cover plate assembly; 210 channel;

[0026] 300 limit assembly; 310 telescopic parts;

[0027] 400 fasteners;

[0028] 500 grooves;

[0029] 600 heat transfer component; 610 support portion; 620 protrusion

[0030] 700 substrate; 7001 second chamfered portion.

[0031] In the drawings, like parts are given like reference numerals, but the drawings are not necessarily drawn to scale. DETAILED DESCRIPTION

[0032] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are set forth in order to provide a comprehensive understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the well-known structures and technologies are not shown in order to avoid unnecessary ambiguity in the present application; and, for clarity, the sizes of some structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0033] The directional words that appear in the following description refer to the directions shown in the figures and do not limit the specific structure of this application. In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0034] Power modules, as important semiconductor devices, enable power conversion and regulation and are widely used in rail transit, smart grids, industrial energy conservation, electric vehicles, and new energy equipment. In recent years, the vigorous development of emerging high-power-density industries has placed higher demands on the manufacturing cost and production efficiency of power modules.

[0035] The power module mainly includes structures such as a substrate, a chip, a capacitor and a resistor, and a heat dissipation substrate. Optionally, the substrate includes a DBC substrate (Direct Bonding Copper, a copper-clad ceramic substrate). Electronic components such as chips and capacitors and resistors can be connected to the substrate by processes such as mounting and reflow soldering. For example, in the process of connecting electronic components to the substrate, it is divided into a tin paste process and a solder sheet process according to the different states of the solder. In the tin paste process, tin paste is first applied to the substrate; the substrate coated with tin paste is transferred to the mounting equipment, and vacuum or other methods are used for alignment, and the electronic components are mounted on the tin paste position; the substrate with the mounted electronic components is transferred to a soldering jig; and the substrate is placed in a reflow oven for reflow soldering to complete the soldering. In the solder sheet process, the substrate is first placed on the mounting equipment carrier, and the position of the substrate is fixed by vacuum or other methods, and solder sheets and chip electronic components are mounted in specific positions in sequence; the substrate with the mounted electronic components is transferred to a soldering jig; and the substrate is placed in a reflow oven for reflow soldering to complete the soldering.

[0036] However, in related technologies, both the mounting process and the welding process require vacuum or other methods to fix the substrate, and vacuum suction and other operations are required, which is inconvenient. In addition, the mounting process requires a set of fixtures to fix the substrate, and the welding process requires another set of fixtures to fix the substrate. This not only increases the cost of fixture research and development, but also requires the replacement of the fixtures when switching between different processes. This involves a series of disassembly and assembly steps, which are cumbersome and can easily cause the position of electronic components to shift, increasing the risk of scratching electronic components and further reducing the production efficiency and quality of power modules.

[0037] Based on the above considerations, in order to solve the problem of jigs in related technologies, a processing jig is proposed.

[0038] Please refer to Figures 1 to 4 , Figure 1 This is an exploded schematic diagram of an embodiment of a processing jig according to an embodiment of the present application. Figure 2 This is an exploded schematic diagram of a partial structure of an embodiment of a processing jig according to an embodiment of the present application. Figure 3 This is a structural diagram of a supporting component in an embodiment of a processing jig according to an embodiment of the present application. Figure 4 It is a structural schematic diagram of the cover plate assembly in an embodiment of the processing fixture of the present application.

[0039] An embodiment of the present application provides a processing jig, comprising a carrier assembly 100, a cover assembly 200, and a limiting assembly 300. The carrier assembly 100 is provided with a positioning hole 110 extending along a first direction X. The positioning hole 110 is at least partially adapted to the shape of a substrate 700 of a power device. The positioning hole 110 is configured to accommodate and limit the substrate 700. The cover assembly 200 is disposed on one side of the carrier assembly 100 in the first direction X and is detachably connected to the carrier assembly 100. The cover assembly 200 is provided with a channel 210 extending through the first direction X. The channel 210 is connected to the positioning hole 110. The limiting assembly 300 at least partially extends into the positioning hole 110. The limiting assembly 300 is connected to the side of the cover assembly 200 facing the carrier assembly 100. The limiting assembly 300 is configured to limit the movement of the substrate 700 in the first direction X.

[0040] The positioning hole 110 is extended along the first direction X. The shape of the positioning hole 110 includes but is not limited to a rectangular hole, a cube hole, or other special-shaped holes.

[0041] Exemplarily, the substrate 700 is in a rectangular parallelepiped shape with second chamfered portions 7001 at four corners. The four edges of the rectangular parallelepiped can abut against the carrier assembly 100 that encloses the positioning hole 110 to limit the position of the substrate 700 .

[0042] The detachable connection between the cover assembly 200 and the bearing assembly 100 includes bolt connection, riveting, etc.

[0043] The shape of the channel 210 of the cover assembly 200 includes, but is not limited to, a cross-shaped channel or other irregularly shaped channels 210. The functions of the channel 210 include facilitating observation of electronic components during the mounting and soldering processes, and improving the efficiency of heat radiation from the channel 210 to the electronic components during the soldering process.

[0044] The structure of the limiting assembly 300 includes but is not limited to a plate structure or an elastic member structure, as long as it can limit the substrate 700 along the first direction X. The number of limiting assemblies 300 includes one, two, or even more, which can be adjusted according to actual conditions.

[0045] The processing jig provided in the embodiment of the present application can fix the substrate 700 by configuring the processing jig including the supporting component 100, the cover component 200 and the limiting component 300. Compared with the related art of fixing the substrate 700 with a vacuum device, the processing jig provided in the embodiment of the present application can simplify the fixing process of the substrate 700, without the need for tedious operations such as vacuum suction, and has a simple structure, which is suitable for online production. In addition, the processing jig can support the processing of different processes, and there is no need to replace the jig when switching processes. For example, during the mounting process, the processing jig of the present application can be used to position the substrate 700. After the mounting is completed, the processing jig, the substrate 700, and the electronic components can be transferred to the reflow furnace together for the welding process. This can save the time of replacing and disassembling jigs between different processes, save the R&D cost of the jig, and reduce the probability of electronic components and the substrate 700 being scratched by the jig during the replacement of the jig, so as to improve the production efficiency and production quality of the power module.

[0046] In some embodiments, along the first direction X, at least a portion of the positioning holes 110 are disposed through the supporting assembly 100 .

[0047] At least part of the positioning hole 110 passes through the supporting component 100, including but not limited to the central part of the positioning hole 110 passing through the supporting component 100, the edge part does not pass through the supporting component 100, or the four corners of the positioning hole 110 do not pass through the supporting component 100, and the other parts of the positioning hole 110 pass through the supporting component 100.

[0048] The processing jig provided in the embodiment of the present application is provided with at least a portion of the positioning holes 110 penetrating the carrier assembly 100, so that the penetrating positioning holes 110 facilitate the transfer of heat from the side of the positioning holes 110 away from the cover assembly 200 to the electronic components and the substrate 700 during the welding process to facilitate welding, thereby improving welding efficiency.

[0049] In some embodiments, the positioning hole 110 includes a first portion 111 and a second portion 112. The first portion 111 is provided to penetrate the carrier assembly 100 along the first direction X, and the second portion 112 is provided to surround a portion of the first portion 111. The second portion 112 includes a groove-like structure that is recessed inwardly from a side surface of the carrier assembly 100 near the cover assembly 200, and a connecting hole provided in the groove-like structure. The groove-like structure is connected to the first portion 111, and at least a portion of the limiting assembly 300 extends into the second portion 112.

[0050] The groove-shaped structure of the second portion 112 is used for overlapping the substrate 700 .

[0051] At least the limiting assembly 300 extends into the second portion 112 and is at least used to limit the substrate 700 located in the second portion 112 along the first direction X.

[0052] The processing jig provided in the embodiment of the present application can achieve more heat transfer to the electronic components and the substrate 700 during the reflow soldering process through the first part 111, thereby improving the heat exchange efficiency. The second part 112 is arranged around the first part 111 and has an inwardly recessed groove structure, which can allow the edge of the substrate 700 to overlap the second part 112, thereby supporting the substrate 700 and preventing the substrate 700 from falling from the positioning hole 110. At the same time, at least the limiting component 300 extends into the second part 112, and the substrate 700 can be limited along the first direction X by the second part 112 and the limiting component 300, thereby improving the accuracy of the position of the substrate 700 during processing.

[0053] In some embodiments, there are multiple second parts 112 , which are spaced apart from each other around the first part 111 , and a limiting assembly 300 is disposed in each second part 112 .

[0054] The processing jig provided in the embodiment of the present application can improve the limiting function of the limiting component 300 on the substrate 700 at multiple locations through the above-mentioned setting, further improve the positioning accuracy of the substrate 700, and reduce the risk of the substrate 700 sliding during the movement of the processing jig and the substrate 700.

[0055] In some embodiments, the orthographic projection of the first portion 111 in the first direction X is polygonal, the orthographic projection of the second portion 112 is arcuate, elliptical or polygonal, and each vertex of the first portion 111 is connected to the second portion 112 .

[0056] A shape formed by a chord and its corresponding arc is called an arc.

[0057] Optionally, the orthographic projection of the first portion 111 in the first direction X is an octagon.

[0058] The processing jig provided in the embodiment of the present application, through the setting of the orthographic projection of the first part 111 in the first direction X, the setting of the orthographic projection of the second part 112, and the setting that each vertex of the first part 111 is connected to the second part 112, makes the shape of the first part 111 of the processing jig more compatible with the shape of the substrate 700, and the processing jig more accurately limits the substrate 700.

[0059] In some embodiments, the second portion 112 is provided with a first chamfered portion 1111 , and an inclined direction of the first chamfered portion 1111 intersects with the first direction X.

[0060] Optionally, the four corners of the substrate 700 include second chamfered portions 70001 .

[0061] Optionally, the inclination direction of the first chamfered portion 1111 is consistent with the inclination direction of the second chamfered portions 7001 at the four corners of the substrate 700 .

[0062] The processing jig provided in the embodiment of the present application can make the structure of the second portion 112 more adaptable to the structural shape of the substrate 700 by providing the first chamfered portion 1111 on the second portion 112 .

[0063] In some embodiments, the limiting assembly 300 includes a telescopic member 310 , and the telescopic member 310 includes at least one of a telescopic cylinder and an elastic member.

[0064] Optionally, the elastic member includes a spring structure.

[0065] The processing jig provided in the embodiment of the present application includes a telescopic member 310 in the limiting component 300, so that the pressing force of the substrate 700 along the first direction X can be adjusted by adjusting the telescopic force of the telescopic member 310. In addition, the telescopic effect of the telescopic member 310 allows the processing jig to adapt to substrates 700 of different thicknesses, thereby having higher versatility. In addition, in the reflow soldering process, the substrate 700 can be pushed and the telescopic member 310 can be extended to further fit the substrate 700 and the heat transfer component 600.

[0066] In some embodiments, the processing jig also includes a fastener 400. Along the first direction X, the fastener 400 is inserted into the cover assembly 200 and detachably connects the cover assembly 200 to the supporting assembly 100. The insertion depth of the fastener 400 along the first direction X is adjustable, and the telescopic member 310 is connected to the fastener 400.

[0067] The fasteners 400 include, but are not limited to, screws, bolts, and the like.

[0068] The fastener is mounted on the cover assembly 200 and is staggered relative to the channel 210 .

[0069] Optionally, the fastener 400 includes a screw, and a threaded hole matching the screw thread is provided in the middle of the first portion for use with the fastener 400 .

[0070] The processing jig provided in the embodiment of the present application is inserted into the cover assembly 200 through the fastener 400 and the cover assembly 200 is detachably connected to the supporting assembly 100, so that the processing jig is easy to disassemble and assemble. The insertion depth of the fastener 400 along the first direction X is adjustable. The limiting force of the limiting assembly 300 on the substrate 700 can be adjusted by adjusting the insertion depth of the fastener 400, and it can also meet the processing requirements of substrates 700 of different thicknesses.

[0071] In some embodiments, the supporting component 100 is provided with a groove 500, which is formed by being recessed from the surface of the supporting component 100 toward the interior of the supporting component 100 toward the cover component 200, and grooves 500 are respectively provided on both sides of the positioning hole 110, and the grooves 500 extend to the supporting component 100 to enclose the wall of the positioning hole 110 and are connected to the positioning hole 110.

[0072] The processing jig provided in the embodiment of the present application is provided with grooves 500 on both sides of the positioning hole 110. The grooves 500 extend to the supporting component 100 to enclose the wall of the positioning hole 110 and are connected to the positioning hole 110, so as to facilitate the placement and removal of the substrate 700 and the insertion of the picking tool to facilitate the placement and removal of the substrate 700.

[0073] In some embodiments, at least part of the positioning holes 110 are set through the supporting component 100, the limiting component 300 is retractable along the first direction X, and the processing jig also includes a heat transfer component 600. The heat transfer component 600 is located on the side of the supporting component 100 away from the cover component 200. The heat transfer component 600 is configured to be inserted into the positioning holes 110 set through the supporting component 100, and enables the substrate 700 to move along the first direction X and drive the limiting component 300 to retract along the first direction X.

[0074] Optionally, the heat transfer component 600 is movable along the first direction X to control the separation and contact between the substrate 700 and the heat transfer component 600 , thereby achieving more precise temperature control.

[0075] The configuration of the heat transfer component 600 is more suitable for large-capacity compartment-based convergence equipment with contact heat transfer.

[0076] The machining jig provided in the embodiment of the present application, through the provision of the heat transfer assembly 600, can achieve heat transfer through the heat transfer assembly 600 to the subunit to be welded. The direct contact between the heat transfer assembly 600 and the substrate 700 can improve the efficiency of heat transfer. The arrangement in which the substrate 700 moves along the first direction X and drives the limit assembly 300 to extend and retract along the first direction X can ensure a better fit between the heat transfer assembly 600 and the substrate 700, thereby improving the efficiency of heat transfer.

[0077] In some embodiments, the heat transfer assembly 600 includes a support portion 610 and a protrusion 620. The protrusion 620 is located on a side of the support portion 610 close to the carrier assembly 100. The protrusion 620 protrudes from the support portion 610 and is shaped to fit within a positioning hole 110 extending through the carrier assembly 100. The protrusion 620 is configured to be inserted into the positioning hole 110 extending through the carrier assembly 100.

[0078] The processing jig provided in the embodiment of the present application can ensure sufficient contact between the substrate 700 located in the positioning hole 110 passing through the supporting component 100 and the protrusion 620 by configuring the protrusion 620 to be adapted in shape to the positioning hole 110 passing through the supporting component 100, and the structural configuration of the protrusion 620 and the support portion 610 is simple and easy to implement.

[0079] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and components may be substituted with equivalents without departing from the scope of the present application. In particular, the various technical features described in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.

Claims

1. A processing jig for processing power devices, characterized in that: include: A carrier assembly is provided with a positioning hole extending along a first direction, wherein the positioning hole is at least partially adapted to the shape of the substrate of the power device, and the positioning hole is configured to accommodate and limit the substrate; a cover assembly, disposed on one side of the bearing assembly in the first direction and detachably connected to the bearing assembly, wherein the cover assembly is provided with a channel penetrating along the first direction, the channel being in communication with the positioning hole; A limiting assembly at least partially extends into the positioning hole, the limiting assembly is connected to a side of the cover assembly facing the bearing assembly, and the limiting assembly is configured to limit movement of the substrate in the first direction.

2. The processing jig according to claim 1, characterized in that: Along the first direction, at least part of the positioning holes penetrates the supporting assembly.

3. The processing jig according to claim 2, characterized in that: The positioning hole includes: A first portion is arranged along the first direction and passes through the bearing assembly; The second part is arranged around part of the first part, and the second part includes a groove-like structure that is recessed inward starting from a side surface of the supporting component close to the cover component and a connecting hole arranged on the groove-like structure. The groove-like structure is connected to the first part, and at least part of the limiting component extends into the second part.

4. The processing jig according to claim 3, characterized in that: There are multiple second parts, which are spaced apart from each other around the first part, and each second part is provided with the limiting component.

5. The processing jig according to claim 4, characterized in that: The orthographic projection of the first portion in the first direction is a polygon; The orthographic projection of the second part in the first direction is arcuate, elliptical or polygonal, and each vertex of the first part is connected to the second part.

6. The processing jig according to claim 4, characterized in that: The first portion is provided with a first chamfered portion, the inclination direction of which intersects with the first direction, and the four corners of the substrate include second chamfered portions, the inclination direction of which is consistent with the inclination direction of the first chamfered portion.

7. The processing jig according to claim 1, characterized in that: The limiting assembly includes a telescopic part, and the processing jig also includes a fastener. Along the first direction, the fastener is inserted into the cover assembly and detachably connects the cover assembly to the bearing assembly. The insertion depth of the fastener along the first direction is adjustable, and the telescopic part is connected to the fastener.

8. The processing jig according to claim 1, characterized in that: The supporting component is provided with a groove, which is formed by the surface of the supporting component facing the cover component toward the interior of the supporting component. The grooves are respectively provided on both sides of the positioning hole, and the grooves extend to the supporting component to enclose the wall surface of the positioning hole and are connected to the positioning hole.

9. The processing jig according to claim 1, characterized in that: At least part of the positioning hole is set through the bearing component, and the limiting component is retractable along the first direction. The processing jig also includes a heat transfer component, which is located on the side of the supporting component away from the cover component. The heat transfer component is configured to be inserted into the positioning hole setting that passes through the supporting component, and enables the substrate to move along the first direction and drive the limiting component to extend and retract along the first direction.

10. The processing jig according to claim 9, characterized in that: The heat transfer component comprises: Support part; The protrusion is located on the side of the support portion close to the bearing component. The protrusion is protruding from the support portion. The protrusion is adapted to the shape of the positioning hole passing through the bearing component. The protrusion is configured to be inserted into the positioning hole passing through the bearing component.

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