Power module, motor controller and vehicle

Abstract

The utility model relates to a power module, a motor controller and a vehicle, the power module comprises a substrate, a connecting plate and a signal terminal, the connecting plate and the substrate are laminated and connected, the connecting plate comprises a conductive layer and an insulating layer, the insulating layer is arranged between the substrate and the conductive layer, and the signal terminal is arranged between the substrate and the conductive layer. The conductive layer is electrically connected with the substrate; and the signal terminal is arranged on one side, far away from the insulating layer, of the conductive layer and is electrically connected with the conductive layer. According to the power module disclosed by the invention, the insulating layer is arranged between the substrate and the conductive layer, so that insulation between the conductive layer and the substrate can be realized, the substrate does not need to be cut to form islands, the equivalent inductance of the power module is reduced, and the through-current capability of the power module is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of motor controllers, and in particular to a power module, a motor controller, and a vehicle. Background Art

[0002] As the efficiency and power density of motor controllers become higher and higher, the current output capacity and high temperature resistance requirements of the power modules of motor controllers are also getting higher and higher. Plastic-encapsulated power modules have become the main solution for power module packaging design due to their small size, high power density, and strong resistance to high temperature and high humidity.

[0003] In related technologies, the signal and power terminals of power modules are located on one side of the substrate along its length, making it difficult to ensure electrical clearance and creepage distances between them. Some power modules place signal terminals on one side of the substrate along its thickness. The signal terminals are soldered directly to the substrate or through copper blocks. This requires cutting the substrate to form islands, which not only increases the equivalent series inductance (ESL) of the power module but also reduces its current-carrying capacity. Utility Model Content

[0004] The present disclosure provides a power module to reduce the equivalent inductance of the power module and improve the current carrying capacity of the power module.

[0005] The power module disclosed herein includes a substrate, a connecting plate and a signal terminal. The connecting plate is stacked and connected to the substrate. The connecting plate includes a conductive layer and an insulating layer. The insulating layer is arranged between the substrate and the conductive layer, and the conductive layer is electrically connected to the substrate. The signal terminal is arranged on a side of the conductive layer away from the insulating layer and is electrically connected to the conductive layer.

[0006] Optionally, the connecting plate further includes a metal layer, which is disposed on a side of the insulating layer close to the substrate, and the metal layer is welded to the substrate.

[0007] Optionally, the connecting plate is a ceramic copper-clad plate, the insulating layer is a ceramic layer, and the conductive layer and the metal layer are both copper foil layers.

[0008] Optionally, the power module further includes a plastic package, the substrate is packaged in the plastic package, and at least a portion of the connecting plate is packaged in the plastic package.

[0009] Optionally, the connecting plate is entirely encapsulated in the plastic package.

[0010] Optionally, the plastic package body is provided with a relief portion for evading the signal terminal, and the plastic package body wraps a portion of the conductive layer away from the surface of the substrate.

[0011] Optionally, the avoidance portion is a avoidance hole, the signal terminal is arranged in the avoidance hole, and there is a gap between the signal terminal and a hole wall of the avoidance hole.

[0012] Optionally, a covering portion is provided on a surface of the conductive layer away from the insulating layer, the plastic package body wraps the covering portion, and the covering portion includes a groove and / or a protrusion.

[0013] Optionally, the orthographic projection of the insulating layer in the direction toward the substrate is larger than the orthographic projection of the conductive layer in the direction toward the substrate; or, the orthographic projection of the insulating layer in the direction toward the substrate is smaller than the orthographic projection of the conductive layer in the direction toward the substrate.

[0014] Optionally, the conductive layer is electrically connected to the substrate via a wire.

[0015] Optionally, the power module further includes a power terminal, and the power terminal and the signal terminal are arranged on the same side of the substrate in a thickness direction of the substrate.

[0016] The present disclosure also provides a motor controller.

[0017] The motor controller disclosed herein includes the power module described in any one of the above embodiments.

[0018] The present disclosure further provides a vehicle.

[0019] The vehicle disclosed herein includes the motor controller described in any one of the above embodiments.

[0020] The power module disclosed herein connects a connecting plate to a substrate and then connects a signal terminal to the connecting plate, thereby securing the connection between the signal terminal and the substrate. The connecting plate comprises a conductive layer and an insulating layer, the conductive layer being electrically connected to the substrate, and the signal terminal being electrically connected to the conductive layer, thereby electrically connecting the signal terminal to the substrate. By providing an insulating layer between the substrate and the conductive layer, insulation between the conductive layer and the substrate is achieved, eliminating the need to cut the substrate to form islands. This not only reduces the equivalent inductance of the power module but also improves its current-carrying capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the structure of the power module of the embodiment of the present disclosure.

[0022] Figure 2 Schematic diagram of the structure of the connection between the signal terminal and the connection plate in the power module of the embodiment of the present disclosure.

[0023] Reference numerals:

[0024] 1. Substrate; 11. First copper clad layer; 12. Ceramic layer; 13. Second copper clad layer;

[0025] 2. Connecting plate; 21. Conductive layer; 211. Covering portion; 22. Insulating layer; 23. Metal layer;

[0026] 3. Signal terminal; 31. Base; 32. Terminal body;

[0027] 4. Plastic sealing body; 41. First plastic sealing portion; 42. Second plastic sealing portion; 421. Protruding portion; 4211. Avoiding portion;

[0028] 5. Solder layer;

[0029] 6. Wire;

[0030] 7. Chip;

[0031] 8. Radiator. DETAILED DESCRIPTION

[0032] The embodiments of the present disclosure are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present disclosure, but should not be understood as limiting the present disclosure.

[0033] like Figure 1 and Figure 2 As shown, the power module of the embodiment of the present disclosure includes a substrate 1, a connection plate 2, and a signal terminal 3. The connection plate 2 is stacked and connected to the substrate 1. The connection plate 2 includes a conductive layer 21 and an insulating layer 22. The insulating layer 22 is provided between the substrate 1 and the conductive layer 21, and the conductive layer 21 is electrically connected to the substrate 1. The signal terminal 3 is provided on a side of the conductive layer 21 away from the insulating layer 22 and is electrically connected to the conductive layer 21.

[0034] The power module of the embodiment of the present disclosure connects the connecting plate 2 to the substrate 1 and connects the signal terminal 3 to the connecting plate 2, thereby achieving a fixed connection between the signal terminal 3 and the substrate 1. By configuring the connecting plate 2 to include a conductive layer 21 and an insulating layer 22, the conductive layer 21 is electrically connected to the substrate 1, and the signal terminal 3 is electrically connected to the conductive layer 21, thereby achieving an electrical connection between the signal terminal 3 and the substrate 1. By providing the insulating layer 22 between the substrate 1 and the conductive layer 21, insulation between the conductive layer 21 and the substrate 1 can be achieved, thereby eliminating the need to cut the substrate 1 to form an island. This not only reduces the equivalent inductance of the power module, but also improves the current carrying capacity of the power module.

[0035] In order to make the technical solution of the present disclosure easier to understand, the following takes the thickness direction of the substrate 1 and the vertical direction as an example to further describe the technical solution of the present disclosure. Figure 1 shown.

[0036] For example, Figure 1 As shown, the connection plate 2 is disposed on the upper side of the substrate 1, the conductive layer 21 is disposed on the upper side of the insulating layer 22, and the signal terminal 3 is disposed on the upper side of the conductive layer 21. The lower end of the signal terminal 3 is electrically connected to the conductive layer 21, and the lower end of the signal terminal 3 is insulated from the substrate 1 by the insulating layer 22.

[0037] Optionally, the substrate 1 is a ceramic copper clad laminate.

[0038] For example, Figure 1 As shown, the substrate 1 includes a first copper clad layer 11, a ceramic layer 12, and a second copper clad layer 13. The first copper clad layer 11 is arranged on the upper side of the ceramic layer 12, and the second copper clad layer 13 is arranged on the lower side of the ceramic layer 12. The connecting plate 2 is arranged on the upper side of the first copper clad layer 11, and the lower end of the connecting plate 2 is connected to the first copper clad layer 11.

[0039] like Figure 1 As shown, the signal terminal 3 includes a base 31 and a terminal body 32 , and the base 31 is electrically connected to the conductive layer 21 .

[0040] The signal terminal 3 is electrically connected to the conductive layer 21 via the base 31 , which can increase the connection area between the signal terminal 3 and the conductive layer 21 and improve the connection reliability between the signal terminal 3 and the conductive layer 21 .

[0041] Optionally, the signal terminal 3 is welded to the conductive layer 21 .

[0042] For example, the signal terminal 3 and the conductive layer 21 are laser welded.

[0043] By welding the signal terminal 3 and the conductive layer 21 , the connection reliability between the signal terminal 3 and the conductive layer 21 is improved, which is beneficial to improving the reliability of the power module.

[0044] In some embodiments, as Figure 1 As shown, the connecting plate 2 further includes a metal layer 23 , and the metal layer 23 is welded to the base plate 1 .

[0045] For example, Figure 1 As shown, the power module further includes a solder layer 5, which is disposed between the metal layer 23 and the substrate 1 in the thickness direction of the substrate 1. The metal layer 23 is soldered to the substrate 1 via the solder layer 5. The solder layer 5 can be a tin solder for system soldering, or a silver paste or copper paste used for sintering.

[0046] By welding the metal layer 23 to the substrate 1 , the connection between the connecting plate 2 and the substrate 1 is achieved, which can improve the connection reliability between the connecting plate 2 and the substrate 1 and is beneficial to improving the reliability of the power module.

[0047] Optionally, the connection board 2 is a ceramic copper-clad board (Direct Bonding Copper, DBC), the insulating layer 22 is a ceramic layer, and the conductive layer 21 and the metal layer 23 are both copper foil layers.

[0048] By setting the connection plate 2 as a ceramic copper-clad plate, not only the insulation performance of the insulating layer 22 can be guaranteed, but also the current carrying capacity of the conductive layer 21 can be guaranteed, thereby improving the reliability of the power module.

[0049] In some embodiments, as Figure 1 As shown, the power module further includes a plastic package 4 , the substrate 1 is packaged in the plastic package 4 , and at least a portion of the connecting plate 2 is packaged in the plastic package 4 .

[0050] At least a portion of the connecting plate 2 is encapsulated in the plastic body 4 , which can be understood as: a portion of the connecting plate 2 is encapsulated in the plastic body 4 , and another portion of the connecting plate 2 is located outside the plastic body 4 ; or, the entire connecting plate 2 is encapsulated in the plastic body 4 .

[0051] For example, Figure 1 As shown, the plastic encapsulation body 4 includes a first plastic encapsulation portion 41 and a second plastic encapsulation portion 42. The second plastic encapsulation portion 42 is arranged to protrude from the first plastic encapsulation portion 41 in the thickness direction of the substrate 1 in a direction away from the substrate 1. The substrate 1 is encapsulated in the first plastic encapsulation portion 41, and the connecting plate 2 is encapsulated in the second plastic encapsulation portion 42.

[0052] By encapsulating at least a portion of the connecting plate 2 in the plastic package 4 , the connection reliability between the connecting plate 2 and the plastic package 4 can be improved, and the reliability of the power module 10 can be further improved.

[0053] Optionally, the connecting board 2 is entirely encapsulated in the plastic package 4 .

[0054] By encapsulating the entire connecting plate 2 in the plastic package 4 , the connection reliability between the connecting plate 2 and the plastic package 4 can be improved, further improving the reliability of the power module 10 .

[0055] Alternatively, as Figure 1 As shown, the plastic package body 4 is provided with a relief portion 4211 for evading the signal terminal 3 , and the plastic package body 4 wraps a portion of the conductive layer 21 away from the surface of the substrate 1 .

[0056] For example, Figure 1As shown, the second plastic sealing portion 42 includes a protruding portion 421, which protrudes upward from the upper side of the connecting plate 2, and the lower end of the protruding portion 421 wraps the upper surface of the connecting plate 2. The protruding portion 421 is provided with a relief portion 4211 for avoiding the signal terminal 3.

[0057] By wrapping the portion of the conductive layer 21 away from the surface of the substrate 1 around the plastic encapsulation body 4, the bonding strength between the plastic encapsulation body 4 and the connecting plate 2 is increased, thereby improving the connection reliability between the plastic encapsulation body 4 and the connecting plate 2 and thereby enhancing the reliability of the power module. Furthermore, providing the relief portion 4211 on the plastic encapsulation body 4 prevents direct contact between the signal terminals 3 and the plastic encapsulation body 4, thereby preventing cracking between the signal terminals 3 and the plastic encapsulation body 4 due to different expansion coefficients, which could lead to insulation failure in the power module, thereby improving the reliability of the power module.

[0058] Optionally, the avoidance portion 4211 is a avoidance hole, the signal terminal 3 is disposed in the avoidance hole, and there is a gap between the signal terminal 3 and a hole wall of the avoidance hole.

[0059] By setting the avoidance portion 4211 as a avoidance hole, the connection reliability between the plastic package body 4 and the connection plate 2 can be increased, thereby improving the reliability of the power module.

[0060] Optionally, a covering portion 211 is provided on a surface of the conductive layer 21 away from the insulating layer 22 , and the plastic package body 4 wraps the covering portion 211 , and the covering portion 211 includes grooves and / or protrusions.

[0061] For example, grooves are formed by etching on the conductive layer 21. The grooves and protrusions can increase the adhesion between the plastic package body 4 and the conductive layer 21.

[0062] By providing a covering portion 211 on the conductive layer 21, the bonding force between the plastic package body 4 and the connecting plate 2 can be increased, the connection reliability between the plastic package body 4 and the connecting plate 2 can be improved, the plastic package body 4 and the connecting plate 2 can be prevented from being delaminated, water vapor can be prevented from entering the power module, and the insulation performance of the power module can be improved.

[0063] Optionally, the orthographic projection of the insulating layer 22 in the direction toward the substrate 1 is larger than the orthographic projection of the conductive layer 21 in the direction toward the substrate 1. Alternatively, the orthographic projection of the insulating layer 22 in the direction toward the substrate 1 is smaller than the orthographic projection of the conductive layer 21 in the direction toward the substrate 1.

[0064] For example, Figure 1 As shown, the area of ​​the insulating layer 22 is larger than the area of ​​the conductive layer 21, so that the side of the insulating layer 22 protrudes from the conductive layer 21, thereby increasing the bonding strength between the plastic package 4 and the connecting plate 2. Of course, the area of ​​the insulating layer 22 can also be smaller than the area of ​​the conductive layer 21, so that the side of the conductive layer 21 protrudes from the insulating layer 22, thereby increasing the bonding strength between the plastic package 4 and the connecting plate 2.

[0065] In this way, the connection reliability between the plastic package body 4 and the connecting plate 2 can be improved, the plastic package body 4 and the connecting plate 2 can be prevented from being delaminated, water vapor can be prevented from entering the power module, and the insulation performance of the power module can be improved.

[0066] Alternatively, as Figure 2 As shown, the conductive layer 21 is electrically connected to the substrate 1 via a wire 6 .

[0067] One end of the wire 6 is electrically connected to the conductive layer 21 , and the other end of the wire 6 is electrically connected to the substrate 1 .

[0068] The conductive layer 21 is electrically connected to the substrate 1 via the wire 6 , which facilitates the electrical connection between the conductive layer 21 and the substrate 1 and facilitates the processing and manufacturing of the power module.

[0069] Optionally, the power module further includes power terminals, and the signal terminals 3 and the power terminals are arranged on the same side of the substrate 1 in the thickness direction of the substrate 1 .

[0070] By arranging the signal terminals 3 and the power terminals on the same side of the substrate 1 in the thickness direction, wiring operations of the power module are facilitated, thereby improving the installation efficiency of the power module.

[0071] Optionally, the signal terminal 3 is a signal pin.

[0072] For example, the signal terminal 3 is a spring signal pin.

[0073] like Figure 1 As shown, the power module further includes a chip 7 . The chip 7 and the signal terminal 3 are arranged on the same side of the substrate 1 in the thickness direction. The chip 7 is electrically connected to the substrate 1 .

[0074] The motor controller of the embodiment of the present disclosure includes the power module described in any of the above embodiments.

[0075] Since the power module of the embodiment of the present disclosure has low equivalent inductance and high current carrying capacity, the motor controller of the embodiment of the present disclosure also has low equivalent inductance and high current carrying capacity.

[0076] The power module of the embodiment of the present disclosure can also be used in devices with direct current and alternating current conversion functions, for example, photovoltaic inverters, high-power inverters and other high-voltage inverters.

[0077] like Figure 1 As shown, the motor controller further includes a heat sink 8 , which is arranged on a side of the substrate 1 away from the connecting plate 2 in the thickness direction of the substrate 1 , and the heat sink 8 is attached to and connected to the substrate 1 .

[0078] The heat sink 8 and the substrate 1 can be welded, and the heat sink 8 is used to dissipate heat from the power module.

[0079] The vehicle of the embodiment of the present disclosure includes the motor controller described in any of the above embodiments, wherein the vehicle is an electric vehicle.

[0080] In the power module of the disclosed embodiment, the signal terminal 3 is connected to the substrate 1 via the connecting plate 2, and the signal terminal 3 is not in direct contact with the plastic package 4. This can solve the problem of cracking at the connection between the signal terminal 3 and the plastic package 4 due to the large difference in expansion coefficient between the signal terminal 3 and the plastic package 4, which causes insulation failure of the power module. In addition, the layout of the signal terminal 3 and the power terminal can be more compact, and will not cause electrical clearance and creepage distance problems between the signal terminal 3 and the power terminal. In addition, the equivalent inductance of the power module can be reduced, and the current carrying capacity of the substrate 1 can be improved.

[0081] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present disclosure.

[0082] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the present disclosure, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0083] In this disclosure, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections, or communication between them; direct connections or indirect connections through an intermediate medium; and internal communication between two elements or interaction between two elements, unless otherwise expressly limited. Those skilled in the art will understand the specific meanings of the above terms in this disclosure based on specific circumstances.

[0084] In the present disclosure, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0085] In the present disclosure, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0086] Although the embodiments of the present disclosure have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present disclosure. Any changes, modifications, substitutions and variations of the above embodiments by those skilled in the art are all within the scope of protection of the present disclosure.

Claims

1. A power module, characterized in that: include: substrate; a connecting plate, the connecting plate being stacked and connected to the substrate, the connecting plate comprising a conductive layer and an insulating layer, the insulating layer being disposed between the substrate and the conductive layer, and the conductive layer being electrically connected to the substrate; The signal terminal is arranged on a side of the conductive layer away from the insulating layer and is electrically connected to the conductive layer.

2. The power module according to claim 1, wherein: The connecting plate further comprises a metal layer, which is arranged on a side of the insulating layer close to the substrate, and the metal layer is welded to the substrate.

3. The power module according to claim 2, wherein: The connecting plate is a ceramic copper-clad plate, the insulating layer is a ceramic layer, and the conductive layer and the metal layer are both copper foil layers.

4. The power module according to claim 1, wherein: It also includes a plastic package, the substrate is packaged in the plastic package, and at least a portion of the connecting plate is packaged in the plastic package.

5. The power module according to claim 4, characterized in that: The connecting plate is entirely encapsulated in the plastic package.

6. The power module according to claim 5, characterized in that: The plastic package body is provided with a relief portion for evading the signal terminal, and the plastic package body wraps a portion of the conductive layer away from the surface of the substrate.

7. The power module according to claim 6, characterized in that: The avoidance portion is a avoidance hole, the signal terminal is arranged in the avoidance hole, and there is a gap between the signal terminal and the hole wall of the avoidance hole.

8. The power module according to claim 6, characterized in that: A covering portion is provided on a surface of the conductive layer away from the insulating layer. The plastic package body wraps the covering portion, and the covering portion includes a groove and / or a protrusion.

9. The power module according to claim 5, characterized in that: The orthographic projection of the insulating layer in the direction toward the substrate is larger than the orthographic projection of the conductive layer in the direction toward the substrate; or An orthographic projection of the insulating layer in a direction toward the substrate is smaller than an orthographic projection of the conductive layer in a direction toward the substrate.

10. The power module according to any one of claims 1 to 9, characterized in that: The conductive layer is electrically connected to the substrate via a wire.

11. The power module according to any one of claims 1 to 9, characterized in that: A power terminal is further included, wherein the power terminal and the signal terminal are arranged on the same side of the substrate in a thickness direction of the substrate.

12. A motor controller, characterized in that: The power module comprises the power module according to any one of claims 1 to 11.

13. A vehicle, characterized in that: Including the motor controller described in claim 12.

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