Heat pipe heat dissipation structure with good heat dissipation effect

Abstract

The utility model belongs to the technical field of heat pipe heat dissipation, and particularly relates to a heat pipe heat dissipation structure with a good heat dissipation effect, which comprises a lower mounting seat, an upper mounting seat, a plurality of heat pipes, a mounting cylinder and a plurality of heat dissipation fins I, the upper mounting base and the lower mounting base are arranged in parallel, the mounting cylinder is fixedly mounted on the sides, close to each other, of the upper mounting base and the lower mounting base, the heat pipes are fixedly mounted on the upper mounting base and the lower mounting base, and the first cooling fins are fixedly mounted on the heat pipes and are arranged in parallel. The multiple first cooling fins are all connected with the outer side of the mounting cylinder, a cooling fan is fixedly mounted at the lower position of the inner side wall of the mounting cylinder, and multiple arc-shaped openings are formed in the bottom of the outer side of the mounting cylinder. By optimizing the layout and the number of the heat pipes and the arrangement mode of the cooling fins, better heat conduction efficiency can be achieved, and meanwhile air flow is further enhanced through the arrangement of the cooling fan, so that the heat dissipation performance is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat pipe heat dissipation, in particular to a heat pipe heat dissipation structure with good heat dissipation effect. Background Art

[0002] With the rapid development of electronic technology, the performance of electronic devices such as computers continues to improve, but the heat generated by their core electronic components (such as CPU chips) during operation has also increased dramatically. If this heat cannot be dissipated in a timely and effective manner, it will have a serious negative impact on the performance, stability, and service life of the electronic components.

[0003] In existing heat dissipation technologies, in order to improve the heat dissipation effect, heat pipe heat dissipation is usually used for heat dissipation operations. For heat pipe heat dissipation structures, some existing designs also have problems. On the one hand, the thermal conductivity of the mounting base of some heat pipe heat dissipation devices is poor, resulting in a large thermal resistance in the process of heat transfer from the heat source to the heat pipe, which limits the heat dissipation efficiency; on the other hand, there are defects in the heat dissipation airflow organization, and the airflow cannot be effectively utilized to increase the heat dissipation rate of the heat sink, resulting in unsatisfactory heat dissipation effect; moreover, in terms of structural stability, some heat pipe heat dissipation structures are prone to loosening between the heat pipe and the mounting base during long-term use, affecting the heat dissipation performance and the reliability of the entire device; in addition, in actual applications, it is also necessary to consider issues such as good contact between the heat dissipation device and the electronic components and the ease of installation. If stable thermal contact cannot be guaranteed, heat transfer will be hindered, further reducing the heat dissipation effect.

[0004] Therefore, the present invention proposes a heat pipe heat dissipation structure with good heat dissipation effect to solve the above problems.

[0005] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. Utility Model Content

[0006] The purpose of the present invention is to solve the shortcomings mentioned in the above background technology and to propose a heat pipe heat dissipation structure with good heat dissipation effect.

[0007] The above technical objectives of the present invention are achieved through the following technical solutions: A heat pipe heat dissipation structure with good heat dissipation effect, comprising a lower mounting seat, an upper mounting seat, a plurality of heat pipes, a mounting cylinder and a plurality of heat sinks;

[0008] The upper mounting seat and the lower mounting seat are arranged parallel to each other, the mounting tube is fixedly mounted on the side where the upper mounting seat and the lower mounting seat are close to each other, multiple heat pipes are fixedly mounted on the upper mounting seat and the lower mounting seat, multiple heat sinks are fixedly mounted on the multiple heat pipes and are arranged parallel to each other, and multiple heat sinks are connected to the outer side of the mounting tube.

[0009] Preferably, a cooling fan is fixedly installed at the lower position of the inner wall of the mounting tube, a plurality of arc-shaped openings are opened at the outer bottom of the mounting tube, a plurality of through holes are opened on the mounting tube, and the plurality of through holes and the plurality of arc-shaped openings are respectively located above and below the cooling fan.

[0010] Preferably, the plurality of through holes are respectively located on one side of the corresponding two heat sinks that are close to each other.

[0011] Preferably, a plurality of heat sinks 2 are fixedly mounted radially on the lower mounting seat with the mounting cylinder as the center.

[0012] Preferably, a plurality of upper support blocks and a plurality of lower support blocks are fixedly mounted on the bottom side of the upper mounting seat and the top side of the lower mounting seat respectively, and the plurality of upper support blocks and the plurality of lower support blocks are fixedly connected to corresponding heat pipes respectively.

[0013] Preferably, a support ring is fixedly mounted on the lower position of the inner wall of the mounting tube, the cooling fan is fixedly mounted on the support ring, and the air outlet of the cooling fan faces the direction of the upper mounting seat.

[0014] Preferably, the lower mounting seat is made of a material with good thermal conductivity.

[0015] Preferably, a slot for accommodating thermal conductive silica gel is provided on the bottom side of the lower mounting seat.

[0016] The beneficial effects of the utility model are:

[0017] The arrangement of multiple heat sinks can provide a heat dissipation effect for the heat pipe. At the same time, the arrangement of the mounting tube can ensure the connection stability between the lower mounting seat and the upper mounting seat. The arrangement of the heat dissipation fan, the through hole and the arc-shaped opening can extract the heat at the lower mounting seat into the mounting tube and blow it toward the upper mounting seat, and then discharge it under the action of the multiple through holes. This can not only improve the heat dissipation effect at the lower mounting seat, but also improve the heat dissipation rate of the heat sink by accelerating the airflow on the surface of the heat sink.

[0018] By radially arranging multiple heat sinks 2 based on the mounting tube as the center, the heat dissipation effect of the lower mounting position can be further improved. At the same time, when the cooling fan draws the airflow, the airflow speed on the surface of the heat sink 2 is increased, thereby effectively enhancing the heat dissipation effect. The lower mounting seat is made of a material with good thermal conductivity to ensure that heat can be quickly transferred from the heat source position to the heat pipe and the heat sink 2. The card slot provided on the bottom side of the lower mounting seat effectively fixes the thermal conductive silicone and ensures good contact between the CPU chip and the device, thereby maintaining a stable thermal conductivity effect and improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 This is a schematic diagram of the three-dimensional structure of a heat pipe heat dissipation structure with good heat dissipation effect proposed by the utility model;

[0021] Figure 2 This is a schematic cross-sectional view of a heat pipe heat dissipation structure with good heat dissipation effect proposed by the present invention;

[0022] Figure 3 For this utility model Figure 2 A schematic diagram of the structure of the main viewing angle;

[0023] Figure 4 This is a partial three-dimensional structural diagram of a heat pipe heat dissipation structure with good heat dissipation effect proposed by the utility model.

[0024] In the figure: 1. Lower mounting seat; 2. Upper mounting seat; 3. Heat pipe; 31. Upper support block; 32. Lower support block; 4. Heat sink 1; 5. Mounting tube; 501. Through hole; 502. Arc-shaped opening; 51. Cooling fan; 6. Heat sink 2. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions of the present invention in conjunction with specific embodiments. Obviously, the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

[0026] Reference Figure 1-4, a heat pipe heat dissipation structure with good heat dissipation effect, including a lower mounting seat 1, an upper mounting seat 2, multiple heat pipes 3, a mounting cylinder 5 and multiple heat sinks 4, the upper mounting seat 2 and the lower mounting seat 1 are arranged parallel to each other, and the material of the lower mounting seat 1 is made of a material with good thermal conductivity, such as copper or aluminum, the mounting cylinder 5 is fixedly installed on the side where the upper mounting seat 2 and the lower mounting seat 1 are close to each other, and the multiple heat pipes 3 are fixedly installed on the upper mounting seat 2 and the lower mounting seat 1 and are arranged based on the mounting cylinder 5 as the center, wherein in order to ensure the installation stability of the heat pipe 3, the bottom side of the upper mounting seat 2 and the top side of the lower mounting seat 1 are respectively fixedly installed with multiple An upper support block 31 and multiple lower support blocks 32, multiple upper support blocks 31 and multiple lower support blocks 32 are respectively fixedly connected to the corresponding heat pipes 3, multiple heat sinks 4 are fixedly installed on the multiple heat pipes 3 and are arranged parallel to each other, and multiple heat sinks 4 are all connected to the outside of the mounting tube 5, and multiple heat sinks 6 are radially fixedly installed on the lower mounting seat 1 based on the mounting tube 5 as the center, which can further improve the heat dissipation effect of the lower mounting seat 1. At the same time, when the cooling fan 51 is working, the air flow speed on the surface of the heat sink 4 is increased, thereby further improving the heat dissipation effect of the electronic components installed under the lower mounting seat 1.

[0027] In order to extract air from the lower mounting seat 1 and transport it upward along the axis of the mounting tube 5, and then discharge it under the action of multiple through holes 501, so as to cooperate with the heat sink 4 to assist the heat dissipation of the heat pipe 3, a cooling fan 51 is fixedly installed at the lower position of the inner wall of the mounting tube 5, and multiple arc-shaped openings 502 are opened at the outer bottom of the mounting tube 5. Multiple through holes 501 are opened on the mounting tube 5, and the multiple through holes 501 and the multiple arc-shaped openings 502 are respectively located above and below the cooling fan 51.

[0028] In order to enable the airflow to blow along the heat sink 1 4 when the through hole 501 blows air outward, thereby improving the heat dissipation effect of the heat sink 1 4, multiple through holes 501 are respectively located on the side where the corresponding two heat sinks 1 4 are close to each other.

[0029] At the same time, in order to ensure the stable operation of the cooling fan 51, a support ring is fixedly installed at the lower position of the inner wall of the mounting tube 5, and the cooling fan 51 is fixedly installed on the support ring, and the air outlet of the cooling fan 51 faces the upper mounting seat 2.

[0030] In this embodiment, in order to ensure the stability of the device and stable heat conduction between the CPU chip and the lower mounting base 1 when the device is installed on the CPU chip, a slot for accommodating thermal conductive silicone is opened on the bottom side of the lower mounting base 1.

[0031] The circuits, electronic components and module structures involved all use existing technologies, which can be fully implemented by those skilled in the art. Needless to say, the content protected by this application does not involve improvements to software, circuits and methods.

[0032] Working principle: When in use, first fill the slot below the lower mounting seat 1 with thermally conductive silicone and clamp the slot on the CPU chip that needs to be cooled. The heat generated by the CPU chip is transferred to the heat pipe 3 through the thermally conductive silicone and the lower mounting seat 1. The heat pipe 3 uses the working fluid inside it to quickly transfer the heat from the heat source (lower mounting seat 1) to the heat sink 1 4 during the evaporation and condensation cycle. At the same time, the heat on the lower mounting seat 1 will also be dissipated through the heat sink 2 6. Since the surface design of the heat sink 1 4 and the heat sink 2 6 is conducive to the flow of air, when the cooling fan 51 is working, it will extract the heat from the lower mounting seat 1. The hot air at the mounting base 1 position enters the mounting tube 5 through the arc-shaped opening 502, and then is discharged along the heat sink 1 4 through the through hole 501, thereby increasing the air flow speed on the surface of the heat sink 1 4 and the heat sink 2 6, thereby achieving the effect of accelerated heat dissipation, ensuring that the temperature of the electronic components remains within a safe range. At the same time, the material with good thermal conductivity of the upper mounting base 2 and the lower mounting base 1 ensures that the heat generated by the CPU chip is quickly transferred to the heat pipe 3 and quickly transferred to the heat sink 1 4, and finally the heat is carried away by the airflow on the surface of the heat sink 4, achieving an efficient heat dissipation effect.

[0033] The above is a detailed introduction to a heat pipe heat dissipation structure with good heat dissipation effect provided by the present invention. This article uses specific embodiments to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core ideas of the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, the present invention can also be improved and modified in a number of ways, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A heat pipe heat dissipation structure with good heat dissipation effect, characterized in that: It comprises a lower mounting seat (1), an upper mounting seat (2), a plurality of heat pipes (3), a mounting cylinder (5) and a plurality of heat sinks (4); The upper mounting seat (2) and the lower mounting seat (1) are arranged parallel to each other, the mounting cylinder (5) is fixedly mounted on a side where the upper mounting seat (2) and the lower mounting seat (1) are close to each other, the plurality of heat pipes (3) are fixedly mounted on the upper mounting seat (2) and the lower mounting seat (1), the plurality of heat sinks (4) are fixedly mounted on the plurality of heat pipes (3) and are arranged parallel to each other, and the plurality of heat sinks (4) are connected to the outer side of the mounting cylinder (5).

2. The heat pipe heat dissipation structure with good heat dissipation effect according to claim 1, characterized in that: A heat dissipation fan (51) is fixedly mounted on the lower portion of the inner side wall of the mounting tube (5); a plurality of arc-shaped openings (502) are provided on the outer bottom portion of the mounting tube (5); a plurality of through holes (501) are provided on the mounting tube (5); the plurality of through holes (501) and the plurality of arc-shaped openings (502) are respectively located above and below the heat dissipation fan (51).

3. The heat pipe heat dissipation structure with good heat dissipation effect according to claim 2, characterized in that: The plurality of through holes (501) are respectively located on the sides of the two heat sinks (4) that are close to each other.

4. The heat pipe heat dissipation structure with good heat dissipation effect according to claim 1, characterized in that: A plurality of heat sinks (6) are fixedly mounted radially on the lower mounting seat (1) with the mounting cylinder (5) as the center.

5. The heat pipe heat dissipation structure with good heat dissipation effect according to claim 1, characterized in that: A plurality of upper support blocks (31) and a plurality of lower support blocks (32) are fixedly mounted on the bottom side of the upper mounting seat (2) and the top side of the lower mounting seat (1), respectively. The plurality of upper support blocks (31) and the plurality of lower support blocks (32) are fixedly connected to corresponding heat pipes (3), respectively.

6. The heat pipe heat dissipation structure with good heat dissipation effect according to claim 2, characterized in that: A support ring is fixedly mounted on the lower portion of the inner wall of the mounting tube (5), and a heat dissipation fan (51) is fixedly mounted on the support ring, with the air outlet of the heat dissipation fan (51) facing the upper mounting seat (2).

7. The heat pipe heat dissipation structure with good heat dissipation effect according to claim 1, characterized in that: The lower mounting seat (1) is made of a material with good thermal conductivity.

8. The heat pipe heat dissipation structure with good heat dissipation effect according to claim 1, characterized in that: A slot for accommodating heat-conducting silica gel is provided on the bottom side of the lower mounting seat (1).

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