Chip pasting machine table

Abstract

The utility model relates to the field of chip pasting, in particular to a chip pasting machine table which comprises a plurality of cushion blocks. The cushion blocks are located below the corresponding base islands in the chip pasting process and are used for supporting the base islands; the cushion block comprises a through groove, the through groove and the side edge connecting rib of the base island coincide relative to the motion trail of the cushion block, and the bottom surface of the through groove is lower than the bottom edge of the side edge connecting rib. According to the utility model, the through groove through which the structure in the base island in the vertical direction can pass is arranged above the cushion block for supporting the base island, so that the side edge connecting ribs in the vertical direction cannot collide with the cushion block, and the shape of the base island can be kept in accordance with the design expectation in the whole process of chip pasting, thereby ensuring that the bearing plane is maintained at the preset height, and improving the production efficiency. Therefore, the subsequent plastic packaging uniformity is greatly improved, and the yield of finished products is increased.

Description

Technical Field

[0001] The utility model relates to the field of chip pasting, in particular to a chip pasting machine. Background Art

[0002] With the development of society, large-scale integrated circuits are increasingly used in various fields of society, and integrated circuits are becoming more and more complex. The difficulty of pasting chips between chips and between chips and substrates is also increasing.

[0003] During the chip pasting and subsequent packaging process, technicians found that some chip pasters including base island structures often had poor plastic sealing uniformity during the subsequent plastic sealing molding process, and the plastic sealing body on one side was incomplete, resulting in the chip pasting machine partially exposed, which ultimately led to a significant drop in the yield of the finished chip pasting and plastic sealing products.

[0004] Therefore, how to avoid the problem of poor chip pasting and plastic sealing uniformity, which results in some chip pasting parts being exposed after plastic sealing and low finished product yield, is an urgent problem to be solved by those skilled in the art. Utility Model Content

[0005] The utility model aims to provide a chip pasting machine to solve the problem in the prior art that the chip pasting plastic sealing is poor in uniformity, which results in some chip pasting parts being exposed after plastic sealing and low finished product yield.

[0006] In order to solve the above technical problems, the utility model provides a chip pasting machine, comprising a plurality of pads;

[0007] The pad is located under the corresponding base island during the chip pasting process and is used to support the base island;

[0008] The pad block includes a through groove, which coincides with a movement trajectory of the side connecting ribs of the base island relative to the pad block, and a bottom surface of the through groove is lower than a bottom edge of the side connecting ribs.

[0009] Optionally, in the chip pasting machine, the pad includes a plurality of separately arranged supporting units, and adjacent supporting units are isolated by the through-groove.

[0010] Optionally, in the chip pasting machine, the pad further includes an air extraction hole;

[0011] The air extraction hole is provided on the top surface of the cushion block, and is used to form a negative pressure in the hole so that the bearing plane of the base island is fitted and fixed on the top surface of the cushion block.

[0012] Optionally, in the chip pasting machine, the pad includes a plurality of air extraction holes;

[0013] The plurality of air extraction holes are arranged in the direction of movement of the side connecting reinforcement relative to the pad.

[0014] Optionally, in the chip pasting machine, the pad is a stainless steel pad.

[0015] Optionally, in the chip pasting machine, the base island is a copper-plated base island.

[0016] Optionally, in the chip bonding machine, the facing side of the pad is an inclined side, and the inclination direction of the inclined side is consistent with the movement direction of the base island;

[0017] The meeting side surface is the side surface of the pad block facing the movement direction of the base island.

[0018] Optionally, in the chip pasting machine, the cross section of the pad is a trapezoidal cross section;

[0019] The meeting side surface corresponds to the hypotenuse of the trapezoidal cross section.

[0020] Optionally, in the chip pasting machine, the arrangement direction of the plurality of pads is perpendicular to the movement direction of the base island.

[0021] Optionally, the chip pasting machine further includes a lifting driver corresponding to the pad;

[0022] The lifting drive is used to drive the cushion block to move in a direction perpendicular to the bearing plane of the base island.

[0023] The chip pasting machine provided by the present invention includes a plurality of pads; the pads are located below the corresponding base islands during the chip pasting process and are used to support the base islands; the pads include through grooves, the through grooves coincide with the movement trajectory of the side connecting ribs of the base island relative to the pads, and the bottom surface of the through grooves is lower than the bottom edge of the side connecting ribs. The present invention provides through grooves above the pads supporting the base islands, which allow the vertical structure (i.e., the side connecting ribs) in the base islands to pass through. This ensures that the vertical side connecting ribs will not collide with the pads during the process of the base islands approaching, reaching, and leaving the pads. This ensures that the shape of the base islands meets the design expectations throughout the chip pasting process, thereby ensuring that the bearing plane is maintained at a preset height, thereby greatly improving the subsequent plastic packaging uniformity and increasing the yield rate of the finished product. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A schematic structural diagram of a specific embodiment of the chip pasting machine provided by the present invention;

[0026] Figure 2 A bottom view of the structure of a specific embodiment of the chip pasting machine provided by the present invention;

[0027] Figure 3 Schematic diagram of the positional relationship between two supporting surfaces of a chip pasting machine in the related art after chip pasting;

[0028] Figure 4 A schematic structural diagram of a specific embodiment of the chip pasting machine provided by the present invention;

[0029] Figure 5 A schematic structural diagram of a specific embodiment of the chip pasting machine provided by the present invention;

[0030] Figure 6 A schematic structural diagram of a specific embodiment of the chip pasting machine provided by the present invention;

[0031] Figure 7 A schematic structural diagram of a specific embodiment of the chip pasting machine provided by the present invention;

[0032] Figure 8 A top view of the partial structure of a specific embodiment of the chip pasting machine provided by the present invention;

[0033] Figure 9 This is a partial structural diagram of a specific implementation method of the chip pasting machine provided by the utility model.

[0034] In the figure, it includes 10-base island, 11-bearing plane, 12-side connecting ribs, 20-pad, 21-through groove, 22-exhaust hole, 23-facing side, 01-chip pasting machine, 02-chip after pasting. DETAILED DESCRIPTION

[0035] To help those skilled in the art better understand the present invention, the present invention is further described below in conjunction with the accompanying drawings and specific embodiments. Obviously, the embodiments described are only a portion of the present invention, not all of the embodiments. All other embodiments derived by those skilled in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

[0036] The core of this utility model is to provide a chip pasting machine, and a structural diagram of a specific embodiment thereof is shown as follows: Figure 1 As shown, it is called the specific embodiment 1, including a plurality of pads 20;

[0037] The pad 20 is located under the corresponding base island 10 during the chip pasting process and is used to support the base island 10;

[0038] The pad 20 includes a through groove 21 , which coincides with a movement trajectory of the side connecting ribs 12 of the base island 10 relative to the pad 20 , and a bottom surface of the through groove 21 is lower than a bottom edge of the side connecting ribs 12 .

[0039] In the present invention, it is assumed that the chip pasting machine is placed horizontally, and the carrying plane 11 and the top surface of the pad 20 are kept horizontal. The carrying plane 11 is located above the pad 20 during the chip pasting process. The "upper, lower, and horizontal" below are also based on this. Of course, in actual production, the setting orientation of the chip pasting machine may change. Please adjust it adaptively at that time.

[0040] During the chip pasting process, the chip to be pasted is placed on the carrier plane 11 and pressed to complete the pasting. Since pressure is involved, the pad 20 is located below the carrier plane 11 during the pasting process to provide support for the carrier plane 11. During the non-pressurized process, the support force of the carrier plane 11 is provided by the side connecting ribs 12. The side connecting ribs 12 are usually provided on the sides of the carrier plane 11.

[0041] It should be noted that in the circuit design of chip connection, there are a lot of symmetrical designs, such as Figure 2 As shown, this corresponds to the need for two base islands 10 of symmetrical design, and in Figure 3 It can be found that in this type of axially symmetrical base island 10 in the chip pasting machine (the chip that has been pasted is represented by 02 in the figure), after the chip is pasted, the supporting surface 11 in one side of the base island 10 often sinks, resulting in inconsistent heights of the supporting surfaces 11 of the base islands 10 on both sides, affecting the stability of other subsequent processes.

[0042] This is because, in the related art, the pads 20 supporting the base island 10 are mostly square solid pads 20, and the corresponding chip pasting machine does not have the function of controlling the lifting of the base island 10 or the pads 20. As a result, when the base island 10 is transferred to the top of the pads 20 and then leaves the top of the pads 20 after pasting, the side connecting ribs 12 will collide with the pads 20, causing the side connecting ribs 12 to bend and tilt, thereby causing the heights of the bearing planes 11 on both sides to be inconsistent. A schematic diagram of a collision is shown in FIG. Figure 4 In the figure, the collision area is marked with a bold explosion icon.

[0043] Of course, although the above example uses a chip bonding machine including two symmetrical base islands 10, it is conceivable that no matter how many base islands 10 are included or how the multiple base islands 10 are arranged, the problem of the side connecting ribs 12 colliding with the pads 20 exists in the chip bonding machine. In other words, the above problem is prevalent in the relevant chip bonding field.

[0044] Furthermore, the pad 20 is a surface-hardened pad 20, and the height of the pad 20 ranges from 75 microns to 125 microns, inclusive. The width of the through-groove 21 ranges from 385 microns to 415 microns, inclusive. Of course, the above parameter ranges are merely a specific embodiment, and in actual use, appropriate parameter data may be selected based on actual circumstances.

[0045] In the present invention, a through groove 21 lower than the side connecting rib 12 is opened on the pad 20 to ensure that the base island 10 can pass through the pad 20 without colliding with the pad 20, thereby avoiding height inconsistency of the base island 10 caused by collision and improving the stability and effect of subsequent processes.

[0046] Preferably, the cushion block 20 is a segmented cushion block 20 , and the cushion block 20 includes a plurality of separately arranged support units, and adjacent support units are isolated by the through-mouth groove 21 .

[0047] In this preferred embodiment, the spacer 20 is composed of multiple support units. The gaps between adjacent support units constitute the through-grooves 21. By adjusting the spacing, position, and size between the different support units, the spacer can be adapted to accommodate different base islands 10 with different side ribs 12, significantly enhancing the versatility of the die attach machine. Of course, the specific number of support units in the spacer 20 and the number of through-grooves 21 (the number of through-grooves 21 should be the number of support units minus one) will be determined based on the number of side ribs 12 on the corresponding base island 10.

[0048] In addition, the cushion block 20 further includes an air extraction hole 22;

[0049] The air extraction hole 22 is provided on the top surface of the cushion block 20 to form a negative pressure in the hole so that the bearing surface 11 of the base island 10 is fixed to the top surface of the cushion block 20. Figure 5 , Figure 5 This is a top view of the pad 20 (the pad 20 in this figure includes two supporting units). An exhaust hole 22 is provided on the pad 20. During the chip pasting process, air can be exhausted through the exhaust hole 22 to form a negative pressure between the top surface of the pad 20 and the carrying plane 11, so that the air pressure on the upper surface of the carrying plane 11 is greater than that on the lower surface, so that the carrying plane 11 is firmly pressed against the top surface of the pad 20 by the atmospheric pressure, making it difficult for the pad 20 and the carrying plane 11 to slide relative to each other, thereby improving the stability during chip pasting.

[0050] Furthermore, the cushion block 20 includes a plurality of air extraction holes 22;

[0051] The plurality of air extraction holes 22 are arranged in the direction of movement of the side connecting reinforcement 12 relative to the cushion block 20 .

[0052] Providing a plurality of exhaust holes 22 arranged along the side connecting ribs 12 relative to the movement direction of the pad 20 can further increase the area of ​​the negative pressure region, increase the size and distribution uniformity of the atmospheric pressure on the bearing plane 11, and further increase the friction between the bearing plane 11 and the pad 20, making it more difficult for the pad 20 and the bearing plane 11 to slide relative to each other.

[0053] As a specific embodiment, the pad 20 is a stainless steel pad 20. Stainless steel has high strength, is easy to process, and has relatively stable mechanical and chemical properties, making it suitable as the material of the pad 20. Of course, other types of pads 20 can also be selected according to actual conditions, and the present invention is not limited thereto.

[0054] In a preferred embodiment, the base island 10 is a copper-plated base island 10. Since the base island 10 is required to be conductive during the process, and copper, while an excellent electrical conductor, has relatively low mechanical strength, in this preferred embodiment, the base island 10 is prepared using copper plating. The copper-plated base island 10 has excellent electrical conductivity, while the base material can be made of other materials with better mechanical properties and higher strength, thereby achieving a balance between conductivity and mechanical strength, resulting in high reliability. Of course, other base island materials, such as pure copper islands, can also be used depending on actual circumstances, and this is not a limitation of the present invention.

[0055] The chip bonding machine provided by the present invention includes a plurality of pads 20. The pads 20 are positioned below corresponding base islands 10 during the chip bonding process to support the base islands 10. The pads 20 include through-grooves 21 that coincide with the motion trajectory of the side ribs 12 of the base islands 10 relative to the pads 20, and the bottom surfaces of the through-grooves 21 are lower than the bottom edges of the side ribs 12. By providing through-grooves 21 above the pads 20 supporting the base islands 10 to allow the vertical structures (i.e., the side ribs 12) in the base islands 10 to pass through, the vertical side ribs 12 do not collide with the pads 20 during the process of the base islands 10 approaching, reaching, and leaving the pads 20. This ensures that the shape of the base islands 10 remains consistent with the design throughout the chip bonding process, thereby ensuring that the support plane 11 remains at a predetermined height. This significantly improves the uniformity of subsequent plastic encapsulation and increases the yield rate of the finished product.

[0056] On the basis of the specific embodiment 1, the pad 20 is further defined to obtain the specific embodiment 2, and its corresponding local specific embodiment is as follows: Figure 6 As shown, it includes a plurality of spacers 20;

[0057] The pad 20 is located under the corresponding base island 10 during the chip pasting process and is used to support the base island 10;

[0058] The pad 20 includes a through groove 21, which coincides with the movement trajectory of the side connecting ribs 12 of the base island 10 relative to the pad 20, and the bottom surface of the through groove 21 is lower than the bottom edge of the side connecting ribs 12;

[0059] The facing side 23 of the pad 20 is an inclined side, and the inclination direction of the inclined side is consistent with the movement direction of the base island 10;

[0060] The meeting side surface 23 is a side surface of the cushion block 20 facing the movement direction of the base island 10 .

[0061] The difference between this embodiment and the above embodiment is that, in this embodiment, the shape of the cushion block 20 is further specified, and the remaining structures are the same as those in the above embodiment, which will not be described in detail here.

[0062] In this preferred embodiment, the facing side 23 of the pad 20 is modified, which can be referred to Figure 6 In the figure, the movement direction of the base island 10 is indicated by a dotted arrow.

[0063] When the base island 10 approaches the cushion block 20 , the supporting plane 11 may not be higher than the cushion block 20 due to errors in height alignment, causing the supporting plane 11 to hit the facing side 23 of the cushion block 20 first, thereby damaging the base island 10 .

[0064] In this preferred embodiment, the facing side 23 is defined as an inclined side, and the inclination direction is defined (diagonally upward along the running direction of the base island 10), so that even if the supporting plane 11 is lower than the top surface of the pad 20, it first contacts the facing side 23 and can slide to the top surface of the pad 20 through the inclined structure of the facing side 23. The facing side 23 plays a role of smooth transition, avoiding direct collision without buffering between the pad 20 and the supporting plane 11, and greatly improving the yield of finished products.

[0065] Of course, the meeting surface can be an oblique straight surface or an inclined surface with an arc. This is not limited in the present invention and can be selected according to actual conditions.

[0066] Furthermore, the cross section of the cushion block 20 is a trapezoidal cross section;

[0067] The side face 23 of the trapezoidal cross section corresponds to the hypotenuse of the trapezoidal cross section. The trapezoidal cross section of the pad 20 is more stable and has a simpler processing process. Figure 7 The spacer 20 with a trapezoidal cross-section can simultaneously cope with the base island 10 approaching from two directions, and has better working versatility.

[0068] As a preferred embodiment, the arrangement direction of the plurality of pads 20 is perpendicular to the movement direction of the base island 10. This preferred embodiment can avoid setting multiple pads 20 in the movement direction of the base island 10, further reducing the possibility of collision and further improving product yield.

[0069] Please refer to Figure 8 , Figure 8 This is a top view of the chip pasting machine. In the figure, concentric circles and crosses are used to represent screw holes and screws on the machine. 01 represents the chip pasting machine. Figure 9 for Figure 8 Corresponding front view, in which the screw is drawn with a dotted line.

[0070] It should be noted that, under normal circumstances, the base island 10 will pass through the pad 20 in a straight line along a single direction. Therefore, the "movement direction of the base island 10" in the present invention is the same as the "movement direction of the side connecting ribs 12 relative to the pad 20" and coincides with the "movement trajectory of the through-mouth groove 21 and the side connecting ribs 12 relative to the pad 20". In addition, the side of the supporting platform of the base island 10 may also include side connecting ribs 12 that have no overlapping area with the pad 20 (see Figure 1 ), since this part of the side connecting reinforcement 12 has no chance to contact the pad 20, there is no need to open a corresponding through groove 21 on the pad 20 for this part of the side connecting reinforcement 12.

[0071] Furthermore, it also includes a lifting driver corresponding to the pad 20;

[0072] The lifting drive is used to drive the cushion block 20 to move in a direction perpendicular to the supporting plane 11 of the base island 10 .

[0073] In this preferred embodiment, a corresponding lifting drive is configured for the pad 20, which can enable the pad 20 to be lifted and lowered. The pad 20 descends when the base island 10 moves through to avoid collision between the side connecting ribs 12 and the pad 20. Of course, when chip pasting is performed and the pad 20 is required to support the base island 10, the pad 20 needs to be mounted to support the bearing plane 11.

[0074] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from the other embodiments. Reference can be made to the descriptions of the identical or similar parts between the various embodiments. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the methods.

[0075] It should be noted that, in this specification, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0076] The above describes in detail the chip bonding machine and die bonding machine provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are merely intended to facilitate understanding of the method and core concepts of the present invention. It should be noted that those skilled in the art may make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications fall within the scope of protection of the claims of the present invention.

Claims

1. A chip pasting machine, characterized in that: including a plurality of spacers; The pad is located under the corresponding base island during the chip pasting process and is used to support the base island; The pad block includes a through groove, which coincides with a movement trajectory of the side connecting ribs of the base island relative to the pad block, and a bottom surface of the through groove is lower than a bottom edge of the side connecting ribs.

2. The chip pasting machine according to claim 1, wherein: The pad includes a plurality of separately arranged support units, and adjacent support units are isolated by the through-groove.

3. The chip pasting machine according to claim 1, wherein: The pad also includes an air extraction hole; The air extraction hole is provided on the top surface of the cushion block, and is used to form a negative pressure in the hole so that the bearing plane of the base island is fitted and fixed on the top surface of the cushion block.

4. The chip pasting machine according to claim 3, wherein: The pad includes a plurality of air extraction holes; The plurality of air extraction holes are arranged in the direction of movement of the side connecting reinforcement relative to the pad.

5. The chip pasting machine according to claim 1, wherein: The pad is a stainless steel pad.

6. The chip pasting machine according to claim 1, wherein: The base island is a copper-plated base island.

7. The chip pasting machine according to any one of claims 1 to 6, characterized in that: The facing side of the pad is an inclined side, and the inclination direction of the inclined side is consistent with the movement direction of the base island; The meeting side surface is the side surface of the pad block facing the movement direction of the base island.

8. The chip pasting machine according to claim 7, wherein: The cross section of the pad is a trapezoidal cross section; The meeting side surface corresponds to the hypotenuse of the trapezoidal cross section.

9. The chip pasting machine according to claim 1, wherein: The arrangement direction of the plurality of pads is perpendicular to the movement direction of the base island.

10. The chip bonding machine according to any one of claims 1 to 6, 8 to 9, characterized in that: Also included is a lifting drive corresponding to the pad; The lifting drive is used to drive the cushion block to move in a direction perpendicular to the bearing plane of the base island.

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